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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard ConnectorsGBC43DREH
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GBC43DREH - Sullins Connector Solutions

Manufacturer Part Number
GBC43DREH
Manufacturer
Sullins Connector Solutions
Allelco Part Number
98D-GBC43DREH
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
48,760 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 86POS 0.100
Package
Tube
Data sheet
GBC43DREH.pdf

HTML Datasheet

xxCxxDREx Drawing.pdf

Environmental Information

Sullins Connector Solutions REACH.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 48760
  • Unit Price: $8.00
  • Subtotal: $0.00

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The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

GBC43DREH Tech Specifications
Sullins Connector Solutions - GBC43DREH technical specifications, attributes, parameters and parts with similar specifications to Sullins Connector Solutions - GBC43DREH

Product Attribute Attribute Value
Manufacturer Sullins Connector Solutions
Termination Solder Eyelet(s)
Series -
Read Out Dual
Pitch 0.100" (2.54mm)
Package Tube
Operating Temperature -65°C ~ 125°C
Number of Rows 2
Number of Positions/Bay/Row 43
Number of Positions 86
Mounting Type Panel Mount
Material - Insulation Polyamide (PA9T), Nylon 9T
Product Attribute Attribute Value
Gender Female
Flange Feature Top Mount Opening, Unthreaded, 0.125" (3.18mm) Dia
Features -
Contact Type Full Bellows
Contact Material Phosphor Bronze
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Black
Card Type Non Specified - Dual Edge
Card Thickness 0.062" (1.57mm)
Base Product Number GBC43

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the GBC43DREH and single-row edge connectors for PCB applications?
The GBC43DREH provides 86 total positions across two rows (43 per row) at 0.100" pitch, compared to single-row alternatives that typically offer half the signal density. The dual-row configuration of the GBC43DREH allows designers to route twice the signal channels within the same card length, which is critical for high-pin-count backplane applications. The 0.062" card thickness specification for the GBC43DREH is optimized for standard PCB profiles, whereas thinner single-row connectors may require different mechanical tooling. For applications requiring parallel data buses, memory modules, or expansion slots with limited physical envelope, the GBC43DREH's dual-read architecture eliminates the need for stacked connectors.
Why does the GBC43DREH use phosphor bronze contacts with gold finish instead of solid gold plating?
The GBC43DREH employs phosphor bronze with 10.0µin (0.25µm) gold plating as a cost-effective material strategy that balances electrical performance with mechanical durability. Phosphor bronze provides superior spring force retention and wear resistance during repeated insertion cycles compared to softer pure gold contacts, which is essential for edge connectors subjected to frequent board swaps or maintenance cycles. The thin gold finish (0.25µm) on the GBC43DREH is sufficient to prevent oxidation of the underlying bronze while maintaining low contact resistance at the mating interface. Full solid gold would increase material cost substantially without providing measurable electrical advantage in typical signal applications, and may introduce brittleness that reduces mechanical cycle life.
Can the GBC43DREH handle high-speed digital signals without signal integrity degradation?
The GBC43DREH's 0.100" pitch and dual-row geometry introduce parasitic inductance and cross-talk characteristics typical of discrete pin connectors rather than high-density differential connectors. At pitches of 0.100", the GBC43DREH is generally suitable for legacy digital interfaces and moderate-speed applications (typically below 100 MHz clean signaling), though signal rise times and stub lengths require careful PCB layout. For high-speed protocols (DDR memory, PCI Express, or gigabit interfaces), the GBC43DREH would require differential pair management and controlled impedance routing. The connector's inductance per pin position is primarily determined by the bellows contact geometry and the solder eyelet termination style; the GBC43DREH does not provide shielding or ground plane integration features found in modern shielded connectors, so applications demanding sub-nanosecond timing should evaluate alternative connector architectures.
What thermal management considerations apply to the GBC43DREH in -65°C to 125°C operating range?
The GBC43DREH's operating range of -65°C to 125°C places it in the industrial/extended temperature bracket, with the lower limit addressing cold-soak scenarios in aerospace or outdoor equipment. The polyamide (PA9T) insulation material used in the GBC43DREH maintains dimensional stability and insulation resistance across this range, though elasticity of the bellows contacts gradually decreases at the low extreme. At 125°C, the gold finish on the GBC43DREH remains stable, but the underlying phosphor bronze experiences minor stress relaxation over extended dwells above 100°C; designers should verify contact pressure specifications after thermal cycling. The dual-row density of the GBC43DREH concentrates 86 pins in a compact footprint, which can create localized hot spots if all positions carry high current; thermal analysis should account for current distribution across the two rows and use solder eyelet connections sized appropriately for power delivery paths.
How does the GBC43DREH compare to DIN 41612 or DIN 43650 connectors for industrial backplane applications?
The GBC43DREH operates at 0.100" (2.54mm) pitch with a dual-row, non-specified edge-card topology, whereas DIN 41612 standardizes three-row male or female connectors at the same pitch, and DIN 43650 specifies M23 industrial power connectors with different mechanical and electrical interfaces. The GBC43DREH is optimized for card-edge insertion into a mating socket, making it ideal for removable modules and daughter boards, while DIN connectors are designed for freestanding panel-mount or bulkhead applications. The GBC43DREH's full-bellows contact design provides gentler wear characteristics during insertion compared to stamped-contact DIN variants, which is beneficial for high-cycle environments. However, the GBC43DREH lacks the environmental sealing and locking features inherent to many DIN 43650 circular connectors; the choice between the GBC43DREH and DIN standards depends on whether the application is internally mounted on a chassis versus exposed to vibration and humidity.
What is the maximum current rating per pin for the GBC43DREH, and how does this affect power distribution design?
The GBC43DREH datasheet does not specify discrete per-pin current ratings; connector current capacity is typically limited by solder eyelet wire gauge, PCB trace width, and overall thermal dissipation. For edge connectors, per-pin current is commonly estimated at 2–5 amperes depending on continuous versus peak duty and ambient temperature. With 86 positions on the GBC43DREH, if all pins were utilized for low-voltage signals (3.3V or 5V logic), aggregate current could reach 200–400 amperes under simultaneous switching, which demands careful power distribution network (PDN) design to avoid excessive voltage droop. Designers should dedicate multiple GBC43DREH pin positions to ground and power planes in a distributed pattern rather than concentrating power on a single row; the polyamide insulation of the GBC43DREH remains stable up to 125°C, but junction temperatures at individual solder joints should not exceed this limit under worst-case current loading.
Is the GBC43DREH suitable for applications requiring frequent hot-swap or repeated insertion cycles?
The GBC43DREH is rated for mechanical insertion cycles according to its full-bellows contact design and phosphor bronze spring material, which are engineered for moderate repetition (typically 50–500 cycles depending on insertion force and contact geometry). The 10.0µin gold finish on the GBC43DREH provides surface protection during contact wear, and the bellows structure allows controlled spring relaxation that extends cycle life compared to simpler stamped contacts. However, the GBC43DREH is not optimized for extreme hot-swap frequencies (>1000 cycles); applications requiring frequent module changes should implement mechanical keying or guide pins to ensure proper alignment and reduce destructive forces on the GBC43DREH contacts. After extended cycling, the GBC43DREH should be inspected for visible contact wear or corrosion; in humid or corrosive environments, periodic contact cleaning or replacement may be necessary to maintain contact resistance below 100 mΩ per position.
What are the RoHS3 and REACH compliance implications for using the GBC43DREH in regulated markets?
The GBC43DREH is marked as ROHS3 Compliant and REACH Unaffected, meaning it contains no restricted substances under the RoHS3 directive (which limits lead, cadmium, hexavalent chromium, and other hazardous materials). The phosphor bronze and gold materials in the GBC43DREH are naturally compliant, and the polyamide insulation (PA9T nylon 9T) does not trigger REACH substance-of-concern restrictions. For equipment destined for European markets or industries with environmental compliance mandates, the GBC43DREH can be deployed without material declaration concerns. ECCN classification as EAR99 indicates the GBC43DREH has no export control restrictions for most dual-use applications, though certain end-use scenarios (military, nuclear) may require additional licensing verification independent of the connector's intrinsic classification.
How should PCB layout and solder joint design be optimized for the GBC43DREH's solder eyelet termination?
The GBC43DREH terminates via solder eyelets, which require plated through-holes (PTHs) sized to accommodate the eyelet barrel diameter—typically 0.040"–0.045" for this connector pitch. PCB layout should provide annular ring dimensions of at least 0.010" around each GBC43DREH eyelet to ensure reliable solder fillet formation and mechanical strength. The dual-row geometry of the GBC43DREH creates closely spaced vias; thermal relief patterns around the eyelet should be conservative to avoid solder bridge formation between adjacent rows during reflow. Solder joint quality on the GBC43DREH is sensitive to thermal profile timing; slow heating rates can allow the gold finish to diffuse into the solder joint, potentially embrittling the connection, while excessive peak temperatures (>260°C) may weaken the phosphor bronze spring structure. Lead-free solder (SAC305 or equivalent) recommended for the GBC43DREH requires verification of solder joint ductility after thermal cycling, as brittle intermetallic growth can propagate from thermal stress.
What mechanical clearances and panel mounting considerations apply to the GBC43DREH installation?
The GBC43DREH is specified with a top-mount opening flange featuring unthreaded 0.125" diameter holes, intended for panel or chassis mounting using screws or standoffs. The flange design provides structural rigidity during card insertion and prevents over-insertion of the GBC43DREH into the mating socket. Panel cutout dimensions should accommodate the GBC43DREH's overall body width (approximately 2.0"–2.2" depending on exact housing geometry) plus 0.050" clearance on each side to prevent binding. The GBC43DREH's black polyamide housing may exhibit slight shrinkage after thermal cycling; panel tolerances should allow ±0.010" variation to maintain proper seating without mechanical stress. For applications using the GBC43DREH in vertical card cages or sliding modules, support brackets should distribute insertion/removal forces across the entire flange to avoid localized cracking of the nylon 9T insulation material.
How does the GBC43DREH's contact design handle voltage overstress or ESD events?
The GBC43DREH provides no integrated ESD suppression or overvoltage protection; external circuit protection (ferrite beads, TVS diodes, or capacitive filters) must be applied at the PCB level if the application encounters voltage transients or electrostatic discharge. The full-bellows contact geometry of the GBC43DREH creates small air gaps between mating surfaces that can support arcing at voltages above approximately 250V in standard atmospheric conditions; applications exceeding 48V should incorporate protective circuitry to prevent contact erosion. The 10.0µin gold finish on the GBC43DREH is relatively thin and offers limited protection against repeated arcing; once the gold layer is breached, the underlying phosphor bronze can oxidize rapidly in humid environments, increasing contact resistance. For critical analog or precision measurement circuits, the GBC43DREH should be protected by low-pass filtering or capacitive clamping to suppress high-frequency transients that can couple through the connector parasitic inductance.
What are the aging and shelf-life characteristics of the GBC43DREH in storage?
The GBC43DREH is rated at Moisture Sensitivity Level (MSL) Not Applicable, indicating that polyamide insulation and phosphor bronze contacts are stable across typical ambient humidity ranges (20–80% RH) without requiring dry-pack storage or baking procedures prior to assembly. Long-term shelf storage of the GBC43DREH should maintain temperature between 16–35°C and relative humidity below 85% to preserve the gold contact finish and prevent oxidation of the bronze underlay. The thin 0.25µm gold plating on the GBC43DREH can develop white corrosion (zinc migration) if stored in high-humidity environments or if residual flux corrosive materials remain on the connector; new GBC43DREH units should be inspected for contact cleanliness before installation. Tube packaging (as specified for the GBC43DREH) provides basic moisture protection but does not offer the hermetic sealing of vacuum-sealed containers; for applications with extended shelf life (>2 years), periodic humidity verification or recalibration of contact resistance is recommended.
How does the GBC43DREH perform in applications requiring shielding or EMI rejection?
The GBC43DREH provides no integrated shielding or Faraday cage structure; the black polyamide housing and dual-row contact geometry offer minimal EMI rejection compared to shielded DIN or high-density connectors. For applications sensitive to radiated or conducted EMI, the GBC43DREH should be integrated into a shielded backplane enclosure or protected with external shield cans around the connector itself. Signal and return routing on the PCB must be carefully managed when using the GBC43DREH; ground pins should be distributed throughout the connector rather than concentrated at edges to provide local return paths for high-frequency signals. The non-specified edge-card format of the GBC43DREH means custom shielding solutions may be required to achieve military-grade EMI suppression (MIL-STD-461 or equivalent); off-the-shelf EMI filters are often not available for this connector type, necessitating design-specific engineering.
What tooling and assembly considerations should be planned for high-volume production using the GBC43DREH?
The GBC43DREH's tube packaging and solder eyelet termination are compatible with standard PCB assembly processes (pick-and-place and wave or reflow soldering), though the dual-row density creates potential for solder bridges and bridging defects. Assembly equipment should be programmed to recognize the GBC43DREH's 43-position-per-row geometry to avoid placement errors; custom vision templates may be required if the assembly line is not pre-qualified for this connector family. Tooling for the GBC43DREH should include solder mask dam patterns around each eyelet to contain solder and reduce defect rates; the spacing between rows (typically 0.1"–0.15") allows adequately sized dams without creating shorts. Incoming inspection of the GBC43DREH should verify contact finish integrity (no visible oxidation on the 0.25µm gold plating) and insulation color consistency; rejected connectors with corrosion or discoloration should be documented to identify supply chain quality issues before large-lot production commitments.

Parts with Similar Specifications

The three parts on the right have similar specifications to Sullins Connector Solutions GBC43DREH

Product Attribute GBC43DREH-S13 GBC43DREH-S734 GBC43DREH-S93 GBC43DREF-S734
Part Number GBC43DREH-S13 GBC43DREH-S734 GBC43DREH-S93 GBC43DREF-S734
Manufacturer Sullins Connector Solutions Sullins Connector Solutions Sullins Connector Solutions Sullins Connector Solutions
Features - - - Simultaneous Sampling
Card Type - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Contact Type - - - -
Pitch - - - -
Flange Feature - - - -
Material - Insulation - - - -
Contact Material - - - -
Color - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Gender - - - -
Contact Finish - - - -
Number of Positions - - - -
Read Out - - - -
Card Thickness - - - -
Number of Positions/Bay/Row - - - -
Number of Rows - - - -
Contact Finish Thickness - - - -
Series - - - -
Termination - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount

GBC43DREH Datasheet PDF

Download GBC43DREH pdf datasheets and Sullins Connector Solutions documentation for GBC43DREH - Sullins Connector Solutions.

Datasheets
xxCxxDREx Drawing.pdf
HTML Datasheet
xxCxxDREx Drawing.pdf
Environmental Information
Sullins Connector Solutions REACH.pdf

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Sullins Connector Solutions

GBC43DREH

Sullins Connector Solutions
98D-GBC43DREH

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