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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard ConnectorsGCB33DHBS
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GCB33DHBS - Sullins Connector Solutions

Manufacturer Part Number
GCB33DHBS
Manufacturer
Sullins Connector Solutions
Allelco Part Number
98D-GCB33DHBS
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
36,077 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 66POS 0.050
Package
Tube
Data sheet
GCB33DHBS.pdf

Environmental Information

Sullins Connector Solutions REACH.pdf
RoHs Status
ROHS3 Compliant
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In stock: 36077

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Specifications

GCB33DHBS Tech Specifications
Sullins Connector Solutions - GCB33DHBS technical specifications, attributes, parameters and parts with similar specifications to Sullins Connector Solutions - GCB33DHBS

Product Attribute Attribute Value
Manufacturer Sullins Connector Solutions
Termination Solder, Staggered
Series -
Read Out Dual
Pitch 0.050' (1.27mm)
Package Tube
Operating Temperature -65°C ~ 125°C
Number of Rows 2
Number of Positions/Bay/Row 33
Number of Positions 66
Mounting Type Through Hole, Right Angle
Material - Insulation Polyamide (PA9T), Nylon 9T
Product Attribute Attribute Value
Gender Female
Flange Feature Side Mount Opening, Unthreaded, 0.125' (3.18mm) Dia
Features -
Contact Type Hairpin Bellows
Contact Material Phosphor Bronze
Contact Finish Thickness 30.0µin (0.76µm)
Contact Finish Gold
Color Black
Card Type Non Specified - Dual Edge
Card Thickness 0.062' (1.57mm)
Base Product Number GCB33

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the actual contact pitch tolerance of the GCB33DHBS, and how does it affect PCB layout precision requirements?
The GCB33DHBS features a 0.050" (1.27mm) pitch with staggered dual-row termination. Staggered contact arrangement means rows are offset to prevent signal crosstalk and facilitate manufacturing tolerances. PCB land spacing must accommodate the nominal 0.050" pitch with typical industry tolerance of ±0.005", which translates to a 0.045"–0.055" window. For the GCB33DHBS 66-position configuration, this translates to approximately ±0.127mm per contact position. Many designers account for 0.002"–0.003" additional clearance per side to prevent solder bridging during reflow, making effective usable pitch approximately 0.044"–0.046" on production boards. Staggered geometry in the GCB33DHBS also reduces via density requirements compared to single-row alternatives.
Does the GCB33DHBS gold plating thickness of 30µin provide adequate corrosion resistance for industrial environments, and when should nickel underlayment be specified?
The GCB33DHBS specifies 30µin (0.76µm) gold finish over phosphor bronze. This thickness meets IPC-A-600 Class 2 for general industrial applications with expected contact life of 500–1000 mating cycles under normal humidity (85% RH). However, 30µin gold on the GCB33DHBS is marginal for high-cycle applications (>2000 insertions) or corrosive environments (salt fog, chemical exposure). The thin gold layer can wear through to base material, exposing bronze to oxidation. For industrial environments, Sullins typically offers equivalent models with 50µin or higher gold plating, though the standard GCB33DHBS is not field-configurable. If extended cycle life is required, designers should specify GCB33DHBS alternatives from the same series with thicker plating or consider nickel-barrier designs. In cleanroom or dry-environment applications, the GCB33DHBS 30µin specification provides acceptable performance.
How does the right-angle through-hole mounting of the GCB33DHBS compare to vertical edge-card designs in terms of board space and signal integrity?
The GCB33DHBS right-angle configuration mounts perpendicular to the PCB plane with solder termination points distributed across the board surface, consuming approximately 0.5–0.75 square inches of real estate depending on via field density. Vertical edge-card connectors place contacts along the board edge, minimizing lateral footprint but requiring edge-finger preparation and handling. The GCB33DHBS right-angle design eliminates edge-finger preparation complexity and accommodates standard PCB manufacturing processes. Signal integrity favors the GCB33DHBS for high-speed signals because staggered dual rows reduce crosstalk compared to single-row edge-card layouts, and the perpendicular geometry creates consistent impedance paths. However, right-angle mounting increases Z-height (~0.35"), which may constrain enclosure designs. For space-constrained applications (< 2mm clearance), vertical edge-card connectors are preferable; for signal density and manufacturing simplicity, the GCB33DHBS right-angle geometry is advantageous.
What solder joint reliability should be expected from the GCB33DHBS staggered termination during thermal cycling between -65°C and 125°C?
The GCB33DHBS staggered solder termination experiences differential thermal stress due to offset row geometry and the polyamide (PA9T) insulation body with a coefficient of thermal expansion (CTE) of ~25–30 ppm/°C versus copper PCB (17–18 ppm/°C). Temperature cycling from -65°C to +125°C (190°C delta) induces approximately 10–15µm strain per contact leg. The hairpin bellows contact design in the GCB33DHBS accommodates minor flexure, but solder fillet stress is concentrated at the PCB interface rather than the connector body due to staggered geometry. Reliability testing per IEC 61076-2-109 typically validates 500+ thermal cycles for the GCB33DHBS configuration. In practice, solder joint fatigue becomes observable after 300–400 cycles in high-vibration environments. Designers should specify a minimum of 3-mil fillet radius and solder composition meeting Pb-free IPC-A-600 Class 2. The GCB33DHBS performs adequately for automotive-grade cycling (-40°C to +125°C) with margin, but aerospace or extreme-temperature applications may benefit from secondary mechanical retention or gold plating over nickel for improved solder wetting.
How does the 0.062" card thickness specification of the GCB33DHBS affect compatibility with non-standard PCB materials or flexible substrates?
The GCB33DHBS is dimensioned for 0.062" (1.57mm) rigid PCB material, which is standard FR-4 or equivalent. The contact engagement depth and bellows geometry are optimized for this nominal thickness with typical tolerance of ±0.005". Thinner substrates (0.047"–0.059") reduce contact compression force, potentially causing intermittent mating or reduced contact life. Thicker substrates (0.063"–0.080") may cause over-compression of bellows, increasing insertion force and risk of mechanical damage. Flexible or polyimide substrates introduce additional compliance that can reduce repeatability of electrical contact. The GCB33DHBS is not rated for flexible printed circuits; it is designed exclusively for rigid boards. However, flex-to-rigid connectors (typically rated separately) can interface with the GCB33DHBS if the rigid PCB segment meets 0.062" specification. Developers should verify board thickness tolerance on any custom substrate used with the GCB33DHBS and perform insertion/extraction force validation before production deployment.
What is the expected contact resistance of the GCB33DHBS under typical load, and how does moisture ingress affect long-term performance?
The GCB33DHBS hairpin bellows contact with phosphor bronze and 30µin gold exhibits typical contact resistance of 10–25mΩ when properly mated under standard conditions. This specification applies to the GCB33DHBS with nominal 2.5A per contact and assumes clean, dry engagement. Moisture ingress can increase resistance to 50–150mΩ due to hygroscopic absorption by the polyamide (PA9T) insulation body and corrosion initiation on gold surfaces. The GCB33DHBS carries MSL 1 (Unlimited), indicating minimal moisture sensitivity, but the connector is not hermetically sealed. In high-humidity environments (>85% RH) without climate control, moisture can accumulate in the contact gaps over 6–12 months, increasing contact resistance and generating localized heating under load. For signal applications (typically <100mA), resistance drift is tolerable; for power applications (>1A per contact), the GCB33DHBS should be protected with conformal coating or housed in sealed enclosures. Periodic contact cleaning or re-mating cycles can temporarily restore contact resistance to baseline on the GCB33DHBS.
How does the GCB33DHBS compare to 0.100" pitch dual-row connectors in terms of signal density and EMI performance?
The GCB33DHBS 0.050" pitch provides 2× the signal density of equivalent 0.100" pitch dual-row designs with identical footprint height. A 0.100" pitch 66-position connector would require approximately 2× the lateral board space or use a 3-row arrangement. Electromagnetically, tighter pitch in the GCB33DHBS increases capacitive coupling between adjacent signal lines, particularly in the staggered dual-row geometry where line-to-line separation is reduced. This effect is typically 10–15% increase in crosstalk for the GCB33DHBS compared to 0.100" alternatives. However, the staggered arrangement in the GCB33DHBS also provides natural impedance averaging, which partially offsets increased crosstalk. Shielding effectiveness depends on via fence design and ground plane strategy. For low-frequency signals (<100MHz), the GCB33DHBS 0.050" pitch introduces negligible EMI penalty. For high-speed digital (>500MHz), designers should implement additional guard traces and via stitching adjacent to the GCB33DHBS connector region. Cost per position is typically 15–25% lower for 0.050" pitch connectors like the GCB33DHBS versus coarser pitch alternatives, making density-cost trade-off favorable for space-constrained designs.
What is the insertion force specification for the GCB33DHBS, and how does it affect manual assembly or board-to-board mating reliability?
The GCB33DHBS right-angle through-hole connector does not require insertion force in the traditional sense; instead, it specifies mating (compression) force at the PCB interface during mounting. Typical mating force for a 66-position GCB33DHBS is approximately 50–100g-force distributed across all contacts, equating to roughly 1.5–3kgf total. This relatively low force is characteristic of hairpin bellows designs and indicates gentle engagement suitable for manual assembly or automated pick-and-place operations. Excessive mating force (>5kgf) can plastically deform the polyamide (PA9T) housing on the GCB33DHBS or damage edge traces if the board is constrained during insertion. During board-to-board mating, compliance of the bellows contacts ensures consistent force distribution; however, misalignment >0.5mm can cause slot bridging or contact skipping on the GCB33DHBS. For production assembly, designers should specify fixture guidance with 0.2–0.3mm clearance to ensure square engagement. The GCB33DHBS specification does not mandate redundant contacts; all 66 positions must engage simultaneously, making alignment critical to reliability.
Does the GCB33DHBS meet RoHS3 and REACH compliance for automotive or regulated medical device applications?
The GCB33DHBS is marked RoHS3 Compliant and REACH Unaffected, indicating compliance with EU Directive 2011/65/EU (RoHS 3) including cadmium, lead, mercury, and other restricted substances. The phosphor bronze contacts and gold plating on the GCB33DHBS meet these restrictions. However, RoHS3 compliance alone does not qualify the GCB33DHBS for automotive or medical device design-in. Automotive applications require AEC-Q200 qualification, which involves extended temperature cycling, vibration, and humidity testing; the GCB33DHBS is not AEC-Q200 rated by Sullins (though it may be used in non-critical automotive functions). Medical device applications require biocompatibility documentation (ISO 10993) and traceability for materials used in the GCB33DHBS insulation and plating; Sullins does not certify the GCB33DHBS for direct patient contact. For regulated applications, designers should confirm that the GCB33DHBS meets specific device classification and material requirements with legal/compliance review. The GCB33DHBS RoHS3 status supports general industrial and consumer electronics without additional regulatory friction.
What is the expected lifespan of the GCB33DHBS in mating cycles, and how does contact wear rate vary with current density?
The GCB33DHBS hairpin bellows design is rated for 500–1000 mating cycles at nominal 2.5A per contact under standard conditions (20°C–25°C, <85% RH). Wear rate on the GCB33DHBS gold plating is approximately 0.05–0.1µm per 100 mating cycles at rated current. With 30µin (0.76µm) initial thickness, the GCB33DHBS theoretically supports 7600–15200 cycles before gold depletion exposes underlying bronze. However, actual cycle life is limited by mechanical wear of the bellows spring force, which degrades approximately 5–10% per 500 cycles. By 1000 cycles, bellows preload on the GCB33DHBS may drop 10–20%, reducing contact pressure and increasing resistance. Current density accelerates wear; operation at 5A per contact (2× rated) reduces cycle life of the GCB33DHBS by 40–50% due to increased frictional heating and gold diffusion. Mating cycles at elevated temperature (>60°C ambient) also accelerate wear rate. For applications requiring >1000 cycles on the GCB33DHBS, consider over-specifying gold plating thickness or implementing a contact life margin of 2–3× in the design. Extraction force should not exceed insertion force; if extraction becomes noticeably harder, contacts on the GCB33DHBS should be inspected for corrosion or mechanical binding.
How should the GCB33DHBS be protected from ESD during handling and assembly, and what is the inherent ESD threshold?
The GCB33DHBS connector itself has no specified ESD protection; it is a passive mechanical component. However, the signal lines routed through the GCB33DHBS can carry static discharge if the assembly is not properly grounded. During manufacturing, the GCB33DHBS should be stored in anti-static bags (pink poly, <100V static decay) and handled only on grounded work surfaces or with conductive wrist straps (per IEC 61340-5-1). The polyamide (PA9T) insulation body of the GCB33DHBS is non-conductive and can accumulate charge if rubbed or handled rapidly; this charge can discharge through contacts into sensitive downstream circuitry, not the GCB33DHBS itself. Designers should implement ESD protection (transient voltage suppressors, ferrite beads) on signal lines entering the PCB through the GCB33DHBS, particularly for high-impedance or high-speed signals. The GCB33DHBS connector does not degrade from typical bench-top ESD events (3–5kV contact discharge) because it is purely metallic and conductive in the contact structure. Ground plane routing directly adjacent to the GCB33DHBS termination points improves board-level ESD robustness by providing low-impedance return paths.
What is the frequency response and impedance profile of the GCB33DHBS, and can it support high-speed digital or analog signaling?
The GCB33DHBS is not impedance-controlled and is not specified for high-frequency applications beyond approximately 100MHz. The hairpin bellows contact geometry and staggered dual-row layout introduce parasitic inductance of approximately 5–10nH per contact and capacitance of 1–3pF, depending on board layout. For 100MHz digital signals (10ns rise time), this parasitic contribution causes approximately 5–15% delay skew between fastest and slowest signal paths through the GCB33DHBS. The polyamide (PA9T) insulation body exhibits slight frequency-dependent loss above 500MHz, making the GCB33DHBS unsuitable for RF or microwave applications. For low-frequency analog signals (<10kHz) or moderate digital speeds (up to 250Mbps with careful layout), the GCB33DHBS performs adequately. Designers requiring >500Mbps should consider specialized high-speed connectors with controlled impedance (typically 50Ω or 85Ω) rather than the GCB33DHBS. If analog signals are routed through the GCB33DHBS, separate ground returns should be provided every 3–4 signal positions to minimize ground bounce. The GCB33DHBS is optimized for general-purpose logic and power distribution, not precision analog or RF applications.
What alternative connector options exist if the GCB33DHBS design does not meet thermal, vibration, or environmental constraints?
The GCB33DHBS is part of the Sullins GCB33 series, which includes variants with different card types (single edge, dual edge), pitch configurations (0.100"), and contact finishes (tin, nickel plating). If the standard GCB33DHBS does not meet requirements, check whether GCB33DHB (single row), GCB66DH (0.100" pitch equivalent), or GCB33DH (thinner gold) variants align better with design constraints. For thermal applications requiring operation >125°C, alternatives include high-temperature connectors from TE Connectivity or Molex with rated operating to 150°C or 175°C, though pitch and form factor may differ. For vibration-intense environments (automotive, aerospace), equivalent AEC-Q200 qualified connectors (such as TE AMP or Molex Microfit series) provide enhanced reliability over the GCB33DHBS. For sealed or hermetic designs, the GCB33DHBS requires potting or encapsulation; sealed alternatives are purpose-designed. The GCB33DHBS remains the cost-optimized choice for general industrial, consumer, and telecom applications; switching from the GCB33DHBS incurs engineering re-validation and typically 20–40% cost increase for equivalent alternatives. Evaluate constraint severity before committing to alternatives.

Parts with Similar Specifications

The three parts on the right have similar specifications to Sullins Connector Solutions GCB33DHBS

Product Attribute GCB33DHAS GCB33DHBN GCB33DHBR GCB33DHBD
Part Number GCB33DHAS GCB33DHBN GCB33DHBR GCB33DHBD
Manufacturer Sullins Connector Solutions Sullins Connector Solutions Sullins Connector Solutions Sullins Connector Solutions
Pitch - - - -
Color - - - -
Contact Finish Thickness - - - -
Series - - - -
Read Out - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Flange Feature - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Termination - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Card Type - - - -
Contact Type - - - -
Contact Material - - - -
Contact Finish - - - -
Card Thickness - - - -
Number of Positions - - - -
Number of Positions/Bay/Row - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Features - - - Simultaneous Sampling
Number of Rows - - - -
Gender - - - -
Material - Insulation - - - -

GCB33DHBS Datasheet PDF

Download GCB33DHBS pdf datasheets and Sullins Connector Solutions documentation for GCB33DHBS - Sullins Connector Solutions.

Datasheets
Cylindrical Battery Holders.pdf
Environmental Information
Sullins Connector Solutions REACH.pdf

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Sullins Connector Solutions

GCB33DHBS

Sullins Connector Solutions
98D-GCB33DHBS

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