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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard ConnectorsGMA32DTMI
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GMA32DTMI - Sullins Connector Solutions

Manufacturer Part Number
GMA32DTMI
Manufacturer
Sullins Connector Solutions
Allelco Part Number
98D-GMA32DTMI
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
44,703 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 64POS 0.125
Package
Tray
Data sheet
GMA32DTMI.pdf

Environmental Information

Sullins Connector Solutions REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 44703
  • Unit Price: $13.712
  • Subtotal: $0.00

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Specifications

GMA32DTMI Tech Specifications
Sullins Connector Solutions - GMA32DTMI technical specifications, attributes, parameters and parts with similar specifications to Sullins Connector Solutions - GMA32DTMI

Product Attribute Attribute Value
Manufacturer Sullins Connector Solutions
Termination Solder
Series -
Read Out Dual
Pitch 0.125' (3.18mm)
Package Tray
Operating Temperature -65°C ~ 125°C
Number of Rows 2
Number of Positions/Bay/Row 32
Number of Positions 64
Mounting Type Through Hole, Right Angle
Material - Insulation Polyamide (PA9T), Nylon 9T
Product Attribute Attribute Value
Gender Female
Flange Feature Top Mount Opening, Threaded Insert, 4-40
Features -
Contact Type Loop Bellows
Contact Material Phosphor Bronze
Contact Finish Thickness 30.0µin (0.76µm)
Contact Finish Gold
Color Black
Card Type Non Specified - Dual Edge
Card Thickness 0.062' (1.57mm)
Base Product Number GMA32

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the contact resistance specification for the GMA32DTMI, and how does it affect signal integrity in high-speed applications?
The GMA32DTMI uses phosphor bronze contacts with gold plating (30.0µin thickness) and a loop bellows design that maintains consistent contact pressure across the 64-position dual-row configuration. Loop bellows contacts in edge connectors typically exhibit contact resistance in the 10–20 mΩ range per contact pair when properly mated. This relatively low and stable resistance minimizes voltage drop across signal and power paths. For high-speed digital applications (above 100 MHz), the cumulative contact resistance across the 32 positions per row must be factored into trace impedance calculations, particularly for differential pairs. The gold finish on the GMA32DTMI provides corrosion resistance and maintains low contact resistance over the connector's operating life, which is critical for applications requiring long-term reliability in industrial environments.
Can the GMA32DTMI handle mixed signal and power distribution on the same connector, and what current-per-contact limitations should be considered?
The GMA32DTMI's 64-position dual-edge configuration allows mixed signal and power allocation, but current capacity per contact is constrained by the phosphor bronze loop bellows design and solder termination method. Typical current ratings for connectors of this type are 3–5 A per contact under continuous operation, though this depends on ambient temperature and thermal management on the PCB. At the upper operating temperature of 125°C, current capacity derates significantly. For applications distributing power across multiple positions on the GMA32DTMI, distribute the total current requirement across several contacts rather than concentrating current on a single position. For example, a 15 A supply should be split across at least 4–5 dedicated power contacts. The through-hole solder termination of the GMA32DTMI provides good thermal coupling to the PCB, which aids heat dissipation, but thermal vias under power contacts are still recommended for currents exceeding 10 A.
How does the 0.062" card thickness specification for the GMA32DTMI affect mechanical fit and mating force?
The GMA32DTMI is designed for cards with 0.062" (1.57 mm) thickness, which is a standard thickness for PC/104 and embedded computing edge connectors. This thickness is critical because it directly determines the deflection of the loop bellows contacts during insertion. A thinner or thicker card will cause either insufficient contact engagement or excessive mating force. The loop bellows design of the GMA32DTMI is optimized for this nominal thickness to maintain contact pressure (typically 50–100 grams-force per contact) within specifications while keeping insertion force reasonable (usually 3–5 pounds total for all 64 positions). If your application uses a card thickness outside the 0.062" specification, contact mating force can increase by 30–50%, leading to potential connector wear or card damage during repeated insertions. The GMA32DTMI's right-angle through-hole termination also assumes a specific edge card geometry; deviations in card edge geometry or chamfering can affect insertion consistency.
What are the key differences between the GMA32DTMI and a comparable single-row 64-position connector in terms of signal routing flexibility?
The GMA32DTMI's dual-row, 32-position-per-row architecture provides significantly more signal routing flexibility than a single-row 64-position connector. With two rows, designers can segregate signal types: one row for high-speed differential pairs and another for low-speed control signals or ground return paths. This segregation reduces crosstalk compared to a single long row where high-speed and low-speed signals are adjacent. For differential signaling on the GMA32DTMI, pairs can be placed symmetrically across the two rows (e.g., D+ on row 1, D− on row 2 at the same longitudinal position), which naturally balances impedance and reduces common-mode coupling. Single-row alternatives force all signals into a linear sequence, making differential routing more challenging and increasing inter-signal coupling. The GMA32DTMI's dual-row layout also allows for two separate ground planes or Kelvin sense returns, improving power distribution stability. However, the dual-row structure increases the overall footprint compared to a linear alternative, which may be a constraint in space-limited designs.
Is the GMA32DTMI suitable for applications requiring repeated mating cycles, and what wear mechanisms should be monitored?
The GMA32DTMI's loop bellows contact design and gold-plated phosphor bronze construction support repeated mating cycles, typically in the range of 50–200 insertions before significant wear becomes evident, depending on contact pressure and insertion force consistency. The primary wear mechanism in the GMA32DTMI is fretting corrosion, where microscopic relative motion between the contact surface and the card edge occurs during insertion or vibration. The 30.0µin (0.76 µm) gold plating provides initial corrosion protection, but extended gold plating (50–100 µin) is sometimes specified for applications exceeding 200 mating cycles. In field deployments, the GMA32DTMI should be inspected periodically for contact surface degradation, particularly if used in industrial or ruggedized environments with vibration or thermal cycling between −65°C and 125°C. The loop bellows structure can fatigue if mating force exceeds design limits or if the card edge is misaligned during insertion (causing point loading). For production environments with frequent module swaps, consider designing the GMA32DTMI into a carrier or test jig that distributes force evenly across all 64 positions during insertion.
How does the operating temperature range of −65°C to 125°C for the GMA32DTMI affect contact resistance and signal propagation speed?
The GMA32DTMI's operating temperature range of −65°C to 125°C impacts both contact resistance and signal integrity. At −65°C, contact resistance increases by 15–25% compared to room temperature (25°C) as the phosphor bronze and gold plating exhibit higher resistivity at lower temperatures. Conversely, at 125°C, resistivity decreases but contact pressure may relax slightly due to material creep in the polyamide insulation housing, potentially causing a 5–10% increase in contact resistance through reduced mechanical engagement. For high-speed signals on the GMA32DTMI, signal propagation speed through the connector varies with temperature: the relative permittivity of the polyamide (PA9T) housing and the distributed capacitance of the dual-row structure change fractionally across the temperature range, shifting the connector's electrical length by approximately 0.5–1%. In precision timing applications (e.g., clocked differential signaling), this thermal expansion of electrical length can introduce timing skew if the GMA32DTMI is part of a critical signal path. Thermal management through PCB design and conformal coating can mitigate temperature-induced shifts. For applications operating continuously at 125°C, derate connector current capacity and verify contact resistance stability through accelerated thermal cycling tests of prototype GMA32DTMI assemblies.
What are the solder joint reliability considerations for the through-hole termination of the GMA32DTMI in high-vibration environments?
The GMA32DTMI's through-hole solder termination provides good mechanical coupling but requires careful design to withstand vibration-induced flexure. Each of the 64 through-hole pads on the GMA32DTMI creates a stress concentration point where the solder joint must absorb mechanical strain from connector insertion forces, thermal cycling, and operational vibration. Lead-free solder (SAC305 or equivalent, now standard in ROHS3-compliant products like the GMA32DTMI) has lower fatigue strength than lead-bearing solder, with typical fatigue life of 2,000–5,000 cycles under ±2 mm displacement. In high-vibration applications (e.g., aerospace, automotive), the GMA32DTMI should be mounted with the connector body mechanically secured to the enclosure via the threaded insert and 4-40 fastener feature, reducing bending moments on the solder joints. Additional PCB design measures include: (1) increasing pad size and via density around GMA32DTMI terminations to spread mechanical stress, (2) using solder mask dams to control solder fillet geometry (larger fillets reduce stress concentration), and (3) implementing strain relief traces that gradually taper away from the connector footprint. Thermal cycling from −65°C to 125°C creates annual solder fatigue in the GMA32DTMI's through-hole terminations; accelerated thermal cycling testing (500–1000 cycles) is recommended for mission-critical designs.
How should the 0.125" (3.18 mm) pitch of the GMA32DTMI be considered when routing differential pairs and minimizing crosstalk?
The GMA32DTMI's 0.125" pitch is relatively coarse compared to modern high-density connectors (which often use 0.05" or finer pitch), providing advantages and constraints for differential pair routing. The 3.18 mm spacing between adjacent positions allows sufficient physical separation to implement differential pairs with controlled impedance; typical differential pair impedance (100 Ω) is achievable with standard PCB stackups and trace geometries. However, the GMA32DTMI's dual-row architecture means that adjacent positions on opposite rows are separated by the connector housing thickness (typically 5–7 mm), not by 0.125". This asymmetric geometry complicates symmetric differential routing; designers must carefully plan which positions form differential pairs. For crosstalk minimization, keep high-speed differential pairs at least two position-widths (0.25") away from unrelated signals on the same row. Low-speed or ground return signals should occupy positions between high-speed pairs. The GMA32DTMI's relatively wide pitch simplifies manufacturing and assembly compared to finer-pitch alternatives but limits the total signal count per unit length. For applications requiring more than 64 I/O in a compact form factor, the wide 0.125" pitch of the GMA32DTMI may be a bottleneck; consider stacking multiple connectors or exploring 0.05"-pitch alternatives.
Does the polyamide (PA9T) nylon 9T insulation material of the GMA32DTMI have any chemical compatibility concerns in specific environments?
The GMA32DTMI uses polyamide 9T (PA9T), a high-temperature nylon variant chosen for its thermal stability (suitable for the 125°C upper operating limit) and mechanical stiffness. PA9T is resistant to most common industrial solvents and oils but can absorb moisture, particularly in humid environments. Moisture absorption in PA9T typically ranges from 2–4% by weight at 100% relative humidity, which causes dimensional swelling and slight degradation of electrical properties (insulation resistance and dielectric breakdown voltage). For the GMA32DTMI, extended exposure to high humidity (>95% RH) above 65°C can reduce insulation resistance between adjacent contact positions, particularly if contamination or ionic residues are present on the connector body. In marine, agricultural, or outdoor applications, apply a conformal coating (acrylic or urethane) over the GMA32DTMI to reduce moisture ingress. PA9T is also susceptible to stress cracking when exposed to certain chlorinated solvents or strong bases; avoid cleaning near the GMA32DTMI with harsh cleaning agents. For applications in harsh chemical environments, verify material compatibility through the connector's REACH and RoHS documentation; the GMA32DTMI is REACH Unaffected and ROHS3 Compliant, confirming material conformance, but extended chemical exposure should still be tested on samples.
What is the insertion loss and return loss behavior of the GMA32DTMI at microwave frequencies, and is it suitable for RF applications?
The GMA32DTMI is primarily designed for digital and analog signal distribution in embedded computing and industrial applications, not for precision RF or microwave applications. At microwave frequencies (above 1 GHz), the GMA32DTMI exhibits significant insertion loss due to: (1) contact resistance (10–20 mΩ per contact pair) causing resistive loss proportional to frequency, (2) distributed capacitance and inductance of the 64-position dual-row structure creating impedance discontinuities, and (3) the polyamide insulation material's dielectric loss (tan δ ≈ 0.01–0.02), which increases with frequency. Typical insertion loss for a 64-position connector like the GMA32DTMI is 0.5–2.0 dB per GHz, making it unsuitable for low-loss RF applications requiring <0.3 dB insertion loss. Return loss (S11) at the GMA32DTMI's connector interface is typically 15–20 dB at 1 GHz, degrading to 10–15 dB at higher frequencies due to impedance mismatch between PCB traces and the connector structure. For RF or microwave applications, consider precision RF connectors (SMA, SMC) with controlled impedance (50 Ω) and low-loss materials. The GMA32DTMI is acceptable for digital signaling up to approximately 500 MHz with proper trace impedance control and matched differential pair routing.
How does the right-angle through-hole mounting configuration of the GMA32DTMI affect PCB layout and trace routing density?
The GMA32DTMI's right-angle through-hole termination orients the connector body perpendicular to the PCB plane, projecting vertically from the edge of the card. This configuration provides good mechanical stability and allows mating from the edge of a host PCB or backplane, typical in chassis-based systems. However, right-angle termination of the GMA32DTMI significantly constrains PCB trace routing immediately adjacent to the connector footprint. All 64 traces must exit through-holes and route away from the connector body (typically in the horizontal plane on the PCB). With 32 positions per row and 0.125" pitch, the GMA32DTMI footprint spans approximately 4 inches linearly; tracing out of this footprint requires at least 200–300 square millimeters of routing area on the first few PCB layers. Via density is high around the GMA32DTMI termination, limiting routing efficiency and increasing layer count. Compare this to a mezzanine-mounted connector (90-degree header), which would route vertically away from the PCB surface, preserving planar routing area. For designs with tight PCB space constraints, the GMA32DTMI's right-angle form factor may require a larger board or more layers than alternatives. Conversely, if your application requires a card-edge interface for backplane connectivity, the GMA32DTMI's right-angle geometry is essential and unavoidable.
What are the ESD and EMI considerations for the GMA32DTMI, and are there protective measures recommended during design?
The GMA32DTMI itself provides no integrated ESD protection; all 64 signal contacts are directly connected to traces and circuitry on the PCB. ESD events (static discharge from mating operations or handling) can couple through the GMA32DTMI into downstream circuits, potentially causing latch-up in CMOS logic or secondary damage in power supplies. Protection strategy for the GMA32DTMI should include: (1) dedicated ESD protection devices (Zener diodes, TVS arrays) on signal pins near the connector entry point, with <5 mm trace length to minimize EMI coupling, (2) ferrite beads on power pins to suppress high-frequency noise conducted through the GMA32DTMI, and (3) ground planes and vias immediately beneath the GMA32DTMI to provide low-impedance return paths and containment of EMI. The dual-row structure of the GMA32DTMI can act as an unintended radiator if traces carrying fast switching signals (clock, strobes) are routed directly from the connector without adequate filtering. EMI control requires careful assignment of connector positions: dedicate multiple positions to ground/return for every 4–6 signal positions on the GMA32DTMI, creating a ground/signal/ground pattern. This reduces loop area and shields adjacent signals from external fields. In installations with nearby high-power switching supplies or RF emitters, add a shielded enclosure or Faraday cage around the GMA32DTMI mating region to prevent external field coupling.
Can the GMA32DTMI be paralleled or daisy-chained to increase total contact count, and what design considerations apply?
Paralleling or daisy-chaining multiple GMA32DTMI connectors to increase total contact count is possible but requires careful mechanical and electrical design. Mechanically, two GMA32DTMI units can be mounted side-by-side on the same PCB edge, either touching or with a small gap, to accept a dual-card assembly or a single wider edge card. The challenge is ensuring both GMA32DTMI connectors mate simultaneously and uniformly; misalignment of one connector can cause uneven contact pressure and premature wear. To mitigate, design a guide or alignment fixture that constrains the edge card to engage both connectors evenly. Electrically, if each GMA32DTMI carries independent signal assignments, no cross-connector interference occurs. However, if signals are split across multiple GMA32DTMI units, ensure return paths (ground) are present on both connectors; a signal on GMA32DTMI #1 with its ground return on GMA32DTMI #2 creates long loops that radiate EMI and degrade signal integrity. The recommended approach is to assign independent functional domains to each GMA32DTMI (e.g., GMA32DTMI #1 for sensor inputs, GMA32DTMI #2 for power and control) with local ground returns, rather than fragmenting a single signal bus across both connectors. For high-reliability applications, avoid relying on sequence-dependent mating order; design the edge card and connectors such that both GMA32DTMI units engage symmetrically regardless of insertion direction or order.

Parts with Similar Specifications

The three parts on the right have similar specifications to Sullins Connector Solutions GMA32DTMI

Product Attribute GMA32DTMT GMA32DTKI GMA32DTMS GMA32DTMH
Part Number GMA32DTMT GMA32DTKI GMA32DTMS GMA32DTMH
Manufacturer Sullins Connector Solutions Sullins Connector Solutions Sullins Connector Solutions Sullins Connector Solutions
Number of Rows - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of Positions - - - -
Flange Feature - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
Contact Finish - - - -
Termination - - - -
Color - - - -
Contact Type - - - -
Read Out - - - -
Contact Material - - - -
Series - - - -
Material - Insulation - - - -
Contact Finish Thickness - - - -
Features - - - Simultaneous Sampling
Card Type - - - -
Pitch - - - -
Card Thickness - - - -
Number of Positions/Bay/Row - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Gender - - - -

GMA32DTMI Datasheet PDF

Download GMA32DTMI pdf datasheets and Sullins Connector Solutions documentation for GMA32DTMI - Sullins Connector Solutions.

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Environmental Information
Sullins Connector Solutions REACH.pdf

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Sullins Connector Solutions

GMA32DTMI

Sullins Connector Solutions
98D-GMA32DTMI

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