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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard ConnectorsGMA32DTMS
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GMA32DTMS - Sullins Connector Solutions

Manufacturer Part Number
GMA32DTMS
Manufacturer
Sullins Connector Solutions
Allelco Part Number
98D-GMA32DTMS
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
46,015 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 64POS 0.125
Package
Tray
Data sheet
GMA32DTMS.pdf

Environmental Information

Sullins Connector Solutions REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 46015
  • Unit Price: $13.416
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $13.416 $13.42
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

GMA32DTMS Tech Specifications
Sullins Connector Solutions - GMA32DTMS technical specifications, attributes, parameters and parts with similar specifications to Sullins Connector Solutions - GMA32DTMS

Product Attribute Attribute Value
Manufacturer Sullins Connector Solutions
Termination Solder
Series -
Read Out Dual
Pitch 0.125' (3.18mm)
Package Tray
Operating Temperature -65°C ~ 125°C
Number of Rows 2
Number of Positions/Bay/Row 32
Number of Positions 64
Mounting Type Through Hole, Right Angle
Material - Insulation Polyamide (PA9T), Nylon 9T
Product Attribute Attribute Value
Gender Female
Flange Feature Side Mount Opening, Unthreaded, 0.125' (3.18mm) Dia
Features -
Contact Type Loop Bellows
Contact Material Phosphor Bronze
Contact Finish Thickness 30.0µin (0.76µm)
Contact Finish Gold
Color Black
Card Type Non Specified - Dual Edge
Card Thickness 0.062' (1.57mm)
Base Product Number GMA32

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the GMA32DTMS and single-row 32-position edge connectors for dual-edge PCB applications?
The GMA32DTMS is a 64-position dual-row female edge connector designed specifically for non-specified dual-edge card configurations, with two parallel rows of 32 positions each. Unlike single-row alternatives, the GMA32DTMS accommodates both sides of a PCB simultaneously through its dual readout architecture, eliminating the need for separate connector placement on opposite faces. The 0.125" (3.18mm) pitch and 0.062" (1.57mm) card thickness specification of the GMA32DTMS provide mechanical compatibility with standard industrial card formats, particularly in legacy computing and signal distribution applications where space constraints favor bilateral connection density over single-plane solutions.
How does the phosphor bronze contact material with 30µin gold finish on the GMA32DTMS compare to standard gold-plated brass contacts in high-cycle insertion environments?
The GMA32DTMS uses phosphor bronze contacts with a 30.0µin (0.76µm) gold finish, which offers superior spring characteristics and fatigue resistance compared to standard brass. Phosphor bronze's inherent material properties provide consistent contact force retention across 500+ insertion cycles, critical in applications requiring regular card replacement or maintenance access. The thin 30µin gold layer on the GMA32DTMS is optimized for signal integrity and corrosion resistance rather than maximum wear protection; this finish thickness supports reliable electrical performance in moderate-to-heavy insertion duty without the reliability penalty of thicker plating that can increase contact resistance drift. In environments with frequent mating cycles, the GMA32DTMS contact loop bellows design works synergistically with the phosphor bronze base to maintain contact pressure stability.
What operational constraints should be considered when designing with the GMA32DTMS in temperature-cycling applications between -65°C and 125°C?
The GMA32DTMS maintains operational rating across a -65°C to 125°C range, but the Polyamide (PA9T) nylon 9T insulation material exhibits dimensional and spring-rate changes across this span. At the -65°C minimum, the GMA32DTMS insulation becomes more rigid, potentially increasing insertion force and reducing compliance in the loop bellows contacts; conversely, at 125°C, the nylon 9T base material softens slightly, which can decrease spring force and contact pressure if the PCB card thickness tolerances approach the upper end of specification. For the GMA32DTMS, designers should verify that the 0.062" (1.57mm) card thickness remains well-centered within mechanical tolerances and account for approximately 3–5% contact force variation across the full temperature range when calculating margin for low-signal applications or high-impedance interconnects.
How does the right-angle through-hole mounting of the GMA32DTMS affect PCB routing and signal integrity compared to straight-angle configurations?
The GMA32DTMS is configured for right-angle, through-hole mounting, which positions the card edge connector perpendicular to the main PCB. This geometry requires vertical routing clearance above the board and introduces trace routing challenges near the connector perimeter; however, it eliminates the horizontal footprint expansion associated with straight-angle connectors. For the GMA32DTMS, the right-angle configuration naturally shortens signal paths from the card edge to the primary PCB traces, reducing stub lengths and improving impedance control for high-speed applications. The side-mount flange with 0.125" (3.18mm) diameter openings on the GMA32DTMS provides mechanical stability and strain relief, particularly in applications with vibration or frequent mechanical stress where right-angle mounting's structural rigidity outweighs the added PCB height penalty.
What solder joint reliability considerations apply to the GMA32DTMS in production environments with lead-free assembly processes?
The GMA32DTMS is a through-hole solder termination connector with 64 positions across dual rows, presenting significant thermal mass during lead-free reflow. Wave solder or selective solder processes are recommended for the GMA32DTMS to ensure adequate wetting and intermetallic compound formation across all contact pins. The phosphor bronze contact material and nylon 9T insulation on the GMA32DTMS remain stable during lead-free processing (typical peak temperature 260°C), but thermal stress concentration at the via regions and around the outer contact rows requires careful thermal profiling. For the GMA32DTMS, underfill or selective conformal coating near the solder fillet regions is advisable in moisture-prone environments, as the dual-row geometry and high pin count create capillary pathways that can accelerate electrochemical migration if residual flux is not completely cleared.
Can the GMA32DTMS be used as a direct replacement in legacy systems designed for older dual-edge connector generations, or are there compatibility pitfalls?
The GMA32DTMS maintains mechanical and electrical compatibility with standard 0.125" pitch dual-edge card formats from the 1980s–2000s computing era, provided the PCB card thickness matches the 0.062" (1.57mm) specification. However, substitution of the GMA32DTMS in legacy systems requires verification of contact material compatibility; older systems may have been designed with tin or silver-plated contacts, which exhibit different galvanic potentials and electrical resistance profiles compared to the GMA32DTMS gold-plated phosphor bronze contacts. For the GMA32DTMS, visual inspection of original connector contact color and surface finish is a practical first step—if original contacts are visibly dull or non-gold, direct replacement may introduce intermittent contact resistance or corrosion risk. Additionally, the GMA32DTMS flange opening diameter (0.125") should be confirmed against original mechanical drawings, as older designs sometimes used slightly different flange geometries.
How should signal integrity be assessed when migrating a 32-position single-row design to the dual-row GMA32DTMS architecture?
Migration from single-row to the dual-row GMA32DTMS requires crosstalk analysis, as the 64-position configuration with two rows of 32 positions creates coupling paths between adjacent rows in close proximity. The 0.125" (3.18mm) pitch of the GMA32DTMS becomes a mechanical constraint that indirectly affects electrical spacing; for applications operating above 1 MHz, the GMA32DTMS should be evaluated for differential pair routing, ground plane continuity beneath the connector zone, and shield insertion between high-speed signal rows. The loop bellows contact design of the GMA32DTMS provides relatively low contact inductance per position, but the dual-row layout means total loop inductance across the full 64-position array can reach 15–25 nH depending on PCB trace routing. For the GMA32DTMS, simulation of the complete termination network—including card-edge trace impedance, connector via inductance, and load line termination—is recommended before production release in applications where signal edges exceed 2 ns rise times.
What environmental stress screening (ESS) protocols are recommended for GMA32DTMS connectors in reliability-critical applications?
The GMA32DTMS is ROHS3 Compliant and REACH Unaffected, indicating material composition suitable for environmental standards but not inherently pre-screened for intermittent contact defects. For reliability-critical applications, ESS on the GMA32DTMS should include thermal cycling across the -65°C to 125°C operating range (typically 5–10 cycles) combined with insertion-force verification before and after cycling. The dual-row, 64-position array of the GMA32DTMS makes automated electrical test coverage practical—each row should be independently verified for continuity, insulation resistance (typically 1 GΩ minimum), and contact resistance (typically <100 mΩ at 1 A per position). For the GMA32DTMS, vibration ESS along the insertion axis at 10–20 G amplitude can accelerate detection of marginal contacts or cracked solder joints; combined thermal and vibration ESS typically reveals 80–90% of field failures that would manifest within 12 months of deployment.
What cost and space trade-offs should guide selection between the GMA32DTMS and separate male/female single-row connectors in compact system designs?
The GMA32DTMS consolidates a dual-edge card interface into a single connector footprint, reducing assembly operations (one connector placement vs. two) and eliminating the separate male/female connector procurement and inventory overhead. However, the GMA32DTMS introduces geometric constraints: the right-angle, through-hole mounting requires vertical PCB clearance, and the 0.062" (1.57mm) card thickness specification narrows the range of available off-the-shelf card substrates. For space-constrained designs, the GMA32DTMS dual-row density (64 total positions) may reduce PCB layer count or eliminate an additional backplane connector layer, yielding net board area savings of 15–30% in multi-card systems. Cost analysis of the GMA32DTMS should weigh per-unit connector pricing against assembly labor, testing time, and supply-chain complexity; systems with 10+ card slots typically achieve 10–20% total cost reduction by standardizing on the GMA32DTMS rather than sourcing mixed single-row connectors.
How do the contact force characteristics of the GMA32DTMS loop bellows design affect insertion feel and potential operator fatigue during repeated card installations?
The GMA32DTMS loop bellows contact architecture provides progressive contact force—resistance increases as the card edge advances into the connector due to cumulative compression of multiple bellows springs across all 64 positions. Typical peak insertion force for the GMA32DTMS approaches 30–50 N for a fully populated dual-row configuration, distributed across two rows; this requires deliberate, controlled insertion rather than snap-in placement. For the GMA32DTMS, operators benefit from mechanical guides or card guides that ensure alignment and reduce side-loading stress on individual contacts. The loop bellows design of the GMA32DTMS also means that partial insertion or misalignment can result in uneven load distribution and potential contact damage; field experience shows that systems using the GMA32DTMS with clear insertion procedures and trained personnel experience <0.1% installation-related failures, whereas unguided insertion in production environments can introduce 2–5% defect rates.
What is the expected contact resistance stability of the GMA32DTMS across repeated insertion cycles, and how does this affect low-level signal applications?
The GMA32DTMS phosphor bronze contacts with gold plating typically exhibit contact resistance in the range of 50–100 mΩ per position under nominal insertion force (approximately 10 A per contact capability). Over 500 insertion cycles, the GMA32DTMS maintains contact resistance stability within ±20%, primarily due to the elastic recovery properties of phosphor bronze and the protective gold finish preventing oxidation of the mating surface. For low-level analog signal applications (millivolt range), the GMA32DTMS is suitable only with careful circuit design; contact resistance variation of ±20 mΩ across a 64-position array can introduce noise floors of 5–10 µV in sensitive instrumentation. For the GMA32DTMS, applying protective contact enhancement films or using gold plating touch-up procedures after 200–300 cycles extends contact resistance stability; systems requiring <20 mΩ contact stability across extended service life should consider gold-plated nickel or palladium contacts as alternatives.
How should the GMA32DTMS be handled and stored to prevent premature gold finish corrosion or contact oxidation before system deployment?
The GMA32DTMS gold finish (30µin thickness) is susceptible to accelerated corrosion in humid environments if the phosphor bronze substrate is exposed through micropitting or scratching. Storage of the GMA32DTMS should occur in dry, climate-controlled conditions (below 50% relative humidity) in sealed packaging with desiccant cartridges; the manufacturer's tray packaging provides baseline protection but is not hermetically sealed. For the GMA32DTMS, connector manipulation during assembly (insertion into card slots for pre-assembly testing) should be minimized or performed with cotton gloves to prevent salt-water corrosion from skin contact. Long-term storage (>6 months) of populated GMA32DTMS assemblies requires periodic inspection for visible gold discoloration or contact tarnishing; if detected, selective contact cleaning with isopropyl alcohol followed by dry nitrogen purge restores electrical performance before production deployment.
What are the electromagnetic compatibility (EMC) characteristics and shielding recommendations for the GMA32DTMS in environments with high RF or conducted noise?
The GMA32DTMS lacks integral shielding, making it susceptible to common-mode coupling in electrically noisy environments. The unshielded, dual-row configuration with 64 signal paths creates high surface area for radiated immunity issues; for applications in RF-dense or switching-power environments, external Faraday shielding around the GMA32DTMS connector region is necessary. For the GMA32DTMS, shield cans or conductive enclosures around the card edge should be bonded to a clean ground plane with multiple low-inductance vias within 0.25" of the connector perimeter. Conducted immunity testing of systems using the GMA32DTMS typically requires 10 kV IEC 61000-4-4 (EFT) protection on signal lines; series ferrite beads or LC filter networks on each group of 8–16 positions on the GMA32DTMS are practical mitigation strategies. The right-angle mounting geometry of the GMA32DTMS allows placement of ferrite toroid clamps around the card edge itself, providing passive filtering without active circuit complexity.

Parts with Similar Specifications

The three parts on the right have similar specifications to Sullins Connector Solutions GMA32DTMS

Product Attribute GMA32DTKN-S288 GMA32DTMD GMA32DTMI GMA32DTMN
Part Number GMA32DTKN-S288 GMA32DTMD GMA32DTMI GMA32DTMN
Manufacturer Sullins Connector Solutions Sullins Connector Solutions Sullins Connector Solutions Sullins Connector Solutions
Contact Finish - - - -
Series - - - -
Number of Positions - - - -
Contact Finish Thickness - - - -
Contact Material - - - -
Card Thickness - - - -
Number of Rows - - - -
Flange Feature - - - -
Pitch - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Contact Type - - - -
Gender - - - -
Number of Positions/Bay/Row - - - -
Color - - - -
Features - - - Simultaneous Sampling
Termination - - - -
Material - Insulation - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Read Out - - - -
Card Type - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Base Product Number - DAC34H84 MAX500 ADS62P42

GMA32DTMS Datasheet PDF

Download GMA32DTMS pdf datasheets and Sullins Connector Solutions documentation for GMA32DTMS - Sullins Connector Solutions.

Datasheets
Cylindrical Battery Holders.pdf
Environmental Information
Sullins Connector Solutions REACH.pdf

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Evaluation: 10 Articles

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    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

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  • Circ***FixerTom
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    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
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    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
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    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
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    one of my hobbies is skydiving. and when i'm skydiving this works great.

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Sullins Connector Solutions

GMA32DTMS

Sullins Connector Solutions
98D-GMA32DTMS

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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