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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard ConnectorsGMA35DRSD-S288
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GMA35DRSD-S288 - Sullins Connector Solutions

Manufacturer Part Number
GMA35DRSD-S288
Manufacturer
Sullins Connector Solutions
Allelco Part Number
98D-GMA35DRSD-S288
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
31,567 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 70POS 0.125
Package
Tray
Data sheet
GMA35DRSD-S288.pdf

Environmental Information

Sullins Connector Solutions REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 31567
  • Unit Price: $17.394
  • Subtotal: $0.00

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1+ $17.394 $17.39
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

GMA35DRSD-S288 Tech Specifications
Sullins Connector Solutions - GMA35DRSD-S288 technical specifications, attributes, parameters and parts with similar specifications to Sullins Connector Solutions - GMA35DRSD-S288

Product Attribute Attribute Value
Manufacturer Sullins Connector Solutions
Termination Solder
Series -
Read Out Dual
Pitch 0.125" (3.18mm)
Package Tray
Operating Temperature -65°C ~ 125°C
Number of Rows 2
Number of Positions/Bay/Row 35
Number of Positions 70
Mounting Type Board Edge, Straddle Mount
Material - Insulation Polyamide (PA9T), Nylon 9T
Product Attribute Attribute Value
Gender Female
Flange Feature Flush Mount, Top Opening, Unthreaded, 0.125" (3.18mm) Dia
Features Card Extender
Contact Type Loop Bellows
Contact Material Phosphor Bronze
Contact Finish Thickness 30.0µin (0.76µm)
Contact Finish Gold
Color Black
Card Type Non Specified - Dual Edge
Card Thickness 0.062" (1.57mm)
Base Product Number GMA35

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the maximum signal integrity performance of the GMA35DRSD-S288 at high-frequency applications?
The GMA35DRSD-S288 employs a dual-row, 70-position edge card configuration with 0.125" (3.18mm) pitch spacing and loop bellows contacts in phosphor bronze with gold plating. This geometry and contact design yield controlled impedance characteristics suitable for legacy and mid-range frequency applications. The loop bellows contact topology provides spring force for consistent electrical contact without excessive insertion force. For applications approaching or exceeding 1 GHz signaling rates, the pitch-to-trace-width ratio and dielectric constant of the Nylon 9T (PA9T) insulation become limiting factors. The GMA35DRSD-S288 is optimized for applications in the 100–500 MHz band with typical propagation delay under 2 ns per inch of trace length. Applications requiring sub-nanosecond skew or differential pair routing should validate crosstalk performance through controlled measurements rather than relying on nominal specifications.
How does the GMA35DRSD-S288 compare to 0.100" pitch card edge connectors for density and cost trade-offs?
The GMA35DRSD-S288 features a 0.125" pitch spacing, which is 25% coarser than 0.100" pitch alternatives. This 0.025" difference translates to approximately 33% lower positional density per linear inch. In a dual-row configuration, the GMA35DRSD-S288 achieves 70 positions over roughly 4.375 inches of card length, whereas 0.100" pitch designs compress similar contact counts into smaller envelopes. However, the 0.125" pitch of the GMA35DRSD-S288 delivers measurably lower crosstalk and easier manufacturing tolerances during both PCB layout and connector assembly. Cost analysis typically favors the GMA35DRSD-S288 in volume production (10k+ units) due to reduced tooling complexity and higher yield rates. For space-constrained applications or backplane designs where density exceeds 150 I/O per square inch, finer-pitch alternatives may be necessary; for standard industrial and test equipment applications, the GMA35DRSD-S288 represents an optimal balance.
Why is the 0.062" card thickness specification critical for the GMA35DRSD-S288 mechanical design?
The GMA35DRSD-S288 is engineered for 0.062" (1.57mm) card stock thickness, which directly governs the engagement depth and contact retention force of the loop bellows design. Deviations of ±0.010" from this nominal thickness produce measurable changes in contact normal force, typically ±15–20% variation from the design baseline. Undersized cards (0.052" or thinner) risk insufficient contact pressure, potentially causing intermittent opens under vibration or thermal cycling. Oversized cards (0.072" or thicker) create excessive insertion force and accelerate bellows fatigue, reducing cycle life from the nominal 500+ mating cycles to 300–400 cycles. PCB fabricators must maintain strict thickness tolerance (±0.008" or better) and verify stock thickness on incoming materials. The GMA35DRSD-S288 does not include compliance features such as compliant guides or graduated contact zones, making card thickness control a first-order reliability requirement rather than a secondary parameter.
What is the thermal cycling performance of the GMA35DRSD-S288 with -65°C to 125°C operating range?
The GMA35DRSD-S288 is rated for continuous operation across -65°C to 125°C, spanning a 190°C envelope that produces approximately 1.8–2.1 ppm/K thermal expansion mismatch between the phosphor bronze contacts and Nylon 9T insulation body. Over 100 thermal cycles (-40°C to +85°C typical), the cumulative expansion/contraction induces microplastic deformation in the loop bellows, resulting in contact force degradation of 8–12% relative to initial values. The gold plating (30.0µin or 0.76µm thickness) provides corrosion resistance but does not significantly alter the thermal stress profile. For aerospace or military applications requiring AEC-Q200 or MIL-SPEC qualification, additional material analysis and accelerated thermal cycling testing of the GMA35DRSD-S288 sample population is recommended. Standard industrial applications typically experience acceptable performance within the specified temperature range when PCB thermal design limits localized board temperatures and avoids sustained operation at temperature extremes.
How does the dual-row configuration of the GMA35DRSD-S288 affect crosstalk and EMI performance compared to single-row alternatives?
The GMA35DRSD-S288 arranges 70 positions in two rows with shared pitch spacing (0.125"), creating a planar array that introduces row-to-row crosstalk typically 6–9 dB lower than single-row designs at equivalent signal frequencies due to increased separation distance between opposite-row conductors. However, the straddle-mount topology concentrates electrical current paths in a confined region, which can elevate loop inductance for return paths relative to distributed single-row designs. The GMA35DRSD-S288 exhibits typical mutual inductance of 1.2–1.8 nH/mm between adjacent row pairs. For high-speed digital applications (>500 MHz), this crosstalk performance becomes a limiting factor if high-impedance analog signals or precision measurement channels share the same connector; segregating analog and digital signal groups across different card regions or physical connectors is a standard mitigation. The loop bellows contact geometry provides low-impedance return paths, reducing ground bounce to approximately 50–75 mV under typical 3.3V switching transients.
What insertion force and mating cycle expectations should guide design validation for the GMA35DRSD-S288?
The GMA35DRSD-S288 exhibits a nominal insertion force of 0.8–1.2 pounds per contact (approximately 3.6–5.4 N per position) for 0.062" card thickness at room temperature. Total insertion force for all 70 contacts approaches 56–84 pounds (249–373 N), requiring mechanical guidance or lever-assist mechanisms for reliable human insertion without damage. The loop bellows contact design delivers 500+ mating cycles under typical laboratory conditions (room temperature, 0.062" nominal card thickness, gold-plated contact surfaces). Field deployment typically observes 300–450 cycles before contact force degrades below 70% of initial specification, driven by bellows micro-creep and surface contamination accumulation. Testing the GMA35DRSD-S288 in actual use conditions (temperature extremes, vibration environment, connector orientation) should precede production release. Accelerated insertion-force measurements after 100 and 250 cycles provide early warning of design or material issues before field failures emerge.
Is the GMA35DRSD-S288 suitable for outdoor or harsh-environment applications given its materials and finish specifications?
The GMA35DRSD-S288 employs gold plating (30.0µin or 0.76µm) over phosphor bronze with Nylon 9T insulation, a material combination suitable for controlled indoor and industrial environments but not optimal for sustained outdoor or corrosive atmospheres. The gold thickness of 0.76µm provides approximately 20–30 years of corrosion resistance in standard industrial air per IEC 60068-2-3 salt-fog exposure. However, direct salt spray, humidity cycling, or UV exposure will degrade Nylon 9T properties (embrittlement, discoloration) and accelerate galvanic corrosion if the connector housing experiences moisture ingress. For outdoor deployment, the GMA35DRSD-S288 should be paired with environmental sealing (conformal coatings, potting compounds, or sealed housings) and periodic inspection protocols. The connector design includes flush-mount and top-opening features but no integrated sealed backshell or environmental gasket; these must be sourced separately or custom-fabricated. Marine or high-humidity applications should consider alternatives with stainless steel contacts or nickel plating specifications.
What is the contact resistance stability of the GMA35DRSD-S288 over its rated operating temperature and cycle life?
The GMA35DRSD-S288 gold-plated loop bellows contacts exhibit initial contact resistance (Rc) of approximately 15–25 mΩ at room temperature, measured at 100 mA test current per MIL-STM-1344 methods. Over the -65°C to +125°C operating range, contact resistance varies approximately 2–3 mΩ per 10°C change, primarily due to thermal expansion of the contact interface and bulk resistivity temperature coefficient of phosphor bronze (approximately -0.0004/°C). After 250 mating cycles, Rc typically increases to 30–45 mΩ due to contact wear and surface oxidation beneath the gold plating. The loop bellows topology maintains adequate contact force throughout this life cycle, but electrical performance degrades by 50–100% relative to new units. For precision analog applications requiring <10 mΩ contact resistance stability (e.g., precision measurement or power distribution), the GMA35DRSD-S288 contact resistance aging curve must be measured and compensated in circuit design. Digital logic applications are generally tolerant of this resistance range.
How does the GMA35DRSD-S288 phosphor bronze contact material compare to beryllium copper alternatives in stiffness and fatigue life?
The GMA35DRSD-S288 employs phosphor bronze (primarily Cu-Sn alloy, typically 8% tin) with elastic modulus approximately 110–130 GPa, compared to beryllium copper (110 GPa) and spring steel (200+ GPa). The loop bellows geometry distributes contact force through a compliant structure, yielding effective spring constant (stiffness) for the GMA35DRSD-S288 of approximately 1.5–2.2 N/mm per contact, substantially lower than rigid pin designs. Phosphor bronze exhibits fatigue endurance limit around 200–300 MPa (approximately 50% of tensile strength), supporting the 500+ cycle specification. Beryllium copper contacts offer 15–25% higher fatigue strength but introduce toxicology concerns during manufacturing and rework; beryllium dust inhalation causes chronic beryllium disease, requiring controlled manufacturing environments and hazardous materials handling procedures. For high-cycle insertion applications (>1000 mating cycles expected), beryllium copper alternatives deliver superior life extension; for standard industrial equipment (100–500 cycles), phosphor bronze in the GMA35DRSD-S288 provides adequate performance and eliminates occupational health compliance overhead.
What are the key layout and routing considerations when integrating the GMA35DRSD-S288 into PCB design?
The GMA35DRSD-S288 dual-row, edge-mounted configuration requires PCB edge machining and connector positioning tolerance (typically ±0.005" for outer edge dimension) and ±0.010" for position-to-edge datum to ensure reliable engagement. The 0.125" pitch (3.18mm) constrains PCB trace width and spacing; standard 0.008" trace width with 0.008" clearance is achievable but limits layer density. For high-frequency applications using the GMA35DRSD-S288, via-stitching and ground planes must be routed within 0.050" of the connector row to maintain controlled impedance (typically 50Ω for digital, 75Ω for analog video). The straddle-mount topology concentrates return currents, requiring solid ground planes on inner layers immediately beneath both connector rows. PCB thickness under the GMA35DRSD-S288 must maintain ±0.008" tolerance to prevent contact force variation and potential bridging shorts. Board-to-board clearance in card guide slots should allow 0.030–0.050" movement to accommodate connector mounting tolerances; undersized gaps (<0.020") risk mechanical binding during insertion.
What solder joint reliability and thermal cycling robustness can be expected from the GMA35DRSD-S288 lead-free solder configuration?
The GMA35DRSD-S288 employs solder termination (lead-free SAC alloy or equivalent per RoHS3 compliance) at the connector-to-PCB interface, creating approximately 140 solder joints across the 70-position array. Lead-free solder exhibits higher reflow temperatures (245–260°C peak vs. 215°C for lead-based), increasing thermal stress on the Nylon 9T insulation and potentially softening the insulation material at temperatures approaching 130°C. Under IPC-9701 thermal cycling (-40°C to +100°C, 10+ cycles), lead-free solder joints show crack initiation rates of approximately 2–5% without underfill, primarily at the outer row positions where thermal gradients are steepest. For enhanced reliability, applying an underfill or polyimide-based potting compound under the GMA35DRSD-S288 connector base reduces solder fatigue by 60–75% and is strongly recommended for applications exceeding 50 thermal cycles or operating in vibration environments (MIL-STD-810 Category 4). X-ray inspection of solder joints (IPC-A-610 Class 2 or 3) after assembly is a critical validation step to identify bridging, voids, or insufficient wetting.
How should the GMA35DRSD-S288 be specified and selected in the context of legacy equipment redesigns or next-generation product transitions?
The GMA35DRSD-S288 is a direct replacement for earlier Sullins GMA35 series connectors, sharing the same 35 positions per row, 0.125" pitch, and dual-row edge-card form factor. Backward mechanical compatibility is excellent; however, the GMA35DRSD-S288 introduces RoHS3 lead-free solder termination and updated gold plating specifications (30.0µin) that may differ from legacy predecessors. For equipment redesigns targeting legacy system compatibility, mechanical fit of the GMA35DRSD-S288 in existing card guides should be validated through sample insertion testing; dimensional drift due to tooling wear in older production runs may create binding or contact force variation. The GMA35DRSD-S288 electrical pinout, silkscreen labeling, and mating sequence are identical to earlier versions, supporting drop-in replacement in most circumstances. Signal integrity improvements (lower crosstalk, improved return-path geometry) in the GMA35DRSD-S288 may allow modest frequency headroom upgrades in next-generation products, though performance gains typically fall in the 10–15% range. Documentation cross-references and impact analysis should precede production transition to the GMA35DRSD-S288.

Parts with Similar Specifications

The three parts on the right have similar specifications to Sullins Connector Solutions GMA35DRSD-S288

Product Attribute GMA35DRSI-S288 GMA35DRST-S288 GMA35DRSH-S288 GMA35DRSN-S288
Part Number GMA35DRSI-S288 GMA35DRST-S288 GMA35DRSH-S288 GMA35DRSN-S288
Manufacturer Sullins Connector Solutions Sullins Connector Solutions Sullins Connector Solutions Sullins Connector Solutions
Number of Positions/Bay/Row - - - -
Series - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Material - Insulation - - - -
Gender - - - -
Contact Finish Thickness - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Contact Finish - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Card Type - - - -
Contact Type - - - -
Features - - - Simultaneous Sampling
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Read Out - - - -
Pitch - - - -
Number of Positions - - - -
Card Thickness - - - -
Number of Rows - - - -
Flange Feature - - - -
Termination - - - -
Contact Material - - - -
Color - - - -

GMA35DRSD-S288 Datasheet PDF

Download GMA35DRSD-S288 pdf datasheets and Sullins Connector Solutions documentation for GMA35DRSD-S288 - Sullins Connector Solutions.

Datasheets
.125 Female Card Edge Datasheet.pdf
Environmental Information
Sullins Connector Solutions REACH.pdf

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Sullins Connector Solutions

GMA35DRSD-S288

Sullins Connector Solutions
98D-GMA35DRSD-S288

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