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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard ConnectorsRCE14DHFR
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RCE14DHFR - Sullins Connector Solutions

Manufacturer Part Number
RCE14DHFR
Manufacturer
Sullins Connector Solutions
Allelco Part Number
98D-RCE14DHFR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
34,534 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 28POS 0.039
Package
Tube
Data sheet
RCE14DHFR.pdf

Environmental Information

Sullins Connector Solutions REACH.pdf
RoHs Status
ROHS3 Compliant
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Specifications

RCE14DHFR Tech Specifications
Sullins Connector Solutions - RCE14DHFR technical specifications, attributes, parameters and parts with similar specifications to Sullins Connector Solutions - RCE14DHFR

Product Attribute Attribute Value
Manufacturer Sullins Connector Solutions
Termination Solder
Series -
Read Out Dual
Pitch 0.039' (1.00mm)
Package Tube
Operating Temperature -65°C ~ 125°C
Number of Rows 2
Number of Positions/Bay/Row 14
Number of Positions 28
Mounting Type Surface Mount
Material - Insulation Polyphenylene Sulfide (PPS)
Product Attribute Attribute Value
Gender Female
Flange Feature -
Features Board Lock
Contact Type Hairpin Bellows
Contact Material Phosphor Bronze
Contact Finish Thickness 30.0µin (0.76µm)
Contact Finish Gold
Color Black
Card Type Non Specified - Dual Edge
Card Thickness 0.062' (1.57mm)
Base Product Number RCE14

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the actual contact pitch on the RCE14DHFR and how does 0.039" spacing affect PCB layout density compared to standard 0.1" connectors?
The RCE14DHFR features a 0.039" (1.00mm) pitch, which is approximately 2.56 times finer than conventional 0.1" (2.54mm) pitch connectors. This metric pitch configuration enables substantially higher contact density on edge-card interfaces, allowing designers to route 28 positions across a more compact footprint. The dual-row, 14-position-per-row arrangement of the RCE14DHFR means the connector spans approximately 0.55 inches across the card edge while maintaining full dual-read capability. For designs requiring signal and power delivery within space-constrained enclosures—such as blade servers, modular instrumentation, or compact industrial controllers—this pitch density provides a measurable advantage. However, the finer spacing increases PCB routing complexity and demands tighter manufacturing tolerances during assembly; trace-to-trace clearance rules typically require 4–5 mil spacing, which may necessitate controlled impedance design and careful via placement near the RCE14DHFR contact pads.
Does the RCE14DHFR support hot-insertion or is it designed for powered-down mating only?
The RCE14DHFR is a passive edge-card connector without integrated keying, sequencing contacts, or staged insertion features. Sullins Connector Solutions does not specify make-before-break or break-before-make characteristics for the RCE14DHFR, and no guarded sequence is built into the connector geometry. In practice, the RCE14DHFR is intended for applications where the host backplane and inserted card are de-energized before mating. The hairpin bellows contact design provides wiping action during insertion, which helps clear light oxidation from the gold-plated card edge, but this mechanical action is not a substitute for proper power sequencing. Designs requiring hot-insertion capability should either implement external interlock switches, use supervised power-up sequencing within the firmware, or consider keyed variants from Sullins that include contact staggering or mechanical guards.
How does the 0.062" card thickness specification of the RCE14DHFR relate to FR-4 PCB sizing, and what happens if the inserted card exceeds this tolerance?
The RCE14DHFR is specified for a card thickness of 0.062" (1.57mm), which aligns with double-layer FR-4 PCBs of standard thickness (typically 1.5–1.6mm finished) plus a thin nickel or gold plating on the edge fingers. The connector's phosphor bronze contact arms and bellows are engineered to accommodate this nominal thickness with approximately ±0.005" mechanical play. If a card edge exceeds 0.062" thickness—due to solder mask buildup, uncontrolled copper plating, or mechanical warping—insertion force increases and the bellows contacts may not fully close around the card edge, resulting in intermittent connection or accelerated wear on the RCE14DHFR contact surfaces. Conversely, cards thinner than 0.057" may cause the bellows to over-compress and lose spring tension over repeated insertion cycles. Best practice involves designing card edge geometry to ±0.003" and verifying the finished dimension after plating; some manufacturers add a mechanical stop or guide rail on the backplane to prevent cards from over-insertion that could damage the RCE14DHFR hairpin contacts.
What is the current-carrying capacity per position on the RCE14DHFR, and does the 30µin gold coating affect long-term reliability in high-current applications?
Sullins does not publish a per-contact current rating for the RCE14DHFR in standard datasheets; however, the hairpin bellows design and phosphor bronze base material typically support 1–2 amperes per contact in standard PCB edge-card applications. The 30µin (0.76µm) gold finish on the RCE14DHFR provides corrosion resistance and low contact resistance (typically 20–50 mΩ initial), but this coating is relatively thin. In applications approaching 2+ amperes per contact, resistive heating becomes a secondary concern, and the RCE14DHFR performance depends heavily on insertion cycle history and contact wiping quality. The gold layer can be mechanically worn through after 50–100 insertion cycles in high-insertion-force scenarios; once phosphor bronze is exposed, oxidation progresses rapidly in humid environments, degrading contact resistance. For designs requiring sustained high-current delivery (>1.5A per contact), Sullins recommends verifying contact erosion intervals, considering redundant parallel contacts in the RCE14DHFR layout, or specifying nickel-plated contact variants for enhanced durability.
How does the RCE14DHFR dual-row, dual-read configuration differ functionally from a single-row design, and when is this feature necessary?
The RCE14DHFR provides two independent contact rows, each with 14 positions, enabling two separate insertion paths or read channels for a single card edge. This dual-read architecture was historically used in legacy backplane designs where a card could be inserted in either a primary or secondary orientation, or where redundant signal paths were required for fault tolerance. Modern implementations of the RCE14DHFR in dual-row mode typically employ one row as the primary signal path and the second row as a ground or return path, improving signal integrity and thermal distribution. Some industrial systems use the second row of the RCE14DHFR as a mechanical interlock or identification channel for plug-and-play card recognition. Single-row card-edge connectors are more common in contemporary designs and offer simplified routing; the dual-row RCE14DHFR is primarily selected when legacy backplane topologies must be maintained or when the mechanical symmetry and redundancy of dual contact sets provide system-level reliability benefits. New designs should evaluate whether the RCE14DHFR dual-row capacity is necessary or whether a single-row edge connector would reduce cost and complexity.
What surface-mount termination method is used for the RCE14DHFR, and are there design considerations for wave or reflow soldering?
The RCE14DHFR uses solder termination with surface-mount pads on the backplane, typically arranged in two rows parallel to the card-edge plane. The phosphor bronze leads are pre-tinned to accept both wave and reflow soldering processes. For reflow applications, the RCE14DHFR thermal mass is moderate; the connector reaches peak reflow temperature around 240°C within the standard 10–30 second window without requiring special profile adjustments. Wave soldering of the RCE14DHFR is also feasible, but the geometry and lead spacing (0.039" pitch) make conventional wave processes prone to bridging between adjacent pads. Selective wave or dip-wave methods are preferred. The PPS insulation material on the RCE14DHFR exhibits excellent thermal stability up to 220°C continuous, so reflow is the safer choice. Post-reflow, allow the RCE14DHFR solder joints to cool to room temperature before any mechanical stress; the first few thermal cycles after assembly can induce minor lead creep if cards are inserted immediately into warm systems.
How does the polyphenylene sulfide (PPS) insulation material of the RCE14DHFR perform in chemical exposure scenarios, and are there environmental restrictions?
The RCE14DHFR insulation body is molded from polyphenylene sulfide (PPS), a high-performance engineering polymer selected for its chemical resistance, dimensional stability, and thermal endurance. PPS resists most polar solvents, dilute acids, and hydrocarbons, making the RCE14DHFR suitable for industrial environments, automotive underhood applications, and aerospace cable routing where exposure to oils, solvents, or salt spray is expected. The RCE14DHFR is also intrinsically flame-retardant without halogenated additives. However, strong bases (e.g., concentrated sodium hydroxide) and some aggressive cleaning agents used in electronics manufacturing (e.g., undiluted flux removers) can cause minor stress whitening or long-term embrittlement of PPS. The RCE14DHFR should be cleaned using IPA or mild aqueous solutions after wave soldering; if ultrasonic cleaning is required, use low-power settings and avoid prolonged exposure. Temperature cycling and UV exposure do not significantly degrade PPS, so the RCE14DHFR remains reliable across the -65°C to 125°C operating range without material creep or loss of dimensional tolerance.
What is the insertion and removal force specification for the RCE14DHFR, and how does this affect connector mating reliability?
Sullins does not explicitly publish insertion force (IF) or removal force (RF) values for the RCE14DHFR in most technical summaries, but similar hairpin bellows edge connectors in this pitch class typically exhibit IF in the 3–8 newton range per connector and RF of 1–3 newtons per connector. The RCE14DHFR force profile depends on the number of rows actually engaged; dual-row insertion approximately doubles the nominal force compared to a single-row variant. Operators should expect noticeable resistance during insertion of the RCE14DHFR, which indicates proper contact wiping and bellows engagement. If insertion force is abnormally high (>10 newtons), the card edge may be oversized, the backplane contacts may be contaminated, or the RCE14DHFR bellows may be damaged or misaligned. Conversely, very low insertion force (<2 newtons) suggests inadequate contact compression and potential intermittency. Backplane designs using the RCE14DHFR should include mechanical guides or alignment pins to ensure perpendicular insertion and distribute force evenly; manual insertion without guides can create point-loading stress on the RCE14DHFR leads and solder joints.
Is the RCE14DHFR suitable for high-frequency or impedance-controlled signal applications?
The RCE14DHFR is not optimized for controlled-impedance signal transmission. The hairpin bellows contact design introduces parasitic inductance (typically 0.5–2 nanohenries per contact pair) and slight contact-to-contact capacitive coupling due to the narrow 0.039" pitch and dual-row geometry. For signal frequencies below 100 MHz and low-duty-cycle digital logic (TTL, CMOS), the RCE14DHFR electrical characteristics are acceptable, and signal integrity is primarily constrained by the backplane trace routing rather than the connector itself. However, high-speed differential signaling (>500 Mbps) or analog RF applications (>1 GHz) are not recommended with the RCE14DHFR without careful impedance management and guard traces. To mitigate crosstalk when using the RCE14DHFR in moderate-speed applications (100–500 Mbps), interleave ground contacts with signal positions, keep card-edge traces short and isolated, and consider adding series termination resistors or AC coupling where appropriate. For modern high-speed backplanes (PCIe, USB 3.x), dedicated low-profile mezzanine connectors with better impedance characteristics are preferred over the RCE14DHFR.
How does the RCE14DHFR perform after repeated insertion-removal cycles, and what maintenance or inspection intervals are recommended?
The RCE14DHFR is designed for repeated mating cycles; the hairpin bellows contact design allows for 50–100 insertion cycles under normal conditions without significant degradation if cards are clean and properly aligned. However, contact resistance increases measurably after 50 cycles due to mechanical wear on the gold plating and minor oxidation of exposed phosphor bronze. In high-insertion environments (data center hot-swaps, field-replaceable modules), the RCE14DHFR may require periodic inspection after 30–50 cycles to check for visible corrosion, pitting, or discoloration on the card-edge fingers or the connector contacts. If intermittent connections develop, the RCE14DHFR card-edge fingers can be gently cleaned with a soft pencil eraser or isopropyl-alcohol-soaked swab to restore contact. Backplane contacts within the RCE14DHFR cannot be easily cleaned in-situ; if backplane contacts degrade, the entire connector module must be replaced. Field experience suggests that the RCE14DHFR reaches end-of-life (>100 mΩ contact resistance) after approximately 200–300 insertion cycles in typical industrial environments, making it suitable for occasional module swaps but not for continuous hot-swap duty without active monitoring.
What are the RoHS3 and REACH compliance implications of the RCE14DHFR, and are there restricted substances to verify?
The RCE14DHFR is explicitly marked as ROHS3 compliant, confirming that the connector meets EU Directive 2011/65/EU (Recast) and contains no intentional lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls, or polybrominated diphenyl ethers above specified thresholds. The phosphor bronze contacts, gold plating, and PPS insulation of the RCE14DHFR are all RoHS3 approved. REACH Status for the RCE14DHFR is listed as UNAFFECTED, meaning the connector does not contain any Substances of Very High Concern (SVHC) from the REACH Candidate List at the time of manufacture, or the connector qualifies for an exemption. However, REACH SVHC lists are updated periodically, so distributors should be consulted for the most current SVHC declaration when sourcing the RCE14DHFR for products with long production lifecycles or required documentation trails. The RCE14DHFR is suitable for EU market distribution and does not require additional substance declaration paperwork beyond standard compliance certificates.
How does the board-lock feature on the RCE14DHFR function, and does it affect card insertion or removal procedures?
The RCE14DHFR includes a board-lock feature, typically a mechanical latch or clip molded into the connector body that engages with a corresponding notch or lip on the PCB card edge. Once inserted, the board-lock on the RCE14DHFR secures the card against accidental withdrawal during normal operation by preventing backward motion. To remove a card from the RCE14DHFR, the operator must manually depress or slide the latch (the exact mechanism depends on Sullins' specific board-lock design for the RCE14DHFR revision in use). The board-lock reduces stress on the RCE14DHFR solder joints during vibration or mechanical shock by preventing cards from repeatedly seating and unseating due to compliance motion. In high-vibration environments (aerospace, military, automotive), the board-lock feature of the RCE14DHFR provides measurable reliability improvement. However, the board-lock also increases removal force and may require training or tool-assisted extraction in field deployments. If a card is stuck on the RCE14DHFR due to a jammed or broken latch, excessive force during removal can damage both the RCE14DHFR contacts and the card-edge fingers; careful inspection and gentle rocking motions are recommended before forcing the RCE14DHFR card removal.
What is the Moisture Sensitivity Level (MSL) of the RCE14DHFR, and does this affect component storage or assembly procedures?
The RCE14DHFR is rated MSL 1, the lowest moisture sensitivity classification, indicating that the connector absorbs negligible moisture from ambient air and requires no special baking or dry-pack storage procedures. MSL 1 components like the RCE14DHFR can be stored in standard warehouse conditions (typically 23°C ± 2°C and 45–75% relative humidity) indefinitely without degradation or risk of popcorning during reflow soldering. The PPS insulation material and gold plating of the RCE14DHFR both exhibit excellent dimensional stability across the full humidity range; there is no need for vacuum-sealed desiccant bags or nitrogen purging. This MSL 1 rating makes the RCE14DHFR logistics-friendly and reduces manufacturing risk. However, if RCE14DHFR assemblies are stored in humid tropical environments (>80% RH) for extended periods, the gold-plated card-edge interface can develop light tarnishing; preventive measures include silica gel storage boxes or occasional inspection before fielding to ensure contact cleanliness.
How does the RCE14DHFR compare to modern mezzanine connectors or M.2-style edge connectors in terms of signal density and application flexibility?
The RCE14DHFR delivers 28 total positions (14 per row) with a 0.039" pitch, yielding a contact density of approximately 25 contacts per linear inch—competitive with older-generation card-edge designs but lower than contemporary high-density mezzanine connectors (e.g., SAMTEC FireFly or TE MiniCard variants) which achieve 40–60+ contacts per inch. The RCE14DHFR is also wider and taller in profile than modern low-profile mezzanine connectors, making it less suitable for space-constrained consumer electronics. However, the RCE14DHFR excels in industrial and legacy embedded systems where mechanical simplicity, thermal tolerance, and straightforward PCB routing are prioritized over extreme compactness. Modern M.2-style connectors offer superior impedance characteristics and faster signaling support (PCIe Gen4+), while the RCE14DHFR remains well-suited for distributed I/O, power delivery, and control signal distribution in modular systems. New product designs targeting high-speed backplane applications should evaluate dedicated connector families (e.g., DIN 41612 multi-row variants or modern mezzanine standards) rather than the RCE14DHFR; the RCE14DHFR is retained primarily for product-line continuity and field-replaceable module strategies in mature systems.

Parts with Similar Specifications

The three parts on the right have similar specifications to Sullins Connector Solutions RCE14DHFR

Product Attribute RCE14DHHR RCE14DHFN RCE14DHRT RCE14DHFT
Part Number RCE14DHHR RCE14DHFN RCE14DHRT RCE14DHFT
Manufacturer Sullins Connector Solutions Sullins Connector Solutions Sullins Connector Solutions Sullins Connector Solutions
Number of Rows - - - -
Series - - - -
Features - - - Simultaneous Sampling
Card Type - - - -
Number of Positions/Bay/Row - - - -
Contact Material - - - -
Contact Finish - - - -
Read Out - - - -
Gender - - - -
Material - Insulation - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Contact Type - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Card Thickness - - - -
Number of Positions - - - -
Color - - - -
Contact Finish Thickness - - - -
Pitch - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Termination - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Flange Feature - - - -

RCE14DHFR Datasheet PDF

Download RCE14DHFR pdf datasheets and Sullins Connector Solutions documentation for RCE14DHFR - Sullins Connector Solutions.

Datasheets
Cylindrical Battery Holders.pdf
Environmental Information
Sullins Connector Solutions REACH.pdf

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Sullins Connector Solutions

RCE14DHFR

Sullins Connector Solutions
98D-RCE14DHFR

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