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Home Products Crystals, Oscillators, Resonators Crystals~~SXT21410DD27-32.000M~~

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SXT21410DD27-32.000M - Suntsu Electronics, Inc.

Name: Suntsu Electronics, Inc. SXT21410DD27-32.000M
Brand: Suntsu Electronics, Inc.
SKU: SXT21410DD27-32.000M
Price: 0.36 USD
Availability: InStock
Rating: 5 (3 reviews)

Manufacturer Part Number: SXT21410DD27-32.000M

Manufacturer: Suntsu Electronics, Inc.

Allelco Part Number: 98D-SXT21410DD27-32.000M

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 5,235 pcs available, New & Original

Parts Description: CRYSTAL 32.000MHZ 10 PF SMD

Package: 4-SMD, No Lead

Data sheet: SXT21410DD27-32.pdf

HTML Datasheet
SXT214 Series.pdf

RoHs Status: ROHS3 Compliant

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Specifications

SXT21410DD27-32.000M Tech Specifications
Suntsu Electronics, Inc. - SXT21410DD27-32.000M technical specifications, attributes, parameters and parts with similar specifications to Suntsu Electronics, Inc. - SXT21410DD27-32.000M

Product Attribute	Attribute Value
Manufacturer	Suntsu Electronics, Inc.
Type	MHz Crystal
Size / Dimension	0.079" L x 0.063" W (2.00mm x 1.60mm)
Series	SXT214
Package / Case	4-SMD, No Lead
Package	Bulk
Operating Temperature	-20°C ~ 70°C
Operating Mode	Fundamental

Product Attribute	Attribute Value
Mounting Type	Surface Mount
Load Capacitance	10pF
Height - Seated (Max)	0.020" (0.50mm)
Frequency Tolerance	±20ppm
Frequency Stability	±20ppm
Frequency	32 MHz
ESR (Equivalent Series Resistance)	100 Ohms

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH info available upon request
ECCN	EAR99
HTSUS	8541.60.0080

Frequently Asked Questions(FAQ)

How does the SXT21410DD27-32.000M crystal’s ±20ppm frequency stability impact timing accuracy in a 32 MHz microcontroller-based system over temperature?: The SXT21410DD27-32.000M specifies ±20ppm frequency stability across its operating temperature range of -20°C to 70°C. At 32 MHz, this translates to a maximum deviation of ±640 Hz. In a real-time clock or communication timing application, this level of stability may require compensation if sub-microsecond timing precision is critical. For example, over a 1-second interval, the accumulated timing error could reach ±20 microseconds. Systems relying on UART or SPI timing with tight baud rate tolerances should verify that this drift remains within acceptable margins for their protocol.

Why is the load capacitance of 10pF specified for the SXT21410DD27-32.000M, and how should this influence external capacitor selection in a typical oscillator circuit?: The SXT21410DD27-32.000M is designed to operate with a load capacitance of 10pF, meaning the total effective capacitance seen by the crystal must match this value for accurate frequency output. When designing the Pierce oscillator circuit, the external load capacitors (C1 and C2) must account for stray PCB capacitance (typically 2–5pF). Using the formula CL = (C1 × C2)/(C1 + C2) + Cstray, selecting 12pF capacitors for C1 and C2 with 3pF stray capacitance yields approximately 9pF, which is acceptably close. Deviations beyond ±1pF can shift the resonant frequency by several ppm, affecting synchronization in RF or timing-sensitive applications.

What are the implications of the 100 Ohm ESR value for the SXT21410DD27-32.000M in terms of drive level and oscillator startup reliability?: The SXT21410DD27-32.000M has an ESR of 100 Ohms, which is moderate for a 32 MHz fundamental mode crystal. This value influences the maximum allowable drive level—typically kept below 100–200 µW to prevent long-term aging or frequency drift. When paired with a microcontroller oscillator circuit, ensure the negative resistance of the amplifier exceeds 5× the ESR (i.e., >500 Ohms) to guarantee reliable startup. Low-power designs using high-impedance feedback resistors may struggle to meet this margin, especially at cold temperatures, so simulation or empirical validation is recommended.

How does the 4-SMD, no-lead package of the SXT21410DD27-32.000M affect PCB layout and reflow soldering compared to traditional through-hole crystals?: The SXT21410DD27-32.000M uses a 4-SMD, no-lead package measuring 2.00mm × 1.60mm with a maximum seated height of 0.50mm, enabling high-density placement on compact PCBs. The absence of leads reduces parasitic inductance, which benefits high-frequency stability at 32 MHz. However, the small pad geometry demands precise solder paste stencil design (typically 50–75% aperture reduction) and controlled reflow profiles to avoid tombstoning. Thermal vias under the package are not recommended due to potential solder wicking, and symmetrical pad layout is critical to ensure even heating during reflow.

Can the SXT21410DD27-32.000M be used in battery-powered IoT devices, and what design considerations apply given its fundamental mode operation?: Yes, the SXT21410DD27-32.000M is suitable for battery-powered IoT applications due to its low drive level requirements and stable fundamental mode operation at 32 MHz. Fundamental mode crystals like this one exhibit lower phase noise and better startup characteristics compared to overtone types, which is advantageous in low-power RF transceivers. However, designers must ensure the microcontroller’s oscillator circuit supports low-capacitance loading and minimizes leakage currents. Power cycling the oscillator during sleep modes can further extend battery life, but repeated startups may introduce minor frequency settling delays (~1–5 ms), which should be accounted for in timing-critical wake-up routines.

How does the frequency tolerance of ±20ppm for the SXT21410DD27-32.000M compare to other crystals in the same frequency range, and when might a tighter tolerance be necessary?: The SXT21410DD27-32.000M’s ±20ppm tolerance is standard for commercial-grade 32 MHz crystals and aligns with many microcontroller oscillator specifications. In comparison, high-precision crystals may offer ±5ppm or better, often at higher cost and with stricter load capacitance matching. For applications such as USB communication, Ethernet timing, or GPS synchronization, where protocol standards mandate tighter frequency control (e.g., ±10ppm for USB 2.0), the SXT21410DD27-32.000M may require system-level calibration or temperature compensation. For general-purpose embedded systems like sensor nodes or motor control, ±20ppm is typically sufficient.

What are the risks of using the SXT21410DD27-32.000M in environments approaching its -20°C lower temperature limit, particularly regarding startup time and frequency drift?: As temperatures approach -20°C, the SXT21410DD27-32.000M may exhibit increased startup time due to reduced crystal activity and higher effective ESR. In cold environments, the oscillator loop gain decreases, potentially causing failure to start if the amplifier’s negative resistance margin is marginal. Additionally, frequency drift near the lower limit can exceed the nominal ±20ppm if the crystal’s turnover temperature is not centered in the operating range. For systems deployed in unheated enclosures or outdoor settings, empirical testing at -20°C is advised, and a crystal with a specified -40°C operating range may be preferable for robustness.

How does the SXT21410DD27-32.000M’s RoHS3 compliance and MSL 1 rating influence procurement and long-term reliability in high-volume manufacturing?: The SXT21410DD27-32.000M is RoHS3 compliant, ensuring compatibility with global environmental regulations and solder processes using lead-free alloys like SAC305. Its MSL 1 (Unlimited) rating indicates no moisture sensitivity, allowing indefinite floor life without dry packing or baking—this simplifies inventory management and reduces handling costs in high-volume production. Unlike MSL 3 or higher components, there is no risk of popcorning during reflow, making the SXT21410DD27-32.000M ideal for automated assembly lines where moisture control logistics would otherwise add complexity.

In a design requiring multiple clock domains, can the SXT21410DD27-32.000M be shared across different subsystems, or should each domain use a dedicated crystal?: While technically possible to buffer and distribute the clock from a single SXT21410DD27-32.000M, doing so introduces jitter, skew, and potential loading effects that can degrade timing integrity. Each additional load increases the effective capacitance on the oscillator node, potentially pulling the frequency outside the ±20ppm tolerance. For subsystems with independent power domains or stringent phase noise requirements (e.g., ADC sampling or RF synthesis), dedicated crystals or a clock generator IC driven by the SXT21410DD27-32.000M is preferred. This approach isolates noise and ensures each domain meets its timing budget.

How does the 0.50mm maximum height of the SXT21410DD27-32.000M benefit ultra-thin device designs compared to taller crystal packages?: With a maximum seated height of 0.50mm, the SXT21410DD27-32.000M enables integration into slim-form-factor devices such as wearables, smart cards, or medical patches where vertical space is constrained. Traditional HC-49 or even smaller SMD crystals often exceed 1.0mm in height, limiting layer stacking or enclosure design. The low profile of the SXT21410DD27-32.000M allows placement under components like flex circuits or display modules, improving mechanical integration without compromising RF shielding or thermal dissipation.

What PCB material and trace routing practices are recommended when using the SXT21410DD27-32.000M to minimize parasitic effects at 32 MHz?: For optimal performance with the SXT21410DD27-32.000M, use FR4 with a dielectric constant stable across temperature, and keep oscillator traces as short and symmetrical as possible—ideally under 10mm in total length. Route XTAL_IN and XTAL_OUT traces away from digital signals, power planes, or switching nodes to reduce coupling noise. A solid ground plane beneath the crystal (with no splits) lowers ground impedance and shields against EMI. Avoid vias in the crystal loop, as they add inductance that can detune the resonant frequency and increase startup time.

How does the SXT21410DD27-32.000M compare to a 32.768 kHz tuning fork crystal in terms of power consumption and application suitability?: The SXT21410DD27-32.000M operates at 32 MHz and is optimized for high-speed processing and RF timing, whereas a 32.768 kHz crystal is designed for ultra-low-power real-time clock (RTC) functions. The SXT21410DD27-32.000M consumes significantly more power due to higher frequency operation and larger drive requirements, making it unsuitable for always-on timekeeping. However, its fast startup and stable output are essential for microcontrollers requiring rapid boot times or precise baud rate generation. In hybrid designs, both crystals may coexist—using the 32.768 kHz for RTC and the SXT21410DD27-32.000M for active processing.

Are there known compatibility issues when pairing the SXT21410DD27-32.000M with specific microcontroller oscillator circuits, such as those in ARM Cortex-M series devices?: The SXT21410DD27-32.000M is generally compatible with ARM Cortex-M MCUs, provided the internal oscillator amplifier meets the required negative resistance and load capacitance specifications. Some MCUs include configurable drive strength or built-in load capacitors; in such cases, disable internal capacitors and rely on external components to match the 10pF load. Refer to the MCU’s oscillator design guide—some require series resistance (e.g., 100–1kΩ) to limit drive level and prevent overdriving the SXT21410DD27-32.000M. Always validate startup behavior across the full temperature range, as process variations in the MCU can affect loop gain.

What aging characteristics should be expected from the SXT21410DD27-32.000M over its operational lifetime, and how might this affect long-term system accuracy?: The SXT21410DD27-32.000M, like most AT-cut crystals, exhibits frequency aging primarily due to contamination migration and stress relief in the electrode structure. Typical aging rates range from ±3ppm to ±5ppm per year under normal conditions. Over a 10-year lifespan, this could result in a cumulative drift of up to ±50ppm, exceeding the initial ±20ppm tolerance. In applications requiring long-term stability—such as metering, navigation, or industrial control—periodic recalibration or selection of a crystal with lower aging specifications may be necessary to maintain system accuracy.

Can the SXT21410DD27-32.000M be used in parallel with a clock buffer IC to drive multiple loads without degrading signal integrity?: Yes, the SXT21410DD27-32.000M can drive a clock buffer IC, but the buffer must present a high input impedance to avoid overloading the crystal. The total capacitive load seen by the SXT21410DD27-32.000M must remain near 10pF, so select a buffer with low input capacitance (typically <5pF) and ensure minimal trace capacitance. The buffer isolates the crystal from downstream loads, preserving frequency stability and reducing jitter. This configuration is common in multi-core processors or FPGA-based systems where a single clock source must fan out to multiple domains without introducing skew or noise.

How does the fundamental mode operation of the SXT21410DD27-32.000M influence its phase noise performance compared to overtone crystals at the same frequency?: The SXT21410DD27-32.000M operates in fundamental mode, which typically provides lower phase noise and better close-in stability than overtone crystals operating at the same 32 MHz frequency. Overtone crystals require additional filtering to suppress unwanted harmonic responses, which can introduce insertion loss and degrade signal purity. For applications like software-defined radios or precision ADCs, the cleaner spectral output of the SXT21410DD27-32.000M reduces the risk of spurious emissions and improves SNR. However, overtone crystals may offer higher Q in some cases, so the choice depends on the noise budget and filtering complexity.

What design verification steps are recommended before finalizing the SXT21410DD27-32.000M in a production schematic?: Before production release, verify the SXT21410DD27-32.000M’s integration through oscillator loop gain simulation (using SPICE models if available), empirical frequency measurement with a frequency counter or spectrum analyzer, and startup testing across temperature extremes. Confirm that the actual load capacitance matches 10pF using a network analyzer or impedance bridge. Perform long-term drift testing over 100+ hours to assess aging effects. Additionally, validate EMI performance in the final enclosure, as nearby RF sources can modulate the crystal’s output. These steps reduce the risk of field failures due to marginal oscillator design.

Parts with Similar Specifications

The three parts on the right have similar specifications to Suntsu Electronics, Inc. SXT21410DD27-32.000M

Product Attribute
Part Number	SXT21410DD27-32.000MT	SXT21410DD27-27.000MT	SXT21410DD27-30.000MT	SXT21410DD27-25.000MT
Manufacturer	Suntsu Electronics, Inc.	Suntsu Electronics, Inc.	Suntsu Electronics, Inc.	Suntsu Electronics, Inc.
Series	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Frequency Tolerance	-	-	-	-
Frequency Stability	-	-	-	-
Type	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Load Capacitance	-	-	-	-
ESR (Equivalent Series Resistance)	-	-	-	-
Size / Dimension	-	-	-	-
Operating Mode	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Frequency	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Height - Seated (Max)	-	-	-	-

SXT21410DD27-32.000M Datasheet PDF

Download SXT21410DD27-32.000M pdf datasheets and Suntsu Electronics, Inc. documentation for SXT21410DD27-32.000M - Suntsu Electronics, Inc..

HTML Datasheet: SXT214 Series.pdf

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Customer Reviews

Evaluation: 10 Articles

Nord***mbedded

Jul 20, 2026

Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.
Arch***ct

Jul 15, 2026

Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.
FPGA***lorer88

Jul 7, 2026

The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.
Nath***oleman

Jun 29, 2026

Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.
Emil***rperTech

Jun 23, 2026

Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.
Liam***terTech

Jun 15, 2026

Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.
Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.

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