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Home Products Crystals, Oscillators, Resonators Crystals~~SXT21412EC16-48.000M~~

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SXT21412EC16-48.000M - Suntsu Electronics, Inc.

Name: Suntsu Electronics, Inc. SXT21412EC16-48.000M
Brand: Suntsu Electronics, Inc.
SKU: SXT21412EC16-48.000M
Price: 0.457 USD
Availability: InStock
Rating: 5 (7 reviews)

Manufacturer Part Number: SXT21412EC16-48.000M

Manufacturer: Suntsu Electronics, Inc.

Allelco Part Number: 98D-SXT21412EC16-48.000M

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 3,000 pcs available, New & Original

Parts Description: CRYSTAL 48.000MHZ 12PF SMD

Package: 4-SMD, No Lead

Data sheet: SXT21412EC16-48.pdf

HTML Datasheet
SXT214 Series.pdf

RoHs Status: ROHS3 Compliant

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Specifications

SXT21412EC16-48.000M Tech Specifications
Suntsu Electronics, Inc. - SXT21412EC16-48.000M technical specifications, attributes, parameters and parts with similar specifications to Suntsu Electronics, Inc. - SXT21412EC16-48.000M

Product Attribute	Attribute Value
Manufacturer	Suntsu Electronics, Inc.
Type	MHz Crystal
Size / Dimension	0.079" L x 0.063" W (2.00mm x 1.60mm)
Series	SXT214
Package / Case	4-SMD, No Lead
Package	Bulk
Operating Temperature	-10°C ~ 60°C
Operating Mode	Fundamental

Product Attribute	Attribute Value
Mounting Type	Surface Mount
Load Capacitance	12pF
Height - Seated (Max)	0.020" (0.50mm)
Frequency Tolerance	±15ppm
Frequency Stability	±25ppm
Frequency	48 MHz
ESR (Equivalent Series Resistance)	60 Ohms

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH info available upon request
ECCN	EAR99
HTSUS	8541.60.0080

Frequently Asked Questions(FAQ)

How does the SXT21412EC16-48.000M crystal’s frequency stability compare to typical requirements for USB 2.0 high-speed applications, and what margin exists given its ±25ppm specification?: The SXT21412EC16-48.000M operates at 48 MHz with a frequency stability of ±25ppm over its operating temperature range of -10°C to 60°C. USB 2.0 high-speed communication mandates a clock accuracy within ±50ppm to ensure reliable data transmission, so this component comfortably meets the standard with a 25ppm safety margin. However, when considering long-term aging and additional environmental stressors such as voltage drift or mechanical shock, the effective system-level stability may approach or exceed the USB spec if not compensated through calibration or design margin. Therefore, while compliant, designers should verify cumulative error budgets across all contributing factors in their application.

What are the implications of using the SXT21412EC16-48.000M in a compact IoT device where board space is constrained, and how does its package size influence layout decisions compared to larger through-hole alternatives?: The SXT21412EC16-48.000M measures 2.00mm x 1.60mm in a surface-mount 4-SMD, no-lead configuration, making it highly suitable for space-constrained designs such as wearable devices or compact sensor nodes. Its small footprint reduces PCB real estate usage by approximately 70% compared to traditional HC-49/U-style crystals, enabling tighter routing and higher component density. However, this miniaturization introduces challenges in thermal management and mechanical stress concentration during soldering. Designers must ensure adequate pad design, avoid sharp trace corners near the crystal, and consider reflow profile control to prevent cracking—especially given the absence of leads to absorb stress. In contrast, through-hole crystals offer better shock resistance but require larger footprints and through-board clearance, making them impractical for modern dense layouts.

Can the SXT21412EC16-48.000M be used reliably in automotive-grade temperature cycling environments, and what derating or reliability precautions should be taken given its stated operating range of -10°C to 60°C?: No, the SXT21412EC16-48.000M is not rated for full automotive operation. Its specified operating temperature range of -10°C to 60°C falls well below the AEC-Q200 requirement of -40°C to +125°C. While it might survive brief exposure to cold storage or industrial environments, prolonged use in vehicles—where temperatures can reach 85°C continuously or drop to -30°C in extreme climates—rises reliability risks including frequency drift beyond ±25ppm, increased failure rates, and accelerated aging. For automotive applications, a qualified AEC-compliant crystal such as those in the SIT1602BC series should be selected instead. If this component is used outside industrial or consumer electronics, the design must include thermal shielding, derated load capacitance margins, and rigorous burn-in testing.

How does the 12pF load capacitance requirement of the SXT21412EC16-48.000M interact with microcontroller input capacitance, and what PCB parasitics could compromise tuning accuracy if not properly managed?: The SXT21412EC16-48.000M is designed for a 12pF load condition, which includes external trim capacitors and internal MCU oscillator circuit capacitance. Typical microcontrollers have input capacitances ranging from 3pF to 9pF depending on model and process node. To meet the 12pF target, external ceramic capacitors (commonly 6pF each in series) are often used. However, parasitic effects such as trace inductance (~1–2nH per mm), via stub resonance, and pad-to-ground capacitance can add 1–3pF unpredictably. These variations shift the effective load away from the crystal’s optimum, causing frequency deviation exceeding ±10ppm and potential startup failures. Designers should simulate the entire oscillator network using SPICE models, minimize trace length (<5mm recommended), and avoid placing traces beneath ground planes without stitching vias to reduce coupling.

What is the expected aging behavior of the SXT21412EC16-48.000M over five years, and how would this impact timing-sensitive applications like audio sampling or UART communication?: Although aging is not explicitly listed in the datasheet, similar SXT214-series crystals typically exhibit initial aging of ≤±3ppm within the first month, followed by an annual drift of ±2 to ±3ppm thereafter. Assuming worst-case ±3ppm/year, over five years the total accumulated aging could reach ±15ppm. Combined with the existing ±25ppm stability, total frequency error might exceed ±40ppm under extreme conditions. For UART communications at 115200 baud, this translates to bit timing errors accumulating beyond one bit period after several seconds unless corrected by software resynchronization. Similarly, audio systems relying on precise sample clocks may experience pitch distortion or buffer underruns. Designers should either select components with tighter aging specs or implement periodic clock calibration routines to maintain system integrity.

How does the equivalent series resistance (ESR) of 60 ohms for the SXT21412EC16-48.000M affect oscillator drive level considerations, and what happens if driven above recommended levels?: The SXT21412EC16-48.000M has an ESR of 60 ohms, which defines the minimum energy required to sustain oscillation in the crystal’s fundamental mode. This value also helps determine the maximum allowable drive level; excessive power increases nonlinear effects such as motional impedance changes, spurious modes, and accelerated electrode erosion. Most MCUs can safely source up to 50µW into a 60Ω load, corresponding to ~1mA peak current. Exceeding this can degrade frequency accuracy by shifting the resonant point due to heating. Conversely, insufficient drive may cause unreliable startup or mode hopping. When designing the feedback resistor or inverter gain in the oscillator loop, engineers should calculate power dissipation as V²/R and ensure it remains below manufacturer guidelines—typically documented in application notes for specific IC families.

In what scenarios would the SXT21412EC16-48.000M outperform a ceramic resonator like the EPSON SG-8002CJ, and vice versa, particularly regarding frequency precision and environmental robustness?: The SXT21412EC16-48.000M offers superior frequency accuracy (±15ppm tolerance, ±25ppm stability) compared to ceramic resonators like the SG-8002CJ, which typically have tolerances of ±0.5% (±500ppm). This makes the crystal ideal for applications requiring precise timing, such as USB communication, RF synthesis, or digital signal processing. Additionally, crystals exhibit much lower phase noise and longer-term stability than ceramics. However, ceramic resonators win in cost, size, and immunity to shock/vibration due to their monolithic structure and lack of fragile quartz elements. The SXT21412EC16-48.000M is thus preferred when performance outweighs form factor concerns; otherwise, a ceramic resonator suffices for simple microcontroller clocks where moderate jitter is acceptable.

What precautions should be taken during PCB assembly to prevent damage to the SXT21412EC16-48.000M, and how do moisture sensitivity level (MSL) 1 characteristics simplify handling compared to higher MSL parts?: The SXT21412EC16-48.000M carries an MSL rating of 1, meaning it is not prone to moisture-induced damage during reflow soldering and does not require baking prior to use. This simplifies handling logistics, reduces storage complexity, and allows unlimited shelf life under normal dry conditions. Nevertheless, care must still be taken during placement: electrostatic discharge (ESD) protection is critical due to the sensitive quartz element, and automated pick-and-place machines should use low-static nozzles. Reflow profiles must follow IPC-J-STD-020 guidelines, avoiding peak temperatures above 260°C or dwell times exceeding 30 seconds to prevent delamination. Unlike MSL 3 or 4 components that require humidity monitoring and pre-bake cycles, MSL 1 parts streamline production flow and reduce risk of popcorning, especially beneficial in high-volume manufacturing environments.

How does the RoHS 3 compliance status of the SXT21412EC16-48.000M influence global market access, particularly in regions with evolving halogen-free regulations?: RoHS 3 compliance confirms the SXT21412EC16-48.000M excludes hazardous substances such as lead, mercury, cadmium, and restricted phthalates, meeting the EU’s Directive 2011/65/EU as amended by 2015/863. This ensures eligibility for sale in European markets and supports corporate sustainability goals. However, some Asian and North American jurisdictions are adopting stricter standards such as China RoHS 2 and California’s Prop 65, which may impose additional labeling or documentation requirements. While the component itself complies, designers must verify full bill-of-materials alignment, especially with interconnect materials and solder alloys. RoHS 3 status alone does not guarantee readiness for all regional frameworks, but it provides a strong foundation for international commercialization without major redesign or re-qualification efforts.

What role does the height-seated measurement of 0.50mm play in stacked PCB designs, and how might this limit vertical integration in multi-layer boards?: With a seated height of 0.50mm, the SXT21412EC16-48.000M occupies minimal vertical space, allowing it to coexist with other tall components such as connectors or batteries without exceeding overall board thickness. In densely populated backplanes or handheld devices, this low profile preserves clearance between adjacent PCBs in z-axis stacking configurations. However, in ultra-thin wearables or foldable displays, even 0.50mm can consume valuable layer budget. Designers must account for this dimension in BOM planning and ensure sufficient clearance above the crystal for pick-and-place tooling access and conformal coating application. Failure to do so may force trade-offs such as relocating antennas or reducing connector pin counts, impacting functionality or manufacturability.

How does the fundamental operating mode of the SXT21412EC16-48.000M affect harmonic suppression and EMI characteristics in RF-adjacent circuits?: Operating in the fundamental mode minimizes spurious harmonics compared to overtone crystals, which require complex circuitry to suppress unwanted frequencies. The SXT21412EC16-48.000M’s fundamental design inherently produces cleaner spectral content, reducing radiated emissions near sensitive RF blocks such as Bluetooth or Zigbee radios. This lowers the need for additional filtering or shielding, simplifying EMC compliance. However, fundamental-mode crystals generally require higher drive levels and more careful layout to avoid exciting parasitic resonances at multiples of the base frequency. Proper grounding, short traces, and decoupling near the MCU help maintain clean operation. When placed within 10mm of an RF module, designers should route oscillator signals perpendicularly and avoid parallel high-speed lines to prevent cross-coupling.

Can the SXT21412EC16-48.000M be substituted for a 48MHz TCXO in low-power battery-operated devices, and what compromises arise regarding temperature compensation and power consumption?: No, the SXT21412EC16-48.000M is a passive crystal, not a temperature-compensated oscillator (TCXO). While it meets basic timing needs at 48MHz, its ±25ppm stability assumes a fixed ambient temperature. In battery-powered systems exposed to thermal swings—such as outdoor sensors—this results in unacceptable frequency drift unless paired with an external compensation algorithm. TCXOs integrate varactor-controlled oscillators and thermistors to actively stabilize output across temperature, consuming tens of µA more than a plain crystal. Replacing a TCXO with this crystal saves power but sacrifices accuracy. If sub-50ppm stability is required dynamically, designers must either accept reduced performance or add digital calibration routines that periodically measure clock drift against a reference and adjust timing counters accordingly—increasing firmware complexity without eliminating hardware limitations.

What impact does the bulk packaging format have on supply chain resilience for the SXT21412EC16-48.000M, and how should inventory planning differ from tape-and-reel components?: Bulk packaging means the SXT21412EC16-48.000M arrives loose in trays or bags, requiring manual sorting before placement—ideal for prototyping or low-volume production but inefficient for automated assembly. It reduces material waste compared to sealed reels but increases labor costs and handling risks such as misplacement or contamination. For high-mix manufacturing, bulk ordering may offer cost savings on unit price but demands robust warehouse controls and FIFO rotation protocols. Suppliers often provide bulk lots with extended shelf life due to MSL 1 status, enhancing supply continuity during demand spikes. However, procurement teams must coordinate closely with production planners to align delivery schedules with build rates, avoiding stockouts while minimizing excess inventory holding costs associated with non-automatable formats.

How does the ECCN classification of EAR99 affect export controls for the SXT21412EC16-48.000M, and what documentation is needed when shipping internationally?: Classified under ECCN EAR99, the SXT21412EC16-48.000M is subject to U.S. Export Administration Regulations but qualifies for most general shipments without special licensing, provided it is not destined for embargoed countries or military end-users. Exporters must still complete Standard Form 7 (or equivalent electronic filing) and ensure accurate commodity classification. Importers may require commercial invoices declaring HTSUS code 8541.60.0080 and confirming RoHS compliance. While the part itself poses low proliferation risk due to civilian-grade construction, companies involved in defense or aerospace should conduct additional due diligence to avoid accidental violations. Proper documentation not only ensures compliance but also accelerates customs clearance, reducing delays in global supply chains.

What steps should be taken if the SXT21412EC16-48.000M fails to oscillate reliably during prototype testing, and how do common failure modes inform design iteration?: If the SXT21412EC16-48.000M does not start consistently, first verify load capacitance matching, drive level, and PCB layout symmetry. Common issues include incorrect trace lengths on feedback paths, mismatched external capacitors, or excessive parasitic inductance from long return traces. Use an oscilloscope with high-impedance probe to check waveform amplitude; absence of oscillation usually indicates insufficient gain or excessive loading. Another cause is ESD damage during handling, evidenced by intermittent operation or drift. Thermal stress from improper reflow can crack the crystal substrate. Iterative debugging involves swapping components, simulating circuit behavior with SPICE, and adjusting capacitor values in 1pF increments. Once functional, perform accelerated life testing under temperature extremes to validate robustness before committing to mass production.

How does the Suntsu Electronics, Inc. brand reputation influence trust in the SXT21412EC16-48.000M’s quality, and what verification methods ensure consistency across batches?: Suntsu Electronics, Inc. specializes in quartz crystals and has established credibility in the embedded systems community through consistent datasheet transparency and adherence to JEDEC standards. While not as widely recognized as Murata or Epson, their SXT214 series demonstrates technical competence in miniaturization and performance metrics. Trust is reinforced by full compliance with RoHS, REACH availability, and clear parametric specifications. To ensure batch-to-batch consistency, designers should request First Article Inspection reports, conduct statistical process control sampling upon receipt, and perform frequency pull analysis across multiple units. Comparing measured ESR, frequency, and aging trends against datasheet limits validates reliability. Engaging directly with the supplier for custom test reports further mitigates risk in safety-critical deployments.

Parts with Similar Specifications

The three parts on the right have similar specifications to Suntsu Electronics, Inc. SXT21412EC16-48.000M

Product Attribute
Part Number	SXT21412EC16-48.000MT	SXT21412EC16-40.000M	SXT21412EC16-40.000MT	SXT21412EC16-52.000MT
Manufacturer	Suntsu Electronics, Inc.	Suntsu Electronics, Inc.	Suntsu Electronics, Inc.	Suntsu Electronics, Inc.
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Load Capacitance	-	-	-	-
Type	-	-	-	-
ESR (Equivalent Series Resistance)	-	-	-	-
Series	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Operating Mode	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Frequency Tolerance	-	-	-	-
Frequency	-	-	-	-
Size / Dimension	-	-	-	-
Height - Seated (Max)	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Frequency Stability	-	-	-	-

SXT21412EC16-48.000M Datasheet PDF

Download SXT21412EC16-48.000M pdf datasheets and Suntsu Electronics, Inc. documentation for SXT21412EC16-48.000M - Suntsu Electronics, Inc..

HTML Datasheet: SXT214 Series.pdf

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Customer Reviews

Evaluation: 10 Articles

Arch***ct

Jul 15, 2026

Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.
FPGA***lorer88

Jul 7, 2026

The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.
Nath***oleman

Jun 29, 2026

Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.
Emil***rperTech

Jun 23, 2026

Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.
Liam***terTech

Jun 15, 2026

Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.
Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.

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