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Home Products Crystals, Oscillators, Resonators Crystals~~SXT32415CA38-13.000M~~

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SXT32415CA38-13.000M - Suntsu Electronics, Inc.

Name: Suntsu Electronics, Inc. SXT32415CA38-13.000M
Brand: Suntsu Electronics, Inc.
SKU: SXT32415CA38-13.000M
Price: 0.323 USD
Availability: InStock
Rating: 5 (3 reviews)

Manufacturer Part Number: SXT32415CA38-13.000M

Manufacturer: Suntsu Electronics, Inc.

Allelco Part Number: 98D-SXT32415CA38-13.000M

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 3,500 pcs available, New & Original

Parts Description: CRYSTAL 13.000MHZ 15PF SMD

Package: 4-SMD, No Lead

Data sheet: -

RoHs Status: ROHS3 Compliant

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Specifications

SXT32415CA38-13.000M Tech Specifications
Suntsu Electronics, Inc. - SXT32415CA38-13.000M technical specifications, attributes, parameters and parts with similar specifications to Suntsu Electronics, Inc. - SXT32415CA38-13.000M

Product Attribute	Attribute Value
Manufacturer	Suntsu Electronics, Inc.
Type	MHz Crystal
Size / Dimension	0.126" L x 0.098" W (3.20mm x 2.50mm)
Series	SXT324
Ratings	-
Package / Case	4-SMD, No Lead
Package	Bulk
Operating Temperature	-30°C ~ 85°C

Product Attribute	Attribute Value
Operating Mode	Fundamental
Mounting Type	Surface Mount
Load Capacitance	15pF
Height - Seated (Max)	0.031" (0.80mm)
Frequency Tolerance	±25ppm
Frequency Stability	±50ppm
Frequency	13 MHz
ESR (Equivalent Series Resistance)	100 Ohms

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH info available upon request
ECCN	EAR99
HTSUS	8541.60.0060

Frequently Asked Questions(FAQ)

How does the frequency stability of the SXT32415CA38-13.000M compare to its initial tolerance, and what implications does this have for timing accuracy in a microcontroller-based system operating at 13 MHz?: The SXT32415CA38-13.000M has an initial frequency tolerance of ±25 ppm and a stability over temperature of ±50 ppm across -30°C to 85°C. While the initial tolerance defines manufacturing variation from the nominal 13 MHz, the stability specification reflects how much the frequency drifts due to environmental changes. For a system relying on precise clocking, such as a UART or SPI interface with strict baud rate requirements, these combined tolerances can result in cumulative frequency error. Over a full operating range, total possible deviation is approximately ±6.5 Hz (25 ppm) from nominal plus ±6.5 Hz under worst-case thermal variation, totaling ±13 Hz. This level of precision may be acceptable for low-speed digital communication but could introduce timing margins in high-speed protocols unless compensated by software calibration or crystal selection with tighter specifications.

What load capacitance value should be used when designing the oscillator circuit for the SXT32415CA38-13.000M, and how does matching this to PCB parasitics affect startup reliability?: The SXT32415CA38-13.000M specifies a recommended load capacitance of 15 pF. In practical oscillator design, the total effective load seen by the crystal includes both external capacitors and PCB trace capacitance. To achieve accurate frequency operation and ensure reliable oscillation, the sum of external capacitors and parasitic capacitance must align with the crystal’s specified load. Mismatches beyond ±5 pF can increase phase noise and reduce gain margin, potentially causing startup failure—especially in environments with high humidity or temperature cycling. For example, if board-level stray capacitance measures 3–4 pF, external capacitors should be selected around 12–13 pF to reach the target 15 pF net load. Failure to match this condition may result in excessive drive levels or insufficient feedback, leading to unreliable operation in mass production.

Can the SXT32415CA38-13.000M be used in applications requiring long-term frequency drift compensation, and what are the limitations based on its aging characteristics?: The SXT32415CA38-13.000M lacks explicit aging data in its datasheet, which typically indicates long-term frequency shift over months or years under controlled conditions. However, fundamental crystals like this one generally exhibit aging rates between ±1 to ±3 ppm per year when operated within rated parameters. Given its ±25 ppm initial tolerance, even conservative aging assumptions suggest that after five years, total accumulated drift could approach ±10 ppm—equivalent to a 130 Hz offset at 13 MHz. This may exceed acceptable thresholds in time-critical systems like real-time clocks or RF synchronization loops. Therefore, while suitable for short-to-medium term embedded applications, designers requiring decade-long stability should consider oven-controlled or TCXO alternatives unless supplemented with periodic calibration routines.

How does the equivalent series resistance (ESR) of 100 ohms in the SXT32415CA38-13.000M influence power consumption and startup behavior in battery-powered devices?: The ESR of 100 ohms in the SXT32415CA38-13.000M represents internal losses in the crystal resonator. Lower ESR improves energy efficiency by reducing power dissipation during oscillation, which is beneficial in low-power designs. At 13 MHz, a 100-ohm ESR implies relatively moderate drive loss compared to lower ESR models (<50 ohms), but higher than premium ultra-low-power variants. In a typical Pierce oscillator configuration drawing 50 µA from a 3.3 V supply, power loss due to ESR would be approximately (I² × R) = (50e-6)² × 100 = 250 nW—negligible overall. However, high drive levels combined with marginal ESR can cause amplitude saturation, increasing EMI and accelerating electrode degradation. Thus, while not prohibitive for most microcontrollers, careful attention to oscillator circuit damping and drive strength is necessary to avoid premature aging in extended deployments.

What are the key differences between the SXT32415CA38-13.000M and other 13 MHz crystals like those in the ECS-130 series in terms of package size, frequency stability, and suitability for compact IoT devices?: The SXT32415CA38-13.000M uses a 4-SMD, no-lead package measuring 3.2 mm × 2.5 mm, offering improved space efficiency over traditional leaded packages. Its ±50 ppm stability is typical for general-purpose crystals, whereas some competitors like the ECS-130-15-XX-DN offer similar form factors but with tighter ±30 ppm stability. Both support surface mount assembly, making them viable for compact IoT modules. However, the SXT32415CA38-13.000M’s slightly lower stability may require more stringent layout practices to mitigate environmental sensitivity. Additionally, the absence of pins reduces solder joint stress, enhancing reliability in vibration-prone environments. When selecting between them, engineers must balance cost, size, and required timing accuracy—choosing the SXT32415CA38-13.000M when moderate precision suffices and budget constraints favor commodity pricing.

Is the SXT32415CA38-13.000M compatible with automatic optical inspection (AOI) and reflow soldering processes commonly used in high-volume SMT assembly?: Yes, the SXT32415CA38-13.000M features a 4-SMD, no-lead footprint optimized for modern SMT lines. Its small dimensions (3.20 mm × 2.50 mm) and flat profile facilitate reliable pick-and-place operations without tombstoning risks. The Moisture Sensitivity Level (MSL) of 1 confirms it requires no special drying prior to reflow, unlike moisture-sensitive components with MSL ≥2. During reflow, peak temperatures below 260°C for less than 60 seconds are safe, aligning with standard lead-free profiles. However, placement accuracy must be within ±0.1 mm to prevent misalignment with pads, especially given the lack of mechanical guides. Most importantly, proper thermal profiling ensures uniform heating to avoid cold joints or microcracks in the crystal structure—critical since even minor defects can degrade frequency stability or cause intermittent failures.

How does the operating temperature range of -30°C to 85°C affect performance in automotive-grade versus industrial control applications using the SXT32415CA38-13.000M?: The SXT32415CA38-13.000M supports operation from -30°C to 85°C, which covers most industrial environments but falls short of automotive AEC-Q200 qualification requiring up to 125°C. At elevated temperatures near 85°C, quartz exhibits reduced motional capacitance and increased ESR, both contributing to higher phase noise. For instance, ESR may rise by 20–30% above room temperature, increasing oscillator loop gain uncertainty. In industrial motor controllers where timing jitter directly impacts commutation accuracy, this variability might necessitate filtering or redundancy. Conversely, in non-automotive settings like consumer electronics or building automation, the device performs reliably. Designers should verify actual system behavior through environmental testing rather than relying solely on datasheet curves, as real-world PCB self-heating and airflow can alter thermal gradients across the crystal.

What considerations apply when cascading multiple timing domains using the SXT32415CA38-13.000M as a reference clock, especially regarding jitter propagation and phase noise integration?: As a fundamental-mode crystal, the SXT32415CA38-13.000M provides clean spectral characteristics with low intrinsic phase noise, making it suitable as a reference source. However, its jitter contribution depends heavily on the oscillator circuit implementation. Assuming a well-designed CMOS inverter-based oscillator with low noise floor, integrated jitter might measure <1 ps RMS over 12 kHz–20 MHz bandwidth. When used to clock downstream ICs such as FPGAs or ADCs, this jitter accumulates additively across distribution stages unless buffered properly. For example, distributing the 13 MHz signal through multiple logic families could double jitter due to threshold dispersion. Therefore, in precision measurement systems, dedicated clock buffers with matched propagation delays should isolate the crystal oscillator from loads to preserve timing integrity. Otherwise, the cumulative effect may violate setup/hold times in synchronous interfaces like I²C at high speeds (>400 kHz).

Does the RoHS compliance status of the SXT32415CA38-13.000M guarantee full compatibility with EU environmental regulations, and are there any hidden restrictions related to rare materials?: The RoHS3 compliance of the SXT32415CA38-13.000M indicates adherence to Directive 2011/65/EU, restricting lead, mercury, cadmium, hexavalent chromium, PBB, PBDE, DBP, DIBP, DEHP, and TBBPA. Since crystals contain negligible amounts of these substances, this certification reflects standard manufacturing practices rather than exceptional material choices. However, "RoHS compliant" does not imply REACH SVHC exemption—though Suntsu Electronics states REACH info is available upon request, implying potential use of registered substances. Designers sourcing globally should confirm SVHC content (<0.1%) for items of very high concern. Additionally, while the component itself avoids restricted elements, associated packaging or labels may not be fully compliant. Always request full material disclosure statements from suppliers to avoid customs delays or penalties in regulated markets.

How should the SXT32415CA38-13.000M be stored before use to prevent frequency shift or mechanical degradation, given its MSL rating and absence of protective coating?: With an MSL of 1, the SXT415CA38-13.000M poses minimal risk from moisture absorption during storage. Nevertheless, best practice dictates keeping it in sealed antistatic bags at ambient conditions (≤60% RH, 25°C max) to prevent contamination and physical abrasion. Crystals are brittle; dropping or scratching electrodes can induce stress fractures that alter resonance frequency or cause intermittent operation. Avoid prolonged exposure to solvents or cleaning agents during handling. If stored longer than one year, visual inspection under magnification is advised for surface defects. Although no bake cycle is needed before reflow, maintaining consistent storage conditions minimizes batch-to-batch variation—particularly important when sourcing from different warehouses or vendors, as humidity fluctuations can subtly affect surface adsorption layers affecting initial frequency trim.

What role does the 15 pF load capacitance play in tuning the resonant mode of the SXT32415CA38-13.000M, and how does this interact with MCU internal capacitance in common oscillator configurations?: The specified 15 pF load capacitance determines the electrical environment around the crystal electrodes, shaping the series and parallel resonant frequencies. In a typical Pierce oscillator, external capacitors (C1 and C2) plus PCB stray capacitance (typically 2–5 pF) must total 15 pF to meet the crystal’s requirement. Modern MCUs often include programmable load capacitance settings (e.g., 8, 12, or 18 pF), allowing software adjustment via internal trimming. For example, if the MCU defaults to 12 pF internal capacitance, external caps of 3–4 pF would suffice. Mismatch leads to off-frequency operation: too little load shifts frequency upward, too much downward. This affects timing accuracy and can push the oscillator outside the guaranteed start-up window, particularly at extreme temperatures. Careful calculation using the formula CL = (C1 × C2)/(C1 + C2) + CS yields correct values, ensuring stable operation across all conditions.

Are there any known reliability issues with the SXT32415CA38-13.000M under high-drive conditions, and how do drive levels impact long-term frequency drift?: Excessive drive levels—often caused by improper feedback resistor selection or incorrect amplifier gain in oscillator circuits—can degrade the SXT32415CA38-13.000M’s performance over time. High drive increases acoustic energy within the crystal, accelerating electrode erosion and shifting resonant frequency. Studies show that doubling drive current from optimal levels can triple aging rates. While the datasheet doesn’t specify maximum drive, industry norms cap it below 100 µW for fundamental crystals. In practice, this translates to keeping output swing below 0.8 Vpp across the crystal terminals. If the host MCU drives the crystal directly without isolation, ensure it operates in low-noise mode and avoids rapid transitions. Monitoring startup time also helps: abnormally slow oscillation suggests overdamping or insufficient gain, while immediate overshoot points to overdrive. Regular reliability screening including accelerated life testing (85°C/85% RH, 1000 hours) is recommended for safety-critical applications, though MSL 1 implies good inherent robustness.

How does the fundamental mode operation of the SXT32415CA38-13.000M compare to overtone modes in terms of harmonic purity and susceptibility to interference in RF-congested environments?: Operating in fundamental mode, the SXT32415CA38-13.000M emits only the primary 13 MHz tone with minimal harmonics, resulting in cleaner spectral output than overtone crystals running at multiples like 39 MHz. Harmonic energy above 20 MHz is typically <-40 dBc, reducing coupling into nearby RF bands. This makes it preferable in mixed-signal boards where switching regulators or wireless modules operate nearby. Overtone crystals require filtering to suppress spurious responses, adding complexity. Conversely, overtone types allow higher frequencies without larger packages, but at the cost of greater sensitivity to parasitic capacitance and layout parasitics. For the SXT32415CA38-13.000M, proper grounding and shielding of oscillator traces further enhances immunity. In RF-rich environments, placing the crystal close to the MCU with minimal vias and guard rings minimizes radiation and reception of interference, preserving timing integrity.

What impact does PCB layout parasitics have on the effective load capacitance seen by the SXT32415CA38-13.000M, and how can engineers minimize unintended frequency deviation?: PCB trace length and width contribute significantly to stray capacitance, typically adding 2–4 pF per square centimeter near the crystal pads. Longer traces increase inductance, affecting impedance matching and damping. For precise 15 pF load targeting, failing to account for these parasitics results in net load deviation of several picofarads—enough to shift frequency by 10–15 ppm. To minimize effects, place the SXT32415CA38-13.000M as close as possible to the MCU’s oscillator pin, use wide ground planes beneath without cuts near pads, and limit trace lengths to <5 mm. Stitching vias around the crystal enhance return path integrity, reducing radiation. Simulation tools like ANSYS SIwave or SPICE models incorporating PCB stackup data allow predictive analysis. Alternatively, iterative tuning using network analyzers or frequency counters during prototype bring-up provides empirical validation, adjusting external capacitor values empirically until stable 13.000 MHz is achieved across temperature extremes.

Can the SXT32415CA38-13.000M be substituted with another crystal model in legacy designs, and what trade-offs arise in terms of size, stability, and procurement lead time?: Substitution is feasible if alternative crystals share comparable electrical and mechanical parameters. For example, swapping the SXT32415CA38-13.000M with a Murata CX2016XBA-13.000M offers identical frequency and package but with ±30 ppm stability and lower ESR (50 ohms). Benefits include tighter timing accuracy and reduced power loss, but potential downsides include longer procurement cycles and higher unit cost. Conversely, using a less stable part like ±100 ppm may save money but compromise system reliability in temperature-varying environments. Mechanical compatibility requires verifying pad alignment and height constraints in tight enclosures. Procurement risks increase if the replacement part has limited distributor stock or obsolescence warnings. Designers should update schematics, BOMs, and layout files systematically, validating functionality through environmental stress tests before committing to production, especially in long-lifecycle products where component availability matters.

Parts with Similar Specifications

The three parts on the right have similar specifications to Suntsu Electronics, Inc. SXT32415CA38-13.000M

Product Attribute
Part Number	SXT32415CA38-13.000MT	SXT32415CA38-13.560MT	SXT32415CA38-13.560M	SXT32415CA38-11.0592MT
Manufacturer	Suntsu Electronics, Inc.	Suntsu Electronics, Inc.	Suntsu Electronics, Inc.	Suntsu Electronics, Inc.
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Ratings	-	-	-	-
Frequency	-	-	-	-
Type	-	-	-	-
Frequency Stability	-	-	-	-
Size / Dimension	-	-	-	-
Height - Seated (Max)	-	-	-	-
Series	-	-	-	-
Load Capacitance	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
ESR (Equivalent Series Resistance)	-	-	-	-
Frequency Tolerance	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Operating Mode	-	-	-	-

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