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Home Products RF/IF and RFID RF Antennas~~ANT165550ST-1003A1~~

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ANT165550ST-1003A1 - TDK Corporation

Name: TDK Corporation ANT165550ST-1003A1
Brand: TDK Corporation
SKU: ANT165550ST-1003A1
Price: 0.035 USD
Availability: InStock
Rating: 5 (9 reviews)

Manufacturer Part Number: ANT165550ST-1003A1

Manufacturer: TDK Corporation

Allelco Part Number: 98D-ANT165550ST-1003A1

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 3,263 pcs available, New & Original

Parts Description: RF ANT 5.6GHZ CHIP SOLDER SMD

Package: Tape & Reel (TR)

Data sheet: ANT165550ST-100.pdf

Datasheets
Cylindrical Battery Holders.pdf

PCN Assembly/Origin
2.73KHz.pdf

HTML Datasheet
Cylindrical Battery Holders.pdf

RoHs Status: ROHS3 Compliant

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Quantity	Unit Price	Ext. Price
1+	$0.096	$0.10
200+	$0.037	$7.40
500+	$0.036	$18.00
1000+	$0.035	$35.00

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Specifications

ANT165550ST-1003A1 Tech Specifications
TDK Corporation - ANT165550ST-1003A1 technical specifications, attributes, parameters and parts with similar specifications to TDK Corporation - ANT165550ST-1003A1

Product Attribute	Attribute Value
Manufacturer	TDK Corporation
VSWR	1.6
Termination	Solder
Series	-
Return Loss	-
RF Family/Standard	WiFi
Package	Tape & Reel (TR)
Number of Bands	1
Mounting Type	Surface Mount

Product Attribute	Attribute Value
Ingress Protection	-
Height (Max)	0.016' (0.40mm)
Gain	-
Frequency Range	5.15GHz ~ 5.9GHz
Frequency Group	SHF (f > 4GHz)
Frequency (Center/Band)	5.6GHz
Features	-
Applications	WLAN
Antenna Type	Chip

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
ECCN	EAR99
HTSUS	8529.10.9100

Frequently Asked Questions(FAQ)

What are the key performance characteristics of the TDK ANT165550ST-1003A1 chip antenna for WLAN applications, and how do they influence real-world signal integrity in dense RF environments?: The TDK ANT165550ST-1003A1 is optimized for 5.15GHz to 5.9GHz operation within the SHF band, targeting IEEE 802.11a/n/ac/ax (WiFi) implementations. With a Voltage Standing Wave Ratio (VSWR) of 1.6 across its operational bandwidth, this value indicates efficient power transfer from the transceiver to the antenna with minimal reflections—lower than the typical threshold of 2.0 for acceptable performance. This low VSWR reduces insertion loss and improves overall system efficiency, which is critical in battery-powered or high-throughput devices where radiated power directly impacts data rates and range. While absolute gain and return loss values aren’t specified in the summary, a VSWR of 1.6 typically correlates with better than 10 dB return loss, suggesting strong impedance matching under nominal conditions. However, in densely populated RF environments—such as urban access points or IoT hubs operating in unlicensed bands—even minor mismatches can lead to interference and packet retransmissions due to increased noise susceptibility. Therefore, proper PCB layout, ground plane design, and clearance around the antenna are essential to maintain consistent performance and avoid detuning effects.

How does the surface-mount solder termination of the TDK ANT165550ST-1003A1 impact manufacturing reliability compared to alternative packaging formats like wire bonding or connector-based antennas?: The TDK ANT165550ST-1003A1 uses a direct solder pad interface for surface mount assembly, which simplifies high-volume production by enabling automated pick-and-place processes compatible with standard reflow soldering profiles. Solder termination provides robust mechanical attachment and stable electrical contact over time, reducing failure risks associated with vibration or thermal cycling—especially important in industrial or automotive applications. In contrast, wire-bonded antennas often require additional encapsulation and are more vulnerable to micro-crack formation during flexure, while connectorized versions introduce parasitic inductance and potential moisture ingress points. For compact designs such as smartphones or embedded modules, the lack of connectors also reduces form factor and cost. Given that the component has an MSL rating of 1, it supports unlimited storage before use, making inventory handling flexible without requiring dry storage—further enhancing supply chain resilience. Thus, the solder-based SMT approach offers a balanced trade-off between manufacturability, durability, and integration density.

Can the TDK ANT165550ST-1003A1 be used in both client-side devices and infrastructure equipment, or is its design biased toward specific end-use scenarios?: Although the datasheet lists "WLAN" broadly as the application domain, the narrow bandwidth (5.15–5.9GHz), moderate gain profile, and compact footprint suggest the TDK ANT165550ST-1003A1 is primarily intended for client-side or edge devices rather than high-gain infrastructure antennas. Access points or routers typically employ larger aperture antennas with higher gain (e.g., 5–8 dBi) and wider beamwidths to cover multiple clients; the absence of explicit gain specification here implies lower directivity. Instead, this antenna appears tuned for space-constrained consumer electronics such as Wi-Fi modules, IoT sensors, or embedded systems where integration depth outweighs raw range requirements. That said, in small cell deployments or distributed antenna systems (DAS), it could serve as a secondary radiator if directional performance is not critical. Its RoHS3 compliance further aligns with global regulatory expectations across both commercial and residential markets.

What design considerations should engineers prioritize when integrating the TDK ANT165550ST-1003A1 into a PCB layout to avoid detuning and ensure consistent VSWR performance?: Maintaining consistent VSWR at 1.6 requires careful attention to the antenna’s proximity to conductive structures and reference planes. The antenna must be mounted on a solid, uninterrupted ground plane with minimal obstructions above or below its radiating element. Clearance zones—typically defined as a minimum distance equal to one-quarter wavelength at center frequency (approximately 13 mm at 5.6 GHz)—should be preserved around the antenna to prevent coupling with traces, metal enclosures, or adjacent components. High-impedance traces, power planes, or mounting brackets near the antenna can alter its radiation pattern and degrade impedance match. Additionally, decoupling capacitors and RF traces should be routed away from the antenna area to minimize capacitive loading. Simulation tools like HFSS or CST can model these interactions early in development, but empirical validation via vector network analyzer (VNA) measurements remains essential before final production release.

How does the height profile of the TDK ANT165550ST-1003A1 (0.40 mm) influence placement constraints in thin-profile devices compared to taller antenna solutions?: At only 0.40 mm in height, the TDK ANT165550ST-1003A1 enables ultra-low-profile designs suitable for slim notebooks, tablets, or wearable devices where internal volume is limited. This miniaturization comes at the cost of reduced radiation efficiency and narrower bandwidth compared to larger antennas, but it aligns well with modern form factor trends. Engineers must ensure that no internal shielding cans, battery packs, or plastic enclosures come within close proximity (<5 mm) of the antenna, as even non-metallic materials can absorb RF energy or shift resonant frequency. In multi-antenna systems (e.g., dual-band Wi-Fi + Bluetooth), coexistence becomes more challenging due to spatial constraints; isolation between antennas must be carefully managed to avoid desensitization. Despite its small size, the antenna still demands dedicated real estate on the top layer of the PCB, limiting routing flexibility beneath it.

Is there any evidence of frequency stability issues with the TDK ANT165550ST-1003A1 across temperature variations common in industrial environments?: While explicit thermal derating curves are not provided in the summary, most ceramic-based chip antennas exhibit relatively stable resonance characteristics over industrial temperature ranges (-40°C to +85°C). The TDK ANT165550ST-1003A1’s narrow bandwidth suggests tight tolerance in fabrication, which generally aids frequency stability. However, extreme thermal gradients or rapid cycling may affect solder joint integrity over long-term reliability. Empirical testing under accelerated life conditions (e.g., thermal shock per JEDEC JESD22-A104) would be required to confirm robustness. For safety-critical applications, it’s advisable to validate VSWR and radiation pattern across full operating temperature span using environmental chambers. If frequency drift exceeds ±50 MHz, it could push operation outside the 5.15–5.9 GHz band, violating regulatory limits or degrading link budget.

How does the ECCN classification (EAR99) of the TDK ANT165550ST-1003A1 affect international export compliance compared to antennas classified under stricter regimes?: The ECCN designation EAR99 means this antenna is subject to U.S. Export Administration Regulations (EAR) but is generally eligible for export without a license under most circumstances, provided it is not destined for restricted end-users or countries. This simplifies logistics for OEMs sourcing globally, especially those deploying IoT devices across North America, Europe, and Asia. Unlike items with ECCNs such as 7A994 (which includes certain active RF components), passive antennas like this one pose lower proliferation risk. Nevertheless, exporters must still comply with anti-boycott reporting and ensure final destination isn’t listed on denied party screenings. For companies operating in regulated sectors (e.g., defense or telecommunications infrastructure), internal classification reviews may still apply, but overall supply chain agility is enhanced relative to higher-controlled commodities.

Should engineers expect significant variation in gain performance between units of the TDK ANT165550ST-1003A1, and what metrics best reflect its suitability for link budget calculations?: Since the datasheet does not specify gain numerically, it's reasonable to assume this is a passive radiator with modest isotropic gain, likely ranging from -3 dBi to +1 dBi depending on implementation. Such values are typical for compact chip antennas, where gain is sacrificed for size and integration ease. Without manufacturer-provided gain patterns or radiation efficiency data, engineers should treat this component as a black-box emitter whose output depends heavily on surrounding structure. For accurate link budget analysis, worst-case assumptions based on similar TDK models suggest a conservative estimate of -2 dBi gain with 70% radiation efficiency. Coupled with the VSWR of 1.6 (≈0.2 dB additional loss), total system loss might reach 1.5 dB—significant in short-range links. Therefore, prototyping with actual hardware under representative load conditions is strongly recommended before committing to design.

How does the tape and reel packaging format benefit procurement and assembly workflows involving the TDK ANT165550ST-1003A1?: Packaged in Tape & Reel (TR), the TDK ANT165550ST-1003A1 is fully compatible with automated SMT assembly lines, enabling high-speed placement and reducing manual handling errors. This format supports continuous feeding during reflow processes and integrates seamlessly with standard pick-and-place machines used by contract manufacturers. It also facilitates just-in-time inventory management and reduces static discharge risks through controlled carrier material. For distributors, TR packaging allows bulk handling and minimizes damage during shipping. Given the MSL 1 rating, components remain shelf-stable indefinitely, so procurement teams can stockpile without concern for degradation. This logistical advantage lowers total cost of ownership for high-volume producers while maintaining traceability through serialization if needed.

In what ways might the lack of detailed return loss specifications impact pre-compliance testing for FCC or CE certification involving the TDK ANT165550ST-1003A1?: Absence of explicit return loss figures means designers cannot assume ideal impedance matching (e.g., < -10 dB) without measurement verification. Poor return loss (> -6 dB) translates directly to reflected power and reduced effective isotropic radiated power (EIRP), potentially causing out-of-spec emissions or failed conducted tests. Pre-compliance setups using VNA must include calibration standards traceable to NIST and account for fixture parasitics. If the measured return loss is worse than expected, redesign efforts may involve adding matching networks (L-match, pi-network) or adjusting grounding. However, such modifications increase bill of materials (BOM) complexity and reduce integration benefits. Early characterization with calibrated test fixtures is therefore non-negotiable for certification readiness, particularly in Class B products where emission margins are tight.

Parts with Similar Specifications

The three parts on the right have similar specifications to TDK Corporation ANT165550ST-1003A1

Product Attribute
Part Number	ANT162500ST-1002A1	ANT161575ST-1202A1	ANT161575TT-3000A1	ANT162442ST-1000AM1
Manufacturer	TDK Corporation	TDK Corporation	TDK Corporation	TDK Corporation
Height (Max)	-	-	-	-
Termination	-	-	-	-
Frequency (Center/Band)	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
VSWR	-	-	-	-
Antenna Type	-	-	-	-
Features	-	-	-	Simultaneous Sampling
Series	-	-	-	-
Ingress Protection	-	-	-	-
Number of Bands	-	-	-	-
Return Loss	-	-	-	-
RF Family/Standard	-	-	-	-
Applications	-	-	-	-
Gain	-	-	-	-
Frequency Group	-	-	-	-
Frequency Range	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)

ANT165550ST-1003A1 Datasheet PDF

Download ANT165550ST-1003A1 pdf datasheets and TDK Corporation documentation for ANT165550ST-1003A1 - TDK Corporation.

Datasheets: Cylindrical Battery Holders.pdf
PCN Assembly/Origin: 2.73KHz.pdf
HTML Datasheet: Cylindrical Battery Holders.pdf

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Jul 20, 2026

Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.
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Jul 15, 2026

Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.
FPGA***lorer88

Jul 7, 2026

The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.
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Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.
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Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.
Liam***terTech

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Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.
Nath***rooks

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Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.

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America	Brazil	7
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