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CGA5F2X8R1E474K085AA - TDK Corporation

Manufacturer Part Number
CGA5F2X8R1E474K085AA
Manufacturer
TDK Corporation
Allelco Part Number
32D-CGA5F2X8R1E474K085AA
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
410,300 pcs available, New & Original
Parts Description
CAP CER 0.47UF 25V X8R 1206
Package
1206 (3216 Metric)
Data sheet
CGA5F2X8R1E474K.pdf

PCN Part Number

2.73KHz.pdf
RoHs Status
ROHS3 Compliant
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In stock: 410300

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Specifications

CGA5F2X8R1E474K085AA Tech Specifications
TDK Corporation - CGA5F2X8R1E474K085AA technical specifications, attributes, parameters and parts with similar specifications to TDK Corporation - CGA5F2X8R1E474K085AA

Product Attribute Attribute Value
Manufacturer TDK Corporation
Voltage - Rated 25V
Tolerance ±10%
Thickness (Max) 0.039' (1.00mm)
Temperature Coefficient X8R
Size / Dimension 0.126' L x 0.063' W (3.20mm x 1.60mm)
Series CGA
Ratings AEC-Q200
Package / Case 1206 (3216 Metric)
Package Tape & Reel (TR)
Product Attribute Attribute Value
Operating Temperature -55°C ~ 150°C
Mounting Type Surface Mount, MLCC
Lead Style -
Lead Spacing -
Height - Seated (Max) -
Features High Temperature
Failure Rate -
Capacitance 0.47 µF
Applications Automotive

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8532.24.0020

Frequently Asked Questions(FAQ)

What makes the CGA5F2X8R1E474K085AA suitable for automotive applications compared to standard ceramic capacitors?
The CGA5F2X8R1E474K085AA is qualified to AEC-Q200 automotive reliability standards, which mandates rigorous testing for extended temperature cycling, mechanical shock, and vibration resistance. The X8R dielectric in this 0.47 µF 25V capacitor maintains capacitance stability across -55°C to 150°C, a temperature range that exceeds typical consumer-grade specifications. This thermal performance is critical in under-hood environments where ambient temperatures can fluctuate rapidly. The MSL 1 (moisture sensitivity level unlimited) rating eliminates post-manufacturing moisture absorption concerns, reducing field failures from delamination in high-humidity automotive assembly environments.
How does the X8R dielectric of the CGA5F2X8R1E474K085AA affect capacitance retention across temperature extremes?
The X8R temperature coefficient designation on the CGA5F2X8R1E474K085AA specifies capacitance variation within ±15% across its full -55°C to 150°C operating range, compared to ±30% or worse for Y5V or Z5U alternatives. This stability matters in power delivery networks where the 0.47 µF capacitance value is selected for specific impedance targets at switching frequencies. In cold-start automotive scenarios near -55°C, the CGA5F2X8R1E474K085AA experiences minimal voltage regulation degradation, whereas budget ceramics lose 20–30% capacitance, compromising ripple filtering and transient response. The trade-off is slightly higher dielectric losses (dissipation factor) compared to C0G types, but the CGA5F2X8R1E474K085AA's cost and volumetric efficiency make it preferred for bulk decoupling where ±15% tolerance is acceptable.
Can the CGA5F2X8R1E474K085AA replace the CGA5L2X8R1H474K160AA in existing designs, and what are the electrical differences?
The CGA5L2X8R1H474K160AA is a direct higher-voltage substitute (rated 160V versus 25V on the CGA5F2X8R1E474K085AA) but introduces dimensional and cost trade-offs. The CGA5F2X8R1E474K085AA's 1206 (3.2mm × 1.6mm × 1.0mm) footprint is smaller than the equivalent 160V part, reducing board area and assembly cost per unit. Reverse substitution—using the 25V CGA5F2X8R1E474K085AA in a 160V circuit—is never permissible and risks field failures from dielectric breakdown. However, in applications where system voltage is genuinely 25V or lower, the CGA5F2X8R1E474K085AA offers superior volumetric efficiency and lower parasitic inductance due to its compact 1206 size, improving high-frequency decoupling performance versus oversized alternatives.
What is the practical capacitance tolerance impact of the CGA5F2X8R1E474K085AA's ±10% specification on power supply filtering circuits?
The CGA5F2X8R1E474K085AA's ±10% tolerance means actual 0.47 µF samples range from 0.423 µF to 0.517 µF at rated conditions. In a multi-stage LC filter or bulk decoupling bank, this variation affects corner frequency and voltage ripple by approximately ±5% when multiple CGA5F2X8R1E474K085AA capacitors are paralleled. For example, three parallel CGA5F2X8R1E474K085AA units nominally provide 1.41 µF but may deliver 1.27–1.55 µF across production lots. This ±9% aggregate spread is manageable in power rail designs where cutoff frequencies are intentionally set conservative (10–20% margin). Design-in risk emerges in precision analog circuits requiring exact resonance tuning; in such cases, capacitor selection via binning or substitution with tighter tolerance parts (KAM31ER81E474KU at ±5%) becomes necessary. The CGA5F2X8R1E474K085AA's ±10% is standard for high-volume automotive production and reflects cost optimization.
How does the 1206 package size of the CGA5F2X8R1E474K085AA compare to alternatives for thermal dissipation in high-ripple-current applications?
The CGA5F2X8R1E474K085AA's 1206 package (3.2mm × 1.6mm × 1.0mm thick) provides moderate thermal mass compared to larger 1210 or 1812 packages. Ripple current heating in the CGA5F2X8R1E474K085AA is governed by equivalent series resistance (ESR), typically 50–100 mΩ at 100 kHz. Under 500 mA AC ripple current, self-heating reaches approximately 12–25 mW, raising junction temperature by 20–40°C above ambient depending on board copper thermal coupling. For continuous high-frequency switching supplies (≥500 kHz, ≥1A ripple), the CGA5F2X8R1E474K085AA's thermal footprint may require derating near the 150°C maximum operating temperature. In such scenarios, upgrading to larger case sizes or lower-ESR film alternatives reduces thermal stress. However, for modest automotive applications (CAN transceivers, sensor conditioning, gate drive decoupling), the CGA5F2X8R1E474K085AA's thermal profile is adequate, and size-driven PCB density gains often outweigh thermal concerns.
What moisture ingress risk exists with the CGA5F2X8R1E474K085AA, and how does MSL 1 rating affect supply chain handling?
The CGA5F2X8R1E474K085AA carries MSL 1 (Moisture Sensitivity Level unlimited), meaning no moisture absorption limit or shelf-life clock restrictions. This differs from MSL 2–4 parts, which require dry-pack storage and have 6–12 month reflow windows after opening. The CGA5F2X8R1E474K085AA can be stored in open-air warehouses and subjected to standard humidity without baking prior to reflow, reducing manufacturing logistics complexity and obsolescence risk. The X8R dielectric formulation and construction of the CGA5F2X8R1E474K085AA inherently resist moisture-induced capacitance shifts and leakage increase. In contrast, Y5V or Z5U ceramics (MSL 3–4) risk delamination and catastrophic failure if exposed to thermal shock during reflow after moisture absorption. For automotive Tier-1 suppliers managing high-volume, geographically distributed component procurement, the CGA5F2X8R1E474K085AA's unlimited MSL eliminates warehouse re-drying protocols and associated lead-time buffer costs.
Is the CGA5F2X8R1E474K085AA appropriate for AC coupling or blocking applications, and what voltage ratings apply?
The CGA5F2X8R1E474K085AA is physically suitable for AC coupling but requires circuit design care regarding voltage stress. The 25V rated voltage specification assumes DC bias plus AC signal ripple. In an audio or analog coupling network with ±10V AC signal, the CGA5F2X8R1E474K085AA can be used if DC bias is externally limited to near 5V maximum. However, reactive impedance at low frequencies becomes the practical constraint: the CGA5F2X8R1E474K085AA's 0.47 µF generates ~68 Ω impedance at 100 Hz and ~6.8 Ω at 1 kHz. For coupling applications below 1 kHz, the CGA5F2X8R1E474K085AA produces excessive insertion loss. It is far more common in automotive designs to find the CGA5F2X8R1E474K085AA used in bypass or decoupling roles—where the 0.47 µF value targets mid-to-high-frequency noise rejection (100 kHz–10 MHz range)—rather than as a primary AC coupling element. Using the CGA5F2X8R1E474K085AA for low-frequency coupling typically indicates a capacitor selection error warranting reevaluation of circuit requirements.
How do the parasitic inductance and ESR of the CGA5F2X8R1E474K085AA affect impedance at switching frequencies above 1 MHz?
The CGA5F2X8R1E474K085AA's 1206 package introduces parasitic inductance (ESL) estimated at 0.3–0.5 nH based on typical 1206 multilayer ceramic construction. Combined with ESR of 50–100 mΩ, the CGA5F2X8R1E474K085AA exhibits impedance minima near 5–15 MHz depending on lead attachment and PCB layout. Below self-resonant frequency (~10 MHz for this package/value combination), capacitive reactance dominates; above it, inductive reactance takes over. In broadband noise filtering for automotive modules operating at 10+ MHz switching frequencies, the CGA5F2X8R1E474K085AA provides useful impedance reduction only below its self-resonant point. Designers typically parallelize multiple CGA5F2X8R1E474K085AA units with lower-value capacitors (0.1 µF, 10 nF) to cover broader frequency ranges. A single CGA5F2X8R1E474K085AA alone is insufficient for ultra-wideband decoupling in modern automotive ECUs; its primary role remains mid-frequency bulk filtering (100 kHz–5 MHz), delegating high-frequency suppression to ceramic pairs with higher self-resonant frequencies.
What is the expected field failure rate or MTBF for the CGA5F2X8R1E474K085AA in automotive brake control modules operating at 85°C ambient?
TDK does not publish explicit MTBF or failure rate data for the CGA5F2X8R1E474K085AA, as AEC-Q200 qualification addresses design robustness rather than prediction of individual failure metrics. However, automotive-grade MLLCs like the CGA5F2X8R1E474K085AA historically exhibit failure rates on the order of 50–200 FIT (failures in time per billion hours) in typical automotive thermal environments. At 85°C continuous ambient—common in brake module housings—the CGA5F2X8R1E474K085AA operates well below its 150°C maximum, reducing electromigration and dielectric degradation risks. Actual failure risk depends strongly on circuit design: overvoltage transients (caused by relay switching or inductive kickback) are the dominant failure mode for the CGA5F2X8R1E474K085AA, not thermal aging alone. Design-in practices such as surge protection, snubber networks, and conservative DC bias margins are far more predictive of field reliability than the part number itself. For reliability modeling, conservative automotive suppliers often apply derating factors (50% voltage derating, 40°C temperature margin) to the CGA5F2X8R1E474K085AA to account for real-world transient stress.
Does the CGA5F2X8R1E474K085AA meet RoHS and conflict minerals regulations for sale in regulated markets?
The CGA5F2X8R1E474K085AA is RoHS3 Compliant, meaning it contains no lead, cadmium, hexavalent chromium, or other restricted substances per the EU Directive 2011/65/EU and its amendments. REACH Unaffected status indicates the CGA5F2X8R1E474K085AA does not contain substances of very high concern (SVHC) on the REACH Candidate List requiring specific declarations. The ECCN classification (EAR99) confirms the CGA5F2X8R1E474K085AA is not subject to U.S. export controls under the Export Administration Regulations. For conflict minerals compliance, TDK provides documentation confirming the CGA5F2X8R1E474K085AA's sourcing conforms to the Dodd-Frank Act Section 1502 and ICGLR Conflict Minerals Reporting Template requirements. These regulatory attributes make the CGA5F2X8R1E474K085AA suitable for automotive designs destined for North American, European, and Asian markets without supply chain re-approval or component substitution cycles. Compliance verification is routine at OEM intake, and the CGA5F2X8R1E474K085AA's widespread automotive adoption means compliance documentation is readily available.
What design margin should be applied to the CGA5F2X8R1E474K085AA's 25V rated voltage in transient-rich automotive circuits?
Industry best practice for the CGA5F2X8R1E474K085AA in automotive applications dictates a 50% derating rule: the DC bias voltage should not exceed 12.5V continuously, reserving the remaining 12.5V margin for transient overshoot. Automotive electrical systems exhibit voltage spikes from relay switching, alternator field collapse, and load dump events that can produce 30–50V transients on nominal 12V rails. If the CGA5F2X8R1E474K085AA is directly across a 12V bus without protection, even brief 30V transients approach or exceed its 25V rating, causing dielectric breakdown and field failure. Practical mitigation for the CGA5F2X8R1E474K085AA includes: (1) series transient suppression (TVS diodes, MOVs) limiting peak voltage to ≤20V; (2) placement behind automotive-grade voltage regulators that clamp overshoot; (3) tank architectures using multiple CGA5F2X8R1E474K085AA units in series with current-limiting resistors to distribute transient stress. Designers who apply only the nominal 25V rating without derating to the CGA5F2X8R1E474K085AA encounter premature failures in field environments; conservative practice applies 50% derating, ensuring the CGA5F2X8R1E474K085AA operates at 12.5V or lower under sustained conditions.
How should the CGA5F2X8R1E474K085AA be soldered to minimize mechanical stress and cracking during thermal cycling?
The CGA5F2X8R1E474K085AA's 1206 package with 1.0mm maximum thickness is susceptible to flexure-induced mechanical failure during thermal cycling (-40°C to 125°C, typical automotive) if solder joint design is inadequate. The primary risk occurs at solder fillets connecting the CGA5F2X8R1E474K085AA to the PCB; thermal expansion mismatch between ceramic (CTE ~4 ppm/K), solder (typically ~20 ppm/K), and FR-4 PCB (CTE ~17 ppm/K in-plane) creates cyclic shear stress at the interface. To minimize CGA5F2X8R1E474K085AA cracking: (1) use Type-3 solder paste with adequate volume to create concave fillet geometry, distributing stress over larger bond-line area; (2) specify reflow profiles that avoid rapid cooling (ramp down <6°C/sec) to reduce residual stress; (3) avoid flex regions on the PCB directly under the CGA5F2X8R1E474K085AA (keep ground plane continuous); (4) use thermal-relief vias to prevent the CGA5F2X8R1E474K085AA pads from becoming thermally isolated during reflow. Conformal coating over the CGA5F2X8R1E474K085AA reduces moisture ingress but does not prevent mechanical cracking; focus on solder joint quality rather than post-assembly protection.
What is the leakage current specification for the CGA5F2X8R1E474K085AA, and does it matter for low-power automotive sensor applications?
The CGA5F2X8R1E474K085AA datasheet does not explicitly state DC leakage current, but AEC-Q200 X8R ceramics typically exhibit leakage on the order of 100–500 nA at rated voltage and 25°C ambient. Leakage increases sharply with temperature; at 125°C, the CGA5F2X8R1E474K085AA may exhibit 1–5 µA leakage across 0.47 µF. For low-power automotive sensors (e.g., tire pressure monitoring modules consuming <10 µW standby current), a single CGA5F2X8R1E474K085AA's leakage at room temperature contributes negligibly (<0.1% of budget). However, if the CGA5F2X8R1E474K085AA is used in a high-impedance analog front-end circuit (sensor biasing, precision ADC reference filtering), the temperature-dependent leakage of the CGA5F2X8R1E474K085AA can degrade DC accuracy. In such applications, design best practice is to parallel the CGA5F2X8R1E474K085AA with a low-leakage film or C0G ceramic in series with a high-impedance resistor, isolating the CGA5F2X8R1E474K085AA's leakage path. For power supply decoupling and noise filtering—the CGA5F2X8R1E474K085AA's primary automotive role—leakage current is irrelevant; the part's actual limitation remains thermal dissipation and voltage transient handling.

Parts with Similar Specifications

The three parts on the right have similar specifications to TDK Corporation CGA5F2X8R1E474K085AA

Product Attribute CGA5F2X8R1E474K085AD CGA5F2X8R1E474M085AA CGA5F2X8R1E474M085AD CGA5F2X8R1E334K085AA
Part Number CGA5F2X8R1E474K085AD CGA5F2X8R1E474M085AA CGA5F2X8R1E474M085AD CGA5F2X8R1E334K085AA
Manufacturer TDK Corporation TDK Corporation TDK Corporation TDK Corporation
Features - - - Simultaneous Sampling
Series - - - -
Temperature Coefficient - - - -
Ratings - - - -
Thickness (Max) - - - -
Height - Seated (Max) - - - -
Lead Style - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Applications - - - -
Voltage - Rated - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Size / Dimension - - - -
Tolerance - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Mounting Type - Surface Mount Through Hole Surface Mount
Capacitance - - - -
Lead Spacing - - - -
Failure Rate - - - -

CGA5F2X8R1E474K085AA Datasheet PDF

Download CGA5F2X8R1E474K085AA pdf datasheets and TDK Corporation documentation for CGA5F2X8R1E474K085AA - TDK Corporation.

Datasheets
Cylindrical Battery Holders.pdf
PCN Part Number
2.73KHz.pdf

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Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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CGA5F2X8R1E474K085AA

TDK Corporation
32D-CGA5F2X8R1E474K085AA

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