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HomeProductsInductors, Coils, ChokesFixed InductorsVLF302510MT-1R5N
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VLF302510MT-1R5N - TDK Corporation

Manufacturer Part Number
VLF302510MT-1R5N
Manufacturer
TDK Corporation
Allelco Part Number
32D-VLF302510MT-1R5N
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
571,600 pcs available, New & Original
Parts Description
FIXED IND 1.5UH 1.65A 66MOHM SMD
Package
Nonstandard
Data sheet
VLF302510MT-1R5.pdf
RoHs Status
 
Our certification
In stock: 571600

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Specifications

VLF302510MT-1R5N Tech Specifications
TDK Corporation - VLF302510MT-1R5N technical specifications, attributes, parameters and parts with similar specifications to TDK Corporation - VLF302510MT-1R5N

Product Attribute Attribute Value
Manufacturer TDK Corporation
Type Drum Core, Wirewound
Tolerance ±30%
Supplier Device Package -
Size / Dimension 0.118" L x 0.098" W (3.00mm x 2.50mm)
Shielding Shielded
Series VLF-MT
Ratings -
Q @ Freq -
Package / Case Nonstandard
Package Tape & Reel (TR)
Product Attribute Attribute Value
Operating Temperature -40°C ~ 105°C
Mounting Type Surface Mount
Material - Core Ferrite
Inductance Frequency - Test 1 MHz
Inductance 1.5 µH
Height - Seated (Max) 0.039" (1.00mm)
Frequency - Self Resonant -
DC Resistance (DCR) 66mOhm Max
Current Rating (Amps) 1.65 A
Current - Saturation (Isat) 1.65A

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8504.50.8000

Frequently Asked Questions(FAQ)

What are the thermal design considerations when using the VLF302510MT-1R5N inductor in high-frequency switching applications?
The VLF302510MT-1R5N operates across -40°C to 105°C, but thermal management depends on both ambient conditions and self-heating from DC losses. With a 66mOhm maximum DC resistance and 1.65A current rating, the inductor dissipates approximately 180mW at full saturation current (I²R = 1.65² × 0.066 ≈ 0.18W). In compact switching regulators or class-D amplifiers, this self-heating can raise the local board temperature by 15–25°C depending on PCB copper area and airflow. The VLF302510MT-1R5N's shielded drum core construction minimizes radiated losses compared to open-core designs, but the 1.00mm maximum seated height leaves limited thermal coupling to ground planes. For applications approaching the 105°C upper limit, verify inductor temperature using thermal imaging or simulation, as the ±30% inductance tolerance can shift with temperature, affecting circuit Q and efficiency.
How does the VLF302510MT-1R5N compare to the VLS3012HBX-1R5M substitute in terms of electromagnetic shielding and circuit layout impact?
Both the VLF302510MT-1R5N and VLS3012HBX-1R5M are shielded 1.5µH inductors with comparable current ratings, but they differ in physical footprint and shielding architecture. The VLF302510MT-1R5N uses a compact 3.00mm × 2.50mm nonstandard drum core package with 1.00mm height, designed for ultra-dense layouts where space constraints demand minimal vertical clearance. The VLS3012HBX-1R5M typically offers a larger footprint with potentially superior shielding performance due to increased core volume and ferrite coverage. In high-density buck converters or RF modules where magnetic coupling to adjacent traces is critical, the VLF302510MT-1R5N's reduced height can paradoxically improve isolation by allowing tighter trace spacing below the inductor without increasing fringing field interactions. Conversely, the substitute may provide lower DCR if the larger core permits thicker wire, reducing conduction losses. Component availability and cost should be weighed against measured shielding effectiveness in your specific layout using 3D electromagnetic simulations.
Why does the VLF302510MT-1R5N specify both a 1.65A current rating and a 1.65A saturation current, and what happens if this limit is exceeded?
The VLF302510MT-1R5N's current rating and saturation current are identical at 1.65A, indicating that the inductor reaches magnetic saturation at its rated current level. This is an unusual design choice typical of compact inductors where ferrite core volume is minimized for size. At or below 1.65A, the inductance remains nominally 1.5µH (within ±30% tolerance). Beyond 1.65A, the inductor enters a nonlinear saturation regime where inductance drops rapidly—often by 20–50% per 0.1A of overcurrent—causing the circuit's effective impedance to decrease sharply. In a switching regulator, saturation manifests as sudden increases in peak current ripple, reduced output voltage regulation, and potential inductor overheating. The VLF302510MT-1R5N is best suited for applications with tightly controlled peak current limits or designs that inherently prevent overcurrent transients, such as current-mode PWM converters with cycle-by-cycle current limiting.
What role does the ±30% inductance tolerance of the VLF302510MT-1R5N play in multi-phase converter stability and load transient response?
The VLF302510MT-1R5N's ±30% inductance tolerance means actual devices can range from 1.05µH to 1.95µH around the nominal 1.5µH. In single-phase converters, this tolerance typically manifests as 5–10% variation in output voltage ripple and transient overshoot, often acceptable if the design includes sufficient capacitive damping and feedback bandwidth. However, in multiphase buck converters (two, three, or four phases), phase current mismatch becomes problematic. If phase inductances vary by ±30%, some phases will carry significantly higher current density due to the lower-impedance paths, leading to unequal thermal stress and premature failure of the highest-current phase. The VLF302510MT-1R5N should be selected with matched inductance bins (typically ±10% or tighter) if used in multiphase designs, or the converter control firmware should include phase current balancing algorithms. For single-phase applications with high-bandwidth feedback, the tolerance is rarely limiting.
How does the VLF302510MT-1R5N's nonstandard package footprint affect supply chain sourcing and design flexibility?
The VLF302510MT-1R5N's nonstandard 3.00mm × 2.50mm package is optimized for extreme miniaturization but creates sourcing constraints. Unlike standard packages such as 1008 or 1210, the VLF302510MT-1R5N is not interchangeable with off-the-shelf alternatives without layout redesign. TDK's supply relationship is essential; if allocation issues arise or if long-term availability is uncertain, design migration to a substitute such as the VLS3012HBX-1R5M may require PCB respin. From a design flexibility perspective, the nonstandard footprint forces early commitment to this specific component during schematic definition rather than allowing late-stage substitution. Engineers should verify with TDK or authorized distributors that the VLF302510MT-1R5N supports the full production volume and lifecycle required (typically 5–10 years for consumer or industrial designs). The MSL 1 rating (unlimited moisture sensitivity) is favorable for assembly, but the compact size may complicate rework procedures if field repairs are anticipated.
In what frequency range is the VLF302510MT-1R5N most effective, and why is inductance tested at 1 MHz rather than at operating frequency?
The VLF302510MT-1R5N is specified with inductance tested at 1 MHz, a standard reference frequency chosen by component manufacturers to enable consistent comparison across datasheets. However, actual inductance behavior depends on frequency and current. At very low frequencies (below 100 kHz), the VLF302510MT-1R5N exhibits minimal frequency-dependent losses, and inductance remains close to the datasheet nominal value. As frequency rises toward the self-resonant frequency (SRF, not specified here but typically 200–500 MHz for compact inductors), parasitic capacitance causes the impedance curve to peak, after which the component behaves increasingly capacitive. For the VLF302510MT-1R5N, the practical operating range is roughly 100 kHz to 10 MHz; beyond 10 MHz, Q degrades significantly, and impedance behavior becomes unpredictable. In high-frequency switching converters (40–400 kHz), the 1 MHz test frequency is reasonably representative. However, for EMI filtering or RF coupling applications above 100 MHz, the VLF302510MT-1R5N should be validated experimentally or via electromagnetic simulation because the 1 MHz specification does not capture high-frequency impedance behavior.
How should the VLF302510MT-1R5N be oriented and positioned relative to high-speed digital signals to minimize electromagnetic coupling and conducted noise?
The VLF302510MT-1R5N's shielded drum core construction provides significant attenuation of radiated fields, but orientation and placement remain critical in low-noise designs. The magnetic field is concentrated primarily along the axis perpendicular to the PCB (the vertical z-direction), with minimal field spreading laterally. Placing the VLF302510MT-1R5N directly adjacent to high-speed clock or data signal traces may still induce small coupling voltages if those traces run parallel to the inductor's magnetic field. Best practice is to position the VLF302510MT-1R5N at least 5 mm away from sensitive analog or clock routing, or shield the nearby traces with a ground plane layer. The 1.00mm maximum height allows the inductor to sit very close to the PCB surface, potentially improving coupling to an underlying ground plane while reducing coupling to adjacent components. In multi-layer boards with a dedicated ground plane directly beneath the VLF302510MT-1R5N, magnetic flux is largely contained, minimizing far-field radiation. Return current paths should be routed directly under or immediately adjacent to the inductor to form a tight loop and reduce loop area; poor return routing negates the shielding benefit of the VLF302510MT-1R5N.
What is the expected lifespan and failure mechanism of the VLF302510MT-1R5N under continuous operation near its rated current and temperature limits?
The VLF302510MT-1R5N is not rated with a mean time to failure (MTTF) or reliability number in the provided datasheet, but industry experience with wirewound ferrite inductors suggests primary failure modes include wire fatigue (thermal cycling), insulation breakdown (high temperature or high-frequency transients), and ferrite core cracking (mechanical shock or thermal gradient stress). Continuous operation at 1.65A and 105°C creates sustained thermal stress on the fine copper wire and encapsulant; thermal cycling from -40°C to 105°C, even if infrequent, can induce wire fracture within 5–10 years. The ferrite drum core is relatively robust but susceptible to microcracking if the component experiences sustained vibration or severe thermal transients (e.g., power supply startup surges). To extend the VLF302510MT-1R5N lifespan, operate at 70–80% of rated current (approximately 1.2–1.3A), maintain operating temperature below 85°C, and use soft-start circuits to limit inrush current at power-up. In safety-critical or long-lifecycle applications (automotive, industrial controls), recommend thermal and electrical design margin beyond minimum specifications.
Can the VLF302510MT-1R5N be used in parallel-resonant or tank circuit topologies, and how does the ±30% tolerance affect tuning?
The VLF302510MT-1R5N can function in resonant circuits (series or parallel LC tanks) for RF matching, harmonic filtering, or DC–DC converter soft-switching applications. However, the ±30% inductance tolerance introduces significant tuning uncertainty. For a parallel-resonant tank with a 1.5µH VLF302510MT-1R5N and a capacitor, the resonant frequency f_r = 1/(2π√LC) varies by approximately ±15% due to inductance spread alone (assuming fixed capacitance). This frequency shift directly degrades Q, efficiency, and bandwidth. To maintain controlled resonance, the circuit must either (1) include a variable capacitor or varactor for tuning, (2) select the VLF302510MT-1R5N from a tight tolerance bin (±10% or better, often requiring secondary sorting), or (3) design the tank with substantial bandwidth tolerance so that ±30% inductance variation remains within acceptable performance limits. In wireless power transfer, RF amplifier impedance matching, or precision filtering applications, the VLF302510MT-1R5N's tolerance may necessitate post-assembly tuning or the use of tighter-tolerance alternatives.
How does the VLF302510MT-1R5N's 66mOhm DC resistance affect buck converter efficiency and output noise in low-voltage, high-current applications?
The VLF302510MT-1R5N's 66mOhm maximum DCR contributes both conduction loss (I²R heating) and output voltage ripple. In a 3.3V buck converter supplying 1.65A, the inductor voltage drop under full current is 1.65A × 0.066Ω ≈ 109mV, representing significant losses and noise injection. Conduction loss (0.18W at 1.65A) is substantial for a miniature inductor and may require derating at elevated ambient temperatures. The 109mV inductor voltage ripple couples into the output voltage node, creating low-frequency current ripple (typically 5–10 kHz in buck topologies) superimposed on the regulated output. This ripple can affect sensitive analog circuits (op-amps, precision ADCs) if not adequately filtered with output capacitors and local bypass networks. For battery-powered systems where efficiency directly impacts runtime, the VLF302510MT-1R5N's DCR should be compared against lower-DCR alternatives in the same inductance and current class; a reduction from 66mOhm to 50mOhm (roughly 24% less loss) could extend battery life by 2–4% in typical mobile applications. Conversely, the compact size of the VLF302510MT-1R5N may justify the higher DCR loss if space is the dominant constraint.
What is the impact of the VLF302510MT-1R5N's MSL 1 moisture sensitivity rating on manufacturing and field reliability in humid environments?
The VLF302510MT-1R5N carries an MSL 1 (Moisture Sensitivity Level 1) rating, meaning it has unlimited shelf life and does not require baking before reflow soldering, even after extended storage in high-humidity environments. This is favorable compared to MSL 2 or higher components, which demand controlled dry-pack storage and pre-reflow thermal conditioning. For manufacturers, the VLF302510MT-1R5N simplifies inventory management and reduces material waste from moisture-induced rejection. In field reliability, MSL 1 provides confidence that the encapsulant and lead frame will not absorb moisture leading to delamination or insulation failure during the product's operational lifetime. However, MSL rating addresses manufacturing moisture exposure, not operational reliability in extreme humidity. The VLF302510MT-1R5N should still be used with standard potting or conformal coating if the end product is exposed to condensation, salt spray, or sustained high humidity (>95% RH), particularly in outdoor or marine applications. The MSL 1 status simplifies supply chain logistics but should not be interpreted as eliminating the need for environmental protection at the system level.
How should the VLF302510MT-1R5N be validated during design prototyping to confirm datasheet performance and identify potential failure modes early?
During prototype validation, the VLF302510MT-1R5N should be characterized across the full operating range of current (0 to 1.65A), frequency (100 kHz to 10 MHz if applicable), and temperature (-40°C to 105°C). Recommended measurements include: (1) inductance versus current using an LCR meter at 1 MHz, noting the saturation curve and confirming the ±30% tolerance is acceptable for your circuit; (2) DCR at elevated temperature (measure at 25°C and 105°C to quantify resistance drift); (3) thermal imaging during steady-state operation at rated current to verify self-heating predictions; (4) radiated and conducted EMI scans in the final assembly to confirm the shielding effectiveness of the VLF302510MT-1R5N meets system requirements; (5) thermal cycling tests (-40°C to 105°C, 10–20 cycles) followed by continuity and inductance checks to detect early wire fatigue or delamination. In switching converters, capture current and voltage waveforms using a high-bandwidth oscilloscope to verify current ripple magnitude, transition slew rates, and any unexpected harmonic content that might indicate core saturation or coupling issues. Early discovery of stress margins or unexpected behavior allows design iteration before production commitment.

Parts with Similar Specifications

The three parts on the right have similar specifications to TDK Corporation VLF302510MT-1R5N

Product Attribute VLF302510MT-1R5N-CA VLF302510MT-1R0N-CA VLF302510MT-1R0N VLF302510MT-150M
Part Number VLF302510MT-1R5N-CA VLF302510MT-1R0N-CA VLF302510MT-1R0N VLF302510MT-150M
Manufacturer TDK Corporation TDK Corporation TDK Corporation TDK Corporation
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Ratings - - - -
Q @ Freq - - - -
Inductance Frequency - Test - - - -
Inductance - - - -
Material - Core - - - -
Series - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Size / Dimension - - - -
Frequency - Self Resonant - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Current Rating (Amps) - - - -
Current - Saturation (Isat) - - - -
Shielding - - - -
DC Resistance (DCR) - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Height - Seated (Max) - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Tolerance - - - -
Type - - - -

VLF302510MT-1R5N Datasheet PDF

Download VLF302510MT-1R5N pdf datasheets and TDK Corporation documentation for VLF302510MT-1R5N - TDK Corporation.

Datasheets
VLF302510MT Series, Commercial.pdf
PCN Obsolescence/ EOL
VLF-MT 18/May/2017.pdf VLF-MT series update LTB date 25/DEP/2019.pdf

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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VLF302510MT-1R5N Image

VLF302510MT-1R5N

TDK Corporation
32D-VLF302510MT-1R5N

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