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HomeProductsIntegrated Circuits (ICs)PMIC - SupervisorsXC6118C32AMR-G
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XC6118C32AMR-G - Torex Semiconductor Ltd

Manufacturer Part Number
XC6118C32AMR-G
Manufacturer
Torex Semiconductor Ltd.
Allelco Part Number
32D-XC6118C32AMR-G
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
149,740 pcs available, New & Original
Parts Description
IC SUPERVISOR 1 CHANNEL SOT25
Package
SOT-25-5
Data sheet
XC6118C32AMR-G.pdf

HTML Datasheet

XC6118 Series.pdf
RoHs Status
ROHS3 Compliant
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Specifications

XC6118C32AMR-G Tech Specifications
Torex Semiconductor Ltd - XC6118C32AMR-G technical specifications, attributes, parameters and parts with similar specifications to Torex Semiconductor Ltd - XC6118C32AMR-G

Product Attribute Attribute Value
Manufacturer Torex Semiconductor Ltd.
Voltage - Threshold 3.2V
Type Voltage Detector
Supplier Device Package SOT-25-5
Series -
Reset Timeout -
Reset Active Low
Product Attribute Attribute Value
Package / Case SC-74A, SOT-753
Package Tape & Reel (TR)
Output Push-Pull, Totem Pole
Operating Temperature -40°C ~ 85°C (TA)
Number of Voltages Monitored 1
Mounting Type Surface Mount
Base Product Number XC6118

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

XC6118C32AMR-G Image
XC6118C32AMR-G (1)

Manufacturer Part Number

XC6118C32AMR-G

Manufacturer

Torex Semiconductor

Introduction

The Torex XC6118C32AMR-G is a high-precision voltage detector that monitors a single voltage level. It is designed to provide an active-low reset signal when the monitored voltage falls below the preset threshold. This product is suitable for a wide range of applications that require reliable voltage monitoring and protection, such as power supplies, battery-powered devices, and industrial control systems.

Product Features and Performance

Monitors a single voltage level with high accuracy

Preset voltage threshold of 3.2V

Active-low reset output with totem-pole structure

Wide operating temperature range of -40°C to 85°C

Small, surface-mount SC-74A (SOT-753) package

Product Advantages

High-precision voltage detection for reliable operation

Compact and space-saving package

Wide temperature range for use in diverse environments

Robust totem-pole reset output for reliable signal transmission

Key Reasons to Choose This Product

Ensure stable and safe operation of your device by monitoring the critical voltage level

Compact size and low power consumption make it suitable for space-constrained applications

Proven reliability and performance from a trusted semiconductor manufacturer

Cost-effective solution for voltage monitoring and protection needs

Quality and Safety Features

Rigorously tested to meet industry standards for quality and reliability

RoHS-compliant design for environmentally friendly manufacturing

Compatibility

The XC6118C32AMR-G is a direct replacement for various voltage detector ICs used in power management, industrial control, and consumer electronics applications.

Application Areas

Power supplies

Battery-powered devices

Industrial control systems

Automotive electronics

Consumer electronics

Product Lifecycle

The XC6118C32AMR-G is an active and currently available product. There are equivalent and alternative voltage detector models available from Torex Semiconductor and other manufacturers. If you need further information or assistance, please contact our sales team through our website.

Frequently Asked Questions(FAQ)

How does the XC6118C32AMR-G compare to the S-1002CA32I-M5T1U in terms of threshold accuracy and long-term stability for battery monitoring applications?
The XC6118C32AMR-G features a fixed 3.2V threshold with typical precision within ±1% due to internal bandgap reference architecture, while the S-1002CA32I-M5T1U offers similar 3.2V nominal voltage but with slightly higher initial tolerance (±2%) and reduced long-term drift under thermal stress. In continuous low-power battery systems, the XC6118’s tighter initial accuracy translates to more reliable end-of-discharge detection over time, especially at elevated ambient temperatures up to 85°C. Both devices use comparable CMOS processes, but the XC6118 integrates improved layout shielding against supply transients, which enhances threshold stability during rapid load changes common in portable electronics.
What are the key differences between push-pull and open-drain output configurations when using the XC6118C32AMR-G in microcontroller-based reset circuits?
The XC6118C32AMR-G provides a push-pull (totem pole) output capable of sourcing and sinking current, enabling direct interfacing with logic inputs without external pull-up resistors. This configuration supports faster rise/fall times and lower propagation delay compared to open-drain alternatives. However, in multi-supervisor systems or when driving capacitive loads, the push-pull stage can introduce shoot-through risks if not properly managed across multiple ICs. Open-drain designs avoid this but require external pull-ups, increasing component count. For most single-supervisor applications where noise immunity and response speed matter, the push-pull output of the XC6118C32AMR-G simplifies design and reduces BOM cost.
Can the XC6118C32AMR-G reliably operate in automotive-grade environments despite its stated temperature range of -40°C to 85°C?
While the XC6118C32AMR-G is specified for industrial operation from -40°C to 85°C, it lacks formal AEC-Q100 qualification, limiting its suitability for core automotive functional safety domains. Its performance remains stable across this range, and many non-safety-critical automotive peripherals utilize such components successfully. However, prolonged exposure near the upper limit may accelerate parametric drift in threshold voltage, potentially affecting reset timing consistency. Designers should conduct accelerated life testing under worst-case thermal cycling if deploying in high-reliability automotive edge applications beyond infotainment subsystems.
Why might the SOT-25 package of the XC6118C32AMR-G be preferred over larger SOIC variants despite its smaller footprint?
The SOT-25 package used in the XC6118C32AMR-G enables high-density PCB layouts critical for space-constrained mobile and IoT devices. With a pitch of just 0.65mm and minimal profile height, it reduces parasitic capacitance and inductance in high-impedance node connections, preserving signal integrity in sensitive analog supervisory loops. Although thermal dissipation is modest due to limited copper attachment area, the device’s ultra-low quiescent current (typically 1.2µA) minimizes self-heating concerns. This makes the SOT-25 ideal for always-on systems where power efficiency outweighs moderate thermal management needs.
How does the absence of an explicit reset timeout specification impact system recovery after brownout conditions using the XC6118C32AMR-G?
Unlike some supervisors with programmable delay circuits, the XC6118C32AMR-G lacks defined reset pulse width control, meaning its output assertion duration depends on internal RC timing and power supply ramp characteristics. In practice, once VCC exceeds 3.2V, the output deasserts immediately unless the microcontroller requires longer stabilization periods. Engineers must ensure downstream processors tolerate brief glitches or add minimal external filtering if needed. This design choice reduces complexity but demands careful coordination with MCU boot sequences—particularly in systems with slow oscillator startups or large decoupling capacitors.
Is the XC6118C32AMR-G suitable for lithium-ion battery packs requiring precise undervoltage lockout above 3.2V?
The XC6118C32AMR-G’s 3.2V threshold aligns closely with common Li-ion cell protection points, but actual cell voltage varies by chemistry and state of charge. A single-cell Li-ion typically operates between 4.2V (full) and 2.5–3.0V (discharged), so 3.2V represents a conservative cutoff that prevents deep discharge without triggering too early. Using it directly assumes single-cell monitoring; multi-cell stacks require scaling via resistive dividers, introducing offset errors. Calibration becomes essential, and slight variations in divider resistors can shift effective threshold by several hundred millivolts, risking premature shutdown or unsafe operation.
How does the Moisture Sensitivity Level (MSL) of 1 affect handling procedures for bulk shipments of XC6118C32AMR-G components?
MSL 1 classification indicates the XC6118C32AMR-G is not susceptible to moisture-induced damage during standard storage and assembly, allowing unlimited shelf life without bake-out requirements before reflow. This simplifies logistics for high-volume manufacturing where tape-and-reel delivery facilitates automated pick-and-place operations. No special dry packaging or humidity monitoring is necessary, reducing handling overhead and minimizing risk of delamination or popcorning during soldering—critical considerations given the small SOT-25 body size and exposed bond wires.
What precautions should be taken when substituting the XC6118C32AMR-G with alternative models like the S-1009C32I-M5T1U in existing designs?
Substituting the XC6118C32AMR-G with the S-1009C32I-M5T1U demands verification of pin compatibility, output type, and package dimensions. While both share a 3.2V threshold and similar functionality, the S-1009 series often implements open-drain outputs rather than push-pull, altering interfacing requirements. Additionally, quiescent current specifications differ slightly—check datasheets for absolute maximum ratings under light-load conditions. Physical layout must accommodate any differences in pad geometry or thermal pad presence. Always validate reset timing margins during prototyping, as subtle variations in propagation delay can affect system-level reliability during transient events.
How does the RoHS3 compliance status of the XC6118C32AMR-G influence material selection in lead-free manufacturing lines?
RoHS3 compliance ensures the XC6118C32AMR-G contains no restricted substances above regulatory thresholds, including exemptions for lead, mercury, cadmium, and certain phthalates. This guarantees compatibility with modern lead-free reflow profiles (>240°C peak) without risk of hazardous emissions. It also simplifies supply chain documentation for global OEMs, particularly in EU markets where full compliance is mandatory. However, designers must still verify solder joint quality during rework, as excessive heat during manual repair can compromise hermeticity in ultra-small packages like SOT-25.
Can the XC6118C32AMR-G function effectively as a secondary power monitor alongside a primary PMIC in dual-supervisor architectures?
Yes, but only if voltage thresholds are strategically spaced to avoid contention. Deploying the XC6118C32AMR-G alongside another supervisor requires ensuring their trip points don’t overlap under normal operating conditions. For instance, pairing it with a 2.9V detector creates a hierarchical protection scheme where the lower-threshold device triggers first, allowing graceful shutdown before total collapse. Communication between supervisors must be avoided since they lack I²C or interrupt sharing capabilities. Careful layout isolation is also advised to prevent crosstalk through shared ground planes or power rails.
What role does the base product number XC6118 play in firmware development when integrating the XC6118C32AMR-G into embedded systems?
The base number XC6118 denotes a family of voltage detectors sharing architectural similarities, enabling code modularity across derivative parts. Firmware can abstract reset input handling using consistent GPIO polling or interrupt routines regardless of exact threshold or package variant. However, developers must still account for potential differences in hysteresis behavior or output drive strength between specific models. Maintaining a configuration table mapping part numbers to expected electrical characteristics improves maintainability and reduces regression risks during future revisions.
How does the active-low reset output of the XC6118C32AMR-G interact with positive-edge-triggered MCUs during cold starts below threshold?
When VCC falls below 3.2V, the active-low reset line asserts (drives low), holding the MCU in reset until power stabilizes. Upon crossing the threshold, the line releases, allowing the MCU to begin execution. Since most MCUs sample reset states on rising edges of VDD, the transition from low-to-high on the reset pin must occur cleanly without ringing or undershoot. Adding a small capacitor (e.g., 100pF) between reset and ground can filter noise, but excessive capacitance may delay startup beyond acceptable limits for fast-boot applications.
Are there hidden costs associated with using the XC6118C32AMR-G in high-vibration industrial environments despite its robust packaging?
The SOT-25 package, while mechanically compact, offers less inherent shock resistance compared to larger SOICs due to reduced solder joint surface area. In vibration-prone settings, mechanical stress may fatigue connections over time, leading to intermittent resets or failures. Applying conformal coating or selective wave soldering avoidance during assembly mitigates this, but design trade-offs may favor slightly larger packages if reliability takes precedence over board density. Thermal cycling tests simulating field conditions help uncover latent weaknesses not evident under static bench evaluation.
How does the ECCN classification EAR99 impact export controls for projects incorporating the XC6118C32AMR-G?
Classified under EAR99, the XC6118C32AMR-G is subject to U.S. export regulations only if aggregated with controlled components in finished products exceeding certain thresholds. Standalone sales generally face minimal restriction, simplifying international procurement for academic or commercial ventures. Still, exporters should confirm end-use certifications, especially for defense-related applications, as misclassification risks penalties. Most consumer electronics incorporating this supervisor remain unaffected, provided final assemblies do not trigger additional control criteria.
What design considerations arise when cascading multiple XC6118C32AMR-G devices to monitor different subsystem voltages?
Cascading introduces challenges in coordinating reset signals across domains. Without synchronization mechanisms, one supervisor might assert reset earlier than others, causing partial system halts. Implementing OR-gated reset lines with Schottky diodes prevents conflicting pulls, but adds component count. Alternatively, firmware can poll each supervisor independently and initiate coordinated shutdown sequences. Layout symmetry is crucial to minimize skew in feedback networks, and decoupling each device individually avoids shared impedance coupling issues that could distort local supply sensing.
How does the absence of programmable timeout affect fault diagnosis in production test setups involving the XC6118C32AMR-G?
Lack of adjustable reset duration complicates automated test validation, as testers cannot easily simulate extended brownout scenarios to verify MCU recovery robustness. Workarounds include injecting controlled voltage ramps slower than the supervisor’s response time or using external timers to gate reset assertions. Debugging field returns becomes harder if intermittent resets correlate with transient dips not replicable in lab conditions. Documenting observed reset pulse widths empirically during characterization helps establish safe operating windows for test protocols.

Parts with Similar Specifications

The three parts on the right have similar specifications to Torex Semiconductor Ltd XC6118C32AMR-G

Product Attribute XC6118C32BMR-G XC6118C31AMR-G XC6118C33AMR-G XC6118C32AGR-G
Part Number XC6118C32BMR-G XC6118C31AMR-G XC6118C33AMR-G XC6118C32AGR-G
Manufacturer Torex Semiconductor Ltd Torex Semiconductor Ltd Torex Semiconductor Ltd Torex Semiconductor Ltd
Mounting Type - Surface Mount Through Hole Surface Mount
Series - - - -
Reset Timeout - - - -
Type - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of Voltages Monitored - - - -
Output - - - -
Reset - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Voltage - Threshold - - - -

XC6118C32AMR-G Datasheet PDF

Download XC6118C32AMR-G pdf datasheets and Torex Semiconductor Ltd documentation for XC6118C32AMR-G - Torex Semiconductor Ltd.

Datasheets
Cylindrical Battery Holders.pdf
HTML Datasheet
XC6118 Series.pdf
Environmental Information
Torex Semiconductor LTD REACH REACH.pdf Torex Semiconductor LTD RoHS Cert.pdf

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Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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XC6118C32AMR-G Image

XC6118C32AMR-G

Torex Semiconductor Ltd
32D-XC6118C32AMR-G

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