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HomeProductsIntegrated Circuits (ICs)PMIC - Motor Drivers, ControllersTC78B006FNG,EL
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TC78B006FNG,EL - Toshiba Semiconductor and Storage

Manufacturer Part Number
TC78B006FNG,EL
Manufacturer
TAEC Product (Toshiba Electronic Devices and Storage Corporation)
Allelco Part Number
98D-TC78B006FNG,EL
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
49,877 pcs available, New & Original
Parts Description
IC MOTOR DRIVER 3.5V-16V 16SSOP
Package
16-SSOP
Data sheet
-
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 49877
  • Unit Price: $1.095
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $1.095 $1.10
200+ $0.438 $87.60
500+ $0.423 $211.50
1000+ $0.416 $416.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

TC78B006FNG,EL Tech Specifications
Toshiba Semiconductor and Storage - TC78B006FNG,EL technical specifications, attributes, parameters and parts with similar specifications to Toshiba Semiconductor and Storage - TC78B006FNG,EL

Product Attribute Attribute Value
Manufacturer TAEC Product (Toshiba Electronic Devices and Storage Corporation)
Voltage - Supply 3.5V ~ 16V
Voltage - Load -
Technology Power MOSFET
Supplier Device Package 16-SSOP
Step Resolution -
Series -
Package / Case 16-LSSOP (0.173", 4.40mm Width)
Package Tape & Reel (TR)
Output Configuration Pre-Driver - Half Bridge (2)
Product Attribute Attribute Value
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Motor Type - Stepper -
Motor Type - AC, DC Brushless DC (BLDC)
Interface PWM
Function Controller - Commutation, Direction Management
Current - Output -
Base Product Number TC78B006
Applications General Purpose

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8542.39.0001

Frequently Asked Questions(FAQ)

What is the operating voltage range for the TC78B006FNG,EL motor driver IC, and how does this influence system design in battery-powered applications?
The TC78B006FNG,EL operates across a supply voltage range of 3.5V to 16V, making it suitable for systems requiring flexible power compatibility. In battery-powered designs—such as cordless tools or IoT edge devices—this range allows operation from a fully discharged lithium-ion cell (around 3.0V nominal) up through regulated 12V industrial supplies. Designers must ensure that under worst-case conditions, including voltage droop during high-current transients, the minimum 3.5V threshold remains stable to avoid unintended shutdowns or erratic commutation behavior.
How does the half-bridge configuration of the TC78B006FNG,EL impact thermal performance when driving a brushless DC motor at high duty cycles?
With two integrated high-side and low-side Power MOSFETs per channel forming a half-bridge, the TC78B006FNG,EL enables efficient current delivery but introduces conduction losses proportional to RMS current squared multiplied by on-resistance. At sustained high loads—say, 2A continuous current with 80% PWM duty cycle—power dissipation can reach several hundred milliwatts per channel. Without adequate PCB copper area or external heatsinking, junction temperatures may approach or exceed the 105°C maximum rating, potentially triggering thermal protection or reliability degradation over time.
Can the TC78B006FNG,EL be used to drive unipolar stepper motors, and what limitations apply compared to dedicated stepper drivers?
While the TC78B006FNG,EL lacks native step resolution control and phase sequencing logic, it can technically drive unipolar stepper motors by manually managing PWM signals and direction inputs. However, this requires significant firmware overhead and sacrifices precision, microstepping capability, and torque ripple reduction—features typically handled by integrated stepper controllers like Allegro A4988 or TI DRV8825. For most applications requiring precise angular positioning, a purpose-built stepper driver remains preferable despite the added cost.
What are the key differences between using the TC78B006FNG,EL versus discrete MOSFET solutions for BLDC motor control in terms of EMI and layout complexity?
The TC78B006FNG,EL integrates gate drivers, bootstrap circuitry, and dead-time control into a single package, reducing parasitic inductance and simplifying layout compared to discrete implementations. This integration minimizes ringing and shoot-through risks while enabling faster switching transitions. However, its compact 16-SSOP footprint demands careful attention to ground plane segmentation and decoupling placement near the device to maintain signal integrity. Discrete solutions offer greater flexibility in choosing MOSFETs but increase component count and require manual tuning of gate resistors and layout parasitics to match performance.
How does the Moisture Sensitivity Level (MSL) classification of MSL 1 affect handling procedures for the TC78B006FNG,EL in high-volume manufacturing environments?
Classified as MSL 1, the TC78B006FNG,EL has unlimited floor life at ≤30°C/60% RH, eliminating strict bake-out requirements before reflow. This simplifies inventory management and reduces lead times in automated assembly lines. Nevertheless, operators must still prevent exposure to ambient humidity above storage conditions during unpacking, especially after tape-and-reel opening; prolonged exposure beyond recommended limits could compromise solder joint quality during IR reflow due to moisture vaporization.
Is it feasible to parallel multiple TC78B006FNG,EL devices to increase output current capacity for high-torque BLDC applications?
Paralleling TC78B006FNG,EL units is generally not advisable without extensive validation. Variations in threshold voltages, on-resistance matching, and thermal gradients cause unequal current sharing even with matched components. Uneven distribution leads to localized heating, premature failure, and possible latch-up. Instead, designers should select higher-current-rated motor drivers or use the TC78B006FNG,EL within its specified 2.5A peak source/sink limit per channel, possibly combining it with external pass transistors if additional current is required.
How does the PWM interface implementation in the TC78B006FNG,EL support sensorless FOC (Field-Oriented Control), and what firmware considerations arise?
The TC78B006FNG,EL supports open-loop trapezoidal commutation via PWM input but does not include Hall-effect sensing or back-EMF detection hardware. Therefore, it cannot directly implement sensorless Field-Oriented Control (FOC), which relies on real-time rotor position estimation. To achieve FOC, an external microcontroller must process back-EMF zero-crossing points or integrate Hall sensors, then generate complementary PWM signals aligned with estimated rotor angle—adding complexity compared to simpler six-step commutation schemes compatible with the IC’s native interface.
What precautions should be taken when selecting gate drive capacitance for external MOSFETs paired with the TC78B006FNG,EL in high-frequency switching applications?
Although the TC78B006FNG,EL drives internal MOSFETs, if used as a pre-driver for discrete FETs, total gate charge (Qg) and Miller plateau characteristics become critical. High-frequency operation demands low Qg to minimize switching losses, yet excessive dV/dt can induce false turn-on due to coupling through stray capacitances. Typical values below 30nC are preferred, and snubber networks or active gate termination may be necessary above 100kHz switching frequencies to suppress oscillations and EMI emissions.
How does the RoHS3 compliance status of the TC78B006FNG,EL influence global regulatory adherence in consumer and industrial product designs?
RoHS3 compliance confirms absence of restricted substances including Pb, Cd, Hg, Cr6+, PBB, and PBDE at permitted thresholds, ensuring compatibility with international environmental directives such as EU Directive 2011/65/EU and China RoHS. This facilitates market access across North America, Europe, and Asia without additional substance testing or documentation, streamlining certification processes for end products ranging from medical devices to automotive peripherals where legislative harmonization is essential.
What role does the internal dead-time control play in preventing shoot-through in the TC78B006FNG,EL, and how is it configured?
The TC78B006FNG,EL incorporates fixed internal dead-time between high-side and low-side MOSFET turn-off and turn-on events, typically around 100ns depending on fabrication process variations. This prevents simultaneous conduction that would short the supply rails and damage the die. Unlike user-adjustable dead-time generators, this fixed value suits moderate-speed switching (<50kHz) applications. At higher frequencies, residual overlap may occur, necessitating careful layout and timing analysis to avoid efficiency loss or device stress.
Can the TC78B006FNG,EL operate reliably in automotive-grade temperature ranges, and what derating strategies apply for extended ambient exposure?
Operating up to 105°C, the TC78B006FNG,EL exceeds standard commercial grades but falls short of typical AEC-Q100 qualified automotive specifications (-40°C to +150°C). In non-automotive environments approaching 85–105°C, designers should derate both output current and switching frequency to maintain margin against thermal runaway. For example, reducing peak current from 2.5A to 2.0A or limiting PWM frequency to <25kHz helps keep junction temperatures well below absolute maximums, preserving long-term reliability in harsh ambient conditions.
What distinguishes the ECCN classification EAR99 of the TC78B006FNG,EL from controlled export categories, and why matters for global sourcing?
Assigned ECCN EAR99 indicates the TC78B006FNG,EL is not subject to U.S. Export Administration Regulations controls, meaning it can be freely exported worldwide without license exceptions under most circumstances. This simplifies supply chain logistics, particularly beneficial for companies sourcing from Asian foundries like Toshiba Semiconductor and Storage, avoiding delays associated with ITAR or dual-use classifications that might otherwise complicate procurement for defense or aerospace-adjacent applications.
How does the 16-SSOP package choice affect PCB routing density and thermal dissipation compared to larger alternatives like SOIC or TSSOP?
The narrow 4.4mm width and fine pitch (0.65mm) of the 16-SSOP package enable compact board layouts ideal for space-constrained designs. However, limited exposed pad size reduces thermal conductivity compared to packages with thermal pads, increasing reliance on internal copper layers or vias for heat spreading. Routing adjacent signal traces must account for creepage and clearance rules near high-voltage nodes to meet safety standards, but the compact form factor often justifies these trade-offs in portable or modular motor-driven systems.
What diagnostic features does the TC78B006FNG,EL offer for fault monitoring in embedded motor control systems?
Unlike advanced drivers with built-in current sensing or overtemperature alarms, the TC78B006FNG,EL provides minimal fault feedback—primarily undervoltage lockout (UVLO) and internal thermal shutdown. Designers must implement external current shunts and microcontroller-based ADC sampling for real-time health monitoring. Alternatively, adding simple comparator circuits can detect supply anomalies or overtemperature conditions, feeding status flags back to the host processor for graceful motor shutdown or alert generation.
In what scenarios would replacing the TC78B006FNG,EL with a fully integrated BLDC controller be advantageous despite higher unit cost?
When system complexity demands features beyond basic half-bridge drive—such as programmable acceleration profiles, stall detection, automatic start sequences, or regenerative braking—a full-featured BLDC controller (e.g., Infineon IRS20P055 or STMicroelectronics L6235) justifies the cost premium. These integrate gate drivers, protection logic, and often communication interfaces (SPI/I²C), reducing external component count and firmware burden, which is critical in mass-produced consumer electronics where time-to-market outweighs BOM savings.
How does the absence of reverse polarity protection in the TC78B006FNG,EL impact system-level robustness in field-deployed equipment?
Without integrated reverse polarity diodes or MOSFET body-diode safeguards, applying incorrect power supply polarity to the TC78B006FNG,EL risks catastrophic failure due to gate oxide breakdown or parasitic thyristor latch-up. Field-installed systems—especially those with user-replaceable batteries—must incorporate external Schottky diodes in series with VCC or use load switches with reverse-blocking capabilities to prevent accidental miswiring, adding cost and complexity but ensuring operational longevity in unpredictable usage environments.

Parts with Similar Specifications

The three parts on the right have similar specifications to Toshiba Semiconductor and Storage TC78B006FNG,EL

Product Attribute TC78B006FTG,EL TC78B009FTG,EL TC78B004FTG,EL TC78B016FTG,EL
Part Number TC78B006FTG,EL TC78B009FTG,EL TC78B004FTG,EL TC78B016FTG,EL
Manufacturer Toshiba Semiconductor and Storage Toshiba Semiconductor and Storage Toshiba Semiconductor and Storage Toshiba Semiconductor and Storage
Output Configuration - - - -
Function - - - -
Applications - - - -
Current - Output - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Technology - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Interface - - - -
Voltage - Load - - - -
Voltage - Supply - - - -
Motor Type - Stepper - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Series - - - -
Motor Type - AC, DC - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Step Resolution - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)

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Customer Reviews

Evaluation: 10 Articles

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

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TC78B006FNG,EL Image

TC78B006FNG,EL

Toshiba Semiconductor and Storage
98D-TC78B006FNG,EL

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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