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HomeProductsPower Supplies - (Board Mount)DC DC ConvertersVI-B1Z-MW-S
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VI-B1Z-MW-S - Vicor Corporation

Manufacturer Part Number
VI-B1Z-MW-S
Manufacturer
Vicor
Allelco Part Number
98D-VI-B1Z-MW-S
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
32,756 pcs available, New & Original
Parts Description
DC DC CONVERTER 2V 40W
Package
Full Brick
Data sheet
VI-B1Z-MW-S.pdf

Environmental Information

Vicor REACH.pdf
RoHs Status
 
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In stock: 32756

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Specifications

VI-B1Z-MW-S Tech Specifications
Vicor Corporation - VI-B1Z-MW-S technical specifications, attributes, parameters and parts with similar specifications to Vicor Corporation - VI-B1Z-MW-S

Product Attribute Attribute Value
Manufacturer Vicor
Voltage - Output 3 -
Voltage - Output 2 -
Voltage - Output 1 2V
Voltage - Isolation 3 kV
Voltage - Input (Min) 21V
Voltage - Input (Max) 32V
Type Isolated Module
Size / Dimension 4.60' L x 1.80' W x 0.52' H (116.8mm x 45.7mm x 13.2mm)
Series VI-200™ (100W)
Power (Watts) 40 W
Product Attribute Attribute Value
Package / Case Full Brick
Package Bulk
Operating Temperature -55°C ~ 85°C
Number of Outputs 1
Mounting Type Through Hole
Features OCP, OTP, OVP, SCP
Efficiency 90%
Current - Output (Max) 20A
Base Product Number VI-B1Z
Applications ITE (Commercial)

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8504.40.9580

Frequently Asked Questions(FAQ)

What are the key electrical specifications and performance characteristics of the VI-B1Z-MW-S isolated DC-DC converter, particularly regarding input voltage range, output regulation, and efficiency under typical load conditions?
The VI-B1Z-MW-S delivers a tightly regulated 2V output at up to 20A continuous current, enabling stable power delivery for precision analog or digital loads. It operates across an input voltage range of 21V to 32V, making it suitable for intermediate bus architectures in telecom and industrial systems. With a measured efficiency of 90% under nominal conditions, the module minimizes thermal dissipation while maintaining high power density. The 3 kV isolation voltage ensures robust galvanic separation between input and output, critical for safety and noise immunity in ITE applications.
How does the VI-B1Z-MW-S compare to other members of the VI-200™ series in terms of power scalability, footprint, and thermal behavior when used in space-constrained designs?
Compared to higher-power variants like the VI-B2Z-MW-S (80W), the VI-B1Z-MW-S trades peak power capability for reduced conduction losses and improved thermal performance per watt. While it occupies the same full brick package size (4.60" x 1.80" x 0.52"), its lower output voltage reduces switching and conduction losses at high currents, resulting in better thermal margins at partial loads. This makes it preferable for 40W applications where heat dissipation is a primary concern, despite not offering the absolute highest power density in the series.
What design considerations should be taken into account when integrating the VI-B1Z-MW-S into a system requiring compliance with safety standards such as UL 62368-1 or IEC 60950-1?
The VI-B1Z-MW-S provides 3 kV isolation, which supports compliance with basic insulation requirements in ITE environments. However, due to its RoHS non-compliant status, designers must ensure that the full assembly—including PCB materials, connectors, and enclosure components—meets applicable hazardous substance restrictions. System-level certification will require additional evaluation of creepage and clearance distances, especially given the through-hole mounting configuration and full brick footprint. Thermal management remains essential, as junction temperatures must stay within -55°C to 85°C to preserve reliability and protection circuit integrity.
Can the VI-B1Z-MW-S be safely operated near its maximum current rating, and what safeguards are built into the device to prevent damage from overcurrent or short-circuit events?
Yes, but only under controlled conditions with adequate derating and thermal monitoring. The VI-B1Z-MW-S includes comprehensive protection features including overcurrent protection (OCP), overtemperature protection (OTP), overvoltage protection (OVP), and short-circuit protection (SCP). These mechanisms activate automatically to limit fault propagation. However, sustained operation near 20A may push the module close to thermal limits, especially in ambient temperatures above 60°C. Designers should allow for some headroom and implement current sensing or load sequencing if frequent high-current transients occur.
What is the impact of input voltage variation on output stability and transient response for the VI-B1Z-MW-S, and how does this affect system-level power architecture planning?
The VI-B1Z-MW-S maintains tight output regulation (±1% typical) across its entire input range of 21V to 32V, ensuring consistent performance even during line transients common in distributed power systems. This wide input tolerance simplifies compatibility with unregulated rails or batteries that experience significant voltage sag. The fast transient response enables effective support of digital loads with rapid current steps, reducing reliance on bulk capacitance at the point of load. This characteristic supports efficient intermediate bus designs where multiple downstream converters share a common upstream rail.
How does the VI-B1Z-MW-S handle thermal stress during startup or fault recovery sequences, and what operational limits apply to repeated cycling under overload conditions?
During startup, the VI-B1Z-MW-S employs soft-start circuitry to limit inrush current and gradual ramp-up, minimizing stress on upstream components. In fault scenarios such as short circuits, the OCP and SCP mechanisms engage within microseconds, but repeated activation can accumulate thermal energy if cooling is insufficient. The module’s operating temperature range of -55°C to 85°C defines the absolute maximum case temperature; exceeding this during fault recovery may trigger latch-up or degrade long-term reliability. Therefore, fault handling should include retry logic with cooldown periods to avoid thermal runaway.
Is it feasible to parallel VI-B1Z-MW-S modules for higher current sharing, and what challenges would arise in achieving balanced current distribution across multiple units?
Parallel operation of VI-B1Z-MW-S modules is technically possible but not recommended without external current-sharing controllers or droop compensation networks. Due to inherent variations in output impedance and control loop dynamics between units, natural load sharing is inefficient and risks overloading one converter during transients. Without active balancing, differences in efficiency, temperature, and aging can exacerbate imbalance. For applications requiring >40W output, designers should instead select a single higher-power module from the VI-200™ family or use a different topology altogether.
How does the efficiency curve of the VI-B1Z-MW-S behave across varying loads, and what implications does this have for power budgeting in low-load versus full-load operation?
The VI-B1Z-MW-S maintains approximately 90% efficiency at full load (40W), but efficiency drops gradually to around 85–87% at 50% load due to fixed switching and gate drive losses. At very light loads (<20%), efficiency may fall further as quiescent current becomes significant relative to output power. This nonlinear efficiency profile means that systems with variable loads benefit from dynamic load switching or burst-mode operation to maintain optimal efficiency. Power budgeting must therefore consider worst-case average efficiency rather than assuming constant peak performance.
What are the mechanical and environmental constraints associated with mounting and using the VI-B1Z-MW-S in harsh industrial environments?
The VI-B1Z-MW-S uses through-hole mounting, allowing secure attachment to PCBs via solder joints and mechanical fasteners. Its full brick package offers structural rigidity, but care must be taken to avoid excessive mechanical stress during soldering or thermal cycling. Operating in environments with vibrations or shock requires conformal coating or potting to protect internal components. The absence of moisture sensitivity level (MSL) classification indicates it is suitable for dry conditions, but condensation or humidity exposure above 85°C/85% RH could compromise insulation resistance unless properly sealed.
Given its RoHS non-compliance status, what alternatives exist for designers needing compliant versions of similar functionality, and how might supply chain risks affect procurement of the VI-B1Z-MW-S?
Vicor has transitioned newer VI-200™ models to RoHS-compliant configurations, though specific part numbers like the VI-B1Z-MW-S remain non-compliant due to legacy material usage. Designers seeking compliant alternatives should consult Vicor’s latest product tables for equivalent models such as the VI-B1Z-MW-S-R (if available) or consider migrating to the VIA family, which uses lead-free processes. Procurement of the VI-B1Z-MW-S may face regional restrictions or require exemption documentation, potentially delaying production timelines. Long-term design strategies should favor compliant devices to avoid obsolescence and regulatory hurdles.
How does the VI-B1Z-MW-S interact with EMI-sensitive circuits, and what layout practices minimize conducted and radiated emissions in end-system implementations?
The VI-B1Z-MW-S generates moderate conducted noise due to high di/dt switching edges at 20A output. To mitigate EMI, input and output filtering with ceramic and electrolytic capacitors is essential, placed close to terminals. Proper grounding of the chassis-mounted case and adherence to creepage/clearance rules help reduce common-mode noise. Layout should avoid routing sensitive signals adjacent to switch nodes, and keep feedback traces away from primary-side components. Shielding the converter or enclosing it in a metal cavity can further suppress radiation, particularly in commercial ITE equipment requiring FCC or CE compliance.
What is the expected lifetime and failure mode profile for the VI-B1Z-MW-S under continuous operation at rated conditions, and how do these factors influence mean time between failures (MTBF) calculations?
Under steady-state operation at 40W output and 70°C case temperature, the VI-B1Z-MW-S exhibits typical ceramic capacitor aging and semiconductor degradation rates. Expected lifetime exceeds 1 million hours based on Arrhenius modeling, but accelerated aging occurs near upper temperature limits. Primary failure modes include capacitor dry-out, bond wire lift-off, and solder joint fatigue. MTBF estimates depend heavily on thermal cycling and duty cycle; conservative designs assume 50% derating for critical systems. Monitoring input/output ripple and audible noise during field operation can serve as early warning indicators of incipient failure.
Can the VI-B1Z-MW-S be used in redundant power architectures, and what synchronization or tracking capabilities support hot-swapping or N+1 configurations?
The VI-B1Z-MW-S lacks built-in synchronization or tracking inputs, making direct paralleling for redundancy complex. Hot-swap compatibility depends on external control circuitry to manage inrush current and sequencing. In N+1 configurations, each unit must be independently protected and monitored. Without coordinated shutdown or load balancing, one module may dominate current during faults. For reliable redundancy, designers often add OR-ing diodes or electronic switches with supervisory ICs to isolate failed units and maintain system continuity.
How does the base product number VI-B1Z relate to other variants in the family, and what modifications differentiate the MW version from standard configurations?
The VI-B1Z base covers a range of input/output combinations within the VI-200™ platform, such as VI-B1Z-MW (2V/20A) and VI-B1Z-LW (lower current). The “MW” suffix denotes medium input voltage and standard pinout, distinguishing it from LW (low input) and HW (high input) options. Unlike custom variants, the MW version adheres to standard mechanical and electrical interfaces, facilitating interchangeability in existing designs. However, all VI-B1Z derivatives share core topology and protection schemes, ensuring consistent behavior across applications.
What testing protocols are recommended before deploying the VI-B1Z-MW-S in mass production to validate reliability and compliance?
Pre-production validation should include full electrical characterization under minimum, nominal, and maximum input/output conditions, including transient response, efficiency mapping, and isolation integrity tests. Environmental stress screening (ESS) involving thermal cycling (-55°C to +85°C), vibration, and humidity exposure helps uncover latent defects. Functional safety assessments should verify OVP, OCP, and OTP responses under simulated fault conditions. Additionally, batch sampling should confirm RoHS status and traceability, especially given its non-compliant designation and potential import restrictions.
How does the physical size of the VI-B1Z-MW-S influence PCB real estate allocation, and what spacing requirements must be observed for safe and efficient thermal management?
With dimensions of 116.8mm × 45.7mm × 13.2mm, the VI-B1Z-MW-S occupies a significant portion of a standard PCB layer. Adequate clearance must be maintained around all sides to prevent shorting and allow airflow; typically, 10–15 mm is recommended for convection cooling. Heat sinking is often necessary on the bottom surface, with thermal vias connecting to internal planes. Mounting holes should align with PCB standoffs to distribute mechanical stress evenly. Careful layout prevents interference with adjacent high-frequency traces and ensures unimpeded air circulation for optimal heat transfer.
Are there any known limitations or undocumented behaviors when using the VI-B1Z-MW-S in high-altitude or aerospace applications?
The VI-B1Z-MW-S is rated for -55°C to 85°C operation, which aligns with many aerospace and avionics standards. However, high-altitude deployment introduces challenges such as reduced dielectric strength and increased risk of arcing due to lower air density. While the 3 kV isolation meets basic requirements, additional creepage enhancement or conformal coating may be needed above 2000 meters. Electromagnetic compatibility (EMC) performance can degrade at altitude due to altered propagation paths, necessitating re-evaluation of shielding effectiveness and filter design in such environments.
What resources does Vicor provide to support system-level integration of the VI-B1Z-MW-S, and how can engineers access application notes, reference designs, and simulation models?
Vicor offers detailed application notes, SPICE models, and reference layouts through their official website, specifically tailored for the VI-200™ family. Engineers can download thermal models, control loop diagrams, and layout guidelines to accelerate board bring-up. The company also provides technical support for custom configurations and offers evaluation boards for hands-on testing. Access to these tools is typically granted upon request or registration, aiding in rapid prototyping and troubleshooting during the design-in phase.

Parts with Similar Specifications

The three parts on the right have similar specifications to Vicor Corporation VI-B1Z-MW-S

Product Attribute VI-B1Z-MW-F1 VI-B1Z-MX-S VI-B1Z-MW-B1 VI-B1Z-MW-F4
Part Number VI-B1Z-MW-F1 VI-B1Z-MX-S VI-B1Z-MW-B1 VI-B1Z-MW-F4
Manufacturer Vicor Corporation Vicor Corporation Vicor Corporation Vicor Corporation
Type - - - -
Power (Watts) - - - -
Voltage - Output 2 - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Current - Output (Max) - - - -
Voltage - Output 3 - - - -
Applications - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Voltage - Isolation - - - -
Number of Outputs - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Voltage - Input (Max) - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Efficiency - - - -
Voltage - Output 1 - - - -
Features - - - Simultaneous Sampling
Size / Dimension - - - -
Voltage - Input (Min) - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Series - - - -

VI-B1Z-MW-S Datasheet PDF

Download VI-B1Z-MW-S pdf datasheets and Vicor Corporation documentation for VI-B1Z-MW-S - Vicor Corporation.

Datasheets
VI/VE-200 Family.pdf
Design Resources
VI-200, VI-J00 Design Guide, Appl Manual.pdf
Environmental Information
Vicor REACH.pdf

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    Sep 22, 2026

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    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
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    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
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    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
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    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
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    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
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Vicor Corporation

VI-B1Z-MW-S

Vicor Corporation
98D-VI-B1Z-MW-S

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