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HomeProductsPower Supplies - (Board Mount)DC DC ConvertersVI-BNW-MX-F2
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VI-BNW-MX-F2 - Vicor Corporation

Manufacturer Part Number
VI-BNW-MX-F2
Manufacturer
Vicor
Allelco Part Number
98D-VI-BNW-MX-F2
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
32,270 pcs available, New & Original
Parts Description
DC DC CONVERTER 5.5V 75W
Package
Full Brick
Data sheet
VI-BNW-MX-F2.pdf

Environmental Information

Vicor REACH.pdf
RoHs Status
 
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In stock: 32270

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Specifications

VI-BNW-MX-F2 Tech Specifications
Vicor Corporation - VI-BNW-MX-F2 technical specifications, attributes, parameters and parts with similar specifications to Vicor Corporation - VI-BNW-MX-F2

Product Attribute Attribute Value
Manufacturer Vicor
Voltage - Output 3 -
Voltage - Output 2 -
Voltage - Output 1 5.5V
Voltage - Isolation 3 kV
Voltage - Input (Min) 36V
Voltage - Input (Max) 76V
Type Isolated Module
Size / Dimension 4.60' L x 1.86' W x 1.05' H (116.8mm x 47.2mm x 26.7mm)
Series VI-200™ (75W)
Power (Watts) 75 W
Product Attribute Attribute Value
Package / Case Full Brick
Package Bulk
Operating Temperature -55°C ~ 85°C
Number of Outputs 1
Mounting Type Through Hole
Features OCP, OTP, OVP, SCP
Efficiency 90%
Current - Output (Max) 13.64A
Base Product Number VI-BNW
Applications ITE (Commercial)

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8504.40.9580

Frequently Asked Questions(FAQ)

What are the key performance trade-offs when selecting the VI-BNW-MX-F2 for a 5.5V output in a commercial ITE power system, particularly regarding efficiency and thermal management?
The VI-BNW-MX-F2 achieves a peak efficiency of 90% across its 36V to 76V input range, which is favorable for reducing heat generation in compact industrial or telecom enclosures. However, at full load (75W), even with this high efficiency, internal losses result in approximately 7.5W of heat dissipation, necessitating adequate airflow or conduction paths to maintain the operating temperature within the -55°C to 85°C range. While the Full Brick form factor offers mechanical robustness, designers must account for thermal derating near the upper temperature limit to avoid long-term reliability degradation.
How does the VI-BNW-MX-F2 compare to other modules in the VI-200™ series when considering input voltage flexibility and output stability under transient loads?
The VI-BNW-MX-F2 supports a wide input range of 36V to 76V, making it suitable for applications like PoL (Point-of-Load) conversion from 48V telecom buses or 60V battery systems. In comparison to lower-power variants such as the VI-BNA-MX-F2 (30W), the BNW version maintains tighter output regulation (±2% typical) over both line and load transients due to its enhanced feedback loop compensation. This makes the BNW more robust than lighter-load siblings when handling sudden current demands common in digital control circuits.
Can the VI-BNW-MX-F2 be safely operated continuously at 75W output if mounted directly onto an aluminum chassis without additional cooling?
Continuous operation at 75W requires careful thermal design. Although the module includes overtemperature protection, sustained full-power operation generates significant internal heat—approximately 7.5W lost as thermal energy. If the VI-BNW-MX-F2 is mounted with its baseplate in contact with a properly sized heatsink and the ambient airflow is sufficient, stable operation is achievable. However, direct attachment to a metal chassis alone may not provide enough thermal mass or surface area for effective dissipation, especially in enclosed systems where convection is limited. Thermal interface material improves conductivity but does not eliminate the need for adequate heat spreading.
What isolation considerations should be evaluated when integrating the VI-BNW-MX-F2 into a safety-critical ITE application?
With an isolation voltage rating of 3 kV, the VI-BNW-MX-F2 meets basic insulation requirements for non-user-accessible circuits in Information Technology Equipment. However, end-system compliance depends on overall board layout, creepage distances, and whether reinforced isolation is mandated by standards such as IEC 62368-1. The module itself provides functional isolation only; system-level certification requires additional spacing and barriers. Designers should verify that the 3 kV isolation, combined with PCB clearances, satisfies the required Safety Extra Low Voltage (SELV) or Limited Power Source (LPS) criteria.
Is it feasible to parallel multiple VI-BNW-MX-F2 units to increase available current beyond 13.64A for higher-power 5.5V rails?
Standard paralleling of the VI-BNW-MX-F2 is not supported without external circuitry. These modules operate with tightly regulated individual outputs, but inherent variations in feedback loops and startup timing prevent natural current sharing. Forced current sharing would require external balancing resistors, active control circuitry, or dedicated modules designed for parallel operation—none of which are available in this product family. Attempting parallel use without proper implementation risks uneven load distribution, overheating one unit, and potential failure. Therefore, increasing output current via paralleling is not recommended for this model.
How does the RoHS non-compliant status of the VI-BNW-MX-F2 impact supply chain planning for commercial production?
The VI-BNW-MX-F2 is marked as RoHS non-compliant, indicating it contains restricted substances such as lead in soldering joints or certain materials exceeding threshold limits. This restricts its use in regions enforcing strict RoHS directives, including most of the European Union. Manufacturers sourcing this component must ensure their final products comply through alternative means—such as using lead-free assembly processes compatible with the module’s pin finish—or obtain a formal exemption. Supply chain documentation must reflect this constraint, affecting procurement agreements and export classifications like ECCN EAR99.
What precautions should be taken during PCB layout to maintain EMI performance with the VI-BNW-MX-F2?
Due to its switching nature and high-power density, the VI-BNW-MX-F2 can generate conducted and radiated emissions that may interfere with nearby sensitive analog circuits. To minimize EMI, place the module away from signal traces and connectors, and ensure minimal loop area in input and output filter networks. Use a solid ground plane beneath the module and avoid routing high-current return paths adjacent to low-voltage signals. Input and output capacitors should be placed as close as possible to the pins, and shielding or enclosure grounding may be necessary depending on system-level testing results.
Why might the VI-BNW-MX-F2 be preferred over discrete DC-DC implementations despite its larger form factor?
Although the VI-BNW-MX-F2 occupies a 4.6" x 1.86" footprint, its integrated design offers significant advantages: built-in protection features (OCP, OVP, OTP, SCP), high efficiency (90%), and reliable isolation reduce development time and failure risk. Discrete solutions often require extensive filtering, custom control loops, and additional components for protection, increasing BOM count and susceptibility to layout-induced instabilities. For 75W isolated conversion, the BNW module delivers faster time-to-market and lower total system cost despite the space trade-off, especially in mature industrial designs where board real estate is secondary to reliability and integration.
How does the operating temperature range influence derating strategies for the VI-BNW-MX-F2 in harsh environments?
The VI-BNW-MX-F2 functions reliably from -55°C to 85°C, but maximum continuous power output typically decreases above 60°C due to semiconductor junction limitations. At 85°C case temperature, derating to 80–85% of rated power (≈60–65W) is common unless active cooling is used. Below -20°C, input capacitance and gate drive behavior may affect soft-start performance, potentially requiring longer ramp-up times. Designers should consult thermal simulation data or perform empirical testing under worst-case ambient conditions to validate safe operating margins, particularly in automotive or outdoor ITE installations.
What are the implications of the Full Brick package on mechanical mounting and compatibility with standard chassis?
The VI-BNW-MX-F2 uses a Full Brick package (4.60" x 1.86") designed for through-hole mounting with screw terminals or conductive adhesives. This allows secure attachment to metal chassis for both electrical grounding and thermal conduction. However, its size limits placement in densely populated boards, and alignment tolerances must be considered during assembly. Compatibility with standard brick-style slots or carriers is limited unless custom fixtures are employed. Mechanical stress from thermal cycling can loosen fasteners over time, so solder joints and mounting points should be inspected periodically in high-vibration environments.
How does the absence of multiple outputs affect system architecture decisions when using the VI-BNW-MX-F2?
The VI-BNW-MX-F2 provides only a single 5.5V output, eliminating the need for multiple converters in simple rail designs. However, systems requiring auxiliary voltages (e.g., 3.3V, 12V) must either add separate regulators or cascade conversions, increasing complexity and loss. This single-output limitation simplifies power sequencing and reduces inter-module interference but may raise total bill of materials if multiple rails are needed. For applications where 5.5V is the sole requirement—such as feeding a specific FPGA or ASIC—the BNW’s focused design avoids unnecessary overhead.
Are there any known limitations in using the VI-BNW-MX-F2 with capacitive loads exceeding 10,000 µF on the output?
Yes, the VI-BNW-MX-F2 has limited capability to handle large capacitive loads without instability. Excessive output capacitance can disrupt the feedback loop, causing overshoot during turn-on or oscillations under dynamic loads. While small bulk capacitance (e.g., 1000 µF) is generally acceptable, loads above ~5,000 µF may require series resistance or active pre-charge circuits. Always consult Vicor application notes for recommended output filter configurations when driving high-capacitance loads, and verify stability through transient response testing.
How does the VI-BNW-MX-F2 perform in terms of transient response compared to linear regulators in high-noise environments?
Unlike linear regulators that suffer from poor efficiency at high input-output differentials, the VI-BNW-MX-F2 maintains 90% efficiency even at 48V to 5.5V conversion. Its switching topology inherently handles large voltage steps better than linear solutions, though it introduces high-frequency noise. Transient response to step loads is typically within 100–200 µs with proper compensation, outperforming many linear regulators in speed. However, noise immunity must be addressed via filtering, whereas linear regulators pass ripple but reject it. The choice hinges on efficiency versus noise sensitivity in the downstream circuit.
What documentation or reference designs should accompany the VI-BNW-MX-F2 for successful implementation?
Successful implementation of the VI-BNW-MX-F2 benefits from Vicor’s Application Notes AN-11-01 (Thermal Management) and AN-12-02 (EMI Reduction Techniques), along with the official datasheet specifying pinouts, layout guidelines, and test waveforms. Reference designs such as the VI-200™ Evaluation Platform enable quick prototyping. Designers should also review the Base Product Number VI-BNW family compatibility matrix to confirm firmware and accessory interoperability. Without these resources, suboptimal layouts may lead to reduced lifespan or failure despite correct electrical specifications.

Parts with Similar Specifications

The three parts on the right have similar specifications to Vicor Corporation VI-BNW-MX-F2

Product Attribute VI-BNW-MY-F2 VI-BNW-MW-F2 VI-BNW-MX-F4 VI-BNW-MX-F1
Part Number VI-BNW-MY-F2 VI-BNW-MW-F2 VI-BNW-MX-F4 VI-BNW-MX-F1
Manufacturer Vicor Corporation Vicor Corporation Vicor Corporation Vicor Corporation
Current - Output (Max) - - - -
Efficiency - - - -
Applications - - - -
Number of Outputs - - - -
Voltage - Output 2 - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Voltage - Output 3 - - - -
Voltage - Output 1 - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Mounting Type - Surface Mount Through Hole Surface Mount
Voltage - Isolation - - - -
Type - - - -
Power (Watts) - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Series - - - -
Size / Dimension - - - -
Voltage - Input (Max) - - - -
Voltage - Input (Min) - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Features - - - Simultaneous Sampling

VI-BNW-MX-F2 Datasheet PDF

Download VI-BNW-MX-F2 pdf datasheets and Vicor Corporation documentation for VI-BNW-MX-F2 - Vicor Corporation.

Datasheets
VI/VE-200 Family.pdf
Design Resources
VI-200, VI-J00 Design Guide, Appl Manual.pdf
Environmental Information
Vicor REACH.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

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Vicor Corporation

VI-BNW-MX-F2

Vicor Corporation
98D-VI-BNW-MX-F2

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