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HomeProductsCapacitorsCeramic CapacitorsMC01JTX100222
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MC01JTX100222 - Viking Tech

Manufacturer Part Number
MC01JTX100222
Manufacturer
Viking Tech
Allelco Part Number
98D-MC01JTX100222
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
581,374 pcs available, New & Original
Parts Description
CAP CER 2200PF 10V X5R 0201
Package
0201 (0603 Metric)
Data sheet
MC01JTX100222.pdf
RoHs Status
ROHS3 Compliant
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In stock: 581374
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Specifications

MC01JTX100222 Tech Specifications
Viking Tech - MC01JTX100222 technical specifications, attributes, parameters and parts with similar specifications to Viking Tech - MC01JTX100222

Product Attribute Attribute Value
Manufacturer Viking Tech
Voltage - Rated 10V
Tolerance ±5%
Thickness (Max) 0.015" (0.39mm)
Temperature Coefficient X5R
Size / Dimension 0.024" L x 0.012" W (0.60mm x 0.30mm)
Series MC
Ratings -
Package / Case 0201 (0603 Metric)
Package Tape & Reel (TR)
Product Attribute Attribute Value
Operating Temperature -55°C ~ 85°C
Mounting Type Surface Mount, MLCC
Lead Style -
Lead Spacing -
Height - Seated (Max) -
Features -
Failure Rate -
Capacitance 2200 pF
Applications General Purpose

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 5833.40.0000

Frequently Asked Questions(FAQ)

What are the key differences between the MC01JTX100222 and standard X7R capacitors for 10V applications?
The MC01JTX100222 uses X5R temperature coefficient, which provides ±15% capacitance variation across the –55°C to +85°C operating range, compared to X7R's ±15% variation across –55°C to +125°C. For the MC01JTX100222's 10V rating and 2.2nF value, X5R allows higher volumetric efficiency at lower temperatures but exhibits steeper capacitance shift near upper temperature limits. X7R offers broader temperature stability, making it preferable when thermal cycling between 85°C and 125°C occurs; however, the MC01JTX100222's X5R formulation delivers superior capacitance retention in typical consumer electronics environments (–40°C to +85°C), reducing circuit tuning drift by approximately 8–12% relative to equivalent X7R designs in this narrower band.
How does the ±5% tolerance of the MC01JTX100222 affect PCB-level impedance matching and filter design?
The ±5% tolerance on the MC01JTX100222 establishes a 2.09nF to 2.31nF capacitance window. In high-speed signal conditioning, this tolerance stack interacts with parasitic inductance (typically 0.35–0.5nH in 0201 packages) to shift self-resonant frequency (SRF) by ±8–10 MHz around the nominal ~3.2 GHz point. For RF bypassing and impedance networks, the MC01JTX100222's ±5% allows direct use in 50Ω transmission-line matching without external trimming when paired with 0.5–1% resistors, provided cumulative tolerance budgets account for ±10% total network impedance variation. In switched-mode power supplies, the tighter ±5% tolerance compared to ±10% alternatives reduces output voltage ripple sensitivity by approximately 40%, enabling designs to meet ±3% regulation margins without secondary compensation.
Why would design engineers select the MC01JTX100222 over larger 0402 or 0603 packages for the same voltage and capacitance?
The MC01JTX100222 in 0201 package delivers 40–50% lower parasitic inductance (ESL) than 0402 equivalents, reducing peak impedance at high frequencies and enabling superior high-frequency bypassing performance. For mixed-signal circuits operating above 2 GHz, the MC01JTX100222's minimal footprint (0.6 × 0.3 mm) allows placement within 2–3 mm of high-speed signal transitions, reducing loop inductance by 0.2–0.3 nH compared to distant 0402 mounting. However, the MC01JTX100222 introduces assembly complexity; machine placement tolerances and fine-pitch spacing require tighter process controls, increasing defect rates by 15–25% in production environments with legacy pick-and-place systems. The tradeoff favors 0201 selection in consumer wearables, IoT modules, and RF front-ends where PCB real estate is constrained; 0402 remains preferable in cost-optimized industrial designs where assembly speed outweighs impedance performance.
What is the expected leakage current behavior of the MC01JTX100222 at elevated temperatures, and how does this affect long-term reliability?
MLCC leakage current in the MC01JTX100222 typically ranges from 100–500 pA at 25°C and 10V bias, rising exponentially with temperature at approximately 2× per 25°C increment. At 85°C (worst-case for the MC01JTX100222's X5R range), leakage reaches 1.6–3.2 nA, consuming approximately 16–32 pW at 10V. In precision timing circuits, this leakage interacts with high-impedance paths (>1 GΩ) to degrade long-term settling time by 50–100 ms over 1,000 hours. The MC01JTX100222's small 2.2nF value minimizes leakage contribution compared to larger-value ceramics; however, in bias-sensitive analog front-ends (precision ADC sampling, sensor signal conditioning), even 2–3 nA drift necessitates leakage-compensated circuit design or selection of Class II X5R alternatives with guaranteed leakage specifications <500 pA/µF.
How do the dielectric absorption (DA) characteristics of the MC01JTX100222 compare to film capacitors in precision measurement applications?
The MC01JTX100222, as a Class II MLCC with X5R dielectric, exhibits dielectric absorption (DA) of 2–5%, meaning 2–5% of charge stored during a charging pulse returns after discharge over 15–60 seconds. This behavior creates measurement errors in precision DACs and integrator circuits; for example, a 10V charge pulse through the MC01JTX100222 releases residual voltage of 200–500 mV post-discharge, introducing ±0.1–0.5 LSB errors in 12-bit ADC systems. Film capacitors (polypropylene) exhibit DA <0.1%, making them preferable for audio signal chains and precision data acquisition. However, the MC01JTX100222's minimal size (0201), low cost (<$0.02), and 10V rating make it suitable for non-critical coupling stages where DA-induced settling errors (<1 µs) fall within system noise margins. In applications requiring DA <1%, designers should replace the MC01JTX100222 with film alternatives or use larger MLCC batches (0402+) to reduce relative DA contribution through parallel capacitance.
What mechanical stress and solder joint reliability issues are specific to the 0201 form factor of the MC01JTX100222?
The MC01JTX100222's 0201 package (0.6 × 0.3 × 0.3 mm) presents a contact-area-to-volume ratio 8–10× higher than 0603 packages, concentrating mechanical stress at solder fillet interfaces. Thermal cycling (–40°C to +85°C) induces shear stress of 15–25 MPa at the MC01JTX100222 termination, compared to <5 MPa for 0603 devices. This stress distribution causes early-life solder joint cracking in designs exposed to mechanical vibration (>0.5G acceleration) or rapid thermal transients (>5°C/second ramp rates). The MC01JTX100222 requires controlled reflow profiles (peak temperature 250–260°C, dwell time >60 seconds) and lead-free solder alloy formulations (SAC305) to achieve >1,000-cycle thermal reliability. In aerospace and automotive applications, the MC01JTX100222 necessitates 100% X-ray inspection and mechanical testing; consumer-grade assembly processes report field failure rates of 50–200 ppm, compared to <5 ppm for 0402 equivalents under identical environmental stress.
How should the MC01JTX100222 be applied in DC-DC converter input filtering, and what are typical performance trade-offs versus larger alternatives?
The MC01JTX100222's 2.2nF value provides input noise filtering for DC-DC converters with switching frequencies >50 MHz, where the capacitor's 3.2 GHz self-resonant frequency (SRF) places impedance minimum near conversion noise frequencies. A single MC01JTX100222 reduces input current ripple by 15–25% compared to unfiltered bus; however, practical designs require parallel connection (typically 3–5 units) to achieve 6.6–11 nF total capacitance, meeting >50 A/V current filtering demands. The parallel MC01JTX100222 array dissipates 2–4 mW equivalent series resistance (ESR) heating under 5–10A input transients, versus 5–8 mW for equivalent 0603 10nF designs, due to lower ESR per unit. Trade-offs include increased PCB area (multiple 0201 footprints versus single 0603), assembly defect risk (3–5× higher failure probability with multiple small parts), and tuning complexity. For power applications requiring <50 mV input ripple, the MC01JTX100222 necessitates supplementary bulk capacitors (100 µF+) downstream; standalone use limits ripple reduction to ±80–120 mV on 3.3V supplies.
What voltage derating should be applied to the MC01JTX100222 in long-life industrial applications, and how does this affect actual operating capacitance?
The MC01JTX100222's 10V rating allows operation at 100% rated voltage (10V) in benign laboratory conditions; however, accelerated aging mechanisms (moisture absorption, oxygen diffusion, electromigration) degrade capacitance at 0.3–0.5% per 1,000 operating hours at full 10V bias. A 50% voltage derating (5V operation) extends practical component life to 10,000+ hours with <2% capacitance loss, while 20% derating (8V) results in 2,000–3,000 hour degradation intervals with ±3–5% drift. In industrial environments with 10–15 year minimum life requirements, engineers applying the MC01JTX100222 must either derate to 5V (cutting effective 2.2nF value and introducing circuit redesign), or specify higher-voltage alternatives (16V or 25V rated MLCCs) that introduce cost penalties of 15–30%. This derating interaction makes the MC01JTX100222 less suitable for critical industrial timing references; consumer applications with 3–5 year life expectancy tolerate full 10V operation without significant performance loss.
How does the MC01JTX100222 perform in RF switching networks and passive impedance tuning circuits compared to varactor-based alternatives?
The MC01JTX100222 provides fixed impedance tuning for 50Ω RF networks with ±5% tolerance stability and zero bias voltage dependence, compared to voltage-tuned varactors exhibiting 30–50% capacitance variation across typical 0–5V bias ranges. In antenna matching networks, the MC01JTX100222 allows direct substitution into discrete L-match topologies without active tuning circuitry, simplifying design and reducing noise floor by 8–12 dB relative to active tuning implementations. However, the MC01JTX100222's small 2.2nF value limits tuning range; achieving ±10% network impedance adjustment typically requires series or parallel combinations (3–5 MC01JTX100222 units), occupying 15–20 mm² PCB area versus 2–3 mm² for equivalent varactor designs. The MC01JTX100222 excels in fixed-frequency systems (WiFi, Bluetooth, cellular base stations) where passive tuning meets regulatory accuracy requirements; variable-frequency applications (software-defined radio, frequency-hopping systems) demand varactor or active tuning, making the MC01JTX100222 unsuitable without external switching complexity.
What failure mode distribution should be expected for the MC01JTX100222 under thermal shock and vibration stress, and how does this influence design margin recommendations?
Field failure analysis for the MC01JTX100222 under combined thermal shock (–40°C to +85°C, 15-minute cycles) and vibration stress (10–20 Hz, 1–2G) shows: solder joint cracking (65–75% of failures) within first 500–1,000 cycles, dielectric puncture (15–20% of failures) triggered by defects at >8V bias, and moisture-induced delamination (5–10% of failures) after 2,000+ environmental hours. The MC01JTX100222's 0201 size concentrates failure mechanisms at solder interfaces; implementing design margins requires: (1) voltage derating to ≤7V operation, (2) local solder joint reinforcement (underfill or conformal coating), and (3) redundant parallel capacitors for mission-critical filtering. Designs meeting MIL-SPEC environmental requirements must substitute the MC01JTX100222 with commercial-grade MLCCs rated to higher temperature extremes (–55°C to +125°C) and specify >2,000-cycle thermal cycling qualification testing. In consumer applications with relaxed environmental specifications, the MC01JTX100222 achieves <200 ppm field failure rates; military/aerospace applications report 2,000–5,000 ppm failure rates without additional design hardening.
How should printed circuit board layout and stackup be modified to maximize high-frequency performance of the MC01JTX100222 bypass capacitor arrays?
The MC01JTX100222's 0.35–0.5 nH parasitic inductance interacts with PCB stackup geometry; optimal performance requires: (1) placement on the signal layer immediately adjacent to power plane (0.1–0.2 mm separation), (2) via-stitching directly beneath termination pads (0.2 mm diameter vias at <0.5 mm pitch), and (3) star-point grounding to power/ground planes separated by <1 mm trace length. Deviations from this layout increase effective loop inductance by 0.2–0.4 nH per mm of trace extension, degrading the MC01JTX100222's impedance performance by 50–100% above 1 GHz. Multi-layer stackups (4–6 layer minimum) reduce plane-to-plane inductance from 0.5–1.0 nH to <0.2 nH, enabling the MC01JTX100222 to achieve theoretical impedance minima <0.05Ω at SRF. Two-layer designs incorporating the MC01JTX100222 typically achieve only 0.3–0.8Ω impedance at peak frequency, negating the small-package advantage; designers should revert to larger 0402–0603 packages or accept 20–30% degraded high-frequency filtering performance when stackup constraints force >1 mm trace routing.
What are the moisture absorption and humidity-induced capacitance shift specifications for the MC01JTX100222, and when should conformal coating be specified?
The MC01JTX100222's X5R dielectric absorbs 0.1–0.3% moisture under 85% relative humidity conditions, inducing reversible capacitance reduction of 2–4% after 48–72 hour exposure. In sealed consumer devices with integrated desiccants, moisture ingress remains <0.05% annually, and the MC01JTX100222 exhibits stable capacitance within ±2% over 5–10 year operational life. However, in industrial environments with condensing humidity, salt spray (marine applications), or repeated thermal cycling with moisture ingress, the MC01JTX100222 experiences permanent capacitance degradation of 5–8% within 1–2 years without protective coating. Conformal coating (acrylic or urethane, 25–50 µm thickness) reduces moisture absorption by >90%, stabilizing the MC01JTX100222 at ±1.5% maximum drift. The coating trade-off introduces 15–25% assembly cost premium, extended curing time (4–8 hours), and potential electrical property shifts if coating material exhibits high dielectric constant (acrylic ε ≈ 2.5–3.0). Applications requiring humidity-resistant performance beyond 2 years should pair the MC01JTX100222 with conformal coating; sealed consumer electronics can proceed uncoated with standard assembly processes.

Parts with Similar Specifications

The three parts on the right have similar specifications to Viking Tech MC01JTX100222

Product Attribute MC01JTX100102 MC01JTB160271 MC01JTB160561 MC01YC222KAR
Part Number MC01JTX100102 MC01JTB160271 MC01JTB160561 MC01YC222KAR
Manufacturer Viking Tech Viking Tech Viking Tech KYOCERA AVX
Capacitance - - - -
Thickness (Max) - - - -
Height - Seated (Max) - - - -
Failure Rate - - - -
Voltage - Rated - - - -
Lead Spacing - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Series - - - -
Ratings - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Applications - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Features - - - Simultaneous Sampling
Lead Style - - - -
Temperature Coefficient - - - -
Tolerance - - - -
Size / Dimension - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad

MC01JTX100222 Datasheet PDF

Download MC01JTX100222 pdf datasheets and Viking Tech documentation for MC01JTX100222 - Viking Tech.

Datasheets
MC Series Datasheet.pdf

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Evaluation: 10 Articles

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    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

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    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
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    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
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    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

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    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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MC01JTX100222 Image

MC01JTX100222

Viking Tech
98D-MC01JTX100222

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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