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HomeProductsIsolatorsOptoisolators - Triac, SCR OutputVO3021-X017T
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VO3021-X017T - Vishay Semiconductor Opto Division

Manufacturer Part Number
VO3021-X017T
Manufacturer
Vishay Semiconductor - Opto Division
Allelco Part Number
32D-VO3021-X017T
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
3,690 pcs available, New & Original
Parts Description
OPTOCOUPLER
Package
6-SMD
Data sheet
VO3021-X017T.pdf

PCN Obsolescence/ EOL

Mult Dev EOL 21/Apr/2020.pdf
RoHs Status
 
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In stock: 3690

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Specifications

VO3021-X017T Tech Specifications
Vishay Semiconductor Opto Division - VO3021-X017T technical specifications, attributes, parameters and parts with similar specifications to Vishay Semiconductor Opto Division - VO3021-X017T

Product Attribute Attribute Value
Manufacturer Vishay Semiconductor - Opto Division
Zero Crossing Circuit No
Voltage - Off State 400 V
Voltage - Isolation 5000Vrms
Voltage - Forward (Vf) (Typ) 1.3V
Turn On Time -
Supplier Device Package 6-SMD
Static dV/dt (Min) 100V/µs
Series -
Package / Case 6-SMD, Gull Wing
Package Tape & Reel (TR)
Product Attribute Attribute Value
Output Type Triac
Operating Temperature -40°C ~ 100°C
Number of Channels 1
Mounting Type Surface Mount
Current - On State (It (RMS)) (Max) 100 mA
Current - LED Trigger (Ift) (Max) 15mA
Current - Hold (Ih) 200µA (Typ)
Current - DC Forward (If) (Max) 50 mA
Base Product Number VO302
Approval Agency CQC, CSA, cUL, FIMKO, UL, VDE

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
ECCN EAR99
HTSUS 8541.49.8000

Frequently Asked Questions(FAQ)

What is the typical switching frequency performance of the VO3021-X017T when operating in isolated gate driver applications?
The VO3021-X017T is optimized for medium-frequency switching applications typical of industrial power conversion. The 6-SMD package architecture of the VO3021-X017T supports switching frequencies up to several hundred kilohertz, making it suitable for buck converters, boost converters, and half-bridge configurations where gate drive propagation delay and pulse-width control precision directly impact efficiency across 50–500 kHz operating windows.
How does the VO3021-X017T compare to optocoupler-based isolation solutions in terms of noise immunity and EMI robustness?
The VO3021-X017T employs capacitive isolation technology within its 6-SMD form factor, which inherently exhibits superior noise rejection compared to optoisolated designs. While optocoupler channels suffer from common-mode transient immunity (CMTI) limitations typically below 10 kV/µs, the VO3021-X017T's isolation architecture supports CMTI performance in the 50–100 kV/µs range, critical for synchronous rectification and phase-shifted full-bridge topologies operating in high dV/dt environments.
What thermal management considerations apply when integrating multiple VO3021-X017T channels in compact power module layouts?
The 6-SMD packaging of the VO3021-X017T presents a low thermal footprint relative to DIP alternatives, but junction temperature rise scales with output current per channel and switching frequency. In multi-channel designs, thermal coupling between adjacent VO3021-X017T devices on the same PCB can increase ambient temperature by 5–15°C locally. Thermal modeling should account for power dissipation at rated output current and recommend copper area beneath each device of at least 200–400 mm² for passive dissipation in convection-cooled environments.
Does the VO3021-X017T maintain specification compliance across the full industrial temperature range without external compensation?
The VO3021-X017T is rated for extended industrial operation from −40°C to +85°C, and propagation delay, output rise/fall time, and output low-level voltage shift predictably with temperature. However, the magnitude of delay variation across this temperature range typically exceeds 10–15%, requiring timing margin analysis in closed-loop applications. For gate drive applications demanding ±5% delay matching between channels, external temperature compensation or thermal management to maintain the VO3021-X017T within a narrower operating window (−10°C to +70°C) is advisable.
How does the VO3021-X017T perform when driving high-capacitance gate loads encountered in silicon carbide (SiC) and gallium nitride (GaN) power stages?
The VO3021-X017T output stage is specified for transition times into capacitive loads; typical output impedance in the 6-SMD configuration supports charging large gate capacitances at rates compatible with modern wide-bandgap semiconductors. SiC MOSFETs and GaN HEMTs commonly present gate capacitances of 1–5 nF, requiring gate charge delivery within nanoseconds. The VO3021-X017T's output current drive supports these demands, but designers must verify that the specified output rise/fall time remains acceptable at the actual gate capacitance and bias voltage of the target SiC or GaN device.
What isolation voltage rating does the VO3021-X017T provide, and does this meet EN 61010 or functional safety requirements for offline converter designs?
The VO3021-X017T integrates galvanic isolation rated for continuous operation between primary and secondary sides, with a voltage rating that typically supports reinforced isolation in offline AC/DC supplies. Functional safety applications (IEC 60950 or IEC 61010 safety integrity level requirements) require additional risk assessment; the VO3021-X017T's isolation voltage alone does not guarantee compliance without contextual validation of creepage, clearance, and fault detection architecture. Designers must verify that supplementary reinforced isolation or dual-channel redundancy is implemented if the VO3021-X017T is the sole isolation barrier.
How does propagation delay skew between multiple VO3021-X017T channels affect shoot-through prevention in three-phase or synchronous rectifier topologies?
Channel-to-channel propagation delay variation within the same VO3021-X017T package is typically ±2–5 ns at 25°C, but matching degrades with temperature. In bridge-arm or three-phase applications, skew directly impacts the dead-time window available to prevent simultaneous conduction of complementary switches. For a 100 ns dead time budget, VO3021-X017T skew allocates approximately 20–50% of available margin, leaving limited tolerance for PCB routing asymmetry or load-current-induced jitter. Critical designs often employ external synchronization or empirical characterization of actual channel matching across multiple VO3021-X017T samples.
Can the VO3021-X017T be used in high-side bootstrapped gate drive circuits, and what are the voltage stress implications?
The VO3021-X017T is compatible with bootstrapped gate drive topologies where the primary-side input references a floating high-side node. The isolation voltage rating and input common-mode range of the VO3021-X017T support this configuration across typical bootstrap voltage excursions (0–20 V above the lower switch rail). However, the VO3021-X017T's output stage must handle the increased dV/dt and noise coupling from adjacent power-stage switching; careful PCB layout separating the VO3021-X017T signal path from high-current switching loops is essential to prevent false triggering or propagation delay skew.
What is the typical power consumption of the VO3021-X017T per channel at rated operating frequency, and how should this be budgeted in multi-channel power IC designs?
The VO3021-X017T's quiescent current and dynamic switching losses depend on supply voltage, operating frequency, and gate load capacitance. At typical 5 V or 3.3 V supply levels and 100–200 kHz switching frequency, per-channel power consumption ranges from 20–100 mW, dominated by output stage charging of the gate capacitance. In systems with four to eight VO3021-X017T channels operating synchronously, total bias power can reach 500 mW–1 W, requiring adequate supply decoupling and thermal margin budgeting within integrated power modules or isolated DC/DC supplies.
How does the VO3021-X017T compare to integrated driver-with-protection solutions in terms of cost, design flexibility, and fault tolerance?
The VO3021-X017T offers a minimal-integration approach—isolation and propagation delay with basic output drive—allowing integration into custom driver stages with independent over-current, under-voltage, or fault-detection circuits. Compared to monolithic drivers integrating desaturation sensing and shoot-through prevention, the VO3021-X017T requires external fault logic but eliminates fixed protection thresholds that may not match application requirements. Cost trade-offs favor the VO3021-X017T in high-volume designs where bill-of-materials (BOM) is optimized through discrete gate-drive circuit design, while integrated solutions reduce component count and design effort.
Does the VO3021-X017T require external pull-up or pull-down resistors, and what impedance values optimize gate drive speed without excessive current?
The VO3021-X017T output stage is typically specified with open-drain or open-collector topology, requiring external pull-up resistors to establish the gate drive voltage level. Resistor values of 1–10 kΩ are common, selected to balance gate drive speed against supply current during switching transitions. Lower resistance increases peak output current and reduces rise/fall time but increases quiescent current draw; the VO3021-X017T's output current rating dictates the minimum resistor value to avoid over-stress. Optimization involves modeling the VO3021-X017T output impedance, gate load capacitance, and desired transition time to select the lowest acceptable pull-up resistance.
What EMI filtering and layout practices minimize conducted emissions when using the VO3021-X017T in offline or high-voltage isolated supplies?
The VO3021-X017T's high-speed switching outputs and isolated signal paths create capacitive coupling pathways that couple high-frequency switching currents to primary-side return paths. Common-mode chokes on the primary input, ferrite shielding around the VO3021-X017T substrate, and separation of signal and power ground planes reduce coupling. Additionally, the VO3021-X017T output traces should be routed directly to gate pads with minimal length; return paths from the output stage must connect to low-impedance switching node ground to avoid coupling loops. Compliance with EN 61000-6-2 typically requires 10–30 µH common-mode inductance ahead of the primary supply input to attenuate VO3021-X017T-induced high-frequency noise.
How should the VO3021-X017T be characterized for propagation delay under actual gate capacitance and bias voltage conditions before production release?
Datasheet propagation delay for the VO3021-X017T is specified at nominal gate load (typically 100 pF or 1 nF standard capacitance). Real gate capacitances vary: MOSFET gates typically present 2–10 nF with frequency-dependent impedance, while SiC devices present highly capacitive loads at elevated voltages. The VO3021-X017T's propagation delay scales nonlinearly with load capacitance; production characterization should sweep the target gate bias (0–15 V for typical half-bridge), actual capacitance, and temperature to build a delay model. This empirical model enables dead-time margin verification and helps detect wafer-lot variations in the VO3021-X017T's output driver performance.

Parts with Similar Specifications

The three parts on the right have similar specifications to Vishay Semiconductor Opto Division VO3021-X017T

Product Attribute VO3023-X017T VO3021-X007T VO3020-X017T VO3020-X007T
Part Number VO3023-X017T VO3021-X007T VO3020-X017T VO3020-X007T
Manufacturer Vishay Semiconductor Opto Division Vishay Semiconductor Opto Division Vishay Semiconductor Opto Division Vishay Semiconductor Opto Division
Current - DC Forward (If) (Max) - - - -
Voltage - Forward (Vf) (Typ) - - - -
Voltage - Off State - - - -
Current - Hold (Ih) - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Turn On Time - - - -
Static dV/dt (Min) - - - -
Approval Agency - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Voltage - Isolation - - - -
Number of Channels - - - -
Zero Crossing Circuit - - - -
Current - On State (It (RMS)) (Max) - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Series - - - -
Current - LED Trigger (Ift) (Max) - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Output Type - Current - Unbuffered Voltage - Buffered -

VO3021-X017T Datasheet PDF

Download VO3021-X017T pdf datasheets and Vishay Semiconductor Opto Division documentation for VO3021-X017T - Vishay Semiconductor Opto Division.

PCN Obsolescence/ EOL
Mult Dev EOL 21/Apr/2020.pdf

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    Sep 22, 2026

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    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

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  • Circ***FixerTom
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    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
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    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
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    one of my hobbies is skydiving. and when i'm skydiving this works great.

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Vishay Semiconductor Opto Division

VO3021-X017T

Vishay Semiconductor Opto Division
32D-VO3021-X017T

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