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HomeProductsIntegrated Circuits (ICs)MemoryW25X20BVZPIG
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W25X20BVZPIG - Winbond Electronics

Manufacturer Part Number
W25X20BVZPIG
Manufacturer
Winbond Electronics Corporation
Allelco Part Number
98D-W25X20BVZPIG
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
15,997 pcs available, New & Original
Parts Description
IC FLASH 2MBIT SPI 104MHZ 8WSON
Package
8-WSON (6x5)
Data sheet
W25X20BVZPIG.pdf

Datasheets

W25Xx0BV Series.pdf

PCN Obsolescence/ EOL

W25Q40/X40B Devices 01/Apr/2015.pdf

PCN Packaging

2.73KHz.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 15997

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Specifications

W25X20BVZPIG Tech Specifications
Winbond Electronics - W25X20BVZPIG technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics - W25X20BVZPIG

Product Attribute Attribute Value
Manufacturer Winbond Electronics Corporation
Write Cycle Time - Word, Page 3ms
Voltage - Supply 2.7V ~ 3.6V
Technology FLASH
Supplier Device Package 8-WSON (6x5)
Series SpiFlash®
Package / Case 8-WDFN Exposed Pad
Package Tube
Operating Temperature -40°C ~ 85°C (TA)
Product Attribute Attribute Value
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Size 2Mbit
Memory Organization 256K x 8
Memory Interface SPI
Memory Format FLASH
Clock Frequency 104 MHz
Base Product Number W25X20

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0071

Frequently Asked Questions(FAQ)

What are the key differences between the W25X20BVZPIG and its closest substitute, W25X20CLZPIG, particularly in terms of operating voltage and temperature range?
The W25X20BVZPIG supports a supply voltage range of 2.7V to 3.6V and operates over an industrial temperature range from -40°C to +85°C. In comparison, the W25X20CLZPIG is specified for 2.7V to 3.6V operation but typically extends its commercial temperature range to -20°C to +70°C, making it less suitable for harsh environments. While both devices share identical memory capacity (2Mbit), interface type (SPI), and package dimensions, the BV variant offers broader thermal resilience due to its wider operating temperature window.
How does the W25X20BVZPIG compare to alternative flash memory options like the SST25VF020B-80-4I-QAE in terms of write latency and endurance characteristics?
The W25X20BVZPIG features a typical page program time of 3ms per word or page, which is consistent with standard serial flash architectures. In contrast, the SST25VF020B series employs SST’s proprietary SuperFlash technology, enabling faster write cycles—often under 1ms—but with generally lower cycle endurance (around 100k to 1M write/erase cycles). The W25X20BVZPIG offers higher endurance, typically rated for 100k cycles, making it more reliable for frequent firmware updates or data logging applications where longevity is critical.
Can the W25X20BVZPIG be used reliably in battery-powered IoT edge devices requiring low-power operation and long-term data retention?
Yes, the W25X20BVZPIG is well-suited for such applications due to its wide 2.7V to 3.6V supply range, enabling compatibility with single-cell Li-ion batteries at 3V. Its deep power-down modes reduce active current consumption to under 1µA, and the device maintains data integrity without refresh for decades under proper conditions. However, system designers must ensure stable voltage during erase/program operations, as the minimum Vcc of 2.7V may limit operation in deeply discharged battery states.
What impact does moisture sensitivity have on PCB assembly when using the W25X20BVZPIG, and how should storage and handling be managed?
The W25X20BVZPIG has a Moisture Sensitivity Level (MSL) of 3, indicating that it can withstand up to 168 hours of exposure to ambient humidity before requiring bake-out prior to reflow soldering. To prevent popcorning during thermal cycling, components should be stored in dry cabinets or sealed packaging with desiccant. If opened beyond this window, baking at 125°C for 24 hours is recommended before placement and reflow.
Is it feasible to parallel multiple W25X20BVZPIG devices to increase available memory bandwidth or capacity for high-speed data streaming?
Parallel connection of multiple W25X20BVZPIG units increases total capacity but introduces significant challenges due to SPI's daisy-chain limitations. While dual-device configurations are possible using separate chip select lines, achieving true concurrent access requires careful arbitration logic and doubles pin count. For most embedded systems, duplicating address space across chips is simpler than increasing throughput via parallelism, unless real-time logging demands dictate otherwise.
How does the 8-WSON (6x5) package of the W25X20BVZPIG affect thermal performance and PCB layout considerations compared to larger SOIC packages?
The compact 8-WSON package reduces parasitic inductance and improves signal integrity at high frequencies (up to 104 MHz), beneficial for SPI timing margins. However, its exposed pad enhances heat dissipation, allowing better thermal management during sustained write operations. Yet, the smaller footprint limits solder joint inspection and increases risk of delamination under thermal stress. Designers should allocate sufficient copper pour beneath the pad and avoid sharp corners near adjacent high-current paths.
What precautions should be taken when interfacing the W25X20BVZPIG with microcontrollers that operate at 1.8V logic levels?
Direct connection is not recommended due to the W25X20BVZPIG’s I/O voltage range (2.7V–3.6V). Voltage level shifting using dedicated ICs (e.g., TXS0108E) or resistive dividers is required to avoid damaging the flash memory while ensuring valid logic thresholds at the MCU side. Alternatively, selecting a 1.8V-compatible SPI flash eliminates conversion overhead but may restrict component choices. Signal slew rates should also be controlled to minimize EMI during clock transitions.
Why might a designer choose the W25X20BVZPIG over a similar NOR flash from another vendor despite higher cost?
The W25X20BVZPIG offers superior density-to-pin ratio and proven reliability in production environments, backed by Winbond’s long-term availability commitment. Unlike some competitors, Winbond provides robust software support including JEDEC compliance and standardized command sets, reducing integration effort. Additionally, its 104 MHz clock frequency enables faster code execution directly from flash, improving system responsiveness versus slower alternatives.
How does the base product number W25X20 relate to the specific variant W25X20BVZPIG, and what role does this play in supply chain planning?
The base product W25X20 denotes the core architecture shared across derivatives like BVZPIG, CLZPIG, and others. Variants differ in packaging, speed grade, or environmental ratings. Maintaining alignment on the base allows manufacturers to qualify platforms once while offering flexible part numbers for regional or reliability needs. This simplifies BOM management and ensures backward compatibility across generations, provided only non-conflicting suffixes are mixed.
What are the implications of the EAR99 classification for the W25X20BVZPIG in global distribution, especially regarding export controls?
Classified under EAR99, the W25X20BVZPIG is subject to general U.S. export regulations but does not require special licenses for most end uses, including consumer electronics and industrial control. However, end-equipment containing this device may still need compliance documentation if exported to embargoed regions. It remains accessible through major distributors without ITAR restrictions, facilitating international design-in.
Can the W25X20BVZPIG support continuous read operations at full 104 MHz clock rate without data corruption?
Yes, the device is specified to maintain reliable data transfer at up to 104 MHz under normal operating conditions. However, PCB trace length and impedance matching become critical above 50 MHz; uncontrolled routing can cause setup/hold violations. Decoupling capacitors within 5 mm of the VCC pin and minimizing stub lengths on MISO/MOSI lines are essential to preserve timing margins at peak frequency.
How does the W25X20BVZPIG handle sector protection mechanisms, and what risks exist if incorrect write commands are issued?
The W25X20BVZPIG implements hardware and software write protection via status register bits controlling individual sectors (typically 4KB each). Incorrectly setting these bits can lock firmware sections from modification, potentially bricking devices during update sequences. Designers must implement safeguards such as CRC checks and rollback mechanisms in bootloaders to recover from accidental protection activation.
What is the significance of the “Not Verified” status under Digi-Electronics Programmable, and how does it affect custom configuration?
This indicates that the device has not undergone Digi-Key’s internal testing or validation process, though it remains compliant with manufacturer specifications. Users can still program custom content (e.g., unique IDs or calibration data) into reserved memory areas, but they assume responsibility for functionality verification. This distinction helps distinguish between pre-tested inventory items and raw components sourced directly from the manufacturer.
Are there any known errata or stability concerns with the W25X20BVZPIG that could affect mass production deployment?
While no critical errata are publicly documented for this part, Winbond periodically releases application notes addressing common pitfalls such as improper reset timing after deep power-down or cumulative charge buildup during repeated erase/write cycles. Implementing guard bands in timing budgets and avoiding rapid power cycling (>100 cycles/day) mitigates latent failure risks in high-duty applications.
How does the W25X20BVZPIG compare to modern QSPI-enabled alternatives in terms of protocol efficiency and future-proofing?
Standard SPI (used by W25X20BVZPIG) requires separate clock and data lines, limiting scalability. Quad-SPI (QSPI) variants allow bidirectional data on four lines, doubling theoretical bandwidth. However, many legacy MCUs lack QSPI support, and migration adds complexity. Unless immediate speed demands justify it, standard SPI suffices for moderate data rates, and software buffering often compensates for latency without hardware changes.
What steps should be taken to validate SPI communication integrity when integrating the W25X20BVZPIG onto a new PCB layout?
Begin with scope measurements of SCLK rising/falling edges relative to CS assertion to confirm timing meets tSU and tH requirements. Use loopback tests with dummy reads to verify command decoding. Then perform functional writes/reads across all temperature extremes (-40°C to +85°C) and supply voltages (2.7V, 3.0V, 3.6V) to uncover marginal cases. Include ECC or checksum validation in firmware for critical data paths.
Why might a designer opt for the W25X20BVZPIG instead of migrating to a larger capacity flash despite having sufficient 2MB storage?
The 2MB capacity matches typical bootloader + application code sizes for mid-range MCUs, reducing pin count and BOM cost. Larger parts may introduce unnecessary complexity in wear leveling or erase scheduling algorithms. Furthermore, Winbond’s SpiFlash® family guarantees bit-level compatibility across densities, easing future upgrades without rewriting low-level drivers.
Does the RoHS3 compliance of the W25X20BVZPIG ensure safe material composition across all manufacturing batches and geographies?
RoHS3 compliance confirms adherence to EU Directive 2015/863, restricting phthalates and other substances beyond original RoHS limits. However, batch-level verification is required since third-party foundries may vary in process chemistry. Always request material declarations from suppliers and conduct periodic XRF screening if handling medical or automotive-grade assemblies.

Parts with Similar Specifications

The three parts on the right have similar specifications to Winbond Electronics W25X20BVZPIG

Product Attribute W25X20BVSNIG W25X20AVSNIG W25X20CLSVIG W25X20CLSNIG TR
Part Number W25X20BVSNIG W25X20AVSNIG W25X20CLSVIG W25X20CLSNIG TR
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Voltage - Supply - - - -
Write Cycle Time - Word, Page - - - -
Memory Format - - - -
Memory Size - - - -
Memory Interface - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Memory Organization - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Memory Type - - - -
Clock Frequency - - - -
Technology - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Base Product Number - DAC34H84 MAX500 ADS62P42
Series - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad

W25X20BVZPIG Datasheet PDF

Download W25X20BVZPIG pdf datasheets and Winbond Electronics documentation for W25X20BVZPIG - Winbond Electronics.

Datasheets
W25Xx0BV Series.pdf
PCN Obsolescence/ EOL
W25Q40/X40B Devices 01/Apr/2015.pdf
PCN Packaging
2.73KHz.pdf

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Customer Reviews

Evaluation: 10 Articles

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    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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    Aug 5, 2026

    Purchased this DSP controller for a motor control application. Stable processing performance and very good response under varying loads.

  • FPGA***dio
    Jul 30, 2026

    This FPGA handled our logic design without any surprises. Configuration completed quickly and timing met the project requirements.

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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W25X20BVZPIG Image

W25X20BVZPIG

Winbond Electronics
98D-W25X20BVZPIG

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