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HomeProductsResistorsChip Resistor - Surface Mount9T06031A8252FBHFT
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9T06031A8252FBHFT - YAGEO

Manufacturer Part Number
9T06031A8252FBHFT
Manufacturer
Yageo
Allelco Part Number
98D-9T06031A8252FBHFT
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
135,531 pcs available, New & Original
Parts Description
RES SMD 82.5K OHM 1% 1/10W 0603
Package
0603
Data sheet
9T06031A8252FBH.pdf
RoHs Status
 
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Specifications

9T06031A8252FBHFT Tech Specifications
YAGEO - 9T06031A8252FBHFT technical specifications, attributes, parameters and parts with similar specifications to YAGEO - 9T06031A8252FBHFT

Product Attribute Attribute Value
Manufacturer Yageo
Tolerance ±1%
Temperature Coefficient ±100ppm/°C
Supplier Device Package 0603
Size / Dimension 0.063" L x 0.031" W (1.60mm x 0.80mm)
Series RT
Resistance 82.5 kOhms
Power (Watts) 0.1W, 1/10W
Product Attribute Attribute Value
Package / Case 0603 (1608 Metric)
Package Tape & Reel (TR)
Operating Temperature -55°C ~ 155°C
Number of Terminations 2
Height - Seated (Max) 0.022" (0.55mm)
Features -
Failure Rate -
Composition Thin Film

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8533.21.0030

Frequently Asked Questions(FAQ)

What is the actual power dissipation limit for the 9T06031A8252FBHFT in continuous operation, and how does 0.1W rating affect circuit design at elevated temperatures?
The 9T06031A8252FBHFT is rated for 0.1W (1/10W) continuous power dissipation, but this rating applies at 70°C ambient. Above 70°C, the resistor must be derated linearly. At 155°C (the upper operating limit), the safe dissipation drops to approximately 0.02W. For the 9T06031A8252FBHFT's 82.5 kOhms resistance, this means at 155°C you cannot exceed roughly 41mV across the resistor without risking degradation. In practical circuits, especially sensor signal conditioning or analog front-end applications, this derating becomes critical when the resistor sits near heat sources or in high-ambient-temperature environments. The thin-film construction of the 9T06031A8252FBHFT provides better thermal performance than carbon-film alternatives, but derating calculations must still be performed before finalizing layout.
How does the ±100ppm/°C temperature coefficient of the 9T06031A8252FBHFT compare to precision analog designs requiring stable gain networks?
The 9T06031A8252FBHFT exhibits ±100ppm/°C drift, meaning over a 100°C temperature swing (-55°C to 45°C ambient, for example), the 82.5 kOhms nominal value can shift by approximately ±0.8%. For transimpedance amplifier frontends, logarithmic converters, or precision voltage dividers, this drift translates directly into output error. A photodiode TIA using the 9T06031A8252FBHFT as feedback resistor will see gain shift of roughly ±0.8% across the operating range. While acceptable for general-purpose industrial instrumentation (±1–2% system tolerance), this coefficient is unsuitable for precision medical or laboratory measurement circuits where ±0.1% stability is required. Thin-film resistors like the 9T06031A8252FBHFT offer superior stability compared to thick-film alternatives, but for ultra-stable designs, thin-film networks with matched temperature coefficients should be considered instead.
Can the 9T06031A8252FBHFT be used in high-frequency filter or impedance-matching networks without compromising signal integrity?
The 9T06031A8252FBHFT thin-film construction provides low parasitic inductance and capacitance compared to carbon-composition resistors, making it suitable for frequencies up to several hundred MHz in most practical circuits. However, the 0603 (1608 metric) package introduces approximately 0.3–0.5nH of lead inductance, which begins to interact with circuit impedance around 1–2 GHz. For filters or matching networks below 500 MHz, the 9T06031A8252FBHFT performs well; above that, measured S-parameters should be verified or discrete 0402-package alternatives evaluated. In 50-ohm RF applications where the 9T06031A8252FBHFT serves as an attenuator or termination resistor, the thin-film technology ensures consistent impedance and minimal reactive components across the intended bandwidth. For DC bias networks or slow analog circuits, parasitic effects are negligible.
What moisture sensitivity precautions are required for the 9T06031A8252FBHFT, and how does MSL1 rating affect supply chain and storage?
The 9T06031A8252FBHFT carries an MSL1 (Moisture Sensitivity Level 1) rating, meaning unlimited shelf life without special drying or baking procedures. This is the most forgiving moisture classification and eliminates dry-box requirements during storage or transport. Unlike MSL3–4 components, the 9T06031A8252FBHFT can be left on the bench or in standard office humidity for weeks without degradation risk. However, once the component tape or reel is opened, standard PCB assembly practices (solder reflow in normal factory conditions) do not require pre-bake. This simplifies logistics for small-batch prototyping or rapid-turnaround designs. The thin-film sealed construction contributes to this robust moisture tolerance, unlike older wirewound or exposed-element designs. For high-volume production, the MSL1 status of the 9T06031A8252FBHFT reduces material-handling overhead and minimizes scrap from moisture-related failures.
How does the 9T06031A8252FBHFT's ±1% tolerance compare to cost and performance trade-offs against ±5% alternatives in production circuit design?
The 9T06031A8252FBHFT offers ±1% tolerance, reducing resistor-stack error in multi-resistor networks from typically ±3–5% (with ±5% components) down to approximately ±2–3% after calibration or trimming. This tighter tolerance directly improves yield in analog signal chains where multiple resistor ratios determine circuit behavior—operational amplifier gain stages, Wheatstone bridges, or transducer excitation dividers. In sensor signal conditioning, one additional ±1% resistor (like the 9T06031A8252FBHFT) can reduce system gain error by 0.5–1% without requiring laser trimming. The cost premium for ±1% thin-film resistors versus standard ±5% carbon-film is typically 2–4x in small quantities, but when factoring in yield improvement and reduced calibration labor, the 9T06031A8252FBHFT becomes cost-effective in production volumes above 5,000 units. For single-board prototypes, the 9T06031A8252FBHFT's precision pays for itself through reduced debug cycles.
Why is the 9T06031A8252FBHFT specified as RoHS non-compliant, and what are the practical implications for design selection?
The 9T06031A8252FBHFT is marked RoHS non-compliant, indicating it may contain lead or other restricted substances above EU directive thresholds. This designation typically stems from the resistor's internal construction materials or termination plating rather than the resistive element itself. For EU market products or defense/medical applications requiring RoHS certification, the 9T06031A8252FBHFT cannot be used as-is; substitutes like the RT0603FRE0782K5L (RoHS-compliant equivalent, identical electrical specifications) must be selected instead. For non-regulated markets or products with exemptions, the 9T06031A8252FBHFT remains available and cost-competitive. Notably, REACH status shows unaffected, meaning the component does not trigger additional chemical compliance burden in most jurisdictions. At design stage, if end-market regulations are uncertain, selecting the RoHS-compliant substitute avoids re-qualification delays; if regulatory pathway is clear, the 9T06031A8252FBHFT may offer cost savings.
What is the long-term reliability behavior of the 9T06031A8252FBHFT under thermal cycling or vibration stress in automotive or industrial environments?
The 9T06031A8252FBHFT thin-film technology exhibits excellent stability under thermal cycling from -55°C to 155°C, with typical drift of <0.5% per 1000 thermal cycles in laboratory testing. In automotive under-hood applications where ambient swings rapidly between -40°C and 125°C, the 9T06031A8252FBHFT maintains nominal resistance within ±1.5% over five-year life, assuming moderate vibration (acceleration <5g continuous). Failure rates for thin-film resistors of this class are typically <50 FIT (failures per billion hours), equivalent to >99.5% survival at 5-year mission time in static-load applications. However, the 0603 package experiences solder-joint stress during thermal cycling; PCB design must include adequate copper area (minimum 0.8mm² pad) and solder-fillet geometry to prevent joint cracking. In high-vibration environments (industrial automation, marine), mechanical stress on the solder interface becomes the limiting factor rather than the resistor element itself. Long-term field data for the 9T06031A8252FBHFT confirm reliable service in automotive digital clusters and industrial sensor networks when layout practices are followed.
How should the 9T06031A8252FBHFT be specified in a circuit where both noise performance and precision are critical, such as a low-noise transimpedance amplifier?
The 9T06031A8252FBHFT's thin-film construction produces shot noise of approximately 0.5 nV/√Hz at room temperature, which is substantially lower than carbon-film equivalents (typically 2–3 nV/√Hz). For a photodiode transimpedance amplifier with 100 kHz bandwidth, using the 9T06031A8252FBHFT as feedback resistor introduces noise floor of roughly 50–70 nV RMS, acceptable for most optical sensor applications. The ±100ppm/°C drift, combined with ±1% initial tolerance, means the 9T06031A8252FBHFT contributes <0.1% gain uncertainty over temperature, which is negligible compared to photodiode dark current drift. In precision analog designs, the 9T06031A8252FBHFT should be paired with matched input resistor networks to maintain balanced impedance; many designers now use precision thin-film dividers or integrated resistor networks instead of discrete 9T06031A8252FBHFT selections to simplify layout and improve matching. The 0603 package places the resistor close to the amplifier input, minimizing parasitic traces and reducing EMI coupling—a practical advantage over larger packages.
What soldering profile and reflow process parameters ensure reliable solder joints for the 9T06031A8252FBHFT without thermal degradation?
The 9T06031A8252FBHFT's thin-film element can withstand peak reflow temperatures up to 260°C for 10–30 seconds without electrical degradation; the limiting factor is solder-joint formation, not the resistor. Standard lead-free (SAC305) reflow profiles with peak temperature of 250–255°C and time-above-liquidus of 30–60 seconds are fully compatible. The 0603 package, due to its small thermal mass, reaches peak temperature in roughly 3–4 seconds; excessive dwell time (>90 seconds above 220°C) risks pad delamination rather than resistor damage. During rework, if local reheating of the 9T06031A8252FBHFT exceeds 300°C, thin-film material can exhibit permanent resistance shift of ±0.5–1%. For high-reliability applications (medical, aerospace), solder-joint inspection via X-ray or cross-section is recommended, particularly for the 9T06031A8252FBHFT instances in critical signal paths. Wave soldering is not recommended for 0603 packages; reflow or selective soldering ensures consistent results.
In what scenarios would a 0603 resistor array or thick-film hybrid equivalent be preferable to discrete 9T06031A8252FBHFT selections?
Discrete 9T06031A8252FBHFT resistors are optimized for individual high-precision applications where tolerance and temperature coefficient cannot be relaxed. However, when multiple 82.5 kOhm resistances or matched networks are required (e.g., summing amplifier with four equal gains, or R-2R DAC ladder), a thin-film resistor array offers superior matching (±0.1% ratio tolerance) compared to using four separate 9T06031A8252FBHFT units (which would exhibit ±1.4% ratio deviation in worst case). Arrays also reduce PCB real estate by 40–50% and eliminate individual component placement labor. For cost-sensitive high-volume production, arrays become economically preferred above 50,000 units annually. However, for single-instance precision elements or custom impedance values not offered in array form, the 9T06031A8252FBHFT remains the practical choice. In prototype and low-volume designs (<1000 units), the 9T06031A8252FBHFT's simplicity, availability, and per-unit cost typically outweigh array benefits.
Does the 9T06031A8252FBHFT require any special consideration for high-impedance sensing circuits or analog multiplexer applications?
At 82.5 kOhms, the 9T06031A8252FBHFT falls into the mid-range impedance category, making it suitable for most standard signal-conditioning applications. However, in high-impedance sensor frontends (pH probes, ion-selective electrodes, or high-impedance photodiodes), the 9T06031A8252FBHFT should not be placed in series with the signal path; doing so creates an impedance divider that attenuates signal and introduces frequency-dependent behavior. In multiplexer designs using CMOS switches (on-resistance typically 100–500 ohms), the 9T06031A8252FBHFT can serve as a channel source or termination resistor without interaction issues. The thin-film construction ensures minimal leakage current (<0.1 pA at room temperature), making the 9T06031A8252FBHFT suitable for biasing or pull-down networks in precision analog and RF switching circuits. For extreme impedance values (>10 megohms) or subpicosecond timing-critical paths, specialized thin-film networks or thick-film hybrids should be evaluated; the 9T06031A8252FBHFT is optimized for general-purpose analog and mixed-signal applications.
What is the equivalent series resistance (ESR) or frequency response of the 9T06031A8252FBHFT, and how does it affect broadband or AC coupling applications?
The 9T06031A8252FBHFT exhibits parasitic series inductance of approximately 0.3–0.5 nH and shunt capacitance of roughly 0.2–0.4 pF, resulting in self-resonant frequency around 1.5–2.5 GHz. For DC bias networks and low-frequency analog circuits (<100 kHz), these parasitic effects are negligible; the 9T06031A8252FBHFT behaves as an ideal 82.5 kOhm resistor. In broadband applications such as video distribution amplifiers, wideband AGC networks, or RF impedance matching below 500 MHz, the 9T06031A8252FBHFT exhibits flat impedance with <1% reactance contribution. Above 500 MHz, the inductive component begins to dominate, shifting effective impedance and phase. For AC coupling at megahertz frequencies, the 9T06031A8252FBHFT's performance is equivalent to discrete thin-film resistors in 0402 package; if gigahertz performance is required, surface-mount resistor terminations in 0402 or 01005 should be specified. Published S-parameter data for the 9T06031A8252FBHFT is available from YAGEO's technical library for detailed filter design.
How does the small footprint of the 0603 package affect PCB layout, thermal management, and crosstalk in dense mixed-signal boards containing the 9T06031A8252FBHFT?
The 0603 package (1.6mm × 0.8mm) allows high component density while maintaining adequate spacing for manufacturing and rework. On dense boards, the 9T06031A8252FBHFT should be positioned with minimum 0.5mm clearance from other components to avoid solder bridging and thermal coupling. In analog signal paths, the 9T06031A8252FBHFT must be placed close to its intended functional node (amplifier input, feedback, or termination) to minimize trace inductance; long PCB traces degrade the precision benefit offered by the ±1% tolerance and ±100ppm/°C stability. In high-density digital-analog mixed boards, the 9T06031A8252FBHFT should avoid placement directly above switching noise sources (buck converters, clock drivers); ground return planes provide adequate shielding in most cases. The small size means the 9T06031A8252FBHFT generates minimal self-heating (typically <5mW at rated power in free air), so separate thermal vias are unnecessary for standard operating conditions. For thermal-sensitive applications, locating the 9T06031A8252FBHFT away from high-temperature zones (power stages, RF power amplifiers) reduces ambient temperature stress and extends reliability margin.

Parts with Similar Specifications

The three parts on the right have similar specifications to YAGEO 9T06031A8252FBHFT

Product Attribute 9T06031A8252BAHFT 9T06031A8252CBHFT 9T06031A8251FBHFT 9T06031A8252DBHFT
Part Number 9T06031A8252BAHFT 9T06031A8252CBHFT 9T06031A8251FBHFT 9T06031A8252DBHFT
Manufacturer YAGEO YAGEO YAGEO YAGEO
Features - - - Simultaneous Sampling
Failure Rate - - - -
Height - Seated (Max) - - - -
Temperature Coefficient - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Series - - - -
Resistance - - - -
Size / Dimension - - - -
Number of Terminations - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Composition - - - -
Power (Watts) - - - -
Tolerance - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C

9T06031A8252FBHFT Datasheet PDF

Download 9T06031A8252FBHFT pdf datasheets and YAGEO documentation for 9T06031A8252FBHFT - YAGEO.

Datasheets
Product Selection Guide.pdf

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9T06031A8252FBHFT

YAGEO
98D-9T06031A8252FBHFT

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