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Home Products Resistors Chip Resistor - Surface Mount~~9T06031A82R0BBHFT~~

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9T06031A82R0BBHFT - YAGEO

Manufacturer Part Number: 9T06031A82R0BBHFT

Manufacturer: Yageo

Allelco Part Number: 98D-9T06031A82R0BBHFT

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 169,628 pcs available, New & Original

Parts Description: RES SMD 82 OHM 0.1% 1/10W 0603

Package: 0603

Data sheet: 9T06031A82R0BBH.pdf

Datasheets
Product Selection Guide.pdf

RoHs Status

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In stock: 169628

Specifications

9T06031A82R0BBHFT Tech Specifications
YAGEO - 9T06031A82R0BBHFT technical specifications, attributes, parameters and parts with similar specifications to YAGEO - 9T06031A82R0BBHFT

Product Attribute	Attribute Value
Manufacturer	Yageo
Tolerance	±0.1%
Temperature Coefficient	±100ppm/°C
Supplier Device Package	0603
Size / Dimension	0.063" L x 0.031" W (1.60mm x 0.80mm)
Series	RT
Resistance	82 Ohms
Power (Watts)	0.1W, 1/10W

Product Attribute	Attribute Value
Package / Case	0603 (1608 Metric)
Package	Tape & Reel (TR)
Operating Temperature	-55°C ~ 155°C
Number of Terminations	2
Height - Seated (Max)	0.022" (0.55mm)
Features	-
Failure Rate	-
Composition	Thin Film

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	RoHS non-compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8533.21.0030

Frequently Asked Questions(FAQ)

What is the tolerance specification of the 9T06031A82R0BBHFT and how does ±0.1% accuracy compare to standard 1% resistors in precision analog circuits?: The 9T06031A82R0BBHFT features ±0.1% tolerance, representing a tenfold improvement over conventional 1% thick-film resistors. This precision is achieved through thin-film deposition technology on ceramic substrates, enabling tighter resistive layer control during manufacturing. In precision analog applications such as transimpedance amplifiers, instrumentation front-ends, and gain-setting networks, the 9T06031A82R0BBHFT reduces circuit calibration complexity and eliminates the need for external trimming potentiometers. The ±100 ppm/°C temperature coefficient of the 9T06031A82R0BBHFT further supports stable DC biasing and ratiometric measurements across the -55°C to 155°C operating window without secondary compensation networks.

Can the 9T06031A82R0BBHFT be used as a direct replacement for TNPW060382R0BETA or RT0603BRE0782RL in existing designs?: The 9T06031A82R0BBHFT shares the same 82Ω resistance value, 0603 package footprint, and ±0.1% tolerance with both TNPW060382R0BETA and RT0603BRE0782RL, making it mechanically and electrically interchangeable in most applications. However, cross-manufacturer substitution should account for minor differences in parasitic inductance (typically 0.3–0.5 nH across thin-film designs) and frequency response characteristics above 100 MHz. For AC signal conditioning, noise performance, or high-frequency filtering where the 9T06031A82R0BBHFT may be deployed, comparative impedance measurements at the operating frequency are recommended to confirm design margins, particularly in broadband systems.

What power dissipation and thermal considerations apply when sizing the 9T06031A82R0BBHFT for a 0.1W continuous-duty application?: The 9T06031A82R0BBHFT is rated for 0.1W (100 mW) continuous power dissipation in free-air conditions. At rated power, the resistive element produces approximately 2.87 volts across the 82Ω resistance (I = √(P/R) = √(0.1/82) ≈ 34.9 mA). In typical PCB layouts with standard 1 oz copper, the 9T06031A82R0BBHFT junction temperature rise is approximately 150–200°C/W above ambient, translating to roughly 15–20°C rise at full power in 25°C ambient conditions. For sustained operation near 155°C upper limit, circuit designers must account for derating: at 70°C ambient, the 9T06031A82R0BBHFT can safely handle continuous power without thermal runaway, though margin analysis is advisable for transient load conditions exceeding 0.1W.

How does the thin-film construction of the 9T06031A82R0BBHFT affect frequency response and parasitic behavior compared to thick-film alternatives?: Thin-film technology, employed in the 9T06031A82R0BBHFT, deposits a resistive alloy layer (typically nichrome) on a ceramic substrate with photolithographic patterning, resulting in lower parasitic series inductance (typically 0.3–0.4 nH) and distributed capacitance versus thick-film constructions. This permits the 9T06031A82R0BBHFT to maintain resistive accuracy into the VHF range without self-resonance artifacts. In filter networks and impedance matching circuits operating above 500 MHz, the 9T06031A82R0BBHFT exhibits flatter frequency response than equivalent thick-film 1/10W resistors. The ±100 ppm/°C temperature coefficient of the 9T06031A82R0BBHFT also reflects superior thin-film stability, as the resistive layer experiences minimal drift from thermal expansion mismatch between substrate and resistive material.

Is the 9T06031A82R0BBHFT suitable for RF and microwave bias networks, and what impedance matching constraints should be considered?: The 9T06031A82R0BBHFT can function as a biasing resistor in RF circuits up to several GigaHertz, provided that the parasitic series inductance (0.3–0.4 nH typical for 0603 thin-film) and substrate capacitance do not interact with transmission line impedances. For 50Ω systems, the 9T06031A82R0BBHFT's low parasitic values ensure minimal reflection coefficient magnitude at microwave frequencies. However, in narrow-band RF front-ends, the 9T06031A82R0BBHFT should be decoupled with parallel bypass capacitors (typically 100–470 pF ceramic) to suppress RF leakage into bias networks. The ±100 ppm/°C temperature coefficient of the 9T06031A82R0BBHFT contributes to bias point drift in power amplifier gate/base bias chains; multi-stage bias compensation may be necessary for temperature-stable RF operation.

What environmental factors affect the long-term reliability of the 9T06031A82R0BBHFT, and does its RoHS non-compliant status impact procurement or lifetime performance?: The 9T06031A82R0BBHFT carries RoHS non-compliant status, indicating presence of lead-bearing solder terminations or other restricted substances. This does not degrade electrical performance or lifetime reliability under standard conditions; rather, RoHS status reflects manufacturing process compliance classification. The 9T06031A82R0BBHFT is rated for operation from -55°C to 155°C with an MSL (Moisture Sensitivity Level) classification of 1, signifying unlimited shelf life and no moisture-bake requirements prior to reflow soldering. Environmental stress factors such as thermal cycling, humidity exposure, and mechanical shock do not differentially affect the 9T06031A82R0BBHFT versus RoHS-compliant alternatives, as thin-film resistor reliability depends on substrate material and resistive layer adhesion rather than solder composition. Procurement teams should verify that RoHS non-compliance aligns with end-product regulatory requirements (military, automotive, or commercial).

How should the 9T06031A82R0BBHFT be handled and stored to maintain ±0.1% tolerance specifications prior to assembly?: The 9T06031A82R0BBHFT's MSL 1 classification permits indefinite dry storage without moisture absorption concerns. However, static discharge poses the primary handling risk for thin-film resistors in surface-mount form. ESD-safe practices—grounded wrist straps, conductive workbenches, and anti-static bags—are recommended during handling. The 9T06031A82R0BBHFT resistance value remains stable across typical storage temperature ranges (-40°C to 70°C); long-term shelf storage at elevated temperatures (>85°C) may introduce minor resistance drift (typically <0.05% over 1–2 years) due to slow aging of the thin-film alloy. Vibration and mechanical shock during shipping do not affect the 9T06031A82R0BBHFT, as solder joints on a properly designed PCB will absorb mechanical energy. Post-reflow thermal cycling (typical range -40°C to 125°C, 500+ cycles) demonstrates minimal performance degradation in the 9T06031A82R0BBHFT.

What soldering profile and thermal management are required for the 0603 package of the 9T06031A82R0BBHFT to ensure solder joint reliability?: The 9T06031A82R0BBHFT in 0603 package (1.60mm × 0.80mm, 0.55mm seated height) is compatible with standard lead-free reflow soldering profiles (peak temperature 240–250°C, dwell 200–220°C for 10–30 seconds). Thermal stress on the 9T06031A82R0BBHFT occurs during ramp-up and ramp-down phases rather than peak dwell; excessive ramp rates (>3°C/s) may induce substrate stress and micro-cracking in the thin-film layer. Post-reflow wave soldering should be avoided, as the 9T06031A82R0BBHFT's thin-film construction and ceramic substrate do not tolerate wave-soldering thermal shock. Thermal relief vias and ground plane thermal spokes under the 9T06031A82R0BBHFT pads help dissipate reflow heat uniformly and reduce solder joint thermal cycling stress during operation.

In precision DC measurement and data acquisition front-ends, how does the ±100 ppm/°C temperature coefficient of the 9T06031A82R0BBHFT compare with alternative thin-film resistor specifications?: The 9T06031A82R0BBHFT's ±100 ppm/°C temperature coefficient represents mid-range performance within the thin-film resistor category. High-precision thin-film resistors (0.05% tolerance) may offer ±50 ppm/°C, while thicker or lower-tolerance variants exhibit ±150–200 ppm/°C. For the 9T06031A82R0BBHFT in a temperature range from -55°C to 155°C (210°C span), worst-case resistance change is approximately ±0.021% (assuming symmetric positive and negative coefficients). In 16-bit or higher resolution data acquisition systems, this translates to approximately 0.3 LSB error at 2.5V full-scale range. The 9T06031A82R0BBHFT is therefore suitable for input transimpedance amplifiers and filtering networks where second-order temperature stability is acceptable; precision ratiometric measurements requiring <0.01% stability may require ratio-matched resistor pairs or external trimming alongside the 9T06031A82R0BBHFT.

What are the electrical performance characteristics of the 9T06031A82R0BBHFT in high-frequency filtering and signal conditioning applications above 1 GHz?: The 9T06031A82R0BBHFT exhibits nearly flat resistance up to approximately 2–3 GHz, constrained primarily by parasitic series inductance (~0.35 nH typical) and substrate capacitance. At 10 GHz, the 9T06031A82R0BBHFT's impedance magnitude increases approximately 10–15% above the nominal 82Ω DC value due to inductive reactance. For baseband and IF filtering (DC to 500 MHz), the 9T06031A82R0BBHFT provides stable 82Ω damping without frequency-dependent derating. In high-Q active filters and low-noise transimpedance amplifiers, the 9T06031A82R0BBHFT's flat frequency response minimizes group delay distortion. Above 5 GHz, designers should verify 9T06031A82R0BBHFT performance via simulation (including parasitic models) or empirical measurement, particularly in phase-critical applications such as vector modulators or phase shifters.

How does MSL 1 classification of the 9T06031A82R0BBHFT influence supply chain logistics and assembly scheduling?: MSL (Moisture Sensitivity Level) 1 classification of the 9T06031A82R0BBHFT signifies unlimited shelf life without moisture-induced solderability degradation. Unlike MSL 2–3 components requiring moisture-bake procedures and time-limited floor life, the 9T06031A82R0BBHFT simplifies inventory management and reduces assembly rework due to moisture reflow failures. This permits direct shipment of the 9T06031A82R0BBHFT from distributors without sealed desiccant packaging, lowering logistics costs and lead-time risk. For contract manufacturers and low-volume production, the 9T06031A82R0BBHFT's MSL 1 status avoids moisture-bake scheduling and associated curing-time delays. High-volume assembly plants benefit similarly: the 9T06031A82R0BBHFT can be stored in open-bin feeders without performance degradation over production runs spanning weeks or months.

What design trade-offs exist between the 9T06031A82R0BBHFT and higher-power 0805 thin-film resistors in multi-stage amplifier biasing networks?: The 9T06031A82R0BBHFT (0603, 0.1W) versus 0805 thin-film alternatives (typically 0.25W) presents a size-to-power trade-off. The 9T06031A82R0BBHFT occupies approximately 30% less PCB area and offers lower parasitic inductance due to reduced lead length, beneficial for high-frequency bias decoupling. However, 0805 alternatives accommodate 2.5× continuous power dissipation, reducing junction temperature rise in high-current bias chains and permitting relaxed thermal design margins. For single-stage bias networks (<50 mA), the 9T06031A82R0BBHFT thermal headroom is adequate; multi-stage RF power amplifier bias networks may require 0805 alternatives to maintain <150°C junction temperature at 70°C ambient without additional heat sinking. The 9T06031A82R0BBHFT's smaller footprint and superior frequency response generally justify selection unless power dissipation exceeds 75 mW continuous.

Parts with Similar Specifications

The three parts on the right have similar specifications to YAGEO 9T06031A82R0BBHFT

Product Attribute
Part Number	9T06031A82R0BAHFT	9T06031A82R0CBHFT	9T06031A82R0DBHFT	9T06031A82R5BBHFT
Manufacturer	YAGEO	YAGEO	YAGEO	YAGEO
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Series	-	-	-	-
Size / Dimension	-	-	-	-
Features	-	-	-	Simultaneous Sampling
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Power (Watts)	-	-	-	-
Tolerance	-	-	-	-
Resistance	-	-	-	-
Temperature Coefficient	-	-	-	-
Composition	-	-	-	-
Failure Rate	-	-	-	-
Height - Seated (Max)	-	-	-	-
Number of Terminations	-	-	-	-

9T06031A82R0BBHFT Datasheet PDF

Download 9T06031A82R0BBHFT pdf datasheets and YAGEO documentation for 9T06031A82R0BBHFT - YAGEO.

Datasheets: Product Selection Guide.pdf

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