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HomeProductsResistorsChip Resistor - Surface MountMMF25SDRE806R
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MMF25SDRE806R - YAGEO

Manufacturer Part Number
MMF25SDRE806R
Manufacturer
Yageo
Allelco Part Number
98D-MMF25SDRE806R
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
40,494 pcs available, New & Original
Parts Description
RES SMD 0.5% 1/4W MELF
Package
MELF
Data sheet
MMF25SDRE806R.pdf

Datasheets

MMF Series.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 40494
  • Unit Price: $0.044
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $0.044 $0.04
200+ $0.017 $3.40
500+ $0.016 $8.00
1000+ $0.016 $16.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

MMF25SDRE806R Tech Specifications
YAGEO - MMF25SDRE806R technical specifications, attributes, parameters and parts with similar specifications to YAGEO - MMF25SDRE806R

Product Attribute Attribute Value
Manufacturer Yageo
Tolerance ±0.5%
Temperature Coefficient ±50ppm/°C
Supplier Device Package MELF
Size / Dimension 0.055" Dia x 0.138" L (1.40mm x 3.50mm)
Series MMF
Resistance 806 Ohms
Power (Watts) 0.25W, 1/4W
Product Attribute Attribute Value
Package / Case MELF, 0204
Package Tape & Reel (TR)
Operating Temperature -55°C ~ 155°C
Number of Terminations 2
Height - Seated (Max) -
Features -
Failure Rate -
Composition Metal Film

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8533.21.0040

Frequently Asked Questions(FAQ)

What are the key differences between the MMF25SDRE806R metal film resistor and standard thick-film chip resistors for precision analog circuits?
The MMF25SDRE806R is a metal film resistor constructed with a precision-deposited metal layer on a ceramic substrate, delivering ±0.5% tolerance and ±50ppm/°C temperature coefficient—significantly tighter specifications than typical thick-film alternatives which commonly offer ±1% tolerance and ±100ppm/°C. In analog signal conditioning, data acquisition front-ends, and transimpedance amplifier networks, the MMF25SDRE806R's superior stability reduces gain drift across temperature excursions and minimizes dc offset errors in precision instrumentation. The 806 Ohms resistance value positions it well for transimpedance applications with moderate bandwidth and low-noise requirements, where thick-film resistors would introduce unacceptable gain uncertainty.
Can the MMF25SDRE806R be used as a current-sense resistor in power management circuits, and what are the thermal management considerations?
The MMF25SDRE806R's 0.25W power rating and 806 Ohms resistance allow operation in moderate-current sensing applications—typical current sensing at 25 mA dissipates 0.5W, which exceeds the component rating and requires thermal derating. For low-side current sensing below 15 mA, the MMF25SDRE806R operates safely with minimal self-heating. However, in higher-current applications, parallel resistor networks or higher power-rated alternatives become necessary. The MELF 0204 package offers superior thermal dissipation compared to miniature 0603 chip resistors due to larger surface area and cylindrical geometry, making it more suitable for thermal environments where 1/4W dissipation proves adequate—such as in fan control circuits or battery management current monitoring operating near room temperature.
How does the ±50ppm/°C temperature coefficient of the MMF25SDRE806R affect precision measurement over an industrial temperature range?
The MMF25SDRE806R experiences a maximum 0.4% total resistance shift across a 110°C span (-55°C to +155°C industrial range), combining the ±0.5% initial tolerance with temperature drift. In a practical ratiometric divider using matched 806 Ohm resistors, gain errors remain predictable and cancel partially through temperature correlation. However, in absolute-value applications—such as precision bridge amplifier networks or stand-alone transimpedance circuits—the cumulative temperature drift produces measurable output drift: a 10 nV/°C amplifier combined with MMF25SDRE806R drift at 50°C offset generates approximately 0.25 µV/°C output change. For military or harsh-environment systems requiring <0.5% accuracy across the full operating range, the MMF25SDRE806R becomes the minimum acceptable choice; automotive or industrial systems with ±1% error budgets accommodate this component readily.
What is the difference between the MMF25SDRE806R and a 0.5W MELF resistor when selecting components for low-noise preamplifier circuits?
The MMF25SDRE806R at 0.25W power rating differs from 0.5W MELF resistors primarily in thermal stability and bias point flexibility rather than noise floor. Both metal film technologies exhibit similar johnson noise characteristics (~1.3 nV/√Hz at room temperature for 806 Ohms), but the MMF25SDRE806R's compact 0.25W rating limits safe bias current to approximately 17 mA before thermal constraints become problematic. In a transimpedance amplifier biased at 15 mA through the MMF25SDRE806R, self-heating adds roughly 0.3°C to the resistor junction temperature under continuous operation, maintaining thermal stability. A 0.5W MELF variant tolerates 25 mA safely, providing greater design margin. For cost-sensitive applications where bias current remains below 10 mA, the MMF25SDRE806R offers equivalent noise performance at lower cost; for high-reliability medical or instrumentation amplifiers requiring sustained high-impedance operation with margin, the 0.5W variant becomes preferred despite similar electrical properties.
Does the MMF25SDRE806R meet RoHS3 and REACH compliance requirements for European market deployment?
The MMF25SDRE806R carries full RoHS3 Compliance certification and REACH Unaffected status, confirming the component is manufactured without restricted lead, cadmium, hexavalent chromium, or other banned substances covered by Directive 2011/65/EU. REACH Unaffected classification indicates the 806 Ohm metal film construction contains no substances of very high concern (SVHC) on the ECHA candidate list. Moisture Sensitivity Level (MSL) 1 designation confirms unlimited shelf life under normal storage conditions without desiccant requirements—critical for automated assembly environments and global supply chain distribution. Design engineers integrating the MMF25SDRE806R into medical devices, industrial instrumentation, or consumer electronics destined for EU, UK, or markets adopting equivalent environmental standards can proceed without additional compliance verification.
How does the MMF25SDRE806R's MELF 0204 package compare to standard 0603 chip resistor packaging for automated assembly and rework?
The MMF25SDRE806R's cylindrical MELF 0204 package (1.40mm diameter × 3.50mm length) differs substantially from rectangular 0603 geometry in placement, reflow, and rework handling. MELF components require specialized pick-and-place tooling with vacuum pickup systems designed for cylindrical surfaces; standard 0603 feeders and nozzles cannot reliably handle MELF parts. Reflow soldering of the MMF25SDRE806R demands careful profile management—the cylindrical geometry creates thermal lag in solder wetting, requiring slightly longer time-above-liquidus windows compared to 0603 resistors of equivalent power. Rework becomes more difficult; localized rework equipment must access both termination ends without damaging the ceramic body. However, the MMF25SDRE806R's superior thermal dissipation through direct PCB contact and larger conductor terminations produces more robust solder joints in harsh thermal cycling environments. For high-volume consumer products with aggressive cost-driven assembly, 0603 alternatives dominate; for aerospace, automotive, or reliability-critical applications accepting higher placement costs, the MELF 0204 package of the MMF25SDRE806R justifies the assembly complexity.
What precision-grade alternative resistor values complement the MMF25SDRE806R in matched divider and filter networks?
The MMF25SDRE806R occupies the mid-range impedance space (hundreds of ohms) in precision analog circuits. Practical complementary values include 1kΩ and 620Ω metal film resistors from the same YAGEO MMF series, all sharing ±0.5% tolerance and ±50ppm/°C temperature coefficient. In a precision logarithmic amplifier or precision attenuator using MMF25SDRE806R as a feedback resistor, matching the transimpedance conversion resistor to identical tolerance and temperature tracking ensures gain stability across the full industrial temperature range. Resistor dividers combining the 806Ω MMF25SDRE806R with 2kΩ or 3.3kΩ precision resistors produce high-impedance reference networks with <0.1% divider ratio drift over temperature. When the 806Ω value appears in series with the 1kΩ resistor, a ratiometric transimpedance of approximately 806Ω results with exceptional linearity. Standard ±5% 0603 chip resistors prove inadequate as complementary components; precision matching demands equivalent metal film technology across the entire network.
How should the MMF25SDRE806R be derated for continuous operation at elevated temperatures above 125°C?
The MMF25SDRE806R maintains rated 0.25W power capacity to 70°C ambient; above this temperature, linear derating applies at roughly 1.5mW per °C. At 125°C ambient (common in automotive under-hood environments), safe continuous dissipation reduces to approximately 0.165W—a 34% derating. At the upper operating limit of 155°C, the component approaches 0.1W maximum safe dissipation. In a current-sensing or bias resistor application where the MMF25SDRE806R passes steady-state current in an industrial furnace controller or automotive power distribution module operating at 140°C ambient, the designer must limit bias current to roughly 11 mA (120 mW dissipation) to maintain safe thermal margins and prevent accelerated reliability degradation. Derating curves for metal film resistors show exponential reliability improvement with reduced power dissipation; operating the MMF25SDRE806R at 50% rated power in high-temperature environments extends mean time between failures by 10x relative to full-power operation. Thermal cycling between -55°C and +155°C adds mechanical stress to terminations; conservative derating becomes essential in aerospace applications.
Why might the MMF25SDRE806R fail when operated in high-frequency switching or RF circuits despite adequate power ratings?
The MMF25SDRE806R exhibits frequency-dependent behavior beyond simple resistive dissipation. At frequencies above 100 MHz, parasitic inductance in the MELF 0204 leads structure introduces impedance rise and phase shift that cannot be predicted from dc resistance alone. In Class D amplifier gate-drive networks or RF matching circuits operating at 200+ MHz, the 806Ω nominal impedance of the MMF25SDRE806R can increase 10-15% due to lead inductance, disrupting impedance matching and creating unintended reflections. Additionally, metal film resistors exhibit voltage-dependent noise and nonlinearity at high signal amplitudes; rapid transient currents in switching applications generate spurious noise signatures that dc measurements do not reveal. For frequencies above 50 MHz or peak transient currents exceeding 50 mA, thick-film chip resistors (0603/0805) with lower parasitic inductance become preferred despite lower absolute tolerance. The MMF25SDRE806R remains suitable for sub-100 kHz analog circuits, transimpedance configurations, and dc bias networks; RF and microwave designers should specify alternative technologies.
Can the MMF25SDRE806R be hand-soldered in prototype and low-volume builds, and what soldering techniques minimize thermal damage?
The MMF25SDRE806R's cylindrical MELF package and metal film construction tolerate hand soldering but require controlled technique. Conventional soldering iron approach from a single termination end fails—heat conducts along the cylindrical body toward the opposite termination, creating uneven solder wetting and potential fracture at the ceramic junction. Successful hand soldering of the MMF25SDRE806R employs a preheating step: warm the entire component to 80-100°C using a hot air pencil or dual-iron technique, then solder each termination sequentially at 350-400°C iron temperature for 2-3 seconds per joint. Exceeding 450°C or applying sustained heat >5 seconds risks thermal shock to the metal film layer, introducing microfractures that degrade precision and increase noise. Wave soldering of bulk prototypes containing MMF25SDRE806R components demands careful flux selection (no-clean formulations preferred) and palletization to prevent component tumbling. In high-reliability medical or aerospace prototypes, hand-soldering the MMF25SDRE806R is generally prohibited; reflow soldering with documented profiles and in-process thermal monitoring ensures reproducible solder joint quality and compliance with AS9100 or IPC standards.

Parts with Similar Specifications

The three parts on the right have similar specifications to YAGEO MMF25SDRE806R

Product Attribute MMF25SDRE806K MMF25SDRE80K6 MMF25SDRE80R6 MMF25SDRE820R
Part Number MMF25SDRE806K MMF25SDRE80K6 MMF25SDRE80R6 MMF25SDRE820R
Manufacturer YAGEO YAGEO YAGEO YAGEO
Height - Seated (Max) - - - -
Size / Dimension - - - -
Tolerance - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Composition - - - -
Number of Terminations - - - -
Resistance - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Series - - - -
Features - - - Simultaneous Sampling
Failure Rate - - - -
Power (Watts) - - - -
Temperature Coefficient - - - -

MMF25SDRE806R Datasheet PDF

Download MMF25SDRE806R pdf datasheets and YAGEO documentation for MMF25SDRE806R - YAGEO.

Datasheets
MMF Series.pdf

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YAGEO

MMF25SDRE806R

YAGEO
98D-MMF25SDRE806R

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