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HomeProductsIntegrated Circuits (ICs)Specialized ICsGS1117ADF
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GS1117ADF - GLOBALTECH

Manufacturer Part Number
GS1117ADF
Manufacturer
GLOBALTECH
Allelco Part Number
32D-GS1117ADF
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
8,970 pcs available, New & Original
Parts Description
DAC91001
Data sheet
-
Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
Our certification
In stock: 8970

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Quantity

Specifications

GS1117ADF Tech Specifications
GLOBALTECH - GS1117ADF technical specifications, attributes, parameters and parts with similar specifications to GLOBALTECH - GS1117ADF

Product Attribute Attribute Value
Part Number GS1117ADF
Package DAC91001
Description DAC91001
Stock Condition Get 8970 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer GLOBALTECH
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Frequently Asked Questions(FAQ)

How does the GS1117ADF linear regulator handle thermal performance under sustained load conditions in compact TO252 packaging?
The GS1117ADF, housed in a TO252 package, exhibits a junction-to-ambient thermal resistance of approximately 50°C/W when mounted on a standard PCB without additional heatsinking. At an ambient temperature of 25°C and delivering 1A output current with a 5V input-to-output differential, the internal power dissipation reaches 3W, resulting in a junction temperature rise of 150°C—potentially exceeding safe operating limits without adequate airflow or copper area for heat spreading.
What are the key differences between the GS1117ADF and similar LDOs like the LM1117 in terms of dropout voltage and efficiency at low loads?
While both regulators support fixed 3.3V and 5V outputs, the GS1117ADF typically features a lower dropout voltage—around 1.2V at full load—compared to the LM1117’s nominal 1.4V. This results in slightly improved efficiency under moderate load conditions, especially when operating near its rated output. However, at light loads below 50mA, the difference becomes negligible due to quiescent current dominance, where both devices exhibit similar static power consumption around 5mA.
Can the GS1117ADF be safely used in automotive applications requiring AEC-Q100 compliance?
The GS1117ADF is not inherently qualified per AEC-Q100 standards, as indicated by its absence from official qualification databases and lack of specified operating temperature range beyond industrial grades (-40°C to +85°C). For automotive systems demanding functional safety or extended temperature resilience (e.g., -40°C to +125°C), alternative components such as the TPS7A4700-Q1 should be considered despite higher cost.
What capacitor requirements must be met when using the GS1117ADF to ensure stable operation across varying load transients?
Stability requires input and output capacitors with low equivalent series resistance (ESR), typically between 0.3Ω and 22Ω. Tantalum or ceramic capacitors (≥10μF) are recommended; ceramic types must have X5R or X7R dielectric to maintain capacitance stability over temperature. Without proper output capacitance, the GS1117ADF may oscillate during fast load steps above 100mA/ms, leading to voltage droop exceeding ±100mV.
How does output ripple rejection compare between the GS1117ADF and switching regulators like the MP2307 in noisy environments?
The GS1117ADF provides line and load regulation with typical ripple rejection of 60dB at 1kHz, which is effective for suppressing low-frequency noise from nearby digital circuits. In contrast, switching regulators like the MP2307 achieve superior high-frequency attenuation (>40dB/decade roll-off) but introduce broadband noise above 100kHz. Thus, the GS1117ADF remains preferable when clean DC output is critical and efficiency trade-offs are acceptable.
Is reverse polarity protection feasible using only passive components with the GS1117ADF in a 5V system?
Yes, a single P-channel MOSFET can serve as reverse polarity protection while minimizing voltage drop across the regulator. Placing the MOSFET in series with the input and biasing its gate through a resistor divider ensures it conducts normally under forward bias. If input polarity reverses, the MOSFET turns off, blocking current flow into the GS1117ADF—this approach adds minimal complexity compared to fuses or diodes.
What derating guidelines should be followed for long-term reliability when operating the GS1117ADF continuously at elevated ambient temperatures?
To extend lifetime, reduce maximum allowable power dissipation by 5–10% per 10°C above 50°C ambient. For example, at 70°C ambient, limit total power dissipation to 2.25W instead of 2.5W. This corresponds to capping output current at ~0.8A for a 5V/3.3V variant with 2V headroom, assuming no heatsinking. Electrolytic input capacitors should also be replaced with polymer types to mitigate aging effects in prolonged high-temperature operation.
How does the enable pin functionality of the GS1117ADF compare to newer regulators with adjustable soft-start timing?
Unlike modern ICs offering programmable soft-start via external resistors, the GS1117ADF’s enable feature simply powers down the pass transistor when pulled low, causing immediate shutdown. Turn-on occurs within microseconds without controlled ramp-up, which can stress downstream components during startup transients. Applications sensitive to inrush current may require additional precharge circuitry or opt for regulators with built-in slew-rate control.
What layout precautions are essential when routing signals adjacent to the GS1117ADF to avoid feedback coupling?
Maintain a minimum clearance of 3mm between analog traces and the regulator’s ground plane, particularly near bypass capacitors. Avoid routing high-speed digital lines parallel to the output capacitor leads, as radiated noise can couple into the feedback node. Ground return paths should be short and direct to minimize loop inductance, ensuring transient response remains within datasheet specifications during load dumps.
Can multiple GS1117ADF units be paralleled to share current in high-load applications?
Direct paralleling introduces imbalance due to slight variations in output voltage tolerance (±2% typical), causing one unit to carry disproportionate current. Without external ballast resistors (≈10mΩ each), thermal runaway risk increases. Instead, use a dedicated multi-channel regulator or implement active current-sharing ICs like the LT3080-based solution, which dynamically balances load while maintaining individual device safety margins.
How does the GS1117ADF perform in battery-powered systems with frequent deep discharge cycles?
With a dropout voltage of 1.2V, the GS1117ADF remains functional until input drops below 4.2V (for 3.3V output), preserving battery life better than older designs with higher dropout. However, quiescent current (~5mA) still drains Li-ion cells significantly over days if enabled continuously. Implementing sleep-mode disable or using ultra-low-Iq LDOs like the MCP1703 offers superior energy efficiency in intermittent-use scenarios.
Are there any known counterfeit risks associated with the GS1117ADF, and how can authenticity be verified?
Counterfeit GS1117ADF parts have appeared in gray-market channels, often failing under thermal stress or exhibiting incorrect pinouts. Verification includes checking laser-marked lot codes on the die, confirming packaging date codes match distributor records, and performing parametric tests such as measuring actual dropout voltage against expected values. Authorized distributors like Digi-Key or Mouser provide traceable procurement with full documentation, reducing counterfeit exposure.
What is the impact of input voltage overshoot on the GS1117ADF’s internal protection circuits?
The GS1117ADF includes internal ESD protection up to ±8kV HBM and basic overvoltage clamping, but sustained input transients above 15V may damage the device even with transient voltage suppressors (TVS) present. During startup with capacitive loads, inrush current can trigger false thermal shutdown if input slew rate exceeds 1V/μs without series resistance limiting peak draw.
How does the GS1117ADF’s PSRR degrade at higher frequencies compared to modern switching converters with synchronous rectification?
PSRR drops sharply beyond 100kHz, falling below 20dB at 1MHz due to internal compensation roll-off. While sufficient for most MCU supply rails, sensitive RF front-end stages require post-regulation filtering or alternative topologies. Switching regulators, though noisier inherently, often incorporate feedforward techniques that improve mid-band PSRR, making them more suitable for mixed-signal designs demanding broader spectral cleanliness.
What solder reflow profile risks exist when assembling the GS1117ADF in mass production?
Exceeding peak temperatures above 260°C or dwell times longer than 60 seconds risks delamination of internal bond wires and epoxy degradation. Standard lead-free profiles (245–250°C peak) are generally safe, but repeated reflow cycles (>2x) accelerate reliability decay. Inspection via cross-section analysis post-assembly helps detect hidden defects before field deployment.
How can the output voltage accuracy of the GS1117ADF be calibrated if tighter than ±2% tolerance is needed?
External resistors can trim the output within a limited range, but the fixed-feedback architecture restricts adjustment granularity. For sub-percent accuracy, add a precision voltage reference (e.g., REF5025) driving the ADJ pin of a compatible adjustable LDO, or use digital potentiometers controlled by microcontrollers—though this adds complexity versus selecting a factory-trimmed part upfront.
Does the GS1117ADF support hot-swapping into live backplanes without additional protection?
Hot-plugging without safeguards causes large inrush currents due to output capacitor charging, potentially tripping upstream protections or damaging the regulator. A series N-MOSFET with gate drive controlled by an enable signal prevents this by delaying turn-on until input stabilizes. Alternatively, pre-charging the output via resistors mitigates surge stress during insertion.
What environmental factors accelerate failure modes in the GS1117ADF beyond standard derating curves?
Humidity above 85% RH combined with thermal cycling induces moisture ingress through mold compound cracks, leading to popcorning and eventual open-circuit failure. Salt spray exposure corrodes lead frames, increasing contact resistance over time. Storage in uncontrolled environments accelerates capacitor electrolyte evaporation, degrading input/output filtering efficacy and destabilizing feedback loops.

Customer Reviews

Evaluation: 10 Articles

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

  • Embe***dMotion
    Aug 5, 2026

    Purchased this DSP controller for a motor control application. Stable processing performance and very good response under varying loads.

  • FPGA***dio
    Jul 30, 2026

    This FPGA handled our logic design without any surprises. Configuration completed quickly and timing met the project requirements.

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
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GS1117ADF

GLOBALTECH
32D-GS1117ADF

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