on March 13th 1,077

MPC8245LZU300D Processor: Datasheet, Features, Applications, and Specifications

The MPC8245LZU300D is a powerful processor made by NXP USA Inc. for embedded systems that need to be fast, efficient, and compact. It runs at 300 MHz, supports up to 2 GB of SDRAM, and has a 32-bit PCI interface for connecting to other devices. This processor includes built-in features like dual UARTs, an I²C controller, and a two-channel DMA controller, making it great for handling different tasks at once. This guide explains its features, design, uses, and benefits, helping you understand why it is an excellent choice for networking, industrial automation, storage, telecom, and other embedded applications.

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MPC8245LZU300D Description

The MPC8245LZU300D from NXP USA Inc. is a high-performance integrated processor based on the PowerPC 603e core, optimized for embedded applications requiring efficient cost, space, and power management. This variant operates at a core speed of 300 MHz and supports up to 2 GB of SDRAM, making it suitable for demanding applications. It features a 32-bit PCI interface capable of 66 MHz, enhancing its compatibility with a variety of PCI peripherals. Integrated functionalities include dual universal asynchronous receiver-transmitters (DUARTs), an I²C controller, and a two-channel DMA controller, among others, which contribute to its versatility in handling complex processing tasks efficiently. Packaged in a 352-ball Tape Ball Grid Array (TBGA) configuration, the MPC8245LZU300D ensures a compact footprint with robust performance in temperatures ranging from 0°C to 105°C.

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MPC8245LZU300D Features

Superscalar Architecture: Enables the processor to execute multiple instructions per clock cycle, boosting the efficiency and speed of the core.

Integrated Caches: Features 16 KB of instruction cache and 16 KB of data cache, which can be partially or fully locked. This helps in minimizing the time taken to access frequently used data, speeding up processing.

Dynamic Power Management: Includes power management modes like nap, doze, and sleep, which help reduce power consumption based on the processor's operational demands.

SDRAM Support: Can handle up to 2 GB of SDRAM across a 32- or 64-bit data bus. It supports multiple configurations, accommodating varying sizes and types of memory banks.

Error Correction: Employs mechanisms like write buffering for PCI and processor accesses, with support for data integrity techniques such as parity, read-modify-write operations, or ECC (Error-Correcting Code).

Versatile ROM and I/O Interfaces: Supports various types of ROM and Flash memory and offers multiple general-purpose I/O ports, making it adaptable to different system architectures.

32-bit PCI Bus: Operates at speeds up to 66 MHz and is compliant with PCI 2.2 standards. It is also capable of interfacing with a range of PCI peripherals thanks to its 5.0-V tolerance.

Dual-Channel Support: Features a two-channel DMA controller that supports direct and chaining modes, which can automate and link data transfers for more efficient data handling.

Scatter-Gather Capability: Facilitates operations that involve reading from or writing to non-contiguous memory sections, equipped with a transfer queue and multiple interrupt options to manage data transfers effectively.

Communication Interfaces: Includes two UARTs for serial communication and an I²C controller that supports both master and slave modes, allowing for varied communication needs.

Programmable Interrupt Controller: Provides robust management of hardware and serial interrupts, improving the system’s responsiveness and control.

Timers and Clock Generation: Incorporates four programmable timers and built-in mechanisms for generating clocks for the PCI bus and SDRAM, ensuring accurate timing and synchronization across different system components.

MPC8245LZU300D Block Diagram

The MPC8245LZU300D block diagram shows how the processor and peripherals interact. It has two main sections: the Processor Core Block and the Peripheral Logic Block. The Processor Core Block handles computations. It includes the Branch Processing Unit (BPU), Integer Unit (IU), Floating-Point Unit (FPU), and Load/Store Unit (LSU). Instructions are fetched, processed, and executed efficiently with the help of 16-KByte Data and Instruction Caches. The Memory Management Units (MMUs) manage memory access. The Peripheral Logic Block connects the processor to external devices. It includes a DMA Controller for fast memory transfers, an I²C Controller for communication, and a Message Unit for input/output operations. The PCI Bus Interface supports a 32-bit PCI connection for expansion. A Memory Controller handles system memory, including SDRAM synchronization clocks. For system control, it has a PIC Interrupt Controller that manages interrupts from different sources. The Data Path ECC Controller ensures data integrity, supporting 32-bit or 64-bit data buses with parity or ECC (Error-Correcting Code). Clock signals like OSC_IN and PCI_SYNC_IN keep everything synchronized for smooth operation.

COP Connector Diagram

The COP Connector Diagram for the MPC8245LZU300D shows the debugging and reset interface used for testing and troubleshooting the processor. The 16-pin COP Header connects the processor to external JTAG/COP debugging tools. Key signals include SRESET, HRESET, and COP_HRESET, which control system resets. The HRST_CTRL input helps coordinate resets using logic gates. The COP_TRST resets the JTAG test logic. The JTAG signals: TMS, TDO, TDI, and TCK are used for boundary scan and in-circuit debugging. The CHKSTOP_IN signal controls processor clocking during debugging, while VDD_SENSE monitors system voltage. Pull-up and pull-down resistors (10 kΩ, 1 kΩ) help stabilize signals. The QACK signal assists in debugging coordination. The COP Connector follows standard JTAG pinout, making it easy to connect with debugging tools.

MPC8245LZU300D Specifications

Type	Parameter
Manufacturer	NXP USA Inc.
Series	MPC82xx
Packaging	Tray
Part Status	Obsolete
Core Processor	PowerPC 603e
Number of Cores/Bus Width	1 Core, 32-Bit
Speed	300MHz
RAM Controllers	SDRAM
Graphics Acceleration	No
Voltage - I/O	3.3V
Operating Temperature	0°C ~ 105°C (TA)
Mounting Type	Surface Mount
Package / Case	352-LBGA
Supplier Device Package	352-TBGA (35x35)
Additional Interfaces	I2C, I²O, PCI, UART
Base Product Number	MPC82

MPC8245LZU300D Applications

Networking Equipment

The MPC8245LZU300D is ideally suited for networking devices such as routers, switches, and network interface cards. Its robust PCI interface and integrated communication peripherals enable high-speed data transfers and efficient management of multiple communication protocols. This capability enhances the performance and reliability of network operations.

Industrial Automation

In the industrial automation, this processor plays a role in powering systems such as programmable logic controllers (PLCs), machine interfaces (HMIs), and other automation machinery. The processor’s ability to handle control and monitoring tasks makes it an important component in modern industrial settings, ensuring precise and efficient process management.

Storage Solutions

The advanced memory interface and DMA capabilities of the MPC8245LZU300D make it an excellent choice for storage-related applications, including RAID controllers and storage area networks (SANs). It excels in managing high-speed data access and efficient storage management, which are great in environments where data integrity and quick access are priorities.

Telecommunications

This microprocessor is well-suited for use in telecommunications equipment, such as base stations and gateways. Its ability to efficiently handle multiple data streams and support various communication protocols helps in improving the overall functionality and reliability of telecommunications infrastructure.

Embedded Systems

The MPC8245LZU300D's versatile integration capabilities make it a prime candidate for embedded systems found in automotive electronics, electronics, and medical devices. Its range of integrated peripherals and interfaces allows for the design of specialized, high-performance embedded solutions tailored to meet the specific needs of these industries.

MPC8245LZU300D Similar Parts

• MPC8245LVV333D

• MPC8245LZU300D

• MPC8245TVV300D

MPC8245LZU300D Advantages

Integrated System-on-Chip (SoC) Design

The MPC8245LZU300D combines the processor core, memory controllers, and peripherals into a single chip. This SoC approach simplifies the system architecture, minimizes the need for external components, and can lead to cost reductions in both development and production phases.

High-Performance Processing

The processor operates at a frequency of 300 MHz and employs a superscalar architecture, which enables it to execute multiple instructions per clock cycle. This high-performance processing capability ensures efficient operation and is superior to processors that do not support such parallelism, making it ideal for demanding applications.

Versatile Memory Support

This processor supports up to 2 GB of SDRAM and features an advanced memory interface that includes error correction and versatile ROM and I/O interfaces. This level of memory support provides flexibility, allowing system to customize the memory configuration to meet specific application needs, an advantage over more rigid systems.

Comprehensive Peripheral Integration

The MPC8245LZU300D includes integrated communication interfaces such as UARTs and an I²C controller, as well as programmable timers and interrupt controllers. This extensive peripheral integration reduces the need for additional external components, simplifying the overall design and improving system reliability by decreasing the potential points of failure.

Low Power Consumption

Featuring dynamic power management with modes like nap, doze, and sleep, the processor can optimize its power usage based on current workload demands. This capability is used in applications where power efficiency is needed, providing an edge over other processors that lack such detailed power control.

MPC8245LZU300D Packaging Dimensions

Package Parameters

Parameter	Dimension (mm)
Package Outline	35 mm × 35 mm
Interconnects	352
Pitch	1.27 mm
Solder Balls	ZU (TBGA package)—62 Sn/36 Pb/2 Ag; VV (Lead-free version of package)—95.5 Sn/4.0 Ag/0.5 Cu
Solder Ball Diameter	0.75 mm
Maximum Module Height	1.65 mm
Co-Planarity Specification	0.15 mm
Maximum Force	6.0 lbs. total, uniformly distributed over package (8 grams/ball)

Pin Assignments and Package Dimensions

MPC8245LZU300D Manufacturer

The MPC8245LZU300D microprocessor is a product of NXP USA Inc., a subsidiary of NXP Semiconductors. NXP Semiconductors, which emerged from Philips Semiconductors, has its U.S. operations headquartered in Austin, Texas. This processor, part of their broader portfolio, integrates technologies optimized for performance and low power consumption, making it suitable for a variety of embedded applications. Although the MPC8245LZU300D has been marked as obsolete, NXP USA Inc. continues to support its legacy products while pushing the boundaries in areas such as automotive, industrial, and IoT through new semiconductor solutions.

Conclusion

The MPC8245LZU300D is a strong and reliable processor built for demanding applications. With its fast processing, built-in communication features, and smart power-saving modes, it helps systems run smoothly and efficiently. Even though it is now obsolete, it is still useful in many networking, industrial, and telecom projects. Its ability to handle multiple tasks while saving power makes it a valuable choice looking for a trusted embedded processor.

Datasheet PDF

MPC8245LZU300D Datasheets:

MPC8245.pdf