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Home Products Integrated Circuits (ICs)Embedded - DSP (Digital Signal Processors)~~ADSP-BF561SBBZ600~~

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ADSP-BF561SBBZ600 - Analog Devices Inc.

Name: Analog Devices Inc. ADSP-BF561SBBZ600
Brand: Analog Devices Inc.
SKU: ADSP-BF561SBBZ600
Price: 11.31 USD
Availability: InStock
Rating: 5 (7 reviews)

Manufacturer Part Number: ADSP-BF561SBBZ600

Manufacturer: Analog Devices, Inc.

Allelco Part Number: 32D-ADSP-BF561SBBZ600

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 6,630 pcs available, New & Original

Parts Description: IC DSP 32BIT 600MHZ 297-BGA

Package: 297-PBGA (27x27)

Data sheet: ADSP-BF561SBBZ6.pdf

Datasheets
ADSP-BF561.pdf Blackfin Processor Family.pdf

PCN Obsolescence/ EOL
ADSP-BF561SBBZ600 OBS 5/Nov/2020.pdf

PCN Assembly/Origin
Assembly Transfer 14/Jul/2021.pdf

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Unit Price: $30.84
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Quantity	Unit Price	Ext. Price
1+	$30.84	$30.84
200+	$11.94	$2,388.00
500+	$11.52	$5,760.00
1000+	$11.31	$11,310.00

The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

ADSP-BF561SBBZ600 Tech Specifications
Analog Devices Inc. - ADSP-BF561SBBZ600 technical specifications, attributes, parameters and parts with similar specifications to Analog Devices Inc. - ADSP-BF561SBBZ600

Product Attribute	Attribute Value
Manufacturer	Analog Devices, Inc.
Voltage - I/O	2.50V, 3.30V
Voltage - Core	1.35V
Type	Fixed Point
Supplier Device Package	297-PBGA (27x27)
Series	Blackfin®
Package / Case	297-BGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	-40°C ~ 85°C (TA)
On-Chip RAM	328kB
Non-Volatile Memory	External
Mounting Type	Surface Mount
Interface	SPI, SSP, UART
Clock Rate	600MHz
Base Product Number	ADSP-BF561

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
Moisture Sensitivity Level (MSL)	3 (168 Hours)
ECCN	3A991A2
HTSUS	8542.31.0001

Parts Introduction

ADSP-BF561SBBZ600 (1)

Manufacturer Part Number

ADSP-BF561SBBZ600

Manufacturer

Analog Devices, Inc.

Introduction

High-performance, low-power 16/32-bit embedded Blackfin processor

Designed for a wide range of digital signal processing (DSP) applications

Product Features and Performance

600 MHz clock rate

328 kB on-chip RAM

Supports SPI, SSP, and UART interfaces

External non-volatile memory

Operating temperature range: -40°C to 85°C

Product Advantages

Powerful DSP capabilities

Low power consumption

Wide operating temperature range

Flexible interfaces for various applications

Key Technical Parameters

Package: 297-PBGA (27x27)

Mounting Type: Surface Mount

Voltage Core: 1.35V

Voltage I/O: 2.50V, 3.30V

Quality and Safety Features

Rigorous testing and quality control

Designed to meet industry standards

Compatibility

Compatible with a wide range of Blackfin series processors

Can be used in various embedded systems and DSP applications

Application Areas

Industrial automation

Automotive electronics

Audio and video processing

Communication systems

Medical devices

Product Lifecycle

Currently available

Replacements and upgrades may be available in the future

Key Reasons to Choose This Product

High-performance and energy-efficient DSP capabilities

Flexible interfaces for versatile applications

Wide operating temperature range for harsh environments

Proven reliability and quality from Analog Devices, Inc.

Frequently Asked Questions(FAQ)

What are the key architectural differences between the ADSP-BF561SBBZ600 and other Blackfin processors when targeting real-time signal processing applications?: The ADSP-BF561SBBZ600 features a dual-MAC (Multiply-Accumulate) architecture optimized for high-throughput fixed-point computations, enabling sustained 600MIPS performance critical in audio filtering or motor control loops. Unlike single-core variants, its on-chip RAM of 328kB supports zero-wait-state data access, reducing latency in tight DSP kernels. This contrasts with external-memory-reliant designs, where memory bottlenecks can limit throughput despite high clock rates. The integrated SPI, SSP, and UART interfaces further reduce host processor overhead in embedded systems.

How does the power-performance trade-off manifest in the ADSP-BF561SBBZ600 compared to lower-clock-speed alternatives?: Operating at 600MHz with a core voltage of 1.35V, the ADSP-BF561SBBZ600 consumes significantly more dynamic power than slower Blackfin models such as the ADSP-BF533 running at 400MHz. While this enables faster execution of complex algorithms like FFTs or FIR filters, it necessitates careful thermal management in space-constrained designs. Engineers must weigh peak throughput requirements against average power budgets, especially in battery-powered or heat-limited environments where leakage current at elevated temperatures becomes non-negligible.

In what scenarios would the external non-volatile memory requirement of the ADSP-BF561SBBZ600 become a design constraint?: Since the ADSP-BF561SBBZ600 lacks internal flash, boot code and application firmware must reside on external NOR or NAND flash, increasing board complexity and cost. This configuration is problematic in volume production where BOM minimization is critical, or in harsh environments where external flash reliability may degrade faster than expected. Systems requiring rapid reboot cycles or deterministic startup times also suffer from added latency due to external memory access delays.

How does the ADSP-BF561SBBZ600 compare to ARM Cortex-M7-based solutions in terms of signal processing efficiency?: The ADSP-BF561SBBZ600 delivers superior computational density for digital filter implementations due to its dedicated MAC units and SIMD-like instruction set, achieving higher operations per cycle than most Cortex-M7 parts. However, the M7 offers broader ecosystem support, richer peripherals, and lower power consumption in control-intensive tasks. For pure DSP workloads—such as beamforming in radar or adaptive noise cancellation—the BF561’s architecture provides measurable performance advantages, but at the expense of software portability and toolchain maturity.

What impact do the mixed I/O voltages (2.5V and 3.3V) have on system-level design using the ADSP-BF561SBBZ600?: The dual I/O voltage rails require level shifting between the core logic and peripheral interfaces, adding components and potential signal integrity risks. While 2.5V operation reduces I/O power, interfacing with legacy 5V sensors or communication protocols demands careful planning. Designers often opt for 3.3V I/O to maintain compatibility with common transceivers and memory modules, accepting slightly higher quiescent current. This flexibility aids integration but complicates PCB layer stackup optimization.

Can the ADSP-BF561SBBZ600 be used effectively in automotive-grade temperature monitoring systems operating near -40°C?: Yes, the ADSP-BF561SBBZ600 supports industrial temperature ranges down to -40°C, making it suitable for automotive edge sensing nodes. However, system-level considerations dominate reliability: external crystals may lose stability at low temperatures, and decoupling capacitors must account for reduced capacitance values. Additionally, firmware must tolerate occasional oscillator drift during cold startups, which the BF561’s PLL can typically compensate for, provided reference timing is stable.

Why might an engineer choose the 297-BGA package over alternative QFP or LQFP packages for the ADSP-BF561SBBZ600?: The 297-ball PBGA (27x27 mm) maximizes pin count while minimizing footprint, essential for integrating dense functionality without sacrificing routing layers. Though more challenging to assemble than QFPs, the BGA enables higher pin density required by the BF561’s rich peripheral set and parallel memory buses. In high-channel-count applications like multi-sensor fusion, this package supports the necessary bandwidth better than smaller footprints, justifying increased assembly costs.

How does moisture sensitivity level (MSL) 3 classification affect storage and handling of ADSP-BF561SBBZ600 components?: With an MSL 3 rating requiring use within 168 hours after opening dry packaging, the ADSP-BF561SBBZ600 demands controlled humidity environments during manufacturing. Without baking before reflow, absorbed moisture can cause popcorning during soldering, potentially damaging the die or causing delamination. Production workflows must incorporate humidity indicator cards and bake-out procedures unless the component is used continuously post-opening.

What role does the base product number ADSP-BF561 play in supply chain risk mitigation for designs relying on the ADSP-BF561SBBZ600?: The base part ADSP-BF561 allows sourcing the BF561SBBZ600 through multiple authorized distributors, improving availability. However, supply chain resilience depends on lead times and regional distribution agreements. Engineers should avoid single-source dependencies by qualifying alternative suppliers early, particularly given the end-of-life trajectory of some older DSP families. Maintaining access to evaluation boards and development tools tied to the base number also simplifies long-term maintenance.

How does the ECCN classification 3A991A2 influence export compliance decisions involving the ADSP-BF561SBBZ600?: Classified under ECCN 3A991A2, the ADSP-BF561SBBZ600 falls under U.S. export regulations governing general purpose microprocessors with performance exceeding certain thresholds. This affects international shipments, especially to countries subject to trade restrictions, requiring exporters to obtain licenses. Projects involving defense or government contracts must verify compliance before deployment, though commercial IoT or industrial applications face fewer barriers.

When selecting between the ADSP-BF561SBBZ600 and newer SHARC-based devices, what factors favor backward compatibility or performance headroom?: Choosing the BF561SBBZ600 makes sense when leveraging existing Blackfin software libraries or maintaining compatibility with legacy sensor stacks. However, SHARC processors offer floating-point units and enhanced SIMD capabilities, beneficial for evolving algorithms requiring higher precision. If future-proofing is prioritized, investing in a SHARC variant may reduce rework costs despite higher initial NRE, especially in audio or scientific computing domains.

How does the absence of internal cache impact real-time determinism in systems using the ADSP-BF561SBBZ600?: Without hardware cache, memory accesses map directly to physical addresses, eliminating unpredictable cache misses that could violate timing deadlines. This improves worst-case execution time (WCET) predictability crucial for safety-critical control loops. While slightly increasing memory bandwidth demand, the BF561’s efficient Harvard architecture offsets this by allowing simultaneous program and data fetches, preserving determinism without caching overhead.

What considerations arise when implementing DMA transfers with the ADSP-BF561SBBZ600 in high-throughput ADC-to-memory streaming applications?: Efficient DMA usage requires aligning source and destination buffers to burst sizes supported by the memory controller, typically 32-byte boundaries. Misaligned transfers fragment bursts, reducing throughput and increasing CPU load. The BF561’s DMA channels support chaining, enabling continuous data movement from ADCs or Ethernet MACs into on-chip SRAM, minimizing interrupt storms. Proper scatter-gather list setup ensures scalability across varying block sizes.

How does the ADSP-BF561SBBZ600 handle synchronization challenges when coordinating with FPGA-based accelerators via its parallel interface?: Direct parallel bus coordination introduces setup/hold timing risks due to propagation delays across PCB traces. The BF561’s flexible memory controllers allow configurable timing parameters to match FPGA output specs, but signal integrity analysis is mandatory. Alternatively, using serial interfaces like SPI or LVDS reduces skew issues. Engineers often implement handshake signals or FIFO buffering in firmware to decouple timing domains and prevent data loss during mode transitions.

What are the implications of the HTSUS code 8542.31.0001 for global tariff calculations involving shipments containing the ADSP-BF561SBBZ600?: Categorized under 8542.31.0001, the BF561SBBZ600 qualifies as an integrated circuit primarily programmable by the user, influencing customs valuation and duty rates in importing countries. Accurate classification prevents underreporting, which could lead to penalties. Exporters should validate country-specific interpretations, as some jurisdictions treat similar ICs under different subheadings affecting landed cost projections for mass production runs.

How does thermal derating affect maximum sustained performance of the ADSP-BF561SBBZ600 in sealed enclosures?: As ambient temperature rises, junction temperature increases, forcing frequency scaling or throttling to stay within 85°C max rating. At 85°C, leakage current grows exponentially, reducing effective MIPS even at fixed 600MHz. In sealed boxes without airflow, peak loads may trigger thermal shutdown unless workloads are curtailed. Thermal modeling using TDP estimates (~1–2W typical) helps size heatsinks or fans appropriately for target environments.

What debugging strategies prove effective when troubleshooting intermittent faults in production units using the ADSP-BF561SBBZ600?: Intermittent issues often stem from marginal power delivery or ESD damage masked during testing. Using JTAG boundary scan reveals stuck pins or weak connections missed by functional tests. Monitoring brownout resets and watchdog triggers provides clues about timing violations. Firmware logging to external memory via DMA captures intermittent states before they repeat, while oscilloscope probing of reset lines detects glitches missed by digital tools.

How does the ADSP-BF561SBBZ600 compare to contemporary C2000 microcontrollers for digital power conversion control applications?: While C2000 MCUs excel in PWM generation and analog feedback loops with specialized peripherals, the BF561SBBZ600 offers greater algorithmic flexibility for advanced control schemes like predictive current control or harmonic compensation. The BF561’s higher clock speed and MAC density accelerate iterative calculations needed for adaptive filters, whereas C2000 devices prioritize low-latency interrupts and hardware acceleration for fixed-cycle tasks. Choice hinges on whether computation complexity outweighs peripheral specialization needs.

Parts with Similar Specifications

The three parts on the right have similar specifications to Analog Devices Inc. ADSP-BF561SBBZ600

Product Attribute
Part Number	ADSP-BF5615BBZ600	ADSP-BF561SBB600	ADSP-BF561SBBZ500	ADSP-BF561SKBCZ500
Manufacturer	Analog Devices Inc.	Analog Devices Inc.	Analog Devices Inc.	Analog Devices Inc.
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Type	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Voltage - I/O	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Non-Volatile Memory	-	-	-	-
Series	-	-	-	-
On-Chip RAM	-	-	-	-
Voltage - Core	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Clock Rate	-	-	-	-
Interface	-	-	-	-

ADSP-BF561SBBZ600 Datasheet PDF

Download ADSP-BF561SBBZ600 pdf datasheets and Analog Devices Inc. documentation for ADSP-BF561SBBZ600 - Analog Devices Inc..

Datasheets: ADSP-BF561.pdf Blackfin Processor Family.pdf
PCN Obsolescence/ EOL: ADSP-BF561SBBZ600 OBS 5/Nov/2020.pdf
PCN Assembly/Origin: Assembly Transfer 14/Jul/2021.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

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