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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~XC2VP20-6FGG676C~~

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XC2VP20-6FGG676C - AMD

Name: AMD XC2VP20-6FGG676C
Brand: AMD
SKU: XC2VP20-6FGG676C
Availability: InStock
Rating: 5 (3 reviews)

Manufacturer Part Number: XC2VP20-6FGG676C

Manufacturer: AMD Xilinx

Allelco Part Number: 32D-XC2VP20-6FGG676C

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 10,930 pcs available, New & Original

Parts Description: IC FPGA 404 I/O 676FBGA

Package: 676-FBGA (27x27)

Data sheet: XC2VP20-6FGG676.pdf

Datasheets
Virtex-II Pro, Pro X.pdf

PCN Obsolescence/ EOL
Mult Dev EOL 6/Jan/2020.pdf

Environmental Information
Xilinx REACH211 Cert.pdf

RoHs Status: ROHS3 Compliant

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Our certification

In stock: 10930

Specifications

XC2VP20-6FGG676C Tech Specifications
AMD - XC2VP20-6FGG676C technical specifications, attributes, parameters and parts with similar specifications to AMD - XC2VP20-6FGG676C

Product Attribute	Attribute Value
Manufacturer	AMD Xilinx
Voltage - Supply	1.425V ~ 1.575V
Total RAM Bits	1622016
Supplier Device Package	676-FBGA (27x27)
Series	Virtex®-II Pro
Package / Case	676-BGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 85°C (TJ)
Number of Logic Elements/Cells	20880
Number of LABs/CLBs	2320
Number of I/O	404
Mounting Type	Surface Mount
Base Product Number	XC2VP20

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A001A7A
HTSUS	8542.39.0001

Parts Introduction

XC2VP20-6FGG676C (1)

Manufacturer Part Number

XC2VP20-6FGG676C

Manufacturer

Xilinx

Introduction

Virtex-II Pro FPGA featuring high-density logic cells, integrated IP cores, and advanced serial connectivity

Product Features and Performance

High performance FPGA

20880 logic elements/cells for extensive programmability

2320 LABs/CLBs

Integrated RAM with 1622016 total bits

404 I/O pins

Supports advanced digital signal processing

Multi-voltage, multi-standard SelectIO™ interface pins

RocketIO™ transceivers for high-speed serial communication

Product Advantages

Support for multi-gigabit transceivers and digital signal processing

High logic capacity and performance suitable for complex applications

Integrated IP cores streamline design processes

Key Technical Parameters

Number of LABs/CLBs: 2320

Number of Logic Elements/Cells: 20880

Total RAM Bits: 1622016

Number of I/O: 404

Voltage Supply Range: 1.425V to 1.575V

Operating Temperature Range: 0°C to 85°C

Quality and Safety Features

Strict adherence to industry standards for manufacturing

Reliability under specified operating temperature range

Compatibility

Surface mount technology compatible

RoHS compliant package for environmental standards

Application Areas

Telecommunications

Networking

Automotive

Industrial control systems

Defense and aerospace systems

Product Lifecycle

Obsolete status

Potential for limited availability

Check for possible replacements or upgrades

Several Key Reasons to Choose This Product

Advanced connectivity with high-speed serial transceivers

Increased system performance through high logic and memory capacity

Diverse applications enabled by extensive I/O support

Flexible, programmable logic suitable for multiple industries

Robust design to ensure reliable operation in a range of conditions

Frequently Asked Questions(FAQ)

How does the XC2VP20-6FGG676C compare to other Virtex-II Pro FPGAs in terms of logic capacity and power efficiency for high-speed digital signal processing applications?: The XC2VP20-6FGG676C offers 20,880 logic elements and 1.62 Mbits of embedded RAM, positioning it above mid-range Virtex-II Pro devices like the XC2VP30 (30K LEs) but below higher-end models such as the XC2VP70. Its operating voltage of 1.5V places it in a moderate power-performance sweet spot—lower than legacy 3.3V FPGAs but not as aggressively scaled as newer-generation parts. For DSP workloads requiring moderate parallelism with strict thermal budgets, this balance makes it suitable where absolute performance is secondary to power-density constraints.

What are the key limitations when implementing high-speed SERDES or GTP transceivers using the XC2VP20-6FGG676C compared to modern FPGA families?: Unlike contemporary Xilinx UltraScale or AMD Versal architectures, the XC2VP20-6FGG676C lacks integrated high-speed transceivers entirely. It relies on external PHY chips or parallel interfaces like LVDS, which increases board complexity and introduces jitter and latency penalties. This limits data rates beyond ~622 Mbps over backplane traces and complicates compliance testing. Designers targeting serial protocols such as PCIe, SATA, or 10G Ethernet must implement these in soft logic or use companion ASICs, adding cost and footprint.

Can the XC2VP20-6FGG676C support multi-gigabit memory interfaces such as DDR3 or QDR II SRAM without significant timing closure challenges?: While feasible in small systems with relaxed timing margins, driving multi-Gbps memory standards like DDR3-800 or QDR II+ from the XC2VP20-6FGG676C demands careful architecture planning due to limited I/O speed grades and absence of dedicated DQS deskewing resources found in newer FPGAs. Clock domain crossing complexity rises significantly, and achieving stable operation across process-voltage-temperature (PVT) corners becomes challenging. Most successful implementations use slower DDR2 or source-synchronous designs with tighter PCB layer stackups.

How should supply decoupling be designed around the XC2VP20-6FGG676C to ensure reliable operation under dynamic load conditions?: Given its 1.5V core voltage and high pin count (676 FBGA), transient current spikes during large logic block reconfigurations necessitate robust local decoupling. A combination of 0201-sized 0.1 µF ceramic capacitors placed within 1 mm of each VCC/VCCA/VCCD pin, plus bulk 10 µF tantalum or polymer caps near the package corners, is recommended. Careful attention to power plane segmentation and return path continuity reduces ground bounce and prevents voltage droop that could cause configuration errors or functional failures.

What impact does the 676-FBGA packaging have on thermal management and signal integrity in compact system designs?: The 27x27 mm BGA package presents dense routing challenges; fine-pitch solder balls limit escape routing options, increasing layer count and via usage. From a thermal standpoint, the exposed pad provides some conduction, but without a heatsink, junction temperatures can exceed 85°C under sustained full utilization, especially if adjacent components generate heat. Signal integrity requires controlled impedance traces with minimal vias, and careful length matching for high-speed nets is critical due to trace proximity and lack of built-in equalization.

Is the XC2VP20-6FGG676C compatible with modern FPGA development tools such as Vivado or even older ISE workflows?: Officially supported only in Xilinx ISE Design Suite (up to version 14.7), the XC2VP20-6FGG676C is not synthesizable in Vivado, which targets newer architectures. Backporting designs may require manual constraint file adjustments and synthesis script modifications. Migration paths are limited, making long-term maintainability difficult. Engineers working with this part must maintain legacy toolchains and consider obsolescence risks when planning production lifecycles.

How does the Moisture Sensitivity Level (MSL) 3 classification affect storage and handling procedures for boards populated with the XC2VP20-6FGG676C?: With an MSL rating of 3 (168-hour floor life at 30°C/60% RH), the XC2VP20-6FGG676C must be stored in dry-packaging until used. Once opened, assembly must occur within 168 hours unless baked per JEDEC J-STD-033. Failure to adhere increases risk of popcorning during reflow, potentially damaging the die or causing delamination. Inventory tracking and bake cycles should be integrated into manufacturing execution systems to prevent latent reliability issues.

What are the implications of using the XC2VP20-6FGG676C in aerospace or industrial automation systems regarding radiation tolerance and ESD protection?: The standard commercial-grade XC2VP20-6FGG676C offers no inherent radiation hardening; SEU (single-event upset) rates in space environments can lead to configuration bit flips requiring scrubbing mechanisms. Similarly, while basic ESD protection exists internally, external TVS diodes are strongly advised for I/O lines exposed to human contact or electrostatic discharge. In safety-critical applications, alternative hardened-by-design families such as the RadHard Virtex-5Q should be evaluated instead.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC2VP20-6FGG676C

Product Attribute
Part Number	XC2VP20-6FG676C	XC2VP20-7FGG676C	XC2VP20-6FG676I	XC2VP20-6FFG896C
Manufacturer	AMD	AMD	AMD	AMD
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Number of Logic Elements/Cells	-	-	-	-
Series	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Number of I/O	-	-	-	-
Voltage - Supply	-	-	-	-
Total RAM Bits	-	-	-	-
Number of LABs/CLBs	-	-	-	-

XC2VP20-6FGG676C Datasheet PDF

Download XC2VP20-6FGG676C pdf datasheets and AMD documentation for XC2VP20-6FGG676C - AMD.

Datasheets: Virtex-II Pro, Pro X.pdf
PCN Obsolescence/ EOL: Mult Dev EOL 6/Jan/2020.pdf
Environmental Information: Xilinx REACH211 Cert.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

Use your express account for shipment if you have one.
Use our account for the shipment. Refer to the table below for the approximate charges.

(Different time frame / countries / package size has different price.)

Delivery Method

Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

QC (Quality Warranty)
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Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
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We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.

ESD

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Third-party certified, strict quality control. Our certification

ISO 9001: 2015
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