Please refer to the English Version as our Official Version.

Europe: France~~(Français)~~ Germany~~(Deutsch)~~ Italy~~(Italia)~~ Russian~~(русский)~~ Poland~~(polski)~~ Czech~~(Čeština)~~ Luxembourg~~(Lëtzebuergesch)~~ Netherlands~~(Nederland)~~ Iceland~~(íslenska)~~ Hungarian~~(Magyarország)~~ Spain~~(español)~~ Portugal~~(Português)~~ Turkey~~(Türk dili)~~ Bulgaria~~(Български език)~~ Ukraine~~(Україна)~~ Greece~~(Ελλάδα)~~ Israel~~(עִבְרִית)~~ Sweden~~(Svenska)~~ Finland~~(Svenska)~~ Finland~~(Suomi)~~ Romania~~(românesc)~~ Moldova~~(românesc)~~ Slovakia~~(Slovenská)~~ Denmark~~(Dansk)~~ Slovenia~~(Slovenija)~~ Slovenia~~(Hrvatska)~~ Croatia~~(Hrvatska)~~ Serbia~~(Hrvatska)~~ Montenegro~~(Hrvatska)~~ Bosnia and Herzegovina~~(Hrvatska)~~ Lithuania~~(lietuvių)~~ Spain~~(Português)~~ Switzerland~~(Deutsch)~~ United Kingdom~~(English)~~

Asia/Pacific: Japan~~(日本語)~~ Korea~~(한국의)~~ Thailand~~(ภาษาไทย)~~ Malaysia~~(Melayu)~~ Singapore~~(Melayu)~~ Vietnam~~(Tiếng Việt)~~ Philippines~~(Pilipino)~~

Africa, India and Middle East: United Arab Emirates~~(العربية)~~ Iran~~(فارسی)~~ Tajikistan~~(فارسی)~~ India~~(हिंदी)~~ Madagascar~~(malaɡasʲ)~~

South America / Oceania: New Zealand~~(Maori)~~ Brazil~~(Português)~~ Angola~~(Português)~~ Mozambique~~(Português)~~

North America: United States~~(English)~~ Canada~~(English)~~ Haiti~~(Ayiti)~~ Mexico~~(español)~~

Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~XC2VP40-5FF1152I~~

Image may be representation.
See specifications for product details.

~~Favorite~~

EXPRESS OPTION

Payment method

XC2VP40-5FF1152I - AMD

Name: AMD XC2VP40-5FF1152I
Brand: AMD
SKU: XC2VP40-5FF1152I
Availability: InStock
Rating: 5 (2 reviews)

Manufacturer Part Number: XC2VP40-5FF1152I

Manufacturer: AMD Xilinx

Allelco Part Number: 32D-XC2VP40-5FF1152I

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 16,590 pcs available, New & Original

Parts Description: IC FPGA 692 I/O 1152FCBGA

Package: 1152-FCBGA (35x35)

Data sheet: XC2VP40-5FF1152.pdf

Datasheets
Virtex-II Pro, Pro X.pdf

PCN Obsolescence/ EOL
Mult Dev EOL 6/Jan/2020.pdf

Environmental Information
Xilinx REACH211 Cert.pdf

RoHs Status

~~Compare~~

Our certification

In stock: 16590

Specifications

XC2VP40-5FF1152I Tech Specifications
AMD - XC2VP40-5FF1152I technical specifications, attributes, parameters and parts with similar specifications to AMD - XC2VP40-5FF1152I

Product Attribute	Attribute Value
Manufacturer	AMD Xilinx
Voltage - Supply	1.425V ~ 1.575V
Total RAM Bits	3538944
Supplier Device Package	1152-FCBGA (35x35)
Series	Virtex®-II Pro
Package / Case	1152-BBGA, FCBGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells	43632
Number of LABs/CLBs	4848
Number of I/O	692
Mounting Type	Surface Mount
Base Product Number	XC2VP40

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	RoHS non-compliant
Moisture Sensitivity Level (MSL)	4 (72 Hours)
REACH Status	REACH Unaffected
ECCN	3A001A7A
HTSUS	8542.39.0001

Parts Introduction

XC2VP40-5FF1152I (1)

Manufacturer Part Number

XC2VP40-5FF1152I

Manufacturer

Xilinx

Introduction

High-capacity, high-performance Virtex-II Pro FPGA with embedded IBM PowerPC processor blocks

Product Features and Performance

Embedded IBM PowerPC processor cores

4848 Logic Blocks/Configurable Logic Blocks (LABs/CLBs)

43632 Logic Elements/Cells

3538944 Total RAM Bits

Supports up to 692 I/O pins

FPGA integrated with multi-gigabit transceivers

Product Advantages

Integration of both logic and high-speed serial communication

High logic and memory resource count for complex applications

On-chip processor for embedded solutions

Robust temperature range for varied environmental conditions

Key Technical Parameters

Number of LABs/CLBs: 4848

Number of Logic Elements/Cells: 43632

Total RAM Bits: 3538944

Number of I/O: 692

Voltage Supply Range: 1.425V to 1.575V

Operating Temperature Range: -40°C to 100°C (TJ)

Quality and Safety Features

Surface Mount Technology for reliable solder connections

Extended operating temperature range for harsh environments

Compliant with industry quality standards for embedded applications

Compatibility

Compatible with various design suites for FPGA programming

Interoperable with other devices in the Virtex-II Pro series

Compatible with 1152-BBGA, FCBGA package specifications

Application Areas

Telecommunications

Aerospace and Defense Systems

Medical Equipment

High-Performance Computing Platforms

Industrial Automation Systems

Product Lifecycle

Obsolete status indicates discontinuation

Possible availability of replacement or upgrade options within the Xilinx product family

Several Key Reasons to Choose This Product

High integration of logic, memory, and processing capabilities reduces system complexity

Support for high-speed serial communication enables advanced data transfer capabilities

Wide operating temperature range suits various industrial and outdoor applications

Manufacturer with a strong reputation for quality and reliability in FPGA design

Potential for use in legacy systems requiring specific component specifications

Frequently Asked Questions(FAQ)

How does the XC2VP40-5FF1152I compare to other Virtex-II Pro FPGAs in terms of logic density and I/O count for high-speed data acquisition applications?: The XC2VP40-5FF1152I offers 43,632 logic elements and 692 I/O pins, providing significantly higher logic capacity than smaller variants like the XC2VP30, which supports up to 31,008 logic cells. This scalability makes the XC2VP40-5FF1152I suitable for complex digital signal processing and multi-channel data acquisition systems where routing congestion and timing closure are critical. The increased I/O count allows direct interfacing with multiple high-speed converters or memory interfaces without requiring external multiplexers.

What are the thermal considerations when deploying the XC2VP40-5FF1152I in industrial control systems operating near its maximum junction temperature?: With an operating range of -40°C to 100°C (TJ), the XC2VP40-5FF1152I can be used reliably in harsh environments, but sustained operation near 100°C demands careful thermal management. Given its power dissipation profile typical of 1.5 V FPGAs at full utilization, adequate heat sinking or airflow is essential to prevent thermal throttling or reduced mean time between failures. PCB layout should ensure thermal vias under the FCBGA package connect effectively to internal ground planes for heat spreading.

Can the XC2VP40-5FF1152I support DDR SDRAM interfaces directly, and what design challenges might arise due to its voltage domain and pin limitations?: While the XC2VP40-5FF1152I includes dedicated I/O banks capable of supporting LVDS and SSTL signaling, implementing DDR memory interfaces requires careful bank assignment due to strict voltage and reference requirements. Each bank operates within a tight 1.425V–1.575V supply window, incompatible with standard 1.8V or 2.5V DDR signals without level-shifters. Additionally, the 692 I/O limit may constrain memory channel count; designers must balance interface speed against available pins, often necessitating external buffers or switching to lower-pin-count alternatives.

How does the XC2VP40-5FF1152I’s MSL rating impact assembly reliability for long-life embedded systems compared to components with lower Moisture Sensitivity Levels?: Rated at MSL 4 (72 hours), the XC2VP40-5FF1152I requires stricter handling protocols during reflow soldering than MSL 1–3 parts. For mission-critical embedded systems with expected lifespans exceeding five years, uncontrolled storage humidity before assembly increases delamination risk at BGA joints. Manufacturers must enforce bake-out procedures and track shelf life rigorously—especially in humid climates—to avoid popcorning and latent reliability failures that could manifest years after deployment.

In what scenarios would the XC2VP40-5FF1152I be preferable over modern mid-range FPGAs despite its legacy status and RoHS non-compliance?: The XC2VP40-5FF1152I remains viable in legacy system upgrades or retrofit projects where board space, pin compatibility, or firmware reuse justifies continued use. Its deterministic architecture and proven timing models benefit safety-certified systems already qualified on this part. However, for new designs requiring regulatory compliance or long-term supply assurance, newer families like Kintex-7 offer better integration, lower static power, and RoHS compliance—making the XC2VP40-5FF1152I a niche choice rather than a forward-looking solution.

What trade-offs exist between using all 692 I/Os versus reserving pins for future expansion when selecting the XC2VP40-5FF1152I for a modular test instrumentation platform?: Allocating all 692 I/Os maximizes current functionality but reduces flexibility for later revisions. Given the fixed pinout of the 1152-FCBGA package, adding features post-manufacturing risks redesign costs. Engineers often reserve 10–15% of I/Os for debugging, calibration, or protocol updates. Alternatively, partitioning banks into dedicated function groups (e.g., one for sensors, another for comms) improves signal integrity and simplifies EMC validation—critical when scaling from prototype to production.

How does the XC2VP40-5FF1152I’s RAM block configuration affect real-time data buffering in video processing pipelines compared to simpler FPGA architectures?: With 3,538,944 total RAM bits organized into distributed and block RAM, the XC2VP40-5FF1152I supports deep line buffers for HD video streams without external memory. However, block RAM is non-uniformly distributed across CLBs, complicating memory mapping. Designers must manually partition pipelines to align with physical blocks, increasing synthesis complexity. This contrasts with modern FPGAs offering uniform BRAM distribution, reducing latency unpredictability in pixel stream processing.

Are there known yield or availability constraints associated with the XC2VP40-5FF1152I that could affect long-term production planning?: As a discontinued product with RoHS non-compliance status, the XC2VP40-5FF1152I faces sourcing volatility. Lead times may exceed 26 weeks during shortages, and end-of-life notifications from distributors signal declining inventory. For stable production runs beyond two years, engineers should evaluate migration paths to supported alternatives—even if performance margins are tighter—to mitigate supply chain disruption risks inherent in legacy semiconductor procurement.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC2VP40-5FF1152I

Product Attribute
Part Number	XC2VP40-5FFG1152I	XC2VP40-5FF1152C	XC2VP40-5FFG1152C	XC2VP40-5FF1148I
Manufacturer	AMD	AMD	AMD	AMD
Number of Logic Elements/Cells	-	-	-	-
Voltage - Supply	-	-	-	-
Total RAM Bits	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Number of LABs/CLBs	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Series	-	-	-	-
Number of I/O	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)

XC2VP40-5FF1152I Datasheet PDF

Download XC2VP40-5FF1152I pdf datasheets and AMD documentation for XC2VP40-5FF1152I - AMD.

Datasheets: Virtex-II Pro, Pro X.pdf
PCN Obsolescence/ EOL: Mult Dev EOL 6/Jan/2020.pdf
Environmental Information: Xilinx REACH211 Cert.pdf

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

Write a Review

Your Email address will not be published.

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

Use your express account for shipment if you have one.
Use our account for the shipment. Refer to the table below for the approximate charges.

(Different time frame / countries / package size has different price.)

Delivery Method

Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

QC (Quality Warranty)
Payment Support
Packaging
Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.

Strict quality inspection builds a solid foundation for electronic component quality.

Visual inspection
Performance testing and reliability verification
Standardized full-process testing
Precise control of every parameter

We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

Quality Inspection

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner

Efficient Supply Management
Cost-Saving Procurement
Fast Sourcing & Delivery

Contact us if you have any questions.

Phone: +00852 9146 4856
Email: info@allelco.com

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.

ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification

ISO 9001: 2015
ISO 13485: 2016
ISO 14001: 2015
ISO 28000: 2007
ISO 45001: 2018
GB/T 27922-2011

SMTA
IPC
ESD
PSMA