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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~XC3S1600E-4FGG320C~~

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XC3S1600E-4FGG320C - AMD

Name: AMD XC3S1600E-4FGG320C
Brand: AMD
SKU: XC3S1600E-4FGG320C
Price: 27.06 USD
Availability: InStock
Rating: 5 (9 reviews)

Manufacturer Part Number: XC3S1600E-4FGG320C

Manufacturer: AMD Xilinx

Allelco Part Number: 32D-XC3S1600E-4FGG320C

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 12,113 pcs available, New & Original

Parts Description: IC FPGA 250 I/O 320FBGA

Package: 320-FBGA (19x19)

Data sheet: XC3S1600E-4FGG3.pdf

Environmental Information
Xilinx REACH211 Cert.pdf

RoHs Status: ROHS3 Compliant

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Specifications

XC3S1600E-4FGG320C Tech Specifications
AMD - XC3S1600E-4FGG320C technical specifications, attributes, parameters and parts with similar specifications to AMD - XC3S1600E-4FGG320C

Product Attribute	Attribute Value
Manufacturer	AMD Xilinx
Voltage - Supply	1.14V ~ 1.26V
Total RAM Bits	663552
Supplier Device Package	320-FBGA (19x19)
Series	Spartan®-3E
Package / Case	320-BGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 85°C (TJ)
Number of Logic Elements/Cells	33192
Number of LABs/CLBs	3688
Number of I/O	250
Number of Gates	1600000
Mounting Type	Surface Mount
Base Product Number	XC3S1600

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991D
HTSUS	8542.39.0001

Parts Introduction

XC3S1600E-4FGG320C (1)

Manufacturer Part Number

XC3S1600E-4FGG320C

Manufacturer

Xilinx

Introduction

Spartan-3E family FPGA designed for high-performance programmable logic solutions

Product Features and Performance

High-density, high-performance, and cost-effective FPGA

Robust programmable logic for versatile hardware acceleration

Advanced process technology for optimized power consumption

Product Advantages

Cost-efficient for high-volume production

Proven Spartan series reliability and longevity

Lead-free and RoHS compliant package

Key Technical Parameters

33192 logic cells for complex digital implementations

3688 LABs/CLBs for efficient logic distribution

6 Million gates for extensive functionality

663552 Total RAM bits for deep memory storage

250 I/O pins for extensive external interfacing

Supports 1.14V to 1.26V power supply for low-power operation

Quality and Safety Features

Stringent quality control for high reliability

Support for industrial operating temperatures ranging from 0°C to 85°C

Compatibility

Surface mount 320-BGA package for standard PCB assembly

Compatible with Spartan-3E family for design scalability

Application Areas

Embedded processing

Industrial control

Telecommunications

Automotive electronics

Consumer electronics

Product Lifecycle

Last Time Buy status indicating the product is nearing discontinuation

Alternatives or next-generation products may be available

Several Key Reasons to Choose This Product

Economical choice for scalable design requirements

Low power operation for energy-efficient designs

Ample logic resources enabling complex circuit integration

Wide range of input/output support facilitating versatile use cases

Established Xilinx quality and support for peace of mind

Frequently Asked Questions(FAQ)

How does the XC3S1600E-4FGG320C compare to other Spartan-3E FPGAs in terms of logic capacity and I/O availability for mid-range digital designs?: The XC3S1600E-4FGG320C offers 33,192 logic cells and 250 general-purpose I/O pins, which places it above models like the XC3S500E that typically provide around 7,380 logic cells. This increased density makes the XC3S1600E suitable for more complex state machines or moderate parallel processing tasks without requiring a larger device footprint. However, when compared to the XC3S2000E, which offers approximately 51,840 logic elements, the XC3S1600E may reach its limits in applications involving large memory controllers or high-throughput data pipelines.

What are the key timing constraints to consider when implementing a synchronous design on the XC3S1600E-4FGG320C at 120 MHz?: Achieving 120 MHz operation on the XC3S1600E-4FGG320C requires careful attention to routing delays and clock skew across the FPGA fabric. Given its architecture and typical propagation delays in the Spartan-3E family, users should expect a maximum achievable frequency closer to 100–110 MHz under standard process conditions. To meet higher frequencies, designers must optimize critical paths through pipelining, using dedicated carry chains, and placing logic within the same LAB to minimize interconnect delay—strategies documented in Xilinx’s ISE Design Suite implementation guides.

Is the XC3S1600E-4FGG320C suitable for automotive or industrial temperature-grade applications requiring extended reliability?: No, the XC3S1600E-4FGG320C is specified for commercial operating temperatures ranging from 0°C to 85°C (TJ). While it meets industrial-grade manufacturing standards, it lacks the full qualification required for automotive environments that demand extended temperature ranges (-40°C to +105°C) and enhanced functional safety compliance. For harsh environment deployments, alternative families such as the CoolRunner-II CPLDs or newer Artix-7 FPGAs with qualified variants should be considered.

Can the XC3S1600E-4FGG320C support DDR memory interfaces such as DDR2 directly without external PHY components?: The XC3S1600E-4FGG320C does not include hardened DDR memory controllers. Implementing DDR2 SDRAM interfaces would require bit-banging techniques or soft IP cores running in the programmable logic, both of which consume significant logic resources and introduce timing uncertainty. Given only 663,552 bits of total RAM and modest DSP capabilities, this approach is generally impractical for sustained data throughput. External PHYs combined with FPGA-side controller logic are recommended instead, though even then, the XC3S1600E may struggle with high-speed DDR2 due to limited internal routing bandwidth.

How many LABs does the XC3S1600E-4FGG320C contain, and what implications does this have for modular HDL design?: The XC3S1600E-4FGG320C contains 3,688 LABs (Logic Array Blocks), each composed of four slices with dedicated flip-flops and LUTs. This structure enables efficient grouping of related logic functions but also introduces coupling effects between adjacent LABs during place-and-route. When writing VHDL or Verilog code, designers benefit from organizing modules into hierarchies no larger than one or two hundred logic cells per module to maintain predictable timing closure and reduce congestion near LAB boundaries.

What power budget should be allocated for a system integrating the XC3S1600E-4FGG320C under typical load conditions?: At 1.2V core supply and assuming moderate switching activity (20% toggle rate), the XC3S1600E-4FGG320C typically draws between 0.8 W and 1.2 W depending on configuration complexity and I/O utilization. With 250 I/O pins active at 3.3V LVCMOS levels, additional dynamic power from termination resistors and output drivers can add up to 0.3 W. Therefore, total system power consumption rarely exceeds 1.5 W in most use cases—important for battery-powered or thermally constrained applications.

Are there any known issues with JTAG boundary scan when programming the XC3S1600E-4FGG320C via Xilinx Platform Cable USB?: Programming the XC3S1600E-4FGG320C using standard JTAG tools like the Platform Cable USB works reliably provided proper pin assignments are used and no conflicting signals are tied to TDI/TDO/ TMS/TCK lines. Some users report intermittent connection failures if multiple boards share a daisy-chained JTAG chain without individual tristate controls; however, this behavior is consistent across all Spartan-3E devices and not specific to the XC3S1600E variant. Always verify chain integrity using iMPACT’s scan chain diagnostic feature before deployment.

In what scenarios would substituting the XC3S1600E-4FGG320C with a different package such as the 285-FTBGA be advantageous?: The XC3S1600E is available in several packages, including the 320-ball FBGA and the 285-ball FTGA. Switching to the 285-FTBGA reduces overall board area by approximately 15%, making it attractive for space-constrained designs. However, the XC3S1600E-4FGG320C specifically uses the 320-ball package, which provides superior thermal dissipation and lower inductance due to finer pitch (0.8mm vs. 1.0mm). Replacing it with the FTGA version could increase risk of solder bridging and reduce reliability unless PCB layout expertise is applied rigorously.

How does the Moisture Sensitivity Level (MSL) rating of 3 for the XC3S1600E-4FGG320C affect storage and handling procedures?: MSL 3 indicates that the XC3S1600E-4FGG320C remains stable for up to 168 hours after opening the moisture barrier pouch at room temperature before soldering. Beyond this window, reflow processes risk popcorning due to trapped moisture vaporizing. Therefore, strict adherence to JEDEC J-STD-020 guidelines is necessary: store unpacked parts in dry cabinets with humidity below 10% RH, and bake if shelf life exceeds 168 hours. This requirement applies universally across all Spartan-3E packages, including the XC3S1600E-4FGG320C.

Does the XC3S1600E-4FGG320C support partial reconfiguration during runtime?: No, the XC3S1600E-4FGG320C does not support partial reconfiguration. Unlike modern FPGA families such as Virtex or Kintex series, Spartan-3E devices lack the necessary infrastructure blocks and configuration port flexibility required for dynamic region updates. Any modification necessitates a full device reload from external flash or host processor. This limitation makes the XC3S1600E unsuitable for adaptive systems requiring runtime adaptability.

What level of ESD protection does the XC3S1600E-4FGG320C offer, and how should it be handled in prototyping environments?: The XC3S1600E-4FGG320C has an absolute maximum junction temperature of 125°C and follows standard semiconductor handling practices, but it lacks integrated ESD diodes beyond basic human-body model (HBM) robustness (~2 kV). During prototyping, especially with BGA packaging, anti-static wrist straps, grounded workstations, and conductive foam trays are strongly advised. Failure to observe these precautions increases the likelihood of latent damage affecting reliability over time.

How many gates equivalent does the XC3S1600E-4FGG320C represent, and how is this metric useful in system planning?: The XC3S1600E-4FGG320C is rated at 1.6 million usable gates, derived from the sum of configurable logic blocks, block RAM, and routing resources. While gate count is not linearly proportional to real-world functionality, it serves as a rough benchmark for estimating resource requirements in early design phases. Compared to CPLDs or ASICs, this figure aligns with medium-complexity digital systems such as protocol converters or sensor fusion engines, helping engineers avoid over-specification while ensuring adequate headroom.

Can the XC3S1600E-4FGG320C drive 5V-tolerant inputs directly, or do interface circuits need to be added?: The XC3S1600E-4FGG320C supports 3.3V LVCMOS I/O standards natively, but does not guarantee 5V tolerance on input pins. Connecting 5V signals directly risks exceeding absolute maximum ratings unless Schottky clamping diodes or level shifters are present. For bidirectional communication with 5V logic families (e.g., TTL), external voltage translators such as TXB0108 or discrete resistor-capacitor networks are required to protect the XC3S1600E-4FGG320C inputs.

What is the expected latency for a single-cycle combinatorial path traversing multiple CLBs in the XC3S1600E-4FGG320C?: A single-cycle combinatorial path crossing multiple CLBs (Configurable Logic Blocks) will experience variable propagation delay depending on net length and routing congestion. Empirical measurements show worst-case delays between 15 ns and 25 ns at 1.2V and 25°C. Since timing closure is sensitive to placement density, users targeting sub-10 ns paths should limit fan-out and use carry chains or DSP48 slices where possible—though the latter are not available in Spartan-3E architecture.

How does the base product number XC3S1600 relate to the full part number XC3S1600E-4FGG320C in terms of functional equivalence?: The base product number XC3S1600 refers generically to the entire family of 1.6M-gate Spartan-3E devices, including variations in speed grade, package type, and power profile. The suffix "-4" denotes the -4 speed grade (slowest), while "FGG320" specifies the 320-ball FBGA package with fine-pitch balls. Thus, the XC3S1600E-4FGG320C is one specific instantiation within the XC3S1600 family, differing from, say, the XC3S1600A-5FGG320I in speed, package, and industrial grade respectively.

Are there any recommended decoupling capacitor values and placements for stable operation of the XC3S1600E-4FGG320C?: Yes, for stable operation, each VCCO and VCCAUX pin on the XC3S1600E-4FGG320C should be bypassed with a 0.1 µF ceramic capacitor placed within 2 mm of the pin using short traces. Additionally, a bulk 2.2 µF tantalum or ceramic capacitor should be located near the FPGA’s power entry point to stabilize low-frequency transients. Poor decoupling has led to erratic behavior in designs using the XC3S1600E-4FGG320C, particularly when driving high-fanout nets or switching multiple I/O banks simultaneously.

What impact does the 1.14V to 1.26V core voltage range have on power supply design for the XC3S1600E-4FGG320C?: Operating within 1.14V to 1.26V demands tight regulation accuracy (±2%) to maintain performance and prevent timing violations. Linear regulators with low dropout (LDO) characteristics are preferred over switching supplies due to reduced noise coupling into sensitive analog PLLs and global clocks. For designs using the XC3S1600E-4FGG320C, selecting an LDO with <10 mV ripple ensures reliable operation across temperature extremes and prevents glitches caused by voltage droop during bursty logic activity.

How does the absence of built-in PLLs in the XC3S1600E-4FGG320C affect clock management strategies?: Unlike later-generation FPGAs, the XC3S1600E-4FGG320C lacks embedded Phase-Locked Loops (PLLs), requiring external crystal oscillators or clock generators to generate stable reference clocks. Users must implement frequency synthesis using Digital Clock Managers (DCMs) available in the programmable logic fabric, which offer coarse phase adjustment and jitter filtering but lack fine-grained control. Designs relying on precise clock alignment (e.g., video synchronization) benefit from off-chip PLLs such as the Si5338, interfaced via dedicated global clock buffers to minimize skew.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC3S1600E-4FGG320C

Product Attribute
Part Number	XC3S1600E-5FGG320C	XC3S1600E-4FGG320I	XC3S1600E-4FG320C	XC3S1600E-4FGG400C
Manufacturer	AMD	AMD	AMD	AMD
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Series	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Number of Logic Elements/Cells	-	-	-	-
Total RAM Bits	-	-	-	-
Number of I/O	-	-	-	-
Number of LABs/CLBs	-	-	-	-
Voltage - Supply	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Number of Gates	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)

XC3S1600E-4FGG320C Datasheet PDF

Download XC3S1600E-4FGG320C pdf datasheets and AMD documentation for XC3S1600E-4FGG320C - AMD.

Environmental Information: Xilinx REACH211 Cert.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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America	Brazil	7
Europe	Germany	5
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Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

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