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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XC4008-5PQ208C
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XC4008-5PQ208C - AMD

Manufacturer Part Number
XC4008-5PQ208C
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XC4008-5PQ208C
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
7,210 pcs available, New & Original
Parts Description
IC FPGA 144 I/O 208QFP
Package
208-PQFP (28x28)
Data sheet
XC4008-5PQ208C.pdf

Environmental Information

Xilinx REACH211 Cert.pdf
RoHs Status
 
Our certification
In stock: 7210

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Quantity

Specifications

XC4008-5PQ208C Tech Specifications
AMD - XC4008-5PQ208C technical specifications, attributes, parameters and parts with similar specifications to AMD - XC4008-5PQ208C

Product Attribute Attribute Value
Manufacturer AMD Xilinx
Voltage - Supply 4.75V ~ 5.25V
Total RAM Bits 10368
Supplier Device Package 208-PQFP (28x28)
Series XC4000
Package / Case 208-BFQFP
Package Tray
Product Attribute Attribute Value
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 770
Number of LABs/CLBs 324
Number of I/O 144
Number of Gates 8000
Mounting Type Surface Mount
Base Product Number XC4008

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

Manufacturer Part Number

XC4008-5PQ208C

Manufacturer

Xilinx

Introduction

Xilinx XC4000 series FPGA offering a customizable logic architecture for complex designs

Product Features and Performance

324 Logic Blocks/CLBs

770 Logic Elements/Cells

10,368 Total RAM Bits

144 I/O Pins

8,000 Logic Gates

Surface Mount Technology

Product Advantages

Rapid prototype and design changes

Notable logic density for its era

High I/O pin count

Key Technical Parameters

Number of LABs/CLBs: 324

Number of Logic Elements/Cells: 770

Total RAM Bits: 10368

Number of I/O: 144

Number of Gates: 8000

Voltage Supply: 4.75V ~ 5.25V

Mounting Type: Surface Mount

Operating Temperature: 0°C ~ 85°C

Quality and Safety Features

Robust operating temperature range: 0°C ~ 85°C

Compatibility

PQFP-208 compatible with standard surface mount processes

Application Areas

Complex digital logic applications

Custom integrated circuit development

Programmable logic device projects

Product Lifecycle

Obsolete

Potential replacement or upgrade options may be limited

Several Key Reasons to Choose This Product

High integration of logic elements

Supports complex and flexible design strategies

Robust thermal and electrical specifications

Well-suited for educational and legacy project applications

Availability of extensive design resources despite product status

Frequently Asked Questions(FAQ)

How does the XC4008-5PQ208C’s 770 logic elements compare to mid-range FPGAs in terms of real-world design capacity for control logic applications?
The XC4008-5PQ208C provides 770 logic elements and 324 LABs/CLBs, which positions it as a compact FPGA suitable for moderate-complexity control systems such as industrial I/O expansion or communication protocol bridging. While modern mid-range FPGAs often exceed 10,000 logic cells, the XC4008-5PQ208C’s resource count aligns with legacy or cost-sensitive designs where gate utilization efficiency matters more than raw capacity. For example, implementing a 16-bit state machine with peripheral glue logic typically consumes 15–20% of the available logic elements, leaving ample room for auxiliary functions without requiring external CPLDs.
What are the implications of the XC4008-5PQ208C’s 4.75V to 5.25V supply range for power system design in 5V-tolerant embedded environments?
The XC4008-5PQ208C operates within a narrow 5V ±5% window, which demands stable regulation in noise-sensitive or long-trace PCB layouts. Unlike modern 1.2V or 3.3V FPGAs, this device requires careful decoupling—typically 0.1µF ceramic capacitors per power pin—and may benefit from a dedicated LDO to avoid voltage droop during simultaneous switching of its 144 I/Os. Designs interfacing with 3.3V logic must use level shifters, as the XC4008-5PQ208C’s I/O banks are not 3.3V tolerant, increasing BOM complexity in mixed-voltage systems.
Can the XC4008-5PQ208C support real-time signal processing tasks given its 10,368-bit block RAM and 8,000-gate count?
The XC4008-5PQ208C’s 10,368 bits of distributed RAM are best suited for small FIFO buffers, lookup tables, or register files rather than data-intensive DSP workloads. For instance, a 256x16-bit dual-port buffer consumes roughly 4,096 bits, limiting concurrent memory-intensive operations. Combined with its 8,000-gate capacity, the device is more appropriate for protocol handling (e.g., UART multiplexing or SPI bridging) than FIR filtering or FFT computation, where even modest kernels would exceed available resources.
How does the 208-BFQFP package of the XC4008-5PQ208C affect PCB layout and thermal management in high-density designs?
The 208-BFQFP (28x28mm) package with 0.5mm pitch demands precise stencil design and reflow profiling to avoid solder bridging, especially given its non-RoHS status and older assembly compatibility. Thermal dissipation is moderate due to the plastic QFP construction; under typical operation at 5V and 50% I/O toggle rate, junction temperatures remain within spec at ambient up to 70°C. However, in enclosed systems with poor airflow, a small heatsink or copper pour under the device may be warranted to maintain TJ below 85°C.
What design risks arise from using the XC4008-5PQ208C in new developments given its non-RoHS status and obsolescence trajectory?
The XC4008-5PQ208C’s non-RoHS compliance limits its use in EU-regulated products or high-reliability markets requiring full material disclosure. Additionally, as a member of the mature XC4000 series, long-term availability is uncertain, increasing lifecycle risk for volume production. Engineers should evaluate second-source options or migration paths to newer architectures like Spartan or Artix families early in the design phase, especially if field upgrades or 10+ year product lifespans are anticipated.
How does the I/O count and configuration flexibility of the XC4008-5PQ208C compare to contemporary CPLDs for glue logic applications?
With 144 user I/Os, the XC4008-5PQ208C offers significantly greater pin flexibility than most CPLDs (typically under 200 macrocells and 64 I/Os), enabling complex interface aggregation without external multiplexers. However, CPLDs like the XC9500XL series provide instant-on capability and lower static power, making them preferable for simple control tasks. The XC4008-5PQ208C shines in scenarios requiring reconfigurable logic blocks—such as adaptive bus interfacing—where a CPLD’s fixed architecture would necessitate multiple devices.
What are the timing closure challenges when targeting the XC4008-5PQ208C for high-speed synchronous designs?
The XC4008-5PQ208C’s architecture, based on older SRAM-based routing, exhibits relatively high interconnect delays compared to modern FPGAs. Achieving timing closure at clock frequencies above 40–50 MHz requires careful floorplanning, pipelining of critical paths, and avoidance of long combinatorial chains. For example, a 32-bit counter with synchronous load may meet timing at 33 MHz but fail at 66 MHz without register retiming—highlighting the need for conservative clock budgeting in performance-critical paths.
Is the XC4008-5PQ208C suitable for safety-critical applications requiring functional redundancy or error detection?
The XC4008-5PQ208C lacks built-in SEU (single-event upset) mitigation, ECC support, or radiation-hardened design features, making it inappropriate for aerospace or automotive safety systems requiring ASIL compliance. While triple modular redundancy (TMR) can be implemented in logic, the underlying configuration memory remains vulnerable to soft errors. For industrial control with moderate fault tolerance, external watchdog circuits and periodic configuration scrubbing may suffice, but full certification would require architectural validation beyond the device’s native capabilities.
How does the moisture sensitivity level (MSL 3) of the XC4008-5PQ208C impact handling and storage during assembly?
Rated MSL 3 (168 hours floor life), the XC4008-5PQ208C must be baked for 24 hours at 125°C if exposed to ambient conditions beyond its sealed bag shelf life. During high-volume pick-and-place operations, trays should be used instead of tape-and-reel to minimize moisture absorption, and inline humidity control (<30% RH) is recommended. Failure to follow MSL protocols can lead to popcorning during reflow, particularly given the large 208-pin QFP package’s susceptibility to thermal stress.
What verification strategies are effective for ensuring reliable configuration of the XC4008-5PQ208C in field-deployed systems?
Since the XC4008-5PQ208C uses volatile SRAM-based configuration, a reliable boot mechanism—such as a parallel PROM or microcontroller-based loader—is essential. Designers should implement cyclic redundancy checks (CRC) on the bitstream and monitor INIT_B and DONE pins to detect configuration failures. In environments with electrical noise, periodic reconfiguration or watchdog-triggered reloads can enhance robustness, though this adds firmware complexity compared to flash-based FPGAs.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC4008-5PQ208C

Product Attribute XC4008E-1PQ208C XC4006E-4PQ208C XC4006E-4PQ208I XC4008E-1PQ160C
Part Number XC4008E-1PQ208C XC4006E-4PQ208C XC4006E-4PQ208I XC4008E-1PQ160C
Manufacturer AMD AMD AMD AMD
Number of LABs/CLBs - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Series - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Mounting Type - Surface Mount Through Hole Surface Mount
Number of Logic Elements/Cells - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Total RAM Bits - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Voltage - Supply - - - -
Number of I/O - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of Gates - - - -

XC4008-5PQ208C Datasheet PDF

Download XC4008-5PQ208C pdf datasheets and AMD documentation for XC4008-5PQ208C - AMD.

Datasheets
XC4000/A/H Families.pdf
Environmental Information
Xilinx REACH211 Cert.pdf

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
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We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
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AMD

XC4008-5PQ208C

AMD
32D-XC4008-5PQ208C

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