About us Contact Us Submit BOM
RFQs(0)
English
Close Menu
View All

Please refer to the English Version as our Official Version.Return

Europe
France(Français) Germany(Deutsch) Italy(Italia) Russian(русский) Poland(polski) Czech(Čeština) Luxembourg(Lëtzebuergesch) Netherlands(Nederland) Iceland(íslenska) Hungarian(Magyarország) Spain(español) Portugal(Português) Turkey(Türk dili) Bulgaria(Български език) Ukraine(Україна) Greece(Ελλάδα) Israel(עִבְרִית) Sweden(Svenska) Finland(Svenska) Finland(Suomi) Romania(românesc) Moldova(românesc) Slovakia(Slovenská) Denmark(Dansk) Slovenia(Slovenija) Slovenia(Hrvatska) Croatia(Hrvatska) Serbia(Hrvatska) Montenegro(Hrvatska) Bosnia and Herzegovina(Hrvatska) Lithuania(lietuvių) Spain(Português) Switzerland(Deutsch) United Kingdom(English)
Asia/Pacific
Japan(日本語) Korea(한국의) Thailand(ภาษาไทย) Malaysia(Melayu) Singapore(Melayu) Vietnam(Tiếng Việt) Philippines(Pilipino)
Africa, India and Middle East
United Arab Emirates(العربية) Iran(فارسی) Tajikistan(فارسی) India(हिंदी) Madagascar(malaɡasʲ)
South America / Oceania
New Zealand(Maori) Brazil(Português) Angola(Português) Mozambique(Português)
North America
United States(English) Canada(English) Haiti(Ayiti) Mexico(español)
HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XC4013E-4PQ160I
Image may be representation.
See specifications for product details.
Share
 Favorite
EXPRESS OPTION
Payment method

XC4013E-4PQ160I - AMD

Manufacturer Part Number
XC4013E-4PQ160I
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XC4013E-4PQ160I
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
8,160 pcs available, New & Original
Parts Description
IC FPGA 129 I/O 160QFP
Package
160-PQFP (28x28)
Data sheet
XC4013E-4PQ160I.pdf

Environmental Information

Xilinx REACH211 Cert.pdf
RoHs Status
 
Compare
Our certification
In stock: 8160

Required fields are indicated by an asterisk (*)
Please send RFQ, we will respond immediately.

Quantity

Specifications

XC4013E-4PQ160I Tech Specifications
AMD - XC4013E-4PQ160I technical specifications, attributes, parameters and parts with similar specifications to AMD - XC4013E-4PQ160I

Product Attribute Attribute Value
Manufacturer AMD Xilinx
Voltage - Supply 4.5V ~ 5.5V
Total RAM Bits 18432
Supplier Device Package 160-PQFP (28x28)
Series XC4000E/X
Package / Case 160-BQFP
Package Tray
Product Attribute Attribute Value
Operating Temperature -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells 1368
Number of LABs/CLBs 576
Number of I/O 129
Number of Gates 13000
Mounting Type Surface Mount
Base Product Number XC4013E

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

Manufacturer Part Number

XC4013E-4PQ160I

Manufacturer

xilinx

Introduction

The XC4013E-4PQ160I is a part of the XC4000E/X series of Field Programmable Gate Arrays designed for high-performance digital circuits.

Product Features and Performance

Embedded FPGA from the XC4000E/X series

Features 576 Logic Blocks/Cell-Based Blocks (LABs/CLBs)

Contains 1368 Logic Elements/Cells

Provides a total of 18432 RAM bits for data storage

Offers 129 Input/Output pins for versatile connectivity

FPGA with 13000 gates for complex logic functions

Surface Mount technology for PCB integration

Product Advantages

Integrates multiple functions in a single device

High logic capacity and flexibility for circuit design

Ability to reprogram for iterative development and updates

Robust IO capabilities facilitating multi-faceted communication

Key Technical Parameters

Number of LABs/CLBs: 576

Number of Logic Elements/Cells: 1368

Total RAM Bits: 18432

Number of I/O: 129

Number of Gates: 13000

Voltage Supply Range: 4.5V to 5.5V

Quality and Safety Features

Operational over a wide temperature range: -40°C to 100°C (TJ)

Compatibility

Compatible with 160-PQFP (28x28) Supplier Device Package

Designed for surface mount technology PCB integration

Application Areas

Suitable for digital signal processing

Customizable for a broad range of electronic applications

Utilized in communications, automotive, and consumer electronics

Product Lifecycle

Status: Obsolete

As an obsolete product, customers should check for replacement or upgrade options

Several Key Reasons to Choose This Product

Superior design flexibility due to a high number of configurable logic elements

Adaptability to multiple applications with a broad range of I/O options

Robustness in various environmental conditions given the wide operating temperature

Ideal for prototypes and one-off designs due to reprogrammability

Xilinx's strong reputation for quality and support in FPGA technology

Frequently Asked Questions(FAQ)

How does the XC4013E-4PQ160I compare to the XC4010E-4PQ160I in terms of logic capacity and I/O availability for a design requiring 120 user I/Os?
The XC4013E-4PQ160I provides 129 I/O pins, which meets the requirement for 120 user I/Os, whereas the XC4010E-4PQ160I offers only 108 I/Os, making it insufficient. Additionally, the XC4013E-4PQ160I includes 1368 logic elements compared to the XC4010E’s 756, offering nearly double the logic resources. This makes the XC4013E-4PQ160I better suited for designs with moderate complexity that require both substantial I/O and logic scalability. The larger CLB count (576 vs. 288) further supports more complex state machine implementations.
What are the key differences between using the XC4013E-4PQ160I in commercial versus industrial temperature ranges, and how might this affect reliability in embedded systems?
The XC4013E-4PQ160I operates from -40°C to 100°C, which covers industrial and extended commercial grades, unlike standard commercial parts limited to 0°C–70°C. This extended range ensures stable operation in harsh environments such as automotive or factory automation systems. However, the component is RoHS non-compliant, which may restrict its use in regions with strict environmental regulations despite its superior thermal performance. Designers must weigh operational requirements against compliance obligations when selecting this FPGA.
Can the XC4013E-4PQ160I support synchronous clock domain crossings without additional synchronization circuitry, given its internal architecture?
No, the XC4013E-4PQ160I, like all FPGAs in the XC4000E series, does not inherently provide automatic clock domain crossing (CDC) handling. Crossing between asynchronous clocks requires explicit use of dual-port RAMs, synchronizer chains, or FIFOs implemented in logic. With only 18,432 total RAM bits available, careful resource allocation is necessary if multiple CDC paths are needed. This necessitates architectural planning during RTL development to avoid timing violations and metastability.
How should power supply noise be mitigated when implementing the XC4013E-4PQ160I in a mixed-signal system with analog peripherals?
Due to its 4.5V–5.5V supply range, the XC4013E-4PQ160I can interface directly with TTL-compatible analog circuits, but noise coupling must be managed. A common approach involves placing ferrite beads and low-ESR bulk capacitors near VCC/VCCAUX pins, along with dedicated power planes separated from noisy digital rails. Decoupling capacitance should exceed 100 nF per power pin, considering the FPGA’s 129 I/Os and high gate count (13K), which increase dynamic switching current demands.
What impact does the MSL 3 classification have on PCB assembly and long-term storage for boards using the XC4013E-4PQ160I?
As an MSL 3 component, the XC4013E-4PQ160I has a maximum exposure time of 168 hours after dry packing before reflow soldering is required. Beyond this window, moisture absorption could lead to popcorning during thermal cycling. Boards must be stored in sealed, desiccated environments with humidity below 60% RH. For production runs exceeding one week, baking at 125°C for 24 hours is recommended prior to rework or reflow to ensure reliability.
Is it feasible to implement soft-core processors like MicroBlaze on the XC4013E-4PQ160I, and what memory constraints should be considered?
While the XC4013E-4PQ160I lacks integrated block RAM, it contains 18,432 bits of distributed RAM accessible through CLBs. This is sufficient for small instruction/data caches or configuration memory, but not ideal for large applications. Implementing a soft processor would require external SDRAM or Flash for program storage, increasing board complexity. Given the limited internal RAM, real-time operating systems with minimal footprint are more appropriate than full-featured Linux-based solutions.
How does the gate count of the XC4013E-4PQ160I influence routing congestion in dense layouts, and what mitigation strategies exist?
At approximately 13,000 equivalent gates, the XC4013E-4PQ160I generates significant netlist density, especially when combined with high I/O activity. Routing congestion can lead to increased propagation delays and setup violations. To mitigate this, designers should partition logic into hierarchical modules, optimize placement constraints, and use timing-driven synthesis tools. Floorplanning critical paths early helps reduce wirelength and improves overall timing closure by up to 30% compared to ad-hoc routing.
What role does the 160-PQFP package play in thermal management for the XC4013E-4PQ160I, and can it dissipate heat effectively without a heatsink?
The 160-pin PQFP (28x28 mm) package features a thermal pad connected internally to ground, aiding conduction to the PCB copper plane. However, peak junction temperatures reach 100°C, limiting passive cooling capability. In air-cooled systems with natural convection, total power dissipation should remain under 1.5W to avoid thermal throttling or accelerated aging. Adequate copper pours and vias under the package enhance heat spreading, but forced airflow is advisable for sustained high-load operations.
How do the LAB/CLB counts of the XC4013E-4PQ160I compare to the XC4016E-4PQ160I, and what implications arise for parallel processing tasks?
The XC4013E-4PQ160I contains 576 LABs (Logic Array Blocks), while the XC4016E-4PQ160I doubles this to 1,152 LABs. For algorithms involving pipelined or massively parallel data paths—such as image filtering or FFT processing—the XC4016E offers significantly higher throughput due to greater parallelism. However, the XC4013E-4PQ160I remains viable for moderately parallel workloads where I/O bandwidth or power budget constrains expansion, provided logic utilization stays below 70% to allow for future feature additions.
Why might a designer choose the XC4013E-4PQ160I over newer FPGA families despite its lack of modern IP blocks and RoHS non-compliance?
The XC4013E-4PQ160I may still be selected for legacy system upgrades or retrofit applications where mechanical compatibility, existing firmware, or certification dependencies prevent migration. Its proven track record in industrial controls and telecom equipment ensures predictable behavior and long-term availability. Furthermore, lower unit cost and absence of licensing fees for proprietary IP make it economical for low-to-medium volume production where advanced features are unnecessary.
What precautions are essential when programming the XC4013E-4PQ160I via JTAG in field-deployed systems?
Field-programming the XC4013E-4PQ160I requires robust JTAG chain integrity checks to avoid partial programming failures. Voltage levels on TMS/TDI/TDO must stay within 0–5V tolerance, and signal rise/fall times should be <10 ns to prevent misinterpretation. Isolating the JTAG port with series resistors and TVS diodes protects against ESD events. Additionally, verifying configuration completion through status register reads ensures successful deployment, especially in remote or inaccessible installations.
How does the absence of built-in PLLs in the XC4013E-4PQ160I affect clock generation and jitter performance in precision timing applications?
Unlike modern FPGAs with embedded Phase-Locked Loops, the XC4013E-4PQ160I relies on external oscillators and discrete PLL ICs for frequency synthesis. This increases board space and introduces phase noise from reference crystals. For applications demanding sub-picosecond jitter (e.g., communication protocols), external low-noise synthesizers are mandatory. Internal DLLs (Delay-Locked Loops) can help deskew inter-domain signals but cannot generate clean clocks independently.
What considerations apply when cascading multiple XC4013E-4PQ160I devices for expanded logic capacity?
Cascading requires careful attention to global routing delays and I/O buffer drive strength. Each XC4013E-4PQ160I has 129 I/Os, but fan-out limitations mean not all can be used simultaneously at full speed. Shared configuration pins must be buffered if multiple devices share a JTAG chain. Moreover, power sequencing becomes critical; simultaneous activation risks inrush currents exceeding the 4.5V–5.5V rail tolerance. Distributed power supplies with soft-start control are recommended for multi-chip designs.
How does the XC4013E-4PQ160I handle ESD protection compared to contemporary FPGAs, and what external measures are advised?
The XC4013E-4PQ160I provides only basic human-body model (HBM) ESD protection (~2 kV), inferior to modern FPGAs with integrated >8 kV protection. In industrial settings with frequent hot-plugging or exposed connectors, external transient suppressors (e.g., TVS diodes rated ±15 V) are strongly advised. Placement within 5 mm of each I/O pin minimizes parasitic inductance and ensures effective clamping during surge events.
Can the XC4013E-4PQ160I support LVCMOS 3.3V signaling directly, and what voltage translation is needed for 5V systems?
Yes, the XC4013E-4PQ160I supports LVCMOS 3.3V inputs and outputs natively, as its I/O banks are compatible with TTL/CMOS standards. However, driving 5V CMOS signals into these banks risks damaging the device unless level shifters are inserted. Bidirectional translators like SN74LVC8T245 are preferred over resistive dividers for reliable bidirectional communication in mixed-voltage environments.
What factors determine whether to use the XC4013E-4PQ160I in a single-supply or split-supply configuration?
Split supplies (e.g., 3.3V for core, 5V for I/O) allow interfacing with legacy peripherals but add complexity. The XC4013E-4PQ160I’s core operates at 4.5V–5.5V, so using 5V for both core and I/O simplifies design but reduces noise margin. If interfacing with 3.3V-only sensors or memories, a single 3.3V supply suffices only if the peripheral tolerates 3.3V inputs—otherwise, translation layers are unavoidable.
How does the gate count correlate with typical application domains for the XC4013E-4PQ160I, and what are representative use cases?
At ~13K gates, the XC4013E-4PQ160I suits mid-range control logic, protocol conversion, or small motor controllers rather than high-performance DSP. Representative applications include industrial Ethernet gateways, CAN bus bridges, or custom serial interfaces. It avoids the overhead of large block RAM or DSP slices found in higher-end devices, making it efficient for glue logic and state-machine-intensive tasks with moderate throughput.
What trade-offs exist between using the XC4013E-4PQ160I and migrating to CPLDs for simpler combinational logic designs?
CPLDs offer deterministic timing and instant-on capability, which the XC4013E-4PQ160I lacks due to configuration latency. However, for designs requiring sequential logic beyond what a CPLD can deliver—such as finite state machines with deep counters or moderate-speed communication stacks—the XC4013E-4PQ160I provides greater flexibility. The choice hinges on complexity: CPLDs win for static logic; the XC4013E-4PQ160I excels in dynamic, reconfigurable systems needing algorithmic adaptability.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC4013E-4PQ160I

Product Attribute XC4013E-4PQ160C XC4013E-4PQ208I XC4013E-4PQ240I XC4013E-4HQ240I
Part Number XC4013E-4PQ160C XC4013E-4PQ208I XC4013E-4PQ240I XC4013E-4HQ240I
Manufacturer AMD AMD AMD AMD
Series - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Number of LABs/CLBs - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of Logic Elements/Cells - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Number of I/O - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Number of Gates - - - -
Voltage - Supply - - - -
Total RAM Bits - - - -

XC4013E-4PQ160I Datasheet PDF

Download XC4013E-4PQ160I pdf datasheets and AMD documentation for XC4013E-4PQ160I - AMD.

Datasheets
XC4000(E, X) Series.pdf
PCN Obsolescence/ EOL
XC4000E,XLA,1700L,E,EL,17S00,XL Families 28/Jul/20.pdf
Environmental Information
Xilinx REACH211 Cert.pdf

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

Write a Review

Your Email address will not be published.

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
Quality Inspection
Quality Inspection Image - 01
Quality Inspection Image - 02
Quality Inspection Image - 03
Quality Inspection Image - 04

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
  • HKBea
  • Paypal
  • MasterCard
  • Western-Union
  • VISA
Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner
  • Efficient Supply Management
  • Cost-Saving Procurement
  • Fast Sourcing & Delivery
Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
AMD

XC4013E-4PQ160I

AMD
32D-XC4013E-4PQ160I

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

Allelco
About Us
History
Certifications
Recruitment
Policies
Terms & Conditions
Privacy Policy
Cookie Policy
Services
Order Tracking
Return & Replacement
Frequently Asked Questions
Contact Us
Order
Shipping & Delivering
Payment Methods
My Account
The BlogsHot PartsChange LanguageNewsSite map
Contact Us
Headquarters Address:
Room C 13/F Harvard Commercial Building
105-111 Thomson Road Wan Chai
HongKong
Service Tel: +852-91464856
Service Email: info@allelco.com
Follow us
Copyright © 2012-2025 AllelcoElec.com. All rights reserved.
0 RFQ
Shopping cart (0 Items)
It is empty.
Submit RFQ
Compare List (0 Items)
It is empty.
Feedback

Your feedback matters! At Allelco, we value the user experience and strive to improve it constantly.
Please share your comments with us via our feedback form, and we'll respond promptly.
Thank you for choosing Allelco.

Subject
E-mail
Comments
Captcha
Drag or click to upload file
Upload File
types: .xls, .xlsx, .doc, .docx, .jpg, .png and .pdf.
Max file size: 10MB