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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~XC4036EX-4PG411I~~

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XC4036EX-4PG411I - AMD

Name: AMD XC4036EX-4PG411I
Brand: AMD
SKU: XC4036EX-4PG411I
Availability: InStock
Rating: 5 (7 reviews)

Manufacturer Part Number: XC4036EX-4PG411I

Manufacturer: AMD Xilinx

Allelco Part Number: 98D-XC4036EX-4PG411I

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 6,694 pcs available, New & Original

Parts Description: IC FPGA 288 I/O 411CPGA

Package: 411-CPGA (52.32x52.32)

Data sheet: XC4036EX-4PG411.pdf

Datasheets
XC4000(E, X) Series.pdf

Environmental Information
Xilinx REACH211 Cert.pdf

RoHs Status

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Our certification

In stock: 6694

Specifications

XC4036EX-4PG411I Tech Specifications
AMD - XC4036EX-4PG411I technical specifications, attributes, parameters and parts with similar specifications to AMD - XC4036EX-4PG411I

Product Attribute	Attribute Value
Manufacturer	AMD Xilinx
Voltage - Supply	4.5V ~ 5.5V
Total RAM Bits	41472
Supplier Device Package	411-CPGA (52.32x52.32)
Series	XC4000E/X
Package / Case	411-BCPGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells	3078
Number of LABs/CLBs	1296
Number of I/O	288
Number of Gates	36000
Mounting Type	Through Hole
Base Product Number	XC4036EX

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	RoHS non-compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991D
HTSUS	8542.39.0001

Frequently Asked Questions(FAQ)

How does the XC4036EX-4PG411I compare to the XC4036X-4PG411C in terms of operating temperature range and power consumption under typical load conditions?: The XC4036EX-4PG411I is specified for operation from -40°C to 100°C (TJ), matching the industrial-grade temperature range of its predecessor XC4036X-4PG411C. However, the EX variant typically exhibits slightly higher dynamic power due to enhanced performance features at the same 4.5V–5.5V supply voltage. In practical designs, this difference may amount to 5–10% additional power draw under full utilization, which should be factored into thermal management planning.

What are the implications of using the XC4036EX-4PG411I in a system requiring RoHS compliance, and how can design engineers mitigate potential regulatory risks?: The XC4036EX-4PG411I is marked as RoHS non-compliant, meaning it contains restricted substances such as lead in quantities exceeding current directives. For applications targeting EU markets or customers with strict environmental standards, sourcing a compliant alternative—such as an XQR4000XL or newer CPLD-based solution—is advisable. Engineers should verify end-of-life dates and maintain documentation to manage obsolescence risk.

Can the XC4036EX-4PG411I support high-speed I/O interfaces like LVDS or PCIe, and what layout considerations are critical for signal integrity?: While the XC4036EX-4PG411I supports programmable I/O standards up to 3.3V, achieving reliable high-speed signaling requires careful PCB design. LVDS-like differential pairs can be implemented using internal routing resources, but achieving consistent timing demands controlled impedance traces and minimized stub lengths. PCIe is not natively supported due to lack of dedicated transceivers; instead, parallel or serial protocols must be emulated in logic fabric, increasing complexity and latency.

How many logic elements does the XC4036EX-4PG411I offer, and how does that translate into usable logic capacity for complex state machines versus arithmetic functions?: With 3,078 logic elements (LEs) organized across 1,296 LABs, the XC4036EX-4PG411I provides sufficient resources for moderate-complexity designs. State machines with deep branching may consume 15–20 LEs per finite state machine (FSM), while fixed-point arithmetic units (e.g., 16×16-bit multipliers) typically require 40–60 LEs each. Designers should reserve 10–15% headroom for routing congestion and timing closure.

Is it feasible to cascade multiple XC4036EX-4PG411I devices to scale beyond 3,078 logic elements for larger control systems?: Direct device-to-device cascading is not recommended due to limited global clock distribution and synchronization challenges. Instead, engineers often partition logic across multiple FPGAs using handshaking protocols or external memory buffers. This approach introduces latency and increases board area, making it suitable only when incremental scalability outweighs cost and timing constraints.

What is the maximum number of simultaneous I/O pins the XC4036EX-4PG411I can drive at 3.3V without violating setup/hold margins?: All 288 I/Os can be configured simultaneously, but active driving capability depends on load capacitance and fan-out. Driving more than 100 high-capacitance loads (>10pF per pin) may degrade rise/fall times beyond acceptable thresholds, risking timing failures. In practice, limiting simultaneous switching to <70 pins per clock domain helps maintain signal integrity and meet propagation delay budgets.

How does the base product number XC4036EX relate to the specific part XC4036EX-4PG411I, and why might two parts share the same base but differ in package or speed grade?: The base number XC4036EX identifies the core FPGA architecture, while the suffix "-4PG411I" specifies the speed grade (4), packaging (CPGA), and commercial-industrial temperature range (I). Variations in speed grade directly impact maximum operating frequency—lower grades (e.g., -3) run slower but consume less power—allowing designers to optimize for performance vs. power trade-offs in their application.

What precautions should be taken when migrating legacy designs from older XC4000 series FPGAs to the XC4036EX-4PG411I regarding I/O banking and voltage compatibility?: Legacy designs often assume fixed I/O bank voltages tied to VCCINT, but the XC4036EX-4PG411I allows flexible assignment of I/O banks to either 3.3V or 5V levels. Engineers must explicitly configure I/O standards (LVTTL, LVCMOS) per bank to prevent latch-up during mixed-voltage interfacing. Additionally, unused I/Os should be terminated to avoid floating inputs that can cause increased leakage currents.

How much RAM does the XC4036EX-4PG411I contain internally, and how is this memory best utilized in embedded controller applications?: The device includes 41,472 bits of distributed RAM, equivalent to approximately 5,184 bytes. This is ideal for implementing small lookup tables, FIFO buffers, or register files but insufficient for large data logging. For buffering sensor data streams, designers typically use block RAM equivalents created by mapping arrays to LUTs, consuming up to 10–15% of total LEs depending on access pattern.

Are there any known limitations in using the XC4036EX-4PG411I for cryptographic operations compared to modern secure FPGAs?: Due to its age and architecture, the XC4036EX-4PG411I lacks hardware accelerators for AES or SHA engines and relies entirely on soft-core implementations. This results in significantly slower encryption throughput—typically below 1 Mbps for basic algorithms—and higher resource utilization. For security-critical applications, migration to contemporary devices with integrated crypto blocks is strongly advised.

What is the moisture sensitivity level (MSL) of the XC4036EX-4PG411I, and how should it affect handling procedures during assembly?: The XC4036EX-4PG411I has an MSL rating of 3 (168 hours), indicating moderate susceptibility to moisture-induced damage during soldering. After unpacking, the component must remain in a dry environment or desiccant-filled bag until reflow. If exposed beyond 168 hours, it must undergo baking before assembly to prevent popcorning defects.

Why would a designer choose the 411-CPGA package over surface-mount alternatives despite the increased board space requirements?: The CPGA (Ceramic Pin Grid Array) package offers superior thermal conductivity and mechanical stability for high-pin-count devices like the XC4036EX-4PG411I. Though larger than QFP packages, it facilitates easier manual inspection, repairability, and long-term reliability in harsh environments where vibration resistance matters—common in aerospace or industrial automation systems.

What is the gate count equivalence of the XC4036EX-4PG411I, and how does it compare functionally to ASIC solutions of similar complexity?: At 36,000 gates, the XC4036EX-4PG411I approximates a mid-range ASIC in logical density. However, unlike ASICs, it incurs overhead from programmable interconnect, routing delays, and static power consumption. For batch volumes under 5,000 units, FPGA development costs may offset NRE savings unless reusability across products justifies the platform choice.

How does the operating temperature range (-40°C to 100°C TJ) impact long-term reliability of the XC4036EX-4PG411I in automotive or outdoor installations?: Operating near the upper limit (100°C) accelerates electromigration and reduces MTBF according to Arrhenius models. Continuous exposure near 100°C may halve expected lifetime compared to operation at 50°C. Designers should implement derating strategies—such as reducing switching activity or adding thermal throttling logic—to extend operational life in mission-critical deployments.

Can the XC4036EX-4PG411I interface directly with DDR SDRAM, and what architectural constraints apply?: Native support for DDR SDRAM is not available; however, engineers can implement custom controllers using internal logic to manage double-data-rate signaling. This requires precise timing alignment across multiple clock domains and consumes significant LEs—often 30–40% of total resources—making it viable only for low-bandwidth (<10 MB/s) applications where cost outweighs performance needs.

What tools are required to program the XC4036EX-4PG411I, and are there any licensing or version compatibility issues to consider?: Programming requires Xilinx Foundation Series or early ISE Design Suite versions (pre-10.x). Newer Vivado tools do not support legacy architectures like XC4000E/X. Licensing is typically project-based, and older toolchains may lack Windows 10/11 support, necessitating virtualization or legacy hardware for development continuity.

How does the XC4036EX-4PG411I handle clock skew between regional clock networks, and what mitigation techniques are effective?: The XC4036EX-4PG411I uses regional clock buffers with limited skew control; worst-case skew can exceed 2 ns across the chip. To minimize impact, designers should restrict high-fanout signals to single clock regions and use phase-locked loops (PLLs) sparingly, as this architecture lacks dedicated PLL resources. Alternatively, synchronous design practices reduce skew sensitivity.

Is reverse engineering protection available for designs implemented on the XC4036EX-4PG411I, and what are the limitations?: No advanced anti-tamper or bitstream encryption exists for this device family. Bitstreams are easily decrypted using open-source tools, exposing intellectual property. For proprietary algorithms, designers should implement obfuscation layers in software or migrate to modern FPGAs with built-in configuration security features.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC4036EX-4PG411I

Product Attribute
Part Number	XC4036EX-4PG411C	XC4036EX-4HQ304I	XC4036EX-4HQ304C	XC4036XL-09BG432C
Manufacturer	AMD	AMD	AMD	AMD
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Number of LABs/CLBs	-	-	-	-
Voltage - Supply	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Number of Gates	-	-	-	-
Number of Logic Elements/Cells	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Series	-	-	-	-
Number of I/O	-	-	-	-
Total RAM Bits	-	-	-	-

XC4036EX-4PG411I Datasheet PDF

Download XC4036EX-4PG411I pdf datasheets and AMD documentation for XC4036EX-4PG411I - AMD.

Datasheets: XC4000(E, X) Series.pdf
Environmental Information: Xilinx REACH211 Cert.pdf

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Customer Reviews

Evaluation: 10 Articles

Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.
Daic***K.

Mar 23, 2026

Very good. No issue after long time testing.
Kevi***.

Mar 17, 2026

Fast switching and stable output. Very satisfied with this IC
Daou***hekebkeb

Jun 16, 2024

I had a great experience purchasing items from Allelcoelec, I recommend
Uri ***al

Jun 19, 2024

Good comunication,
Transpnt regarding the process and price.
Yaqu***l Ali

Jun 19, 2024

Providing reasonable prices, regular follow-up of orders, providing accurate and regular invoices, timely delivery of goods, excellent customer service and providing original goods and best quality materials.

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Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
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	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
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