Please refer to the English Version as our Official Version.

Europe: France~~(Français)~~ Germany~~(Deutsch)~~ Italy~~(Italia)~~ Russian~~(русский)~~ Poland~~(polski)~~ Czech~~(Čeština)~~ Luxembourg~~(Lëtzebuergesch)~~ Netherlands~~(Nederland)~~ Iceland~~(íslenska)~~ Hungarian~~(Magyarország)~~ Spain~~(español)~~ Portugal~~(Português)~~ Turkey~~(Türk dili)~~ Bulgaria~~(Български език)~~ Ukraine~~(Україна)~~ Greece~~(Ελλάδα)~~ Israel~~(עִבְרִית)~~ Sweden~~(Svenska)~~ Finland~~(Svenska)~~ Finland~~(Suomi)~~ Romania~~(românesc)~~ Moldova~~(românesc)~~ Slovakia~~(Slovenská)~~ Denmark~~(Dansk)~~ Slovenia~~(Slovenija)~~ Slovenia~~(Hrvatska)~~ Croatia~~(Hrvatska)~~ Serbia~~(Hrvatska)~~ Montenegro~~(Hrvatska)~~ Bosnia and Herzegovina~~(Hrvatska)~~ Lithuania~~(lietuvių)~~ Spain~~(Português)~~ Switzerland~~(Deutsch)~~ United Kingdom~~(English)~~

Asia/Pacific: Japan~~(日本語)~~ Korea~~(한국의)~~ Thailand~~(ภาษาไทย)~~ Malaysia~~(Melayu)~~ Singapore~~(Melayu)~~ Vietnam~~(Tiếng Việt)~~ Philippines~~(Pilipino)~~

Africa, India and Middle East: United Arab Emirates~~(العربية)~~ Iran~~(فارسی)~~ Tajikistan~~(فارسی)~~ India~~(हिंदी)~~ Madagascar~~(malaɡasʲ)~~

South America / Oceania: New Zealand~~(Maori)~~ Brazil~~(Português)~~ Angola~~(Português)~~ Mozambique~~(Português)~~

North America: United States~~(English)~~ Canada~~(English)~~ Haiti~~(Ayiti)~~ Mexico~~(español)~~

Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~XC6SLX45T-2CSG324C~~

Image may be representation.
See specifications for product details.

~~Favorite~~

EXPRESS OPTION

Payment method

XC6SLX45T-2CSG324C - AMD

Name: AMD XC6SLX45T-2CSG324C
Brand: AMD
SKU: XC6SLX45T-2CSG324C
Price: 35.94 USD
Availability: InStock
Rating: 5 (8 reviews)

Manufacturer Part Number: XC6SLX45T-2CSG324C

Manufacturer: AMD Xilinx

Allelco Part Number: 32D-XC6SLX45T-2CSG324C

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 12,127 pcs available, New & Original

Parts Description: IC FPGA 190 I/O 324CSBGA

Package: 324-CSPBGA (15x15)

Data sheet: XC6SLX45T-2CSG3.pdf

Environmental Information
Xilinx REACH211 Cert.pdf

RoHs Status: ROHS3 Compliant

~~Compare~~

Our certification

In stock: 12127

Unit Price: $37.50
Subtotal: $0.00

Want a better price?
Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity	Unit Price	Ext. Price
1+	$37.50	$37.50
30+	$35.94	$1,078.20

The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

XC6SLX45T-2CSG324C Tech Specifications
AMD - XC6SLX45T-2CSG324C technical specifications, attributes, parameters and parts with similar specifications to AMD - XC6SLX45T-2CSG324C

Product Attribute	Attribute Value
Manufacturer	AMD Xilinx
Voltage - Supply	1.14V ~ 1.26V
Total RAM Bits	2138112
Supplier Device Package	324-CSPBGA (15x15)
Series	Spartan®-6 LXT
Package / Case	324-LFBGA, CSPBGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 85°C (TJ)
Number of Logic Elements/Cells	43661
Number of LABs/CLBs	3411
Number of I/O	190
Mounting Type	Surface Mount
Base Product Number	XC6SLX45

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991D
HTSUS	8542.39.0001

Parts Introduction

XC6SLX45T-2CSG324C (1)

Manufacturer Part Number

XC6SLX45T-2CSG324C

Manufacturer

Xilinx

Introduction

The XC6SLX45T-2CSG324C is a Spartan-6 LXT FPGA from Xilinx for embedded applications.

Product Features and Performance

FPGA from the Spartan-6 LXT Series

High performance with a logic cell count of 43,661

Integrated RAM of 2,138,112 total bit

Supports 190 I/O pins for versatile interfacing

Supports supply voltages between 1.14V and 1.26V

Product Advantages

Optimized for logic and DSP applications

Low power consumption

High-speed serial connectivity with advanced power management

Proven Spartan-6 family reliability

Key Technical Parameters

Number of LABs/CLBs: 3411

Total RAM Bits: 2138112

Number of I/O: 190

Voltage Supply: 1.14V ~ 1.26V

Operating Temperature: 0°C ~ 85°C

Quality and Safety Features

Stringent quality control measures

Compliant with pertinent industry safety standards

Compatibility

Suited for use in most embedded FPGA platforms

Compatible with various development tools and software from Xilinx

Application Areas

Ideal for a range of applications including communications, automotive, consumer electronics, and industrial

Product Lifecycle

Currently active with no reported discontinuation

Options for future upgrades and replacement parts available

Reasons to Choose This Product

High-density logic cells for complex designs

Scalable and power-efficient architecture for various applications

Wide operating temperature range suitable for harsh environments

Reliable manufacturer with extensive support and resources

Versatile I/O capabilities catering to high-performance interfaces

Frequently Asked Questions(FAQ)

How does the XC6SLX45T-2CSG324C compare to other Spartan-6 LXT FPGAs in terms of logic capacity and power efficiency for mid-range digital signal processing applications?: The XC6SLX45T-2CSG324C offers 43,661 logic elements and 3,411 LABs within the Spartan-6 LXT family, making it suitable for moderately complex designs such as multi-channel filtering or protocol bridging. Compared to lower-density variants like the XC6SLX16 or XC6SLX25, it provides significantly higher logic resources without requiring a transition to higher-power families such as Kintex-7. Its 1.2V core voltage enables better power efficiency than older-generation FPGAs, though not as low as modern ultra-low-power devices. For DSP-intensive tasks requiring more than 20,000 logic cells but less than 50,000, this device strikes a balance between performance per watt and available fabric.

What is the recommended thermal design approach when integrating the XC6SLX45T-2CSG324C into a compact embedded system with limited airflow?: Given its 324-ball CSPBGA package (15x15 mm), the XC6SLX45T-2CSG324C requires careful PCB layout and thermal management due to high pin density and concentrated power dissipation. With an operating temperature range of 0°C to 85°C junction temperature and typical static power consumption around 0.5–1.2W depending on configuration, passive cooling may suffice in sealed enclosures with adequate copper pour and thermal vias under the package. However, dynamic power can increase significantly during high-switching activity; designers should implement clock gating and I/O control strategies to reduce switching noise and heat generation. A minimum 2-oz copper ground plane beneath the component is strongly advised.

Can the XC6SLX45T-2CSG324C reliably drive legacy 3.3V LVTTL peripherals directly from its 1.2V I/O banks, and what precautions are necessary?: No, the XC6SLX45T-2CSG324C operates at 1.2V nominal core voltage with I/O standards typically supporting 1.8V or lower. Direct connection to 3.3V LVTTL signals risks damaging the FPGA. Instead, level shifting using dedicated transceivers (e.g., TXS series) or discrete MOSFET-based shifters is required. Alternatively, some Spartan-6 packages support selectable I/O voltages via VCCO pins—verify that selected banks are configured for 3.3V operation if supported. Always consult the Spartan-6 SelectIO User Guide and ensure signal integrity across voltage domains with proper termination and decoupling.

In what scenarios would choosing the XC6SLX45T-2CSG324C over an ASIC be justified despite higher unit cost and longer development time?: The XC6SLX45T-2CSG324C becomes advantageous when time-to-market, design flexibility, or low-to-mid volume production (<10k units) favors reconfigurable logic over custom silicon. Applications benefiting include prototyping ASIC functionality, systems requiring field updates (OTA firmware patches), or products with evolving standards where hardware adaptability reduces obsolescence risk. Its 190 general-purpose I/O and integrated block RAM (2.1 Mbits) enable rapid implementation of communication interfaces, state machines, and memory controllers without external components, accelerating development cycles compared to full ASIC tape-out.

How does the XC6SLX45T-2CSG324C handle configuration security, and what mechanisms exist to protect bitstreams from unauthorized access or reverse engineering?: The Spartan-6 LXT architecture supports AES-128 encryption for configuration bitstreams when programmed via JTAG or SPI interface using a trusted source. The XC6SLX45T-2CSG324C includes a built-in AES engine and supports one-time programmable (OTP) fuses for key storage. Designers must generate encrypted .bit files using Xilinx iMPACT or Vivado, then load them through a secure host processor or dedicated configuration controller. Note that while this protects against casual interception, physical probing of configuration pins or side-channel attacks remain possible; additional system-level obfuscation may be needed for high-security environments.

What impact does the Moisture Sensitivity Level 3 (MSL 3) have on handling and storage requirements for bulk shipments of XC6SLX45T-2CSG324C devices?: As an MSL 3 component with a floor life of 168 hours, the XC6SLX45T-2CSG324C must be stored in dry ambient conditions (below 60% RH) after opening moisture-barrier packaging. After desoldering or prolonged exposure, devices require baking at 125°C for 24 hours before rework to prevent popcorning during reflow. This applies especially in lead-free assembly processes exceeding peak temperatures above 240°C. Distributors and contract manufacturers should maintain controlled storage environments and track bake cycles to ensure reliability—failure to comply can void warranty and compromise solder joint integrity.

When implementing DDR2 memory interfaces with the XC6SLX45T-2CSG324C, which constraints must be considered regarding timing closure and routing complexity?: The XC6SLX45T-2CSG324C supports DDR2 up to 400 Mbps per pin using its high-speed SelectIO banks, but achieving reliable operation demands strict adherence to Xilinx’s Memory Interface Generator (MIG) guidelines. Key constraints include length matching (±50 mils for address/control lines), impedance-controlled routing (typically 50Ω single-ended), and placement near global clock buffers. Due to limited global clock networks in the CSG324 package, designers often use regional clocks and careful phase alignment to meet setup/hold margins. Failure to meet these constraints results in increased bit error rates and system instability.

How should power sequencing be managed when booting systems containing the XC6SLX45T-2CSG324C alongside other mixed-voltage components?: Although the core operates at 1.2V (±5%), the XC6SLX45T-2CSG324C supports multiple VCCO rails (up to six independent I/O banks). Power sequencing generally follows “core before I/O” convention to avoid latch-up, but specific requirements depend on peripheral ICs connected to each bank. For example, connecting to DDR2 memory may require simultaneous assertion of both FPGA VCCO and DRAM supply rails. Always verify absolute maximum ratings in the datasheet and consider using PMBus-enabled power managers capable of tracking multiple voltage rails with configurable delays and monitoring.

What role does the Base Product Number XC6SLX45 play in cross-referencing parts across different package configurations, and how does it affect inventory planning?: The XC6SLX45 base number identifies all derivatives sharing the same die size and functional capabilities, differing only in package type, speed grade, and I/O count. For instance, the XC6SLX45T-2CSG324C shares the same underlying silicon as the XC6SLX45-2FG484 or XC6SLX45-2CPG236C, enabling consistent RTL compatibility. However, thermal, electrical, and routing characteristics vary significantly by footprint. Inventory planners must track base part numbers to forecast demand but differentiate by package-specific lead times and pricing tiers—especially important for high-pin-count variants like the CSPBGA used here.

Why might a designer choose the XC6SLX45T-2CSG324C over a Cyclone IV or Artix-7 equivalent for industrial automation applications requiring extended temperature operation?: While newer FPGAs like the Artix-7 offer superior power efficiency and higher logic density, the XC6SLX45T-2CSG324C remains viable in cost-sensitive industrial designs where moderate performance suffices and existing toolchain familiarity reduces risk. Its 0°C to 85°C commercial-grade rating aligns with many factory-floor controllers, and proven reliability in automotive-grade derivatives (e.g., -40°C to +100°C versions) provides confidence in long-term operation. Additionally, legacy IP cores and reference designs optimized for Spartan-6 may accelerate deployment without sacrificing robustness.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC6SLX45T-2CSG324C

Product Attribute
Part Number	XC6SLX45T-2CSG324I	XC6SLX45T-2CSG484C	XC6SLX45T-2CSG484I	XC6SLX45T-2FG484C
Manufacturer	AMD	AMD	AMD	AMD
Number of Logic Elements/Cells	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Number of LABs/CLBs	-	-	-	-
Voltage - Supply	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Total RAM Bits	-	-	-	-
Number of I/O	-	-	-	-
Series	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)

XC6SLX45T-2CSG324C Datasheet PDF

Download XC6SLX45T-2CSG324C pdf datasheets and AMD documentation for XC6SLX45T-2CSG324C - AMD.

Environmental Information: Xilinx REACH211 Cert.pdf

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

Write a Review

Your Email address will not be published.

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

Use your express account for shipment if you have one.
Use our account for the shipment. Refer to the table below for the approximate charges.

(Different time frame / countries / package size has different price.)

Delivery Method

Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

QC (Quality Warranty)
Payment Support
Packaging
Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.

Strict quality inspection builds a solid foundation for electronic component quality.

Visual inspection
Performance testing and reliability verification
Standardized full-process testing
Precise control of every parameter

We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

Quality Inspection

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner

Efficient Supply Management
Cost-Saving Procurement
Fast Sourcing & Delivery

Contact us if you have any questions.

Phone: +00852 9146 4856
Email: info@allelco.com

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.

ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification

ISO 9001: 2015
ISO 13485: 2016
ISO 14001: 2015
ISO 28000: 2007
ISO 45001: 2018
GB/T 27922-2011

SMTA
IPC
ESD
PSMA