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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~XC6SLX9-3TQG144C~~

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XC6SLX9-3TQG144C - AMD

Name: AMD XC6SLX9-3TQG144C
Brand: AMD
SKU: XC6SLX9-3TQG144C
Price: 15.68 USD
Availability: InStock
Rating: 5 (3 reviews)

Manufacturer Part Number: XC6SLX9-3TQG144C

Manufacturer: AMD Xilinx

Allelco Part Number: 32D-XC6SLX9-3TQG144C

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 7,772 pcs available, New & Original

Parts Description: IC FPGA 102 I/O 144TQFP

Package: 144-TQFP (20x20)

Data sheet: XC6SLX9-3TQG144.pdf

Environmental Information
Xilinx REACH211 Cert.pdf

RoHs Status: ROHS3 Compliant

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Unit Price: $16.38
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Quantity	Unit Price	Ext. Price
1+	$16.38	$16.38
30+	$15.68	$470.40

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Specifications

XC6SLX9-3TQG144C Tech Specifications
AMD - XC6SLX9-3TQG144C technical specifications, attributes, parameters and parts with similar specifications to AMD - XC6SLX9-3TQG144C

Product Attribute	Attribute Value
Manufacturer	AMD Xilinx
Voltage - Supply	1.14V ~ 1.26V
Total RAM Bits	589824
Supplier Device Package	144-TQFP (20x20)
Series	Spartan®-6 LX
Package / Case	144-LQFP
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 85°C (TJ)
Number of Logic Elements/Cells	9152
Number of LABs/CLBs	715
Number of I/O	102
Mounting Type	Surface Mount
Base Product Number	XC6SLX9

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.39.0001

Parts Introduction

XC6SLX9-3TQG144C (1)

Manufacturer Part Number

XC6SLX9-3TQG144C

Manufacturer

Xilinx

Introduction

The XC6SLX9-3TQG144C is part of the Spartan-6 LX family of FPGAs offering an optimal blend of low cost, low power and high performance.

Product Features and Performance

715 Logic Array Blocks/Configurable Logic Blocks (LABs/CLBs)

9152 Logic Elements/Cells

589,824 Total RAM Bits

102 Input/Output Ports (I/Os)

14V to 1.26V Core Voltage Supply

Surface Mount Technology for PCB integration

Operates reliably over a 0°C to 85°C temperature range

144-pin Low-profile Quad Flat Package (LQFP)

Spartan-6 LX Series optimized for cost-sensitive applications

Product Advantages

High logic density for complex logic integration

Low power consumption suitable for battery-powered devices

Advanced memory structures for efficient data management

Balance of performance and power suitable for a wide range of applications

Broad I/O support enhancing interface capability

Key Technical Parameters

LABs/CLBs: 715

Logic Elements/Cells: 9152

Total RAM Bits: 589824

Number of I/O: 102

Supply Voltage Range: 1.14V ~ 1.26V

Operating Temperature: 0°C ~ 85°C

Quality and Safety Features

Extensively tested for operational integrity across temperature ranges

Design conforms to industry standards for safety and reliability

Compatibility

Compatible with standard surface mount technology processes

Broad EDA tool support for design and development purposes

Application Areas

Consumer Electronics

Automotive infotainment systems

Communications infrastructure

Industrial automation systems

Low-power wireless connectivity

Portable medical devices

Product Lifecycle

Product status: Active

No immediate risk of discontinuation reported

Replacement parts or upgrades available as newer FPGA generations evolve

Several Key Reasons to Choose This Product

Highly customizable FPGA for diverse application needs

Good price-performance ratio for budget-sensitive projects

Extensive support from Xilinx ecosystem, including software tools and community forums

Robust package design for a wide range of industrial and commercial applications

Ease of programming and integration reduces time to market for new devices and systems

Frequently Asked Questions(FAQ)

How does the power consumption of the XC6SLX9-3TQG144C compare to other FPGA devices in the Spartan-6 LX family, and what design considerations should influence selection for low-power applications?: The XC6SLX9-3TQG144C operates at a core voltage between 1.14V and 1.26V, which is consistent across the Spartan-6 LX series and reflects AMD’s focus on balancing performance with power efficiency. While absolute power consumption varies based on logic utilization and I/O activity, this device typically consumes under 500 mW under typical load conditions when fully configured. Compared to higher-density variants such as the XC6SLX16 or XC6SLX25, the XC6SLX9-3TQG144C offers reduced resource count and lower dynamic power due to fewer logic elements—9,152 LEs versus up to 21,760 in larger models. Designers targeting battery-powered or thermally constrained systems may prefer this part for its smaller footprint and moderate resource density, though clock gating and I/O switching rate remain key determinants of actual power draw.

What are the implications of using the XC6SLX9-3TQG144C in a high-speed digital signal processing application, particularly regarding internal routing congestion and timing closure?: With 102 general-purpose I/O pins and 9,152 logic elements organized into 715 LABs, the XC6SLX9-3TQG144C provides sufficient resources for many DSP tasks, including basic FIR filtering and simple FFT implementations. However, high-speed DSP workloads that require extensive multiplier chains or parallel data paths may encounter routing delays due to limited interconnect bandwidth and LAB-to-LAB propagation times of approximately 1.8 ns. Timing closure becomes challenging beyond 150 MHz in complex designs without careful floorplanning. The device supports up to 480 Mbps transceivers in select packages, but the TQG144C lacks hard transceivers, relying solely on soft logic for high-speed serial protocols. Therefore, while suitable for moderate-rate applications, designers must validate critical paths early using static timing analysis in ISE or Vivado.

In what scenarios would the XC6SLX9-3TQG144C be preferable over the XC6SLX45-3FTG256C despite having fewer logic elements, and vice versa?: The XC6SLX9-3TQG144C may be favored over the XC6SLX45-3FTG256C when pin count and package size are critical constraints, as the 144-pin LQFP offers more I/O (102 vs. 192) but in a smaller form factor than the 256-ball fine-pitch BGA. Conversely, if an application requires significantly more embedded memory or DSP slices—such as implementing a deep state machine or large lookup tables—the XC6SLX45-3FTG256C provides greater capacity with 32,256 logic elements and 2,112 Kb of block RAM. For cost-sensitive designs where only minimal programmable logic is needed—like glue logic or interface bridging—the XC6SLX9-3TQG144C delivers adequate functionality with lower unit cost and easier board integration.

How does the operating temperature range of the XC6SLX9-3TQG144C impact reliability in industrial environments, and are there any layout or thermal management recommendations?: The XC6SLX9-3TQG144C is rated for commercial operation from 0°C to 85°C junction temperature, making it suitable for most industrial control systems but limiting use in harsh outdoor or automotive environments without additional cooling. Junction-to-ambient thermal resistance depends heavily on PCB copper area and airflow; typical designs dissipate less than 2 W, so passive cooling suffices in well-designed layouts. To ensure reliability, designers should allocate sufficient ground and power plane copper around the 144-TQFP package, avoid placing heat-generating components directly adjacent, and verify that local ambient temperatures do not exceed 70°C under full load. Thermal simulation tools like Xilinx Power Estimator (XPE) can help estimate die temperature based on activity factors and switching frequencies.

Can the XC6SLX9-3TQG144C support multiple voltage domains, and how should power sequencing be managed during system startup?: Yes, the XC6SLX9-3TQG144C can operate with multiple supply rails, including core (1.2V), VCCO banks configurable from 1.2V to 3.3V, and optional auxiliary voltages for I/O standards like LVCMOS or LVDS. Power sequencing must adhere to AMD guidelines: core power (VCCINT) should ramp before I/O supplies (VCCO), and all rails must reach stable levels before configuration begins. Failure to comply risks latch-up or improper initialization. Using POR (Power-On Reset) circuits and monitoring ICs ensures clean transitions. Additionally, decoupling capacitors—typically 10 µF bulk and 0.1 µF ceramic per power pin—are essential near each VCC pin to maintain transient response during high-frequency switching.

What configuration method is recommended for the XC6SLX9-3TQG144C, and how does this affect development time and production programming?: The XC6SLX9-3TQG144C supports master serial configuration via SPI flash memory, which is ideal for production deployments due to its simplicity and reliability. This method eliminates external configuration devices and reduces BOM cost compared to JTAG-based loading. During development, however, JTAG remains the fastest path for iterative debugging and partial reconfiguration. Once functional, the FPGA can self-initialize from an onboard SPI-compatible flash (e.g., Micron N25Q series), enabling hot-swap capability and secure boot features. Designers should account for the ~1–2 second configuration time when estimating system startup latency.

How does the number of available I/O pins (102) in the XC6SLX9-3TQG144C constrain system design, especially when interfacing with multiple high-speed peripherals?: With 102 general-purpose I/Os, the XC6SLX9-3TQG144C can accommodate most medium-complexity systems, including USB, Ethernet MAC, SPI, I²C, and parallel interfaces. However, simultaneous use of multiple high-bandwidth interfaces—such as dual-SPI flash, HDMI, and SDIO—may exhaust available pins without multiplexing or shared buses. Bank partitioning allows flexible VCCO assignments, enabling mixed-voltage support, but each bank has dedicated I/O limits (~33 pins per 3.3V bank). Designers must perform pin planning early, considering future expansion, and may need to prioritize signals or adopt serial protocols to conserve pins. Pin planning tools in Vivado help visualize constraints and optimize placement.

Is the XC6SLX9-3TQG144C compatible with modern FPGA development flows, and what toolchain versions are required for synthesis and implementation?: The XC6SLX9-3TQG144C is supported by AMD’s current development ecosystem through Vivado WebPACK or ISE Design Suite, depending on license level. While ISE remains functional for existing projects, new designs benefit from Vivado’s improved timing analysis and IP integration. Minimum supported versions include ISE 14.7 or Vivado 2020.2 for full compatibility. Migration to newer toolchains enables access to advanced features like partial reconfiguration and improved power estimation. Designers should also update constraint files (.ucf or .xdc) to reflect updated pin mappings and timing requirements, as older scripts may not align with revised device behavior.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC6SLX9-3TQG144C

Product Attribute
Part Number	XC6SLX9-3TQG144I	XC6SLX9-3CSG324C	XC6SLX9-3FTG256C	XC6SLX9-3FT256C
Manufacturer	AMD	AMD	AMD	Xilinx
Total RAM Bits	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Number of Logic Elements/Cells	-	-	-	-
Number of LABs/CLBs	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Series	-	-	-	-
Number of I/O	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Voltage - Supply	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad

XC6SLX9-3TQG144C Datasheet PDF

Download XC6SLX9-3TQG144C pdf datasheets and AMD documentation for XC6SLX9-3TQG144C - AMD.

Environmental Information: Xilinx REACH211 Cert.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
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