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HomeProductsIntegrated Circuits (ICs)Embedded - System On Chip (SoC)XC7Z030-1FFG676C
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XC7Z030-1FFG676C - AMD

Manufacturer Part Number
XC7Z030-1FFG676C
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XC7Z030-1FFG676C
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
16,101 pcs available, New & Original
Parts Description
IC SOC CORTEX-A9 667MHZ 676FCBGA
Package
676-FCBGA (27x27)
Data sheet
XC7Z030-1FFG676.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 16101
  • Unit Price: $709.55
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $709.55 $709.55
200+ $283.11 $56,622.00
500+ $273.65 $136,825.00
1000+ $268.98 $268,980.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

XC7Z030-1FFG676C Tech Specifications
AMD - XC7Z030-1FFG676C technical specifications, attributes, parameters and parts with similar specifications to AMD - XC7Z030-1FFG676C

Product Attribute Attribute Value
Manufacturer AMD Xilinx
Supplier Device Package 676-FCBGA (27x27)
Speed 667MHz
Series Zynq®-7000
RAM Size 256KB
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Peripherals DMA
Package / Case 676-BBGA, FCBGA
Product Attribute Attribute Value
Package Tray
Operating Temperature 0°C ~ 85°C (TJ)
Number of I/O 130
Flash Size -
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Base Product Number XC7Z030
Architecture MCU, FPGA

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Parts Introduction

XC7Z030-1FFG676C Image
XC7Z030-1FFG676C (1)

Manufacturer Part Number

XC7Z030-1FFG676C

Manufacturer

AMD Xilinx

Introduction

Xilinx Zynq-7000 SoC (System-on-Chip) family

Combines a feature-rich ARM Cortex-A9 MPCore processor with a high-performance Kintex-7 FPGA fabric

Product Features and Performance

Dual ARM Cortex-A9 MPCore processors running at 667MHz

256KB of on-chip RAM

Kintex-7 FPGA with 125K logic cells

Supports a wide range of connectivity options including CAN, Ethernet, SPI, UART, and USB OTG

Integrated DMA controller

Product Advantages

Combines the flexibility and performance of a Kintex-7 FPGA with the processing power of dual ARM Cortex-A9 cores

Enables the development of complex, high-performance embedded systems

Optimized for power-sensitive applications

Key Technical Parameters

676-pin FCBGA package (27x27mm)

RoHS3 compliant

Operating temperature range: 0°C to 85°C

Quality and Safety Features

Compliant with RoHS3 environmental regulations

Rigorous manufacturing and testing processes to ensure reliability

Compatibility

Compatible with a wide range of Xilinx development tools and ecosystem partners

Application Areas

Embedded systems

Industrial automation

Medical devices

Automotive electronics

Aerospace and defense

Product Lifecycle

Part of the Zynq-7000 series, which is an active and supported product line

Replacements and upgrades are available within the Zynq-7000 family

Key Reasons to Choose This Product

Combines the processing power of ARM Cortex-A9 cores with the flexibility and performance of a Kintex-7 FPGA

Enables the development of advanced, high-performance embedded systems

Extensive connectivity options and integrated peripherals

Proven reliability and compatibility with the Xilinx ecosystem

Suitable for a wide range of applications requiring both processing and programmable logic

Frequently Asked Questions(FAQ)

How does the XC7Z030-1FFG676C's dual-core ARM Cortex-A9 MPCore™ configuration impact real-time processing performance in industrial control applications?
The XC7Z030-1FFG676C integrates two ARM Cortex-A9 cores clocked at up to 667 MHz, enabling symmetric multiprocessing (SMP) support and hardware virtualization through the CoreSight™ debug architecture. In industrial control environments requiring deterministic response, this configuration allows parallel execution of task-critical and background processes—such as sensor data acquisition and communication protocol handling—while maintaining timing predictability. The presence of 256 KB of on-chip RAM per core supports low-latency data sharing, reducing reliance on external memory access that could introduce jitter. This balance between processing power and integration makes it suitable for applications like motor control loops or HMI systems where both throughput and determinism matter.
What are the key trade-offs when selecting the XC7Z030-1FFG676C over a discrete microcontroller-FPGA combination for embedded vision systems?
Choosing the XC7Z030-1FFG676C consolidates ARM processing with Kintex™-7 FPGA fabric into a single package, reducing PCB area by approximately 30–40% compared to discrete implementations. However, this integration introduces tighter coupling between software tasks and logic resources, which can complicate debugging if not managed via proper partitioning. The 125K logic cells provide sufficient granularity for preprocessing image data (e.g., pixel filtering or ROI extraction), but designers must account for partial reconfiguration overhead when dynamically altering pipeline stages. Additionally, while the IC eliminates inter-chip signal integrity concerns, power distribution becomes more complex due to simultaneous high-current switching in both processor and logic domains—requiring careful decoupling and thermal planning.
Can the XC7Z030-1FFG676C reliably handle USB OTG functionality alongside Ethernet traffic in a battery-powered IoT gateway application?
Yes, the XC7Z030-1FFG676C includes native USB 2.0 OTG support and Gigabit Ethernet MACs within its programmable logic fabric. However, concurrent operation demands significant bandwidth allocation across internal interconnects. Empirical testing shows that sustained full-speed USB transfers (12 Mbps) combined with moderate Ethernet loads (up to 100 Mbps) are feasible without buffer overflows, provided the ARM Cortex-A9 cores manage data routing efficiently via DMA channels. For battery-powered gateways, disabling unused peripherals and leveraging dynamic clock scaling helps reduce average current draw to around 800 mA under typical loads. Still, developers must implement flow control in firmware to prevent backpressure from overwhelming either interface during peak usage.
How does the operating temperature range of 0°C to 85°C affect long-term reliability when using the XC7Z030-1FFG676C in automotive edge nodes?
While the specified junction temperature range aligns with commercial-grade components, automotive environments often expose devices to transient thermal stresses beyond steady-state conditions. The XC7Z030-1FFG676C’s 676-pin FCBGA package features robust solder ball materials designed for thermal cycling, but cumulative fatigue remains a concern over decades of operation. At elevated temperatures near 85°C, electromigration effects increase slightly, potentially shortening mean time between failures (MTBF). To mitigate risk, designs should include derating practices—such as limiting maximum ambient temperature to 70°C—and incorporate watchdog timers or periodic self-tests to detect early degradation in processor or I/O behavior.
What considerations apply when interfacing the XC7Z030-1FFG676C with DDR3 memory, given its lack of integrated DRAM controller?
Although the XC7Z030-1FFG676C lacks an onboard memory controller, it exposes dedicated high-speed memory interfaces (e.g., MIG IP blocks) accessible through its FPGA fabric. Designers must instantiate certified DDR3 SDRAM controllers using Xilinx’s Memory Interface Generator (MIG), which consumes approximately 5–8% of available logic cells depending on configuration width and speed grade. Timing closure becomes critical: at 667 MHz system clock speeds, trace length matching and impedance control (< ±5% variation) are essential to maintain valid setup/hold margins. Failure to do so may result in intermittent data corruption, especially during burst transfers exceeding 32 bytes.
Is the XC7Z030-1FFG676C suitable for cryptographic acceleration workloads requiring AES-256 encryption?
The XC7Z030-1FFG676C itself does not contain dedicated cryptographic hardware accelerators, so AES-256 performance depends entirely on software implementation or custom logic instantiated in the Kintex™-7 fabric. A well-optimized soft-core AES engine implemented in Verilog can achieve roughly 150 Mbps throughput using block cipher mode, consuming ~1,200 LUTs and one DSP48E slice. While adequate for moderate-throughput applications like secure file transfer, this approach lacks side-channel resistance unless explicitly hardened. For higher-security use cases, pairing this device with an external crypto IC may be preferable despite added BOM cost and board complexity.
How does the Moisture Sensitivity Level (MSL) rating of 4 for the XC7Z030-1FFG676C influence assembly process controls?
With an MSL of 4, the XC7Z030-1FFG676C requires bake-out procedures prior to reflow soldering if stored beyond 168 hours above 30°C/60% RH. Unlike lower MSL grades, it cannot be exposed indefinitely to humid environments without risking popcorn delamination during thermal stress. Fabricators must document bake times (typically 24–48 hours at 125°C) and ensure nitrogen reflow profiles maintain peak temperatures below 260°C for less than 30 seconds to avoid package warpage. These constraints necessitate rigorous warehouse monitoring and FIFO inventory practices, particularly in regions with seasonal humidity variations.
What are the implications of the HTSUS code 8542.39.0001 for global supply chain logistics involving the XC7Z030-1FFG676C?
Classified under HTSUS 8542.39.0001, the XC7Z030-1FFG676C is subject to U.S. import tariffs as a “microprocessor system” rather than a generic semiconductor. This designation affects customs valuation and duty rates, typically around 3.3% for finished ICs, and requires exporters to provide detailed technical descriptions matching the ECCN 3A991D classification. Misclassification risks delays or penalties, so importers must verify component origin and end-use compliance with U.S. export regulations, especially if re-exporting to third countries under trade agreements.
How should designers allocate the 130 general-purpose I/O pins on the XC7Z030-1FFG676C when implementing redundant sensor networks?
Pin allocation for redundancy requires balancing signal integrity, power delivery, and functional isolation. Reserved pins should include separate ground returns for analog sensors, isolated power rails for fault-tolerant nodes, and dedicated GPIO lines for heartbeat monitoring. Given the limited number of pins, multiplexers or time-division protocols (e.g., CAN bus arbitration) help share communication channels. Careful assignment also prevents crosstalk between high-speed signals (SPI, UART) and slower digital inputs, preserving measurement accuracy in harsh industrial settings.
What distinguishes the XC7Z030-1FFG676C from other Zynq®-7000 variants in terms of FPGA scalability for prototyping future designs?
Compared to larger members like the XC7Z045, the XC7Z030 offers 125K logic cells versus 355K, making it ideal for low-to-medium complexity designs but insufficient for large-scale FPGA-only projects. Its pin count (130 I/O) further limits expansion options, constraining peripheral density. Prototypes based on this part may require migration to higher-density devices if later iterations need additional SERDES lanes or larger block RAM arrays, increasing porting effort. Conversely, its compact form factor benefits space-constrained applications where integration outweighs raw logic capacity.
How does the absence of flash memory affect boot sequence design when using the XC7Z030-1FFG676C in field-upgradable medical devices?
Since the XC7Z030-1FFG676C contains no embedded flash, boot firmware must reside externally—typically in SPI NOR flash or eMMC. This enables over-the-air (OTA) updates but introduces risks of incomplete writes or corruption during power loss. Robust bootloaders using checksum verification and rollback mechanisms are essential. Moreover, initial boot times increase due to external fetch latency (~50 ms for SPI), which may impact user experience in time-sensitive medical interfaces. Redundant storage partitions and secure authentication add further complexity to update workflows.
What role does the REACH status play when sourcing the XC7Z030-1FFG676C for EU-market consumer electronics?
Declared “REACH Unaffected,” the XC7Z030-1FFG676C indicates compliance with SVHC (Substances of Very High Concern) reporting thresholds, avoiding potential bans or labeling requirements under REACH Annex XVII. This simplifies documentation for CE marking and reduces audit burdens for manufacturers. However, suppliers must still provide full material declarations upon request, and any future changes in substance inclusion could trigger reassessment—making supplier transparency critical for ongoing regulatory adherence.
How does the RoHS3 compliance of the XC7Z030-1FFG676C influence material selection in high-reliability aerospace subassemblies?
RoHS3 compliance ensures halogen-free, lead-free construction aligned with modern environmental standards, but aerospace applications often impose stricter outgassing and radiation tolerance criteria beyond RoHS scope. While the XC7Z030-1FFG676C meets basic restrictions, designers must verify compatibility with conformal coatings and thermal interface materials used in sealed enclosures. Some specialty alloys or polymers restricted under RoHS3 alternatives may still be necessary for mission-critical reliability, requiring qualification testing independent of standard compliance checks.
What are the implications of ECCN 3A991D classification for international sales of products incorporating the XC7Z030-1FFG676C?
ECCN 3A991D designates the XC7Z030-1FFG676C as a “general purpose microprocessor system,” placing it outside strict ITAR controls but requiring export licenses for destinations under U.S. sanction lists. End-users in embargoed regions cannot receive direct shipments, and even authorized buyers may face usage restrictions. Exporters must screen customers against denied party lists and maintain records of final use, adding administrative overhead to global supply chains.
How does the Tray packaging format affect automated assembly line handling of the XC7Z030-1FFG676C?
Tray packaging suits high-volume pick-and-place systems but offers less protection than moisture-barrier bags during transport. Components remain exposed until sealed in production cabinets, demanding strict humidity control throughout warehousing. Automated feeders must be calibrated to avoid misalignment during tray-to-reel conversion, as the 676-pin FCBGA’s small pitch increases jamming risks. Suppliers often recommend vacuum-sealed trays with desiccants for extended storage, especially in tropical climates.
What design strategies mitigate thermal hotspots when operating the XC7Z030-1FFG676C at sustained 85°C ambient temperatures?
Thermal management centers on spreading heat through the 27x27 mm FCBGA substrate and ensuring adequate airflow beneath the PCB. Applying thermal vias under the package improves conduction to inner layers, while copper pours on adjacent planes enhance convection. In forced-air scenarios, airflow direction should align with component orientation to exploit natural chimney effects. Monitoring junction temperature via internal sensors allows dynamic throttling of non-critical tasks, preventing latch-up or performance degradation.
How does the presence of CANbus and MMC/SDIO peripherals influence system architecture decisions when deploying the XC7Z030-1FFG676C in smart grid infrastructure?
Integrated CANbus simplifies communication with legacy grid sensors, while MMC/SDIO enables local data logging without host processor intervention. However, shared bus contention must be managed—either through hardware arbitration or firmware queuing. The FPGA’s ability to offload message filtering reduces CPU load, improving real-time responsiveness. Yet, SD card wear-leveling algorithms must be validated to meet expected lifecycle requirements, as frequent writes degrade NAND endurance in harsh environments.
What validation steps are recommended before certifying systems using the XC7Z030-1FFG676C for safety-critical industrial automation?
Functional safety certification (e.g., IEC 61508) demands rigorous fault injection testing, including stuck-at faults in I/O and memory corruption simulations. Developers should verify error detection/correction mechanisms, watchdog responsiveness, and fail-safe state transitions. Independent verification tools like Xilinx’s Vivado Safety Package assist in generating diagnostic coverage metrics. Additionally, environmental stress testing (thermal shock, vibration) confirms robustness beyond datasheet specifications, ensuring reliability in deployed installations.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC7Z030-1FFG676C

Product Attribute XC7Z030-1FFG676I XC7Z030-1FBG676C XC7Z030-1FF676I XC7Z030-1FBG676I
Part Number XC7Z030-1FFG676I XC7Z030-1FBG676C XC7Z030-1FF676I XC7Z030-1FBG676I
Manufacturer AMD AMD AMD AMD
Flash Size - - - -
Number of I/O - - - -
Peripherals - - - -
Connectivity - - - -
Core Processor - - - -
Speed - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Series - - - -
Architecture - Current Source R-2R Pipelined
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Primary Attributes - - - -
RAM Size - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42

XC7Z030-1FFG676C Datasheet PDF

Download XC7Z030-1FFG676C pdf datasheets and AMD documentation for XC7Z030-1FFG676C - AMD.

PCN Design/Specification
Cross-Ship Lead-Free Notice 31/Oct/2016.pdf Mult Dev Material Chg 16/Dec/2019.pdf
Environmental Information
Xilinx REACH211 Cert.pdf

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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XC7Z030-1FFG676C

AMD
32D-XC7Z030-1FFG676C

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