Manufacturer Part Number
XCKU3P-1SFVB784E
Manufacturer
Xilinx
Introduction
The XCKU3P-1SFVB784E is an FPGA from Xilinx’s Kintex® UltraScale+™ series, designed for next-generation FPGA applications, providing a perfect blend of power, performance, and functionality.
Product Features and Performance
Embedded FPGA (Field Programmable Gate Array) technology
Surface mount 784-BFBGA, FCBGA package
Supports operating temperatures from 0°C to 100°C
Power supply voltage range of 0.825V ~ 0.876V
Features 20340 LABs/CLBs and 355950 logic elements/cells
Contains 31641600 total RAM bits
Includes 304 input/output ports
Product Advantages
High logic density and increased functionality
Efficient power management for improved power consumption
Robust thermal and electrical performance in demanding environments
Key Technical Parameters
Number of LABs/CLBs: 20340
Number of Logic Elements/Cells: 355950
Total RAM Bits: 31641600
Number of I/O: 304
Voltage Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C
Quality and Safety Features
Built to operate reliably under a wide range of environmental conditions
Ensures stable performance from 0°C up to 100°C
Compatibility
Compatible with a variety of electronic assembly processes due to its surface mount package
Versatile I/O interface for extensive compatibility with peripheral devices
Application Areas
Ideal for high-performance computing, networking, and telecommunications applications
Suitable for use in aerospace, defense, and industrial markets
Product Lifecycle
Currently active with ongoing support and production
Not nearing discontinuation, and upgrading options are available as part of the Kintex® UltraScale+™ series
Several Key Reasons to Choose This Product
Supports high-density logic applications and complex algorithm implementations
Optimal power efficiency which lowers operational costs
Adaptable to a wide range of industrial and technological applications
Reliable operation and extended product lifecycle support from Xilinx
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