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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XCS10XL-4VQG100C
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XCS10XL-4VQG100C - AMD

Manufacturer Part Number
XCS10XL-4VQG100C
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XCS10XL-4VQG100C
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
15,740 pcs available, New & Original
Parts Description
IC FPGA 77 I/O 100VQFP
Package
100-VQFP (14x14)
Data sheet
XCS10XL-4VQG100.pdf

Environmental Information

Xilinx REACH211 Cert.pdf
RoHs Status
 
Our certification
In stock: 15740

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Specifications

XCS10XL-4VQG100C Tech Specifications
AMD - XCS10XL-4VQG100C technical specifications, attributes, parameters and parts with similar specifications to AMD - XCS10XL-4VQG100C

Product Attribute Attribute Value
Manufacturer AMD Xilinx
Voltage - Supply 3V ~ 3.6V
Total RAM Bits 6272
Supplier Device Package 100-VQFP (14x14)
Series Spartan®-XL
Package / Case 100-TQFP
Package Tray
Product Attribute Attribute Value
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 466
Number of LABs/CLBs 196
Number of I/O 77
Number of Gates 10000
Mounting Type Surface Mount
Base Product Number XCS10XL

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

XCS10XL-4VQG100C Image
XCS10XL-4VQG100C (1)

Manufacturer Part Number

XCS10XL-4VQG100C

Manufacturer

AMD Xilinx

Introduction

Xilinx Spartan-XL series FPGA (Field Programmable Gate Array)

Designed for embedded systems and applications requiring low cost and low power

Product Features and Performance

10,000 gate FPGA

466 logic elements/cells

6,272 total RAM bits

196 LABs/CLBs (Logic Array Blocks/Configurable Logic Blocks)

77 I/O pins

Operating temperature range: 0°C to 85°C

Supply voltage: 3V to 3.6V

Product Advantages

Low cost and low power solution for embedded applications

Flexible and reconfigurable logic for custom hardware design

Suitable for a wide range of applications due to its versatile feature set

Key Technical Parameters

Package: 100-VQFP (14x14)

Mounting Type: Surface Mount

Series: Spartan-XL

Quality and Safety Features

Xilinx quality and reliability standards

Compatibility

Designed for use in embedded systems and applications

Application Areas

Suitable for a wide range of embedded applications, such as industrial automation, consumer electronics, and communications equipment

Product Lifecycle

This is an active product, with no plans for discontinuation

Upgrades and replacements may be available in the Xilinx Spartan series

Several Key Reasons to Choose This Product

Low cost and power efficient solution for embedded applications

Flexible and reconfigurable FPGA architecture for custom hardware design

Xilinx quality and reliability standards

Suitable for a wide range of embedded applications

Frequently Asked Questions(FAQ)

How does the XCS10XL-4VQG100C's logic element count compare to other Spartan®-XL FPGAs in terms of resource utilization for moderate-complexity digital designs?
The XCS10XL-4VQG100C provides 466 logic elements and 196 LABs, which aligns with entry-level Spartan®-XL devices optimized for small to medium state machines or glue logic. This makes it suitable for applications requiring fewer than 5,000 gates, such as protocol bridging or control interfaces, but less appropriate for larger algorithmic processing compared to higher-density Spartan-II or Spartan-III variants.
What is the typical power consumption profile of the XCS10XL-4VQG100C during active configuration, and how does it affect thermal design in embedded systems?
Operating at 3.3V supply with a maximum junction temperature of 85°C, the XCS10XL-4VQG100C typically draws tens of milliamps under normal operation—approximately 10–30 mA depending on I/O activity and internal switching. In compact embedded designs using this FPGA, passive cooling suffices, but PCB layout should ensure adequate trace width and decoupling near VCCINT to maintain stable voltage rails.
Can the XCS10XL-4VQG100C be used in industrial environments requiring extended temperature ranges beyond its specified 0°C to 85°C?
No. The device is rated only for commercial temperature operation (0°C to 85°C). For industrial or automotive applications exceeding these limits, alternative FPGA families with wider temperature grades—such as those supporting -40°C to +100°C—should be selected instead.
Is it feasible to implement high-speed serial communication protocols like SPI or I²C using the XCS10XL-4VQG100C given its limited gate count?
Yes, basic versions of SPI and I²C can be efficiently implemented within the XCS10XL-4VQG100C’s 10k-gate capacity, especially when targeting low data rates or simple sensor interfacing. However, complex protocols requiring large buffers or tight timing margins may strain available resources and increase development time.
How many I/O pins are available on the XCS10XL-4VQG100C, and what constraints apply to their assignment in a system design?
The XCS10XL-4VQG100C offers 77 user-configurable I/O pins via its 100-VQFP package. These must comply with bank voltage compatibility; since the part uses 3V LVCMOS signaling, all I/O must interface with 3.3V-compatible devices unless internal level shifting is added, which consumes additional logic resources.
Does the XCS10XL-4VQG100C support partial reconfiguration, and if not, what implications does this have for firmware update strategies?
No, the Spartan®-XL family, including the XCS10XL-4VQG100C, does not support partial reconfiguration. Any configuration change requires full reprogramming, so system designers must account for longer downtime during updates or consider external non-volatile memory with manual refresh cycles.
How does the RAM block allocation in the XCS10XL-4VQG100C compare to modern FPGAs, and what are realistic use cases for its 6,272-bit distributed memory?
With only 6,272 bits of block RAM (equivalent to about 789 bytes), the XCS10XL-4VQG100C lacks dedicated SRAM blocks found in newer devices. Instead, most memory is implemented via distributed RAM using LUTs. This limits deep FIFO implementations or large lookup tables but supports small buffers, shift registers, or truth tables under 1 KB in size.
What is the significance of the Moisture Sensitivity Level 3 designation for the XCS10XL-4VQG100C, and how should it influence assembly planning?
MSL 3 indicates the XCS10XL-4VQG100C must be assembled within 168 hours after opening humidity-controlled packaging. Beyond that, baking may be required to prevent solder joint defects. This necessitates careful inventory turnover and process control in volume manufacturing environments.
Are there any known limitations when using the XCS10XL-4VQG100C in designs requiring multiple clock domains or asynchronous resets?
While the XCS10XL-4VQG100C supports multiple clock domains through standard routing and PLL availability, its relatively modest routing resources mean complex multi-clock topologies risk timing closure failures. Asynchronous resets are discouraged; synchronous reset discipline is strongly recommended due to setup/hold timing constraints in compact designs.
How does the base product number XCS10XL relate to derivative variants like the -4VQG100C, and what design considerations arise from selecting this specific speed grade?
The XCS10XL-4VQG100C belongs to the XCS10XL base family differentiated by speed grade (-4), package (VQFP), and voltage (V). Speed grade -4 implies a nominal propagation delay suitable for up to ~100 MHz logic paths under typical conditions. Designers must verify actual path delays in their implementation before relying on this figure for critical timing budgets.
What ECCN classification applies to the XCS10XL-4VQG100C, and how might this affect international procurement logistics?
The device carries an ECCN of EAR99, meaning it is not subject to strict export controls under U.S. regulations and can generally be procured globally without special licensing, simplifying supply chain operations across regions.
Can the XCS10XL-4VQG100C drive legacy 5V logic signals directly, and what precautions are necessary?
Directly driving 5V TTL/CMOS inputs from the XCS10XL-4VQG100C is unsafe due to its 3.3V I/O standard. A level-shifting circuit—either discrete transistors or dedicated ICs—is required to protect both the FPGA and connected 5V devices while maintaining signal integrity.
What development tools are officially supported for programming the XCS10XL-4VQG100C, and are third-party alternatives viable?
Xilinx (now AMD) recommends Vivado WebPACK or older ISE Design Suite for synthesis and implementation. Third-party tools like Intel Quartus cannot target this architecture. Using unverified toolchains risks functional failure due to unsupported constraint formats or IP compatibility issues.
How does the pin count and footprint of the XCS10XL-4VQG100C compare to similar-footprint packages, and what mechanical constraints apply?
The 100-pin VQFP (14×14 mm body) offers more I/O than smaller QFPs but less than BGA packages. Its fine-pitch leads (~0.5mm) require precise soldering and careful handling during assembly to avoid damage, especially in automated pick-and-place processes.
Is there a difference between the number of gates and logic elements in the XCS10XL-4VQG100C, and how should engineers interpret each metric?
The “10,000 gates” rating reflects a historical measure from early FPGAs, while “466 logic elements” represents actual programmable fabric units. Engineers should rely on logic elements and LAB counts for accurate resource estimation, as gate counts from older architectures don’t scale predictably across technologies.
What role does the Base Product Number XCS10XL play in long-term supply planning for projects using the XCS10XL-4VQG100C?
The base number XCS10XL identifies a discontinued but still available FPGA line. While currently stocked, future availability isn't guaranteed. Projects requiring sustained production should evaluate newer families like Artix® or Spartan®-3A for better lifecycle support, though migration effort must be weighed against current cost and performance needs.
How does the XCS10XL-4VQG100C handle ESD protection, and what board-level measures are essential during prototyping?
The device includes standard human-body model (HBM) ESD protection diodes on I/O pins, typically rated at 2 kV. However, these are insufficient for harsh environments. External TVS diodes and proper grounding practices are recommended, especially when hot-swapping cables or operating in electrically noisy settings.
What are the implications of the HTSUS code 8542.39.0001 for customs clearance and duty calculations involving the XCS10XL-4VQG100C?
This Harmonized Tariff Schedule code classifies the device as an integrated circuit under semiconductor provisions, usually resulting in minimal import duties in most countries. However, final classification depends on end-use and country-specific rules, so importers should consult local customs authorities to confirm treatment.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XCS10XL-4VQG100C

Product Attribute XCS10XL-4VQ100C XCS10XL-4VQG100I XCS10XL-4VQ100I XCS10XL-5VQ100C
Part Number XCS10XL-4VQ100C XCS10XL-4VQG100I XCS10XL-4VQ100I XCS10XL-5VQ100C
Manufacturer AMD AMD AMD AMD
Series - - - -
Number of LABs/CLBs - - - -
Number of Logic Elements/Cells - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Mounting Type - Surface Mount Through Hole Surface Mount
Number of Gates - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Total RAM Bits - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Voltage - Supply - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Number of I/O - - - -

XCS10XL-4VQG100C Datasheet PDF

Download XCS10XL-4VQG100C pdf datasheets and AMD documentation for XCS10XL-4VQG100C - AMD.

PCN Obsolescence/ EOL
Spartan, XC9500, CoolRunner 26/Oct/2011.pdf
Environmental Information
Xilinx REACH211 Cert.pdf

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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This is achieved through our commitment to the continual improvement of our processes, services, and products.


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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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XCS10XL-4VQG100C Image

XCS10XL-4VQG100C

AMD
32D-XCS10XL-4VQG100C

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