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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XCV200-4PQ240I
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XCV200-4PQ240I - AMD

Manufacturer Part Number
XCV200-4PQ240I
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XCV200-4PQ240I
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
11,530 pcs available, New & Original
Parts Description
IC FPGA 166 I/O 240QFP
Package
240-PQFP (32x32)
Data sheet
XCV200-4PQ240I.pdf

Datasheets

Virtex 2.5 V.pdf

Environmental Information

Xilinx REACH211 Cert.pdf
RoHs Status
 
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Specifications

XCV200-4PQ240I Tech Specifications
AMD - XCV200-4PQ240I technical specifications, attributes, parameters and parts with similar specifications to AMD - XCV200-4PQ240I

Product Attribute Attribute Value
Manufacturer AMD Xilinx
Voltage - Supply 2.375V ~ 2.625V
Total RAM Bits 57344
Supplier Device Package 240-PQFP (32x32)
Series Virtex®
Package / Case 240-BFQFP
Package Tray
Product Attribute Attribute Value
Operating Temperature -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells 5292
Number of LABs/CLBs 1176
Number of I/O 166
Number of Gates 236666
Mounting Type Surface Mount
Base Product Number XCV200

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A001A7B
HTSUS 8542.39.0001

Parts Introduction

Manufacturer Part Number

XCV200-4PQ240I

Manufacturer

Xilinx

Introduction

The XCV200-4PQ240I is a high-performance FPGA from Xilinx's Virtex Series, designed for advanced embedded system applications.

Product Features and Performance

1176 Logic Blocks/Configurable Logic Blocks (LABs/CLBs)

5292 Logic Elements/Cells

57344 Total RAM Bits

166 I/O Pins

236666 Logic Gates

Surface Mount Package

Operating Temperature Range: -40°C ~ 100°C (TJ)

Product Advantages

Robust temperature grade supporting extreme environments

High logic gate count for complex circuit implementations

Adequate memory for intermediate data storage

Key Technical Parameters

Supply Voltage: 2.375V ~ 2.625V

Mounting Type: Surface Mount

Package/Case: 240-BFQFP

Supplier Device Package: 240-PQFP (32x32)

Quality and Safety Features

Stringent operating temperature range ensuring reliability in difficult conditions

Compatibility

Compatible with devices that support the 240-PQFP (32x32) footprint and supply voltages

Application Areas

Ideal for embedded processing, telecommunications, and signal processing

Product Lifecycle

Obsolete status; potential difficulty in procurement

Consider alternatives for new designs to ensure longevity and support

Several Key Reasons to Choose This Product

Wide operating temperature range suitable for industrial-grade applications

Significant logic and I/O capability for complex digital systems

Potential for integration into existing designs with compatible requirements

Part of the well-known Xilinx Virtex Series guaranteeing a level of performance and reliability

Frequently Asked Questions(FAQ)

How does the XCV200-4PQ240I's gate count compare to other Virtex FPGAs, and what implications does this have for logic-intensive applications?
The XCV200-4PQ240I contains 236,666 gates, which places it in the mid-range of the Virtex series. Compared to larger models like the XCV500 (over 600K gates), it offers significantly less logic capacity, making it more suitable for medium-complexity designs rather than large-scale system-on-chip implementations. This gate count supports designs requiring moderate state machine complexity or control logic but may necessitate architectural partitioning when implementing deeply pipelined algorithms or large lookup tables. Designers should consider this limitation when planning resource allocation across multiple clock domains or parallel processing units.
What are the key thermal considerations when using the XCV200-4PQ240I in industrial temperature environments?
Operating across -40°C to 100°C junction temperature range demands careful thermal management due to reduced carrier mobility at lower temperatures and increased leakage current at higher temperatures. At 100°C, static power consumption can increase by 15–20% compared to room temperature operation. Engineers must ensure adequate PCB copper area for heat spreading and consider airflow requirements, as natural convection alone may be insufficient for sustained high-switching activity. Thermal via arrays under the PQFP package help conduct heat to inner layers but require proper pad design to avoid solder joint fatigue during thermal cycling.
Can the XCV200-4PQ240I support DDR memory interfaces without external PHYs, and what timing constraints apply?
While the XCV200-4PQ240I lacks integrated memory controllers, its I/O banks can implement DDR signaling up to 333 Mbps using source-synchronous techniques with IDELAY and IODELAY primitives. However, achieving stable operation requires precise calibration of delay chains and careful routing to maintain setup/hold margins. For DDR2-667 or faster interfaces, external PHY chips become necessary due to voltage swing and timing margin requirements beyond what FPGA internal delays can reliably manage. The 166 I/O pins allow configuration of multiple narrow-bus memories but limit bandwidth compared to dedicated controller solutions.
How does the Moisture Sensitivity Level 3 classification affect storage and handling of the XCV200-4PQ240I before assembly?
With an MSL rating of 3, the XCV200-4PQ240I must be stored in dry ambient conditions (relative humidity <10%) and used within 168 hours after opening the moisture-barrier bag if not baked. Failure to comply risks popcorning during reflow soldering, which could compromise bond wires or cause delamination. Manufacturers typically recommend baking at 125°C for 24 hours prior to assembly if the component has been exposed to ambient humidity beyond the threshold. These precautions are critical given the plastic PQFP package’s susceptibility to moisture absorption over time.
What is the impact of the RoHS non-compliant status on supply chain and regulatory compliance for the XCV200-4PQ240I?
The RoHS exemption indicates lead-containing finishes or materials incompatible with standard lead-free soldering processes, likely due to the BGA substrate or interconnect metallurgy common in older FPGA generations. This affects procurement strategies—especially in EU-regulated markets—where alternative sourcing or customer-specific exemptions may be required. Suppliers often segregate these parts into controlled batches, increasing traceability overhead. Design teams should verify end-use applicability early and communicate requirements to procurement to avoid last-minute redesigns if compliance becomes mandatory.
How many logic elements does one LAB/CLB contain in the XCV200-4PQ240I, and how should this influence HDL coding style?
The XCV200-4PQ240I features 1176 LABs (Logic Array Blocks) distributed across 5292 logic elements, averaging approximately 4.5 LEs per LAB. This architecture favors compact, efficiently packed combinational or small-state-machine blocks. VHDL/Verilog code should minimize wide fan-out nets and avoid unnecessary register duplication, as each LE integrates a flip-flop and LUT. Aggressive optimization settings may collapse logic too aggressively, leading to inefficient use of carry chains; instead, explicit use of DSP48 slices for arithmetic operations aligns better with the target architecture and preserves routing efficiency.
Is the XCV200-4PQ240I suitable for radiation-hardened applications, and what alternatives exist if it is not?
No, the XCV200-4PQ240I is not designed for radiation-tolerant or hardened applications. Single-event upsets (SEUs) can corrupt configuration memory and logic states in space or avionics environments. For such uses, manufacturers offer hardened variants like the RT-FPGA series from Microsemi (formerly Actel), which include error-correction codes (ECC) and triple-modular redundancy (TMR). If transitioning from this part, designers must account for longer qualification cycles, higher unit costs, and potentially reduced performance due to hardening overhead.
What are the advantages of using the 240-PQFP package versus larger QFPs for the XCV200-4PQ240I in space-constrained layouts?
The 32x32 mm 240-pin PQFP strikes a balance between pin density and manufacturability compared to smaller QFPs with fewer pins or larger ones requiring more board real estate. Its gull-wing leads allow reliable automated assembly while maintaining adequate pitch (0.5 mm) for most production lines. However, thermal performance lags behind ceramic packages like FBGA, so high-power designs benefit from additional ground planes and thermal relief stitching. In portable or handheld systems, the footprint size enables integration without excessive layer counts, though signal integrity must be managed carefully due to longer trace lengths on outer layers.
How does the total RAM bit count relate to block RAM usage in typical designs using the XCV200-4PQ240I?
With 57,344 total RAM bits, the XCV200-4PQ240I provides 72 KB of embedded block RAM organized as dual-port BRAMs. Assuming standard 18Kb blocks (common in Virtex architectures), this equates to roughly 32 BRAM blocks. Each can be configured as two 18Kb ports or four 9Kb ports, enabling flexible FIFO, buffer, or small-table implementations. Designers should allocate these resources judiciously—large LUTRAM-based buffers consume logic elements too, whereas block RAM preserves area and power efficiency for data staging tasks like DMA buffers or protocol decoders.
What clocking architecture options are available in the XCV200-4PQ240I, and how do global vs regional clocks differ in performance?
The XCV200-4PQ240I includes multiple dedicated global clock inputs (CLKIN0–CLKIN7), phase-locked loop (PLL) modules, and regional clock networks. Global clocks distribute signals with minimal skew but consume significant routing resources; regional clocks reduce congestion by limiting distribution to specific quadrants but introduce higher skew across regions. PLLs enable frequency synthesis and deskewing of external references, crucial for synchronous protocols like PCIe or Ethernet MACs. Careful placement of clock sources and use of BUFGCE primitives ensures low jitter and deterministic timing closure.
How does the supply voltage tolerance of ±125 mV around 2.5V affect power supply design for the XCV200-4PQ240I?
Tolerating only ±125 mV means the XCV200-4PQ240I requires tightly regulated 2.5V supplies with excellent line and load regulation. Voltage deviations beyond this window may cause functional failures or degraded timing margins. Linear regulators with low dropout (<50 mV) and PSRR >60 dB at 1 MHz are recommended, or switching converters followed by linear post-regulation. Decoupling capacitors must be placed within 5 mm of power pins, using combinations of bulk (10 µF tantalum) and high-frequency ceramics (0.1 µF X7R) to suppress broadband noise from internal switching activity.
What are the limitations of using the XCV200-4PQ240I for high-speed serial communication without external transceivers?
Without external GTH/GTX transceivers, the XCV200-4PQ240I cannot support standards like PCIe Gen2 (>5 GT/s) or Ethernet 10GBASE-R (>10 Gbps). Its LVDS-capable I/O can reach ~650 Mbps point-to-point, sufficient for LVDS video links or SPI-over-LVDS but inadequate for mainstream serial protocols. Implementing SERDES internally requires custom framing logic and suffers from bit-error rates above acceptable thresholds due to lack of equalization and clock recovery circuitry. External transceiver co-processors add cost, power, and board complexity but deliver robust link integrity.
How should engineers evaluate the trade-off between using LUTRAM vs block RAM in projects utilizing the XCV200-4PQ240I?
LUTRAM in the XCV200-4PQ240I consumes logic elements but avoids dedicated BRAM resources, useful for small, irregular memory structures (<512 bits). Block RAM offers higher density, dedicated ports, and lower latency for larger datasets (>1 KB). Since the device has limited BRAM (72 KB total), prioritizing block RAM for frequently accessed data paths conserves LEs and improves timing predictability. Mixing both types requires careful analysis: LUTRAM may fragment logic, worsening routability, while overusing BRAM leaves insufficient resources for control logic.
What documentation is essential when selecting the XCV200-4PQ240I for a new design, and why go beyond the datasheet?
Beyond the datasheet, engineers should consult the Virtex-2 user guide for architecture details, IBIS models for signal integrity simulation, and the FPGA Advantage tools reference manual for optimal implementation strategies. Application notes on power sequencing, configuration schemes (JTAG vs PROM), and thermal derating curves provide context missing from parametric tables. These resources reveal subtle behaviors like configuration flash endurance limits or I/O hysteresis thresholds that directly impact reliability in field deployments.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XCV200-4PQ240I

Product Attribute XCV200-4PQ240C XCV200-4FG256I XCV200-4FG456I XCV200-4FG256C
Part Number XCV200-4PQ240C XCV200-4FG256I XCV200-4FG456I XCV200-4FG256C
Manufacturer AMD AMD AMD AMD
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of Logic Elements/Cells - - - -
Series - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Gates - - - -
Number of I/O - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Voltage - Supply - - - -
Total RAM Bits - - - -
Number of LABs/CLBs - - - -
Mounting Type - Surface Mount Through Hole Surface Mount

XCV200-4PQ240I Datasheet PDF

Download XCV200-4PQ240I pdf datasheets and AMD documentation for XCV200-4PQ240I - AMD.

Datasheets
Virtex 2.5 V.pdf
PCN Obsolescence/ EOL
Spartan,Virtex FPGA/SCD 18/Oct/2010.pdf
Environmental Information
Xilinx REACH211 Cert.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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AMD

XCV200-4PQ240I

AMD
32D-XCV200-4PQ240I

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