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HomeProductsIntegrated Circuits (ICs)Specialized ICsXC5VLX30-3FFG324C
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XC5VLX30-3FFG324C - XILINX

Manufacturer Part Number
XC5VLX30-3FFG324C
Manufacturer
AMD Xilinx
Allelco Part Number
41D-XC5VLX30-3FFG324C
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
10,400 pcs available, New & Original
Parts Description
FCBGA-324(19x19)
Data sheet
-
Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
Our certification
In stock: 10400

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Specifications

XC5VLX30-3FFG324C Tech Specifications
XILINX - XC5VLX30-3FFG324C technical specifications, attributes, parameters and parts with similar specifications to XILINX - XC5VLX30-3FFG324C

Product Attribute Attribute Value
Part Number XC5VLX30-3FFG324C
Package FCBGA-324(19x19)
Description FCBGA-324(19x19)
Stock Condition Get 10400 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer AMD Xilinx
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Parts Introduction

Manufacturer Part Number

XC5VLX30-3FFG324C

Manufacturer

Xilinx

Introduction

The XC5VLX30-3FFG324C is a powerful and versatile Virtex-5 LX FPGA (Field Programmable Gate Array) from Xilinx. This device offers a high-performance, low-power solution for a wide range of embedded applications, including industrial automation, medical imaging, and communication systems.

Product Features and Performance

2,400 Configurable Logic Blocks (CLBs) with 30,720 Logic Cells

1,179,648 Total RAM Bits

220 I/O Pins

Operating Voltage: 0.95V to 1.05V

Operating Temperature: 0°C to 85°C (Junction Temperature)

324-pin BBGA (Ball Grid Array) package

Product Advantages

High performance and power efficiency for demanding embedded applications

Flexible and reconfigurable architecture allows for rapid prototyping and design changes

Extensive on-chip resources, including dedicated DSP and memory blocks, enable complex functionality

Low-power operation for energy-conscious designs

Key Reasons to Choose This Product

Proven Virtex-5 FPGA technology from a trusted industry leader

Optimized for a wide range of embedded applications with high-performance and low-power requirements

Scalable and adaptable solution that can be tailored to specific design needs

Comprehensive development tools and ecosystem support for streamlined design and integration

Quality and Safety Features

Rigorous quality control and testing processes ensure reliable operation

Supports industry-standard safety certifications (e.g., IEC 61508, ISO 26262) for critical applications

Compatibility

The XC5VLX30-3FFG324C is compatible with other Virtex-5 LX FPGA devices, allowing for seamless integration and migration within the Virtex-5 product family.

Application Areas

Industrial automation and control

Medical imaging and diagnostics

Telecommunications and networking equipment

Military and aerospace systems

Scientific and research instrumentation

Product Lifecycle

The XC5VLX30-3FFG324C is an active, currently available product from our website's sales team. There are several equivalent or alternative Virtex-5 LX FPGA models available, such as the XC5VLX30T-3FFG324C and the XC5VLX50-3FFG324C, which offer different resource configurations and performance characteristics. If you have any questions or need assistance in selecting the right Virtex-5 FPGA for your application, please contact our sales team through our website's sales team.

Frequently Asked Questions(FAQ)

What are the key architectural considerations when designing with the XC5VLX30-3FFG324C FPGA in a high-reliability embedded system?
The XC5VLX30-3FFG324C integrates 30,720 logic elements and 2,400 LABs/CLBs within the Virtex-5 LX architecture, which employs a 6-input LUT structure and improved routing efficiency over previous generations. This enables higher logic density per mm², making it suitable for compact embedded designs. However, designers must account for the 0.95V–1.05V core voltage tolerance, requiring tight power supply regulation to avoid timing margin degradation. The 1,179,648 bits of block RAM are organized in 36Kb blocks, supporting efficient memory partitioning for control logic or data buffering, but careful floorplanning is needed to minimize routing congestion given the 324-FCBGA package’s limited escape routing.
How does the I/O count and package type of the XC5VLX30-3FFG324C influence PCB layout complexity in surface-mount designs?
With 220 user I/Os distributed across a 324-ball FCBGA (19x19 mm) package, the XC5VLX30-3FFG324C demands a minimum of four PCB layers with controlled impedance routing for high-speed signals. The fine 1.0 mm ball pitch requires laser-drilled microvias and strict adherence to solder mask-defined pads to prevent bridging. Signal integrity is further challenged by simultaneous switching noise (SSN), especially when multiple I/O banks operate near the 1.05V upper limit. Designers should allocate dedicated ground and power planes adjacent to the BGA and use IBIS models early in the layout phase to validate timing and crosstalk margins.
Can the XC5VLX30-3FFG324C operate reliably in industrial environments with ambient temperatures up to 70°C?
Yes, the XC5VLX30-3FFG324C is rated for a junction temperature (TJ) range of 0°C to 85°C, which allows safe operation in industrial environments where ambient temperatures reach 70°C, provided adequate thermal management is implemented. The FCBGA package has moderate thermal resistance, so a thermal pad connection to the PCB ground plane or use of a heat spreader is recommended under sustained high-load conditions. Dynamic power dissipation must be monitored using XPE (Xilinx Power Estimator), as leakage current increases significantly near the upper temperature limit, potentially pushing TJ beyond safe thresholds without proper derating.
How does the XC5VLX30-3FFG324C compare to the XC5VLX50-3FFG324C in terms of resource utilization and power efficiency for mid-complexity DSP applications?
The XC5VLX30-3FFG324C offers 30,720 logic elements and 1.18 Mbit of block RAM, while the XC5VLX50-3FFG324C provides 51,840 logic elements and 1.94 Mbit of RAM. For DSP workloads using MAC operations, the larger device may allow more parallel processing, but the XC5VLX30-3FFG324C often achieves better power-per-logic ratio due to lower static current draw. In designs where 220 I/Os are sufficient and algorithm complexity fits within 30K logic cells, the XC5VLX30-3FFG324C can reduce total power by 15–20% compared to the XC5VLX50 variant, especially when leveraging its optimized carry chain structure for arithmetic functions.
What are the implications of the MSL-4 rating for the XC5VLX30-3FFG324C during assembly and rework?
The moisture sensitivity level (MSL) 4 rating for the XC5VLX30-3FFG324C means the device can be exposed to ambient conditions for only 72 hours before requiring dry baking at 125°C for 24 hours. This short floor life necessitates strict inventory control in high-mix manufacturing environments. During rework, localized heating must be carefully managed to avoid delamination of the FCBGA package, which is prone to popcorning if internal moisture vaporizes rapidly. Stencil design and reflow profiling should prioritize uniform heat distribution across the 19x19 mm body to prevent warpage-induced solder opens.
How should power sequencing be handled when integrating the XC5VLX30-3FFG324C into a multi-voltage system?
The XC5VLX30-3FFG324C requires core voltage (VCCINT) to be applied before or simultaneously with I/O voltages (VCCO), with a maximum differential of 0.5V during ramp-up to prevent latch-up. A typical sequence involves enabling the 1.0V core supply first, followed by 1.2V to 3.3V I/O banks within 100 ms. Power-good signals from regulators should gate configuration logic to avoid partial programming. Reverse current protection diodes on VCCO rails are recommended when mixing voltage domains, especially if some I/O banks interface with 3.3V peripherals while others operate at 1.8V.
What design trade-offs arise when using the XC5VLX30-3FFG324C for real-time control applications with strict deterministic latency requirements?
While the XC5VLX30-3FFG324C provides sufficient logic and I/O for real-time control, its asynchronous routing fabric introduces variable signal delays that can challenge deterministic timing. Hardened logic blocks like DSP48E slices offer predictable latency for arithmetic operations, but general-purpose logic paths may require pipelining to meet sub-microsecond response targets. Designers must use synchronous design practices, constrain clock domains with precise timing exceptions, and leverage the global clock network to minimize skew. The 324-FCBGA package’s inductance profile also favors lower-frequency control loops unless differential signaling is used for high-speed feedback paths.
How does the XC5VLX30-3FFG324C support secure boot and configuration integrity in unattended field deployments?
The XC5VLX30-3FFG324C supports AES-based bitstream encryption and SHA-based authentication when used with a compatible external flash memory. However, the decryption engine operates at reduced configuration speed, increasing boot time by approximately 30% compared to unencrypted loads. Designers must ensure the configuration interface (typically SelectMAP or SPI) is physically protected to prevent side-channel attacks. The device lacks on-chip non-volatile key storage, so secure key management relies on external tamper-resistant components, adding complexity in cost-sensitive applications.
What are the limitations of using the XC5VLX30-3FFG324C in high-speed serial communication applications compared to newer FPGA families?
The XC5VLX30-3FFG324C lacks integrated high-speed transceivers, limiting serial communication to external PHYs via parallel interfaces such as LVDS or CMOS. This restricts its use in protocols requiring >3.125 Gbps data rates, such as PCIe Gen2 or 10G Ethernet. While the I/O banks support up to 800 Mbps LVDS, signal integrity degrades significantly beyond 600 Mbps due to package parasitics in the 324-FCBGA. For new designs targeting high-speed serial links, newer families with embedded GTX transceivers offer better performance, though the XC5VLX30-3FFG324C remains viable for lower-rate industrial buses like EtherCAT or Profinet when paired with discrete PHYs.
How can thermal performance be optimized when the XC5VLX30-3FFG324C is used in a sealed enclosure with limited airflow?
In sealed enclosures, conduction cooling through the PCB is critical. The XC5VLX30-3FFG324C’s exposed thermal pad (if utilized) should be soldered to a large copper pour connected to internal ground planes acting as a heat spreader. Thermal vias (≥12 mil diameter, spaced ≤5 mm apart) under the package improve heat transfer to inner layers. Power estimation tools should be used to simulate worst-case junction temperatures under continuous operation, and dynamic frequency scaling can be implemented to reduce heat generation during idle periods. Operating near the 85°C TJ limit for extended durations may accelerate electromigration, particularly in high-switching nodes.
What configuration methods are supported by the XC5VLX30-3FFG324C, and how do they impact system boot time and reliability?
The XC5VLX30-3FFG324C supports Master Serial, Slave Serial, Master SelectMAP, and JTAG configuration modes. Master Serial mode using a commodity SPI flash is common in embedded systems due to simplicity, but boot time can exceed 50 ms depending on bitstream size and clock frequency. Slave SelectMAP allows faster loading via a host processor but requires precise timing control. JTAG is suitable for debug but not production. Reliability is enhanced by enabling the internal configuration watchdog timer and using a robust pull-up on the PROGRAM_B pin to prevent accidental resets in noisy environments.
How does the XC5VLX30-3FFG324C compare to the XC5VLX30T-3FFG324C in terms of I/O flexibility and high-speed interface support?
The XC5VLX30-3FFG324C and XC5VLX30T-3FFG324C share identical logic resources and package, but the “T” variant includes integrated GTP transceivers capable of up to 3.75 Gbps, enabling direct implementation of high-speed serial protocols like Aurora or CPRI. The non-transceiver XC5VLX30-3FFG324C relies entirely on external components for serial communication, increasing BOM complexity and board space. However, for applications using only parallel interfaces such as DDR2 or LVDS, the XC5VLX30-3FFG324C offers lower power and cost, making it preferable when transceivers are unnecessary.
What precautions should be taken when designing the decoupling network for the XC5VLX30-3FFG324C’s power rails?
The XC5VLX30-3FFG324C requires a multi-stage decoupling strategy due to its mixed-signal I/O and core domains. A combination of 10 µF bulk capacitors, 0.1 µF ceramic capacitors placed within 2 mm of each VCCINT/VCCO pin, and 10 nF high-frequency caps near high-switching I/O banks is recommended. Power plane resonance in the 100–500 MHz range must be damped using low-ESR capacitors. The 0.95V core rail is particularly sensitive to voltage ripple; simulations should verify that peak-to-peak noise remains below 30 mV under full toggle conditions to maintain timing closure.
Is the XC5VLX30-3FFG324C suitable for safety-critical applications requiring functional safety certification?
While the XC5VLX30-3FFG324C can be used in safety-related systems, it lacks built-in features such as SEU (single-event upset) mitigation or certified fault injection testing required for ISO 26262 or IEC 61508 compliance. Designers must implement external watchdog timers, redundant logic paths, and periodic configuration scrubbing to meet safety integrity levels. The absence of a hardened processor core also increases software complexity for diagnostic routines. For new safety-critical designs, newer FPGAs with integrated ARM cores and safety documentation are generally preferred.
How does the RoHS3 compliance of the XC5VLX30-3FFG324C affect solder selection and reflow profile design?
As a RoHS3-compliant device, the XC5VLX324C uses lead-free solder balls (typically SAC305), requiring higher reflow peak temperatures (240–250°C) compared to tin-lead processes. The reflow profile must include a slow ramp-up (1–2°C/sec) to avoid thermal shock to the FCBGA package, followed by a dwell time of 60–90 seconds above 217°C to ensure complete solder wetting. Stencil thickness should be limited to 0.12 mm to prevent solder bridging on the 1.0 mm pitch, and nitrogen atmosphere during reflow improves joint reliability by reducing oxidation.

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
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XILINX

XC5VLX30-3FFG324C

XILINX
41D-XC5VLX30-3FFG324C

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