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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~EPF10K30EFC256-1~~

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EPF10K30EFC256-1 - Altera

Name: Altera EPF10K30EFC256-1
Brand: Altera
SKU: EPF10K30EFC256-1
Availability: InStock
Rating: 5 (8 reviews)

Manufacturer Part Number: EPF10K30EFC256-1

Manufacturer: Altera (Intel)

Allelco Part Number: 32D-EPF10K30EFC256-1

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 16,664 pcs available, New & Original

Parts Description: IC FPGA 176 I/O 256FBGA

Package: 256-FBGA (17x17)

Data sheet: -

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In stock: 16664

Specifications

EPF10K30EFC256-1 Tech Specifications
Altera - EPF10K30EFC256-1 technical specifications, attributes, parameters and parts with similar specifications to Altera - EPF10K30EFC256-1

Product Attribute	Attribute Value
Manufacturer	Altera (Intel)
Voltage - Supply	2.375V ~ 2.625V
Supplier Device Package	256-FBGA (17x17)
Series	FLEX-10KE®
Package / Case	256-BGA
Package	Bulk

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 70°C (TA)
Number of LABs/CLBs	216
Number of I/O	176
Mounting Type	Surface Mount
Base Product Number	EPF10K30

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	RoHS non-compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.39.0001

Frequently Asked Questions(FAQ)

What are the key electrical characteristics and operating conditions for the Altera EPF10K30EFC256-1 FPGA, particularly in relation to supply voltage tolerance and thermal performance?: The EPF10K30EFC256-1 operates within a tightly regulated supply voltage range of 2.375V to 2.625V, ensuring compatibility with standard 2.5V logic environments while allowing minor deviations without compromising core functionality. This narrow window is critical when interfacing with legacy systems or power delivery networks that may exhibit slight fluctuations. The device is rated for operation across an industrial temperature range from 0°C to 70°C (TA), which supports deployment in moderately harsh environments such as embedded control systems or instrumentation panels where ambient cooling is limited. Given its 256-ball FBGA packaging, thermal management must account for efficient heat dissipation through the substrate to avoid junction temperature derating during sustained high-logic utilization.

How does the I/O count of 176 compare between the EPF10K30EFC256-1 and other FLEX-10KE series devices like the EPF10K20 or EPF10K40, and what implications does this have for PCB routing complexity and system scalability?: The EPF10K30EFC256-1 provides 176 general-purpose I/O pins, which sits midway between the EPF10K20 (typically 144 I/O) and EPF10K40 (up to 256 I/O) variants within the same FLEX-10KE family. This intermediate configuration offers a balance between pin-limited designs and those requiring extensive peripheral connectivity. Compared to the lower-density EPF10K20, the extra 32 I/O enables more complex communication protocols—such as dual UARTs, parallel memory interfaces, or multiple sensor inputs—without exceeding typical BGA routing layer constraints. Relative to the higher-end EPF10K40, however, it avoids the need for more advanced PCB stackups or additional decoupling capacitors due to reduced pin density, making it suitable for compact but moderately I/O-intensive applications.

Can the EPF10K30EFC256-1 be used in safety-critical systems despite not being qualified under automotive or industrial certification standards?: While the EPF10K30EFC256-1 lacks formal certifications such as AEC-Q100 or IEC 61508, it may still find use in non-safety-critical industrial or commercial systems where reliability is ensured through software redundancy, environmental controls, or periodic diagnostics. Its operation over 0°C to 70°C aligns with many industrial control environments, but users must conduct rigorous stress testing under worst-case conditions—including power cycling, EMI exposure, and extended burn-in—to validate long-term stability. In applications involving human safety or regulatory compliance, supplemental hardware monitoring (e.g., voltage supervisors, watchdog timers) and architectural fault tolerance should be implemented alongside the FPGA logic to mitigate single-point failures.

Why does the EPF10K30EFC256-1 have a RoHS non-compliant status, and how might this affect procurement planning for European or global manufacturing lines?: The EPF10K30EFC256-1 is marked as RoHS non-compliant due to the inclusion of lead in its die attach material or certain package-level interconnects, common in legacy semiconductor processes before widespread adoption of lead-free assembly. This status restricts direct use in final products destined for the European Union market unless exemption clauses apply. For global supply chains, engineers must verify whether their contract manufacturers can segregate RoHS-compliant inventory or source compliant alternatives. Alternatively, end-equipment labeling or documentation may need to reflect restricted substance content per local regulations. Procurement teams should cross-check distributor stock against RoHS declarations and consider lifecycle replacement strategies if future product revisions transition to compliant variants.

What is the significance of the Moisture Sensitivity Level (MSL) rating of 3 for the EPF10K30EFC256-1, and how should it influence storage and handling procedures prior to PCB assembly?: With an MSL rating of 3, the EPF10K30EFC256-1 requires controlled dry storage and must undergo reflow soldering within 168 hours (7 days) after moisture exposure begins. This classification reflects sensitivity to moisture-induced popcorning during thermal reflow, especially problematic in fine-pitch BGA packages like the 256-pin FBGA. Proper handling includes storing components in hermetically sealed bags with desiccant and humidity indicator cards, using bake-out cycles at 125°C for >24 hours if shelf life exceeds MSL limits, and adhering to JEDEC J-STD-033 guidelines. Failure to follow these protocols risks delamination, solder joint cracking, and latent defects manifesting post-deployment.

How do the 216 LABs/CLBs in the EPF10K30EFC256-1 compare to equivalent FPGA architectures from competitors like Xilinx Spartan or Lattice MachXO, and what design trade-offs emerge from this resource allocation?: At 216 logic array blocks (LABs), the EPF10K30EFC256-1 offers moderate logic capacity compared to mid-range CPLDs but falls short of entry-level SRAM-based FPGAs such as the Xilinx Spartan-6 (which can exceed 10k logic cells). However, its structured architecture—optimized for low-power, non-volatile configuration—makes it more suitable for glue logic, state machines, and interface bridging rather than large-scale algorithmic processing. When contrasted with Lattice MachXO3LF devices offering similar I/O counts but lower logic density, the EPF10K30 trades flexibility for higher gate counts per LAB, enabling more complex combinational logic per unit area. Designers must assess whether deterministic timing and instant-on capability outweigh reconfigurability needs in time-to-market constrained projects.

Is it feasible to cascade multiple EPF10K30EFC256-1 devices for expanded logic capacity, and what challenges would arise in synchronizing configuration and signal integrity?: Cascading EPF10K30EFC256-1 devices is technically possible using external control logic to manage configuration sequences via the JTAG interface, but introduces significant practical hurdles. Each device requires independent configuration memory initialization, and without built-in master-slave support, designers must implement custom boot-up coordination circuitry. Additionally, inter-device communication paths increase trace lengths on the PCB, exacerbating skew, crosstalk, and EMI risks—especially problematic given the high-speed I/O capabilities of modern peripherals. Moreover, the lack of shared clock domains complicates synchronous designs. Most engineers opt instead for larger single-chip solutions or migrate to newer FPGA families with native multi-device support, making cascading the EPF10K30 an inefficient path for scalable logic expansion.

Given its base product number EPF10K30, how compatible is the EPF10K30EFC256-1 with development tools such as Quartus II, and are there known limitations when targeting older versions?: The EPF10K30EFC256-1 fully supports Altera’s Quartus II software, though optimal feature utilization—including advanced place-and-route algorithms and power analysis—is best achieved with Version 8.0 or later. Earlier releases may lack optimizations for the FLEX-10KE architecture’s embedded multipliers and PLLs, leading to suboptimal timing closure or increased static power consumption. Users targeting legacy toolchains should verify IP core compatibility and ensure sufficient device database coverage. Furthermore, while the EPF10K30EFC256-1 appears in current Quartus libraries, long-term support depends on continued maintenance by Intel (post-Altera acquisition); engineers should monitor vendor advisories for EOL notices affecting software compatibility beyond 2025.

Parts with Similar Specifications

The three parts on the right have similar specifications to Altera EPF10K30EFC256-1

Product Attribute
Part Number	EPF10K30EFC256-1X	EPF10K30EFC256-1	EPF10K30EFC256-1X	EPF10K30EFC256-2
Manufacturer	Altera	Intel	Intel	Altera
Voltage - Supply	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Series	-	-	-	-
Number of I/O	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Number of LABs/CLBs	-	-	-	-

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
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