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HomeProductsIntegrated Circuits (ICs)Interface - Analog Switches, Multiplexers, DemultiplexersMAX4684EBC+T
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MAX4684EBC+T - Analog Devices Inc./Maxim Integrated

Manufacturer Part Number
MAX4684EBC+T
Manufacturer
Maxim Integrated
Allelco Part Number
32D-MAX4684EBC+T
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
10,722 pcs available, New & Original
Parts Description
IC SWITCH SPDTX2 800MOHM 12UCSP
Package
12-UCSP
Data sheet
MAX4684EBC+T.pdf

Datasheets

MAX4684-85.pdf

Part Numbering Guide

Part Numbering System.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 10722
  • Unit Price: $1.393
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $1.393 $1.39
10+ $1.222 $12.22
30+ $1.115 $33.45
100+ $1.005 $100.50
500+ $0.956 $478.00
1000+ $0.934 $934.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

MAX4684EBC+T Tech Specifications
Analog Devices Inc./Maxim Integrated - MAX4684EBC+T technical specifications, attributes, parameters and parts with similar specifications to Analog Devices Inc./Maxim Integrated - MAX4684EBC+T

Product Attribute Attribute Value
Manufacturer Maxim Integrated
Voltage - Supply, Single (V+) 1.8V ~ 5.5V
Voltage - Supply, Dual (V±) -
Switch Time (Ton, Toff) (Max) 50ns, 30ns
Switch Circuit SPDT
Supplier Device Package 12-UCSP
Series -
Package / Case 12-WFBGA, CSPBGA
Package Tape & Reel (TR)
Operating Temperature -40°C ~ 85°C (TA)
On-State Resistance (Max) 800mOhm
Product Attribute Attribute Value
Number of Circuits 2
Multiplexer/Demultiplexer Circuit 2:1
Mounting Type Surface Mount
Current - Leakage (IS(off)) (Max) 1nA
Crosstalk -68dB @ 100kHz
Charge Injection 200pC
Channel-to-Channel Matching (ΔRon) 60mOhm
Channel Capacitance (CS(off), CD(off)) 84pF, 37pF
Base Product Number MAX4684
-3db Bandwidth -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

MAX4684EBC+T Image
MAX4684EBC+T (1)

Manufacturer Part Number

MAX4684EBC+T

Manufacturer

Analog Devices

Introduction

The MAX4684EBC+T is an SPDT analog switch with high-performance capabilities packaged for efficient surface mounting suitable for a wide range of applications.

Product Features and Performance

SPDT switch configuration

High-speed switching with switch times of 50ns (on) and 30ns (off)

Low on-state resistance of 800mOhm

Channel-to-Channel Matching at 60mOhm

Single supply voltage ranging from 1.8V to 5.5V

Dual supply voltage not applicable

High off-isolation of crosstalk -68dB at 100kHz

Small signal charge injection of 200pC

Low channel capacitance of 84pF when off

Minimal leakage current of 1nA when off

Product Advantages

Provides fast and reliable switching capability

Low power consumption and high efficiency

Excellent analog signal integrity with low distortion

Enhances battery life due to low leakage and charge injection

Compatible with a broad range of supply voltages, increasing versatility

Key Technical Parameters

Voltage Supply, Single (V+): 1.8V ~ 5.5V

Channel-to-Channel Matching (ΔRon): 60mOhm

On-State Resistance (Max): 800mOhm

Switch Time (Ton, Toff) (Max): 50ns, 30ns

Current Leakage (IS(off)) (Max): 1nA

Crosstalk: -68dB @ 100kHz

Quality and Safety Features

Built for high durability and reliability

Optimized for low electromagnetic interference

Manufactured under strict compliance with international standards

Compatibility

Suitable for integration in multiple digital and analog circuits

Flexible for use in single-ended or differential applications

Compatible with various signal types

Application Areas

Communication equipment

Test equipment

Consumer electronics

Medical instruments

Product Lifecycle

Product Status: Active

Not nearing discontinuation

Upgrades and replacements are available

Several Key Reasons to Choose This Product

Extremely fast switching times enable high-speed signal processing

Exceptional signal integrity makes it ideal for sensitive analog applications

Versatile power compatibility accommodates diverse system designs

Minimized power loss ensures efficiency

Durable and reliable for use in commercial and industrial environments

Frequently Asked Questions(FAQ)

How does the MAX4684EBC+T handle signal integrity in high-speed analog routing applications, and what are its key electrical characteristics that influence crosstalk and channel capacitance?
The MAX4684EBC+T exhibits strong signal integrity performance due to its low channel capacitance—37pF for the drain-to-source off capacitance (CD(off)) and 84pF for source-to-drain off capacitance (CS(off))—which minimizes charge injection and preserves fast transient response. With a crosstalk specification of -68dB at 100kHz, it effectively suppresses adjacent channel interference, making it suitable for precision analog multiplexing in sensor front-ends or audio/video switching systems. These parameters, combined with a leakage current of less than 1nA when off, ensure minimal signal degradation over long traces or through multiple stages.
What are the implications of the 60mOhm channel-to-channel matching (ΔRon) on system accuracy when using the MAX4684EBC+T in precision measurement circuits?
A ΔRon of 60mOhm indicates moderate mismatch between the two SPDT channels of the MAX4684EBC+T, which can introduce gain errors in buffered or unamplified signal paths. In high-impedance or low-voltage applications such as thermocouple conditioning or bridge sensor readout, this variation may lead to measurable offset shifts across channels. For systems requiring sub-percent accuracy, external calibration or software compensation is often necessary, especially if both channels contribute to averaged measurements or differential signals.
Can the MAX4684EBC+T be used in battery-powered portable devices, and how do its supply voltage range and power-down behavior affect overall system efficiency?
Yes, the MAX4684EBC+T supports single-supply operation from 1.8V to 5.5V, aligning well with modern low-voltage microcontroller and sensor interfaces common in portable electronics. Its ultra-low off-state leakage of 1nA ensures negligible standby power draw during inactive periods. When paired with control logic that places the device in shutdown mode, this enables extended battery life in intermittent-use scenarios such as wearable health monitors or IoT edge nodes where duty cycling is typical.
How does the propagation delay of 50ns (Ton) impact timing budgets in a data acquisition system using the MAX4684EBC+T as an input multiplexer?
The turn-on time of 50ns for the MAX46884EBC+T means that after a control signal changes state, the switch must settle before sampling begins to avoid glitches. In a 1Msps ADC system, this introduces a fixed latency of 50μs per channel change, which may require adjustment in sample-and-hold sequencing or FIFO buffering to maintain synchronization. While not prohibitive for most general-purpose ADCs, it becomes critical in synchronous multichannel systems where phase alignment across channels must be preserved.
In comparison to other Analog Devices dual SPDT switches like the MAX4424, how does the MAX4684EBC+T differ in terms of on-resistance and bandwidth suitability for RF applications?
Unlike the MAX4424, which targets higher-frequency RF paths with tighter Ron variation and better isolation up to several hundred MHz, the MAX4684EBC+T trades some RF performance for lower Ron (800mΩ vs. typically >1Ω in RF-grade parts) and broader compatibility with mixed-signal systems. The MAX4684EBC+T’s -68dB crosstalk at 100kHz reflects its focus on precision DC-to-mid-band analog switching rather than RF signal routing, making it more appropriate for instrumentation than wireless front-ends.
Is it safe to operate the MAX4684EBC+T near its thermal limits, and how does junction temperature affect its reliability in compact PCB designs?
Operating the MAX4684EBC+T within its specified ambient range of -40°C to 85°C is generally safe under normal conditions, but continuous high-power switching—such as driving capacitive loads at high frequency—can elevate internal temperatures beyond ambient. Given its small 12-UCSP package with limited thermal dissipation area, sustained operation near the upper limit requires careful layout with adequate copper pour and spacing from heat-sensitive components. No derating is called out in the datasheet, so designers should assume full functionality within spec but monitor empirical heating in prototype validation.
How does the MSL 1 classification of the MAX4684EBC+T simplify manufacturing handling, and what precautions are still necessary during reflow soldering?
As an MSL 1 component, the MAX4684EBC+T has unlimited shelf life and no required baking prior to use, significantly reducing storage logistics for high-volume production. However, despite its robustness, it must still undergo standard lead-free reflow profiles without exceeding peak temperatures above the solder melting point. Rapid thermal transitions can induce mechanical stress in the tiny CSP die, so slow ramp rates during preheat and soak phases help preserve package integrity.
What design considerations arise when cascading multiple MAX4684EBC+T devices to expand switching capacity, and how does charge injection accumulate in such configurations?
Cascading MAX4684EBC+T switches introduces additive charge injection effects: each device contributes ~200pC of charge transfer during switching, which can distort low-level signals or cause voltage spikes in sensitive analog stages. To mitigate this, either buffer the signal upstream or use guard rings and careful grounding to suppress parasitic coupling. Additionally, control logic must account for cumulative propagation delays (50ns per stage), which may necessitate timing margin adjustments in synchronous applications like multiplexed data buses.
Why might someone choose the UCSP-12 package variant (MAX4684EBC+T) over larger BGA or SOIC alternatives for space-constrained designs?
The 12-UCSP package offers extreme miniaturization with a footprint under 1mm², ideal for handheld medical devices or compact industrial sensors where board real estate is at a premium. Despite its small size, it retains standard pinout compatibility with other UCSP variants, enabling reuse across product lines. The trade-off is increased difficulty in inspection and rework, but automated pick-and-place systems handle placement reliably, justifying adoption in volume manufacturing.
Does the MAX4684EBC+T support bidirectional signal flow, and how does this capability influence circuit topology in bidirectional communication protocols?
Yes, the MAX4684EBC+T is inherently bidirectional due to its symmetric transistor architecture, allowing signals to pass equally in either direction. This simplifies implementation in protocols like I2C or SMBus where direction depends solely on master-slave roles. Designers can route bidirectional lines through the switch without additional isolation circuitry, though care must be taken to manage bus contention and ensure adequate pull-up/pull-down resistors are present on both sides of the switch.
How does the absence of explicit -3dB bandwidth data affect stability analysis when using the MAX4684EBC+T in feedback loops or active filter configurations?
Since the datasheet does not specify -3dB bandwidth, stability margins in closed-loop applications involving the MAX4684EBC+T cannot be directly assessed from published parameters alone. Indirectly, however, the combination of low capacitance (37–84pF), moderate Ron (800mΩ), and fast switching times suggests adequate mid-band performance up to tens of MHz. For critical stability cases, small-signal modeling or SPICE simulation incorporating parasitic elements is recommended to verify phase margin before committing to layout.
In comparison to CMOS-based analog switches from competing vendors, how does the MAX4684EBC+T balance cost, performance, and integration level for general-purpose switching tasks?
The MAX4684EBC+T delivers competitive Ron and leakage for its class, with a compact footprint and wide supply range, positioning it well against similar CMOS switches from TI or ON Semiconductor. It lacks advanced features like break-before-make or rail-to-rail inputs found in higher-end parts, but achieves this through proven process technology and simplified control interface. For non-RF, non-high-voltage applications requiring two SPDT channels in minimal space, it offers a favorable cost-performance ratio without excessive complexity.
What role does the Base Product Number (MAX4684) play in supply chain management and firmware portability when selecting the MAX4684EBC+T?
The base product number (MAX4684) groups all package and grade variants—including MAX4684EBC+T—under a common identifier, simplifying procurement forecasting and inventory planning. Firmware written to control any MAX4684 variant remains compatible across packages, provided pin functions align; in this case, the UCSP-12 maintains consistent logic mapping, enabling reuse of driver code in different form-factor designs without modification.
Are there any known limitations in using the MAX4684EBC+T with very low-voltage signals below 100mV, and how does Ron variation affect signal fidelity in such regimes?
At very low voltages (<100mV), even small absolute Ron variations (e.g., ±100mΩ from nominal 800mΩ) create significant relative errors—up to 20%—especially in high-gain amplifier stages. Combined with the 60mOhm channel mismatch, this risks introducing offset errors that overwhelm the original signal. In such cases, buffered or unity-gain configured amplifiers before switching are advisable to minimize loading effects and improve linearity.
How does RoHS3 compliance of the MAX4684EBC+T influence regulatory acceptance in global markets, particularly in automotive or aerospace sectors?
RoHS3 compliance confirms the absence of restricted substances including Pb, Cd, Hg, Cr6+, PBB, and PBDE above threshold limits, meeting stricter environmental standards beyond basic RoHS. While automotive and aerospace certifications require additional qualification (e.g., AEC-Q100), RoHS3 status facilitates smoother entry into EU and international markets by defaulting to compliant material sourcing. It also reduces risk of supply disruption due to regional regulations, supporting long-term product lifecycle continuity.
Can the MAX4684EBC+T drive capacitive loads directly, and what are the consequences of repeated switching into large capacitors?
The MAX4684EBC+T can switch capacitive loads, but frequent toggling into large capacitors (>100nF) stresses the output stage due to charge injection and inrush current. Each transition transfers ~200pC, which over many cycles may accumulate or interact with load impedance to cause voltage droop or oscillation. For heavy capacitive loads, consider adding series resistance (e.g., 10–100Ω) at the output to dampen ringing and protect the switch, while accepting minor bandwidth reduction.
What testing methodology would you recommend to validate real-world performance of the MAX4684EBC+T in a custom PCB before mass deployment?
Validate the MAX4684EBC+T using a test fixture that replicates actual load conditions: measure Ron uniformity across both channels at multiple supply voltages, inject a 1kHz sine wave to assess distortion and crosstalk, and perform eye diagram analysis if used in digital-assisted analog paths. Also verify thermal rise under worst-case duty cycle and confirm control timing meets setup/hold requirements relative to downstream ADCs or processors. Early validation prevents late-stage failures in field-deployed systems.
How does the choice between Cut Tape and Digi-Reel packaging affect assembly line throughput when integrating the MAX4684EBC+T into automated SMT workflows?
Both Cut Tape (CT) and Digi-Reel® formats feed seamlessly into standard pick-and-place machines, but Digi-Reel provides continuous tape feeding, reducing mid-process stops and improving line efficiency in high-volume runs. Cut Tape suits smaller batch productions where reel handling overhead isn’t justified. Either format maintains identical part orientation and indexing, ensuring consistent placement accuracy for the tiny 12-UCSP package, so selection hinges primarily on production scale rather than technical constraints.

Parts with Similar Specifications

The three parts on the right have similar specifications to Analog Devices Inc./Maxim Integrated MAX4684EBC+T

Product Attribute MAX4684AEBC+T MAX4684EBC-T MAX4684ETB+T MAX4684EBC-T10
Part Number MAX4684AEBC+T MAX4684EBC-T MAX4684ETB+T MAX4684EBC-T10
Manufacturer Analog Devices Inc./Maxim Integrated Analog Devices Inc./Maxim Integrated Analog Devices Inc./Maxim Integrated Analog Devices Inc./Maxim Integrated
-3db Bandwidth - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Crosstalk - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Current - Leakage (IS(off)) (Max) - - - -
Channel-to-Channel Matching (ΔRon) - - - -
Channel Capacitance (CS(off), CD(off)) - - - -
Voltage - Supply, Single (V+) - - - -
Multiplexer/Demultiplexer Circuit - - - -
Charge Injection - - - -
Number of Circuits - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
On-State Resistance (Max) - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Series - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Switch Circuit - - - -
Switch Time (Ton, Toff) (Max) - - - -
Voltage - Supply, Dual (V±) - - - -

MAX4684EBC+T Datasheet PDF

Download MAX4684EBC+T pdf datasheets and Analog Devices Inc./Maxim Integrated documentation for MAX4684EBC+T - Analog Devices Inc./Maxim Integrated.

Datasheets
MAX4684-85.pdf
Environmental Information
Maxim Integrated REACH.pdf Maxim Integrated RoHS Cert.pdf Red Phosphorous Certificate.pdf
Part Numbering Guide
Part Numbering System.pdf
Application Notes
Selecting the Right CMOS Analog Switch.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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MAX4684EBC+T Image

MAX4684EBC+T

Analog Devices Inc./Maxim Integrated
32D-MAX4684EBC+T

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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