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HomeProductsIntegrated Circuits (ICs)Specialized ICsFM31256-GTR
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FM31256-GTR - Infineon Technologies

Manufacturer Part Number
FM31256-GTR
Manufacturer
Infineon Technologies
Allelco Part Number
32D-FM31256-GTR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
2,818 pcs available, New & Original
Parts Description
IC PROCESSOR COMPANION 14SOIC
Package
14-SOIC
Data sheet
FM31256-GTR.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 2818
  • Unit Price: $4.551
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $4.551 $4.55
10+ $4.03 $40.30
30+ $3.137 $94.11
100+ $2.87 $287.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

FM31256-GTR Tech Specifications
Infineon Technologies - FM31256-GTR technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies - FM31256-GTR

Product Attribute Attribute Value
Manufacturer Infineon Technologies
Type Processor Companion
Supplier Device Package 14-SOIC
Series -
Package / Case 14-SOIC (0.154", 3.90mm Width)
Product Attribute Attribute Value
Package Tape & Reel (TR)
Mounting Type Surface Mount
Base Product Number FM31256
Applications Processor-Based Systems

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0071

Parts Introduction

FM31256-GTR Image
FM31256-GTR (1)

Manufacturer Part Number

FM31256-GTR

Manufacturer

Infineon Technologies

Introduction

The FM31256-GTR is a high-performance, low-power, non-volatile ferroelectric random access memory (FRAM) integrated circuit (IC) suitable for use in processor-based systems.

Product Features and Performance

High-speed read/write operation with typical access times of 70 ns

Low power consumption with maximum standby current of 10 μA

Unlimited read/write endurance

Data retention of over 10 years

Wide operating voltage range of 2.7 V to 5.5 V

Available in a compact 14-pin SOIC package

Product Advantages

Non-volatile memory with fast access speeds and low power requirements

Unlimited read/write endurance for reliable data storage

Wide operating voltage range for compatibility with various systems

Key Technical Parameters

Memory Capacity: 256 Kbit

Interface: SPI

Operating Voltage: 2.7 V to 5.5 V

Maximum Access Time: 70 ns

Maximum Standby Current: 10 μA

Quality and Safety Features

RoHS3 compliant for environmental safety

Tape and reel packaging for reliable delivery

Compatibility

Suitable for use in processor-based systems, such as industrial controls, consumer electronics, and embedded applications.

Application Areas

Industrial automation and control systems

Portable electronic devices

Embedded systems

Product Lifecycle

The FM31256-GTR is an active product from Infineon Technologies and is not nearing discontinuation. Replacement or upgrade options may be available from the manufacturer.

Key Reasons to Choose This Product

High-speed, low-power FRAM technology for reliable data storage

Unlimited read/write endurance for long-lasting performance

Wide operating voltage range for compatibility with various systems

Compact 14-pin SOIC package for space-constrained applications

RoHS3 compliance for environmental sustainability

Frequently Asked Questions(FAQ)

How does the FM31256-GTR from Infineon Technologies interface with a host processor in a typical embedded system design, and what considerations should be made for signal integrity?
The FM31256-GTR functions as a processor companion IC designed to manage real-time tasks such as clock generation, power sequencing, or peripheral management in conjunction with a primary microcontroller or microprocessor. In most implementations, it communicates via standardized serial interfaces like I2C or SPI, depending on the specific configuration and firmware support. Engineers should account for pull-up resistor values on open-drain lines, clock stretching behavior if applicable, and ensure proper decoupling capacitance near the device’s VCC pin to maintain stable operation. Given its 14-SOIC package with a 3.90 mm width, layout parasitics can impact high-speed signaling; therefore, maintaining short trace lengths and avoiding vias adjacent to signal paths is advisable.
What are the thermal performance characteristics of the FM31256-GTR when operating under continuous load in a compact PCB environment, and how does the package influence heat dissipation?
The FM31256-GTR uses a standard 14-lead SOIC package without an exposed thermal pad, which limits passive cooling compared to larger QFN or BGA variants. Under normal operating conditions with ambient temperatures below 40°C and moderate current draw (typically < 10 mA), junction temperatures remain within safe limits due to low power consumption (< 15 mW). However, in densely populated boards with limited airflow, cumulative thermal rise may necessitate spacing between components or inclusion of copper pours connected to internal ground planes for improved conduction. Thermal resistance from junction to ambient for this package is approximately 100–120°C/W, so designers must avoid sustained full-load operation above 70°C board temperature without verification through prototype testing.
Can the FM31256-GTR be used in automotive-grade applications, and what modifications or certifications might be required beyond standard industrial ratings?
While the FM31256-GTR itself is not specified for AEC-Q100 qualification, it is manufactured by Infineon Technologies—a company that supports automotive supply chains—and meets RoHS3 compliance. Its industrial temperature range (-40°C to +85°C) makes it suitable for non-critical automotive infotainment subsystems where reliability requirements are moderate. For safety-relevant functions requiring ISO 26262 compliance, additional validation, failure mode analysis, and possibly redundancy would be necessary. If automotive use is intended, consultation with Infineon’s product team and assessment against functional safety standards is strongly recommended before design-in.
When comparing the FM31256-GTR with alternative processor companion devices such as the DS1307 or PCF8563, what key differences emerge in terms of functionality, interface protocol, and power consumption?
Unlike dedicated RTCs like the DS1307 or PCF8563, the FM31256-GTR is not primarily a real-time clock but rather a configurable companion IC tailored for coordination with a host processor. It typically offers more flexible I/O control logic, programmable timing functions, and integrated voltage monitoring rather than calendar tracking. In contrast to the DS1307, which draws around 300 µA in active mode and uses I2C with battery backup capability, the FM31256-GTR consumes significantly less static current (~1 µA in standby) and may support multiple communication protocols. Compared to the PCF8563, which includes oscillator compensation and alarm features, the FM31256-GTR emphasizes system-level synchronization and power management, making it better suited for applications where precise task scheduling or reset control is needed alongside clock distribution.
What role does the Moisture Sensitivity Level (MSL) rating of 3 play during reflow soldering of the FM31256-GTR, and how should inventory handling practices be adjusted accordingly?
An MSL rating of 3 indicates that the FM31256-GTR begins to absorb moisture at elevated humidity levels after 168 hours (7 days) of storage under uncontrolled ambient conditions. This classification mandates adherence to JEDEC J-STD-033 guidelines: components must be baked prior to reflow if stored beyond 168 hours unless kept in sealed packaging with desiccant. During assembly, exposure to reflow temperatures (typically peaking at 245°C) for several seconds can cause internal delamination or popcorning. To mitigate risk, manufacturers recommend using dry-packaged inventory with humidity indicators, baking at 125°C for 24 hours if shelf life exceeds MSL window, and limiting time in ambient atmosphere during production flow.
Is reverse polarity protection required when integrating the FM31256-GTR into a power supply network, and what design strategies are commonly employed?
Although the FM31256-GTR lacks built-in ESD protection diodes capable of sustaining high-voltage transients, reverse polarity damage is generally avoided through careful power rail design rather than component-level safeguards. Most implementations assume clean, regulated supply rails derived from a well-designed DC-DC converter or LDO stage. However, if input sources vary or connectors are prone to miswiring (e.g., in field-deployable units), adding a Schottky diode in series with the VCC line or employing a P-channel MOSFET-based ideal diode circuit provides robust protection. Since the device operates at core voltages between 2.7V and 5.5V, even brief exposure to inverted polarity could compromise latch-up susceptibility, especially if bypass capacitors discharge rapidly onto the wrong node.
How does the FM31256-GTR support system reset functionality, and what external components are typically needed to ensure reliable power-on resets?
The FM31256-GTR often incorporates a precision voltage monitor circuit that asserts a reset signal to the host MCU when the supply drops below a defined threshold—commonly around 2.0V or 2.7V—ensuring clean initialization during brownout events. To guarantee monotonic power ramp-up and prevent spurious resets, engineers usually include a small ceramic capacitor (e.g., 10 nF) across the RESET output and optionally a pull-up resistor (4.7 kΩ) on the reset line to VCC. Additionally, a bulk capacitor (1–10 µF) near the IC helps stabilize the supply during transient loads. Proper placement of these elements within centimeters of the FM31256-GTR minimizes parasitic inductance and ensures the reset pulse duration remains consistent with the host processor’s minimum reset width requirement.
What impact does lead-free reflow profile have on the long-term reliability of the FM31256-GTR, particularly concerning solder joint fatigue?
As a ROHS3-compliant device, the FM31256-GTR utilizes lead-free solder compatibility, which requires higher peak temperatures (typically 240–250°C vs. ~220°C for tin-lead). The SOIC package’s relatively large coefficient of thermal expansion mismatch with FR4 PCBs increases mechanical stress during thermal cycling. Over time, repeated exposure to such profiles accelerates solder joint creep, potentially leading to open connections at the leads. Designers should verify that their reflow process stays within the manufacturer’s recommended maximum junction temperature (TJmax) of 150°C and limits dwell time above 235°C to less than 60 seconds. Using SAC305 solder alloy with controlled flux chemistry further reduces voiding and improves joint integrity under thermal stress.
Can the FM31256-GTR operate reliably in environments with high electromagnetic interference, and what layout techniques enhance its noise immunity?
Operating in noisy environments demands attention to both the FM31256-GTR’s inherent robustness and surrounding circuit topology. While it features basic ESD protection per human-body model (HBM) Class 2, it lacks immunity to fast transient bursts common in industrial settings. To improve resilience, implement a star grounding scheme, minimize loop areas in signal traces, and place ferrite beads or common-mode chokes on communication lines if interfacing over longer cables. Decoupling capacitors—especially 100 nF ceramic placed within 5 mm of the VCC and GND pins—are critical for suppressing high-frequency supply noise. Avoid routing digital signals parallel to analog or clock lines unless separated by a ground plane; this reduces crosstalk that could corrupt configuration registers or trigger unintended resets.
What programming or configuration method is used for customizing the behavior of the FM31256-GTR, and are there development tools available for initial evaluation?
Configuration of the FM31256-GTR typically occurs through software running on the host processor, leveraging its internal register map accessible via I2C or SPI. No dedicated flash programmer is required, though some variants may support bootstrapping options via specific GPIO states during power-up. Infineon provides reference schematics and application notes (e.g., AN-xxxx) detailing register definitions and timing diagrams. For rapid prototyping, evaluation boards compatible with Arduino or STM32 microcontrollers are sometimes available through distributor platforms like Digi-Key or Mouser, enabling quick validation of reset timing, watchdog triggers, or clock division ratios without custom PCB fabrication.
How does the FM31256-GTR compare to newer generations of companion chips from competitors like Microchip or NXP in terms of integration density and feature set?
Relative to recent offerings such as Microchip’s MCP7941x family or NXP’s PCA9500 series, the FM31256-GTR offers fewer integrated peripherals but trades complexity for simplicity in basic timing and reset supervision tasks. Modern alternatives often combine RTC, EEPROM, and I/O expanders in single packages, whereas the FM31256-GTR focuses narrowly on processor coordination with minimal overhead. In systems where cost and footprint matter more than multifunctionality, the FM31256-GTR remains viable. However, for designs demanding extended date/time logging, tamper detection, or secure authentication, newer ICs provide superior value despite slightly higher quiescent current. Selection ultimately hinges on whether the application requires calendar awareness or merely deterministic reset signaling.
What precautions should be taken when replacing the FM31256-GTR with a functionally similar part during obsolescence planning?
Substituting the FM31256-GTR requires thorough electrical and behavioral equivalence checks. Key parameters include supply voltage range (±5% tolerance), reset threshold accuracy (±50 mV typical), propagation delay on output signals, and supported communication protocols. Even if two parts share the same pinout and nominal function, subtle differences in internal architecture (e.g., hysteresis levels on voltage monitors) can alter system response during power-up sequences. Always consult the replacement candidate’s errata sheet, perform side-by-side bench testing under worst-case conditions (low VCC, fast ramp rates), and validate firmware compatibility before committing to a new BOM. Blind substitution risks silent failures during field deployment.

Parts with Similar Specifications

The three parts on the right have similar specifications to Infineon Technologies FM31256-GTR

Product Attribute FM31256-GTR. FM31256-STR FM3116-GTR FM31256-G
Part Number FM31256-GTR. FM31256-STR FM3116-GTR FM31256-G
Manufacturer Ramtron (Cypress Semiconductor) Cypress Semiconductor Cypress Semiconductor Infineon Technologies
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Type - - - -
Applications - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Mounting Type - Surface Mount Through Hole Surface Mount
Series - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)

FM31256-GTR Datasheet PDF

Download FM31256-GTR pdf datasheets and Infineon Technologies documentation for FM31256-GTR - Infineon Technologies.

PCN Design/Specification
Datasheet Update 27/Feb/2014.pdf F-FRAM Marking Changes 30/Aug/2013.pdf
PCN Other
MSL Standardization 15/Dec/2014.pdf
PCN Packaging
Mult Dev Cover Tape Chg 26/Sep/2019.pdf Ship Label REV.pdf
PCN Assembly/Origin
Qualification Passivation Layer 22/Mar/2014.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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FM31256-GTR Image

FM31256-GTR

Infineon Technologies
32D-FM31256-GTR

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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