Please refer to the English Version as our Official Version.

Europe: France~~(Français)~~ Germany~~(Deutsch)~~ Italy~~(Italia)~~ Russian~~(русский)~~ Poland~~(polski)~~ Czech~~(Čeština)~~ Luxembourg~~(Lëtzebuergesch)~~ Netherlands~~(Nederland)~~ Iceland~~(íslenska)~~ Hungarian~~(Magyarország)~~ Spain~~(español)~~ Portugal~~(Português)~~ Turkey~~(Türk dili)~~ Bulgaria~~(Български език)~~ Ukraine~~(Україна)~~ Greece~~(Ελλάδα)~~ Israel~~(עִבְרִית)~~ Sweden~~(Svenska)~~ Finland~~(Svenska)~~ Finland~~(Suomi)~~ Romania~~(românesc)~~ Moldova~~(românesc)~~ Slovakia~~(Slovenská)~~ Denmark~~(Dansk)~~ Slovenia~~(Slovenija)~~ Slovenia~~(Hrvatska)~~ Croatia~~(Hrvatska)~~ Serbia~~(Hrvatska)~~ Montenegro~~(Hrvatska)~~ Bosnia and Herzegovina~~(Hrvatska)~~ Lithuania~~(lietuvių)~~ Spain~~(Português)~~ Switzerland~~(Deutsch)~~ United Kingdom~~(English)~~

Asia/Pacific: Japan~~(日本語)~~ Korea~~(한국의)~~ Thailand~~(ภาษาไทย)~~ Malaysia~~(Melayu)~~ Singapore~~(Melayu)~~ Vietnam~~(Tiếng Việt)~~ Philippines~~(Pilipino)~~

Africa, India and Middle East: United Arab Emirates~~(العربية)~~ Iran~~(فارسی)~~ Tajikistan~~(فارسی)~~ India~~(हिंदी)~~ Madagascar~~(malaɡasʲ)~~

South America / Oceania: New Zealand~~(Maori)~~ Brazil~~(Português)~~ Angola~~(Português)~~ Mozambique~~(Português)~~

North America: United States~~(English)~~ Canada~~(English)~~ Haiti~~(Ayiti)~~ Mexico~~(español)~~

Home Products Integrated Circuits (ICs)Memory~~S25FL512SDSMFB010~~

Image may be representation.
See specifications for product details.

~~Favorite~~

EXPRESS OPTION

Payment method

S25FL512SDSMFB010 - Infineon Technologies

Name: Infineon Technologies S25FL512SDSMFB010
Brand: Infineon Technologies
SKU: S25FL512SDSMFB010
Price: 0.195 USD
Availability: InStock
Rating: 5 (2 reviews)

Manufacturer Part Number: S25FL512SDSMFB010

Manufacturer: Infineon Technologies

Allelco Part Number: 32D-S25FL512SDSMFB010

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 4,566 pcs available, New & Original

Parts Description: IC FLASH 512MBIT SPI/QUAD 16SOIC

Package: 16-SOIC

Data sheet: S25FL512SDSMFB0.pdf

Datasheets
S25FL512S.pdf

PCN Assembly/Origin
Wafer Fab Site 06/Apr/2021.pdf

PCN Packaging
Ship Label REV.pdf Ship Label/Document Standardization 24/Jan/2018.pdf

RoHs Status: ROHS3 Compliant

~~Compare~~

Our certification

In stock: 4566

Unit Price: $0.53
Subtotal: $0.00

Want a better price?
Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity	Unit Price	Ext. Price
1+	$0.53	$0.53
200+	$0.205	$41.00
500+	$0.198	$99.00
1000+	$0.195	$195.00

The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

S25FL512SDSMFB010 Tech Specifications
Infineon Technologies - S25FL512SDSMFB010 technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies - S25FL512SDSMFB010

Product Attribute	Attribute Value
Manufacturer	Infineon Technologies
Write Cycle Time - Word, Page	-
Voltage - Supply	2.7V ~ 3.6V
Technology	FLASH - NOR
Supplier Device Package	16-SOIC
Series	Automotive, AEC-Q100, FL-S
Package / Case	16-SOIC (0.295', 7.50mm Width)
Package	Tray
Operating Temperature	-40°C ~ 105°C (TA)

Product Attribute	Attribute Value
Mounting Type	Surface Mount
Memory Type	Non-Volatile
Memory Size	512Mbit
Memory Organization	64M x 8
Memory Interface	SPI - Quad I/O
Memory Format	FLASH
Clock Frequency	80 MHz
Base Product Number	S25FL512

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991B1A
HTSUS	8542.32.0071

Parts Introduction

S25FL512SDSMFB010 (1)

Manufacturer Part Number

S25FL512SDSMFB010

Manufacturer

infineon-technologies

Introduction

The S25FL512SDSMFB010 is a high-performance, 512Mbit FLASH memory chip designed for a range of electronic applications, featuring SPI - Quad I/O interface for efficient data transfer.

Product Features and Performance

Non-Volatile FLASH memory

512Mbit memory size

64M x 8 memory organization

SPI Quad I/O interface for faster data transfer

Supports clock frequencies up to 80 MHz for rapid read/write operations

Operates across a wide voltage range of 2.7V to 3.6V

Designed to perform reliably in operating temperatures from -40°C to 105°C

Product Advantages

High-density storage solution for sophisticated applications

Quad I/O interface allows for high-speed data communication

Wide operational temperature range suitable for automotive and industrial applications

AEC-Q100 qualification ensures automotive-grade reliability

Flexible voltage range accommodation

Key Technical Parameters

Memory Type: Non-Volatile, FLASH NOR

Memory Size: 512Mbit

Memory Organization: 64M x 8

Memory Interface: SPI Quad I/O

Clock Frequency: 80 MHz

Voltage Supply: 2.7V ~ 3.6V

Operating Temperature: -40°C ~ 105°C (TA)

Grade: Automotive

Mounting Type: Surface Mount

Quality and Safety Features

AEC-Q100 qualified for automotive use

Robust performance over a wide operating temperature range

Compatibility

Compatible with systems requiring high-speed, high-density non-volatile memory

Surface Mount 16-SOIC package for easy integration into various design layouts

Application Areas

Automotive electronics

Industrial control systems

High-performance computing platforms

IoT devices

Telecommunications infrastructure

Product Lifecycle

The chip is in the Active phase, with no current plans for discontinuation, ensuring long-term availability for projects and designs.

Several Key Reasons to Choose This Product

High storage capacity for complex data storage needs

Fast data transfer rates enhance system performance

Automotive-grade reliability supports mission-critical applications

Wide operating temperature range for use in extreme environments

Backed by Infineon Technologies, a leader in semiconductor solutions

Frequently Asked Questions(FAQ)

How does the S25FL512SDSMFB010 compare to other 512Mbit SPI NOR Flash devices in terms of interface bandwidth and power efficiency for automotive infotainment applications?: The S25FL512SDSMFB010 supports a Quad I/O SPI interface capable of 80 MHz clock speeds, enabling data transfer rates up to 320 Mbps (using DDR modes). This provides significantly higher bandwidth than standard SPI NOR flashes limited to single or dual I/O. Compared to similar-density devices like the S25FL256S or Winbond W25Q512JV, the Infineon part maintains this performance across a wider operating voltage range of 2.7V to 3.6V, which enhances power efficiency in battery-sensitive or always-on systems. Its AEC-Q100 Grade 1 qualification ensures reliability under thermal stress typical in automotive environments.

What are the key differences between the S25FL512SDSMFB010 and the base product S25FL512 in terms of packaging and environmental robustness?: While both share the same core architecture and memory density, the S25FL512SDSMFB010 is specifically packaged in a 16-SOIC (7.5mm width) tray configuration, whereas the base S25FL512 may be available in alternative packages such as SOIJ or larger TSSOP variants. More importantly, the "S" suffix in S25FL512SDSMFB010 indicates enhanced automotive compliance—this variant fully meets AEC-Q100 Grade 1 (-40°C to +105°C TA), includes extended endurance testing, and undergoes additional reliability screening absent from non-automotive S25FL512 parts.

Can the S25FL512SDSMFB010 reliably operate in high-vibration automotive environments, and what design considerations should engineers account for?: Yes, due to its AEC-Q100 qualification and robust package construction, the S25FL512SDSMFB010 is designed for harsh automotive conditions including mechanical shock and vibration. Engineers should still follow best practices: ensure proper PCB land pattern design per JEDEC standards, use adequate solder fillets, and avoid placing traces near board edges. Additionally, firmware should implement wear leveling and error correction if storing critical data, since flash memory has finite write cycles—typically rated for 100k program/erase cycles at full temperature extremes.

How does the S25FL512SDSMFB010 support secure code execution in modern vehicle ECUs compared to legacy SPI NOR solutions?: Unlike older SPI NOR memories that offered only basic protection registers, the S25FL512SDSMFB010 integrates hardware-based security features including unique device IDs, read/write protection bits, and optional sector locking. These enable secure boot implementations by allowing trusted code regions to be write-protected post-programming. When paired with an MCU supporting XIP (Execute In Place), it allows direct execution from flash without loading into RAM, reducing attack surface and improving real-time performance over buffered execution models used in lower-performance alternatives.

What is the impact of using the S25FL512SDSMFB010 in a cold-start automotive application where power supply ramps slowly?: The S25FL512SDSMFB010 supports a minimum VCC of 2.7V, but its absolute maximum rating specifies operation down to 1.65V during active commands. During cold starts, if VCC remains below 2.7V but above 1.65V, the device may enter a low-power state or fail to execute certain operations. Engineers must ensure stable supply rails before initiating communications and may need soft-start circuitry or delayed flash access in initial system bring-up sequences to prevent undefined behavior or corruption.

In what scenarios would the S25FL512SDSMFB010 outperform parallel NOR flash alternatives despite its narrower interface?: For cost-sensitive, space-constrained automotive designs such as body control modules or ADAS sensors, the S25FL512SDSMFB010 offers significant advantages over parallel NOR due to fewer pins (16 vs. 24–48), simpler PCB routing, and lower BOM cost. Despite the serial interface, its 80 MHz Quad I/O mode delivers sufficient bandwidth for boot code, calibration tables, and OTA updates. In systems where parallel flash would require additional decoupling capacitors, level shifters, and careful signal integrity planning, the serial solution reduces layout complexity while meeting timing requirements.

How does the Moisture Sensitivity Level (MSL) of 3 for the S25FL512SDSMFB010 affect handling during automotive production assembly?: With an MSL of 3, the S25FL512SDSMFB010 must be baked if stored beyond 168 hours (6 weeks) at 30°C/60% RH before reflow soldering. Automotive manufacturers typically enforce stricter handling protocols: components are often baked proactively, and floor life tracking is mandatory. Failure to adhere can lead to popcorning during reflow, causing delamination or electrical opens. Designers should coordinate with procurement teams to manage inventory turnover and ensure compliance with IPC/JEDEC J-STD-033 guidelines.

What trade-offs exist between using the S25FL512SDSMFB010 versus embedded eMMC or QSPI NAND for infotainment storage?: While eMMC offers higher density and better endurance, it introduces protocol overhead and lacks true random access speed. QSPI NAND provides faster writes but suffers from bad block management complexity and limited erase unit sizes. The S25FL512SDSMFB010 strikes a balance: it supports fast XIP execution, deterministic access times, and simple wear-leveling when used with host-managed firmware. However, it consumes more static power than NAND due to cell leakage, making it less ideal for ultra-low-power sleep modes common in always-connected vehicles.

Can multiple S25FL512SDSMFB010 devices be daisy-chained on the same SPI bus for expanded memory capacity?: Yes, the S25FL512SDSMFB010 supports daisy-chaining via its dedicated CS# (Chip Select) pin and internal address counters. Each device responds only when its individual CS# is asserted, allowing multiple chips to share MOSI/MISO/CLK lines. This reduces pin count on the microcontroller but requires careful attention to propagation delay and signal rise/fall times at 80 MHz. For two devices, total trace length differences should stay under 5 cm to maintain timing margins; otherwise, clock skew could cause data capture errors during high-speed transfers.

Why might an engineer choose the S25FL512SDSMFB010 over a similar-density SLC NAND despite NAND’s superior endurance?: The S25FL512SDSMFB010 provides deterministic read latency, no garbage collection overhead, and direct instruction execution—critical for safety-critical functions like brake control or engine management. While SLC NAND offers higher endurance (100k+ cycles), it requires complex wear-leveling algorithms and suffers from variable write latency. In contrast, the flash NOR’s byte-addressable nature simplifies software development and debugging. For applications where real-time predictability outweighs raw throughput, the S25FL512SDSMFB010’s architectural clarity justifies its selection even with lower raw write endurance.

How does the ECCN classification 3A991B1A influence export controls for the S25FL512SDSMFB010 in international automotive projects?: Classified under ECCN 3A991B1A, this part falls within “information storage devices” and is subject to U.S. export regulations administered by BIS. It does not require a license for most commercial end uses, including automotive electronics shipped to allied countries, but restrictions apply to certain military or surveillance applications. Engineers involved in global supply chains must verify final destination countries and ensure compliance with local import/export laws, especially when sourcing through third-party distributors outside North America or Europe.

What role does the “SMF” suffix play in the S25FL512SDSMFB010 part number, and how does it affect supply chain availability?: The “SMF” in S25FL512SDSMFB010 denotes the specific automotive-grade revision with extended temperature testing, conformal coating compatibility, and enhanced ESD protection. This variant is produced in lower volumes than consumer counterparts, increasing lead time sensitivity. Distributors may stock limited quantities, so designers should place early allocations or consider alternate sourcing strategies. The suffix also signals tighter quality traceability requirements, impacting supplier audits and failure analysis documentation needed for production release.

How should firmware handle sector protection states when using the S25FL512SDSMFB010 in a production line programming environment?: Before programming, all protected sectors must be unprotected using the Write Status Register command. The default state after power-up is typically unlocked, but some configurations may leave portions locked. After programming, reapply protection as needed via status register bits. Firmware must read the current protection status first to avoid unintended lockouts. For mass production, automated tools should include verification steps to confirm protection settings match intended configuration before shipping ECUs.

What are the implications of operating the S25FL512SDSMFB010 near its voltage limits during hot soak testing in an automotive thermal chamber?: Operating at 3.6V maximum or 2.7V minimum pushes the device close to spec boundaries. At 3.6V, internal regulation circuits draw slightly higher quiescent current, potentially affecting system-level power budgets. Near 2.7V, noise margin decreases, increasing susceptibility to supply ripple or crosstalk. During hot soak tests (e.g., 105°C), leakage currents rise, which can cause unexpected behavior if VCC fluctuates. Engineers should derate voltages slightly in critical applications and monitor supply stability under worst-case thermal conditions.

How does the S25FL512SDSMFB010 compare to newer Octal SPI devices like the S25FL256SAG in terms of scalability and future-proofing?: While the S25FL512SDSMFB010 uses a traditional Quad SPI interface, newer Octal SPI devices double the data path width, achieving theoretical speeds up to 666 Mbps. However, Octal SPI requires more pins and careful impedance matching. The S25FL512SDSMFB010 remains competitive for current-generation MCUs with limited SPI peripherals and moderate bandwidth needs. For future designs requiring >400 Mbps sustained throughput, migration to Octal SPI may be warranted, but for 80–160 Mbps applications common in mid-tier ECUs, the existing interface suffices with lower risk.

Parts with Similar Specifications

The three parts on the right have similar specifications to Infineon Technologies S25FL512SDSMFB010

Product Attribute
Part Number	S25FL512SDSMFV010	S25FL512SDSMFB013	S25FL512SDSMFBG10	S25FL512SDSMFM010
Manufacturer	Infineon Technologies	Infineon Technologies	Infineon Technologies	Infineon Technologies
Series	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Technology	-	-	-	-
Write Cycle Time - Word, Page	-	-	-	-
Clock Frequency	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Memory Organization	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Memory Type	-	-	-	-
Memory Interface	-	-	-	-
Memory Format	-	-	-	-
Memory Size	-	-	-	-
Voltage - Supply	-	-	-	-

S25FL512SDSMFB010 Datasheet PDF

Download S25FL512SDSMFB010 pdf datasheets and Infineon Technologies documentation for S25FL512SDSMFB010 - Infineon Technologies.

Datasheets: S25FL512S.pdf
PCN Assembly/Origin: Wafer Fab Site 06/Apr/2021.pdf
PCN Packaging: Ship Label REV.pdf Ship Label/Document Standardization 24/Jan/2018.pdf

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

Write a Review

Your Email address will not be published.

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

Use your express account for shipment if you have one.
Use our account for the shipment. Refer to the table below for the approximate charges.

(Different time frame / countries / package size has different price.)

Delivery Method

Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

QC (Quality Warranty)
Payment Support
Packaging
Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.

Strict quality inspection builds a solid foundation for electronic component quality.

Visual inspection
Performance testing and reliability verification
Standardized full-process testing
Precise control of every parameter

We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

Quality Inspection

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner

Efficient Supply Management
Cost-Saving Procurement
Fast Sourcing & Delivery

Contact us if you have any questions.

Phone: +00852 9146 4856
Email: info@allelco.com

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.

ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification

ISO 9001: 2015
ISO 13485: 2016
ISO 14001: 2015
ISO 28000: 2007
ISO 45001: 2018
GB/T 27922-2011

SMTA
IPC
ESD
PSMA