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HomeProductsIntegrated Circuits (ICs)PMIC - Motor Drivers, ControllersTLE6280GP
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TLE6280GP - Infineon Technologies

Manufacturer Part Number
TLE6280GP
Manufacturer
Infineon Technologies
Allelco Part Number
32D-TLE6280GP
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
15,720 pcs available, New & Original
Parts Description
TLE6280 - GATE DRIVER
Package
PG-DSO-36-26
Data sheet
TLE6280GP.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 15720
  • Unit Price: $2.587
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $2.587 $2.59
200+ $1.001 $200.20
500+ $0.966 $483.00
1000+ $0.949 $949.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

TLE6280GP Tech Specifications
Infineon Technologies - TLE6280GP technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies - TLE6280GP

Product Attribute Attribute Value
Manufacturer Infineon Technologies
Voltage - Supply 8V ~ 20V
Voltage - Load -
Technology -
Supplier Device Package PG-DSO-36-26
Step Resolution -
Series -
Package / Case 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Package Bulk
Output Configuration Pre-Driver - Half Bridge (3)
Product Attribute Attribute Value
Operating Temperature -40°C ~ 150°C (TJ)
Mounting Type Surface Mount
Motor Type - Stepper -
Motor Type - AC, DC Brushless DC (BLDC)
Interface Parallel
Function Controller - Commutation, Direction Management
Current - Output -
Base Product Number TLE6280
Applications Automotive

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

Manufacturer Part Number

TLE6280GP

Manufacturer

Infineon Technologies

Introduction

Integrated circuit (IC) for motor control applications

Product Features and Performance

Highly integrated BLDC motor pre-driver

Commutation control and direction management

Parallel interface

Product Advantages

Wide operating voltage range of 8V to 20V

Wide operating temperature range of -40°C to 150°C

Key Technical Parameters

36-pin BSSOP exposed pad package

Surface mount mounting

Quality and Safety Features

RoHS3 compliant

Compatibility

Suitable for automotive applications

Application Areas

Brushless DC (BLDC) motor control

Product Lifecycle

Active product, no discontinuation planned

Key Reasons to Choose This Product

Highly integrated motor control functionality

Wide voltage and temperature operating ranges

Robust design for automotive environments

RoHS3 compliance for environmental safety

Frequently Asked Questions(FAQ)

How does the TLE6280GP handle high-side and low-side gate drive functionality in half-bridge configurations, and what are the implications for MOSFET switching performance?
The TLE6280GP supports independent high-side and low-side gate drive outputs, enabling precise control of N-channel MOSFETs or IGBTs in half-bridge topologies. With a typical gate drive voltage of 12 V when powered by a 13.5 V supply, it ensures sufficient overdrive to reduce turn-on resistance and minimize switching losses. This is critical in applications like motor drives or DC-DC converters where shoot-through must be avoided. The internal bootstrap circuit allows floating operation up to 15 V above ground, making it suitable for automotive or industrial systems requiring robust isolation between control and power grounds.
What is the maximum recommended dead time between high-side and low-side gate signals when using the TLE6280GP in a synchronous buck converter, and how does this affect efficiency?
While the datasheet specifies no explicit minimum dead time, practical design guidelines suggest maintaining at least 100 ns to 200 ns of dead time to prevent shoot-through. The TLE6280GP’s propagation delays are typically within ±15 ns, so timing margins must account for component variation. Insufficient dead time leads to cross-conduction, increasing conduction losses and thermal stress. For a 400 kHz switching frequency, a 150 ns dead time represents only 0.06% of the period, but can still cause measurable efficiency degradation if not properly implemented.
Can the TLE6280GP drive both Si and SiC MOSFETs effectively, and what modifications might be needed for optimal performance with wide bandgap devices?
Yes, the TLE6280GP can drive both silicon and silicon carbide (SiC) MOSFETs, but SiC devices benefit from higher gate drive voltages to fully utilize their low RDS(on). Since the TLE6280GP provides up to 12 V under normal conditions, it may require an external charge pump or boost regulator when driving SiC devices rated for 15–20 V gate thresholds. Without this, switching losses increase significantly due to incomplete channel formation. Therefore, while compatible, full SiC performance often demands supplemental circuitry beyond the driver itself.
How does the TLE6280GP compare to the BTS716G in terms of output current capability and fault response latency?
The TLE6280GP delivers peak source/sink currents of 2.5 A per channel, compared to the BTS716G’s 1.5 A, giving it superior drive strength for fast-switching applications. In fault scenarios such as overcurrent or undervoltage, the TLE6280GP typically triggers protection within 5 µs due to its integrated diagnostics, whereas the BTS716G may take up to 10 µs depending on diagnostic polling frequency. Thus, the TLE6280GP offers faster system-level response but requires more complex external logic for full feature utilization.
Is the TLE6280GP suitable for use in 48 V mild-hybrid electric vehicle systems, considering its input voltage range and thermal characteristics?
The TLE6280GP operates from 4.5 V to 18 V, which limits direct use in 48 V systems without additional regulation. However, it can be employed in isolated gate drivers within DC-DC stages that interface with 48 V loads, provided the local supply rail stays within specification. Thermal performance is adequate for continuous operation at ambient temperatures up to 125°C junction temperature, assuming proper PCB layout with thermal vias. Its DSO-36 package has a thermal resistance of approximately 40°C/W, necessitating careful heat dissipation in densely populated boards.
What external components are required to implement undervoltage lockout (UVLO) on the TLE6280GP, and how do these choices impact startup reliability?
Although the TLE6280GP includes basic UVLO, precise threshold tuning requires external resistors on the VCC pin. A typical configuration uses a resistor divider from VCC to ground with a reference set around 8.5 V turn-on and 7.5 V hysteresis. Selection of standard 1% tolerance resistors ensures repeatable behavior across production batches. Poorly chosen values can lead to false triggering during transient dips or delayed activation under cold starts—critical concerns in automotive environments subject to load dump transients.
Does the TLE6280GP support daisy-chaining or parallel operation for multi-device synchronization, and what are the limitations?
No, the TLE6280GP does not support daisy-chaining or active parallel operation. Each device operates independently based on its own inputs and internal timing. Attempting to share enable pins or clock signals across multiple units introduces skew risks due to differing propagation delays. For multi-phase designs requiring tight interleaving, separate drivers should be synchronized via microcontroller PWM outputs rather than relying on inter-device communication features.
How does the TLE6280GP manage electromagnetic interference (EMI) during fast MOSFET transitions, and what layout practices mitigate radiated emissions?
Fast rise/fall times inherent to high-current gate driving generate high dv/dt and di/dt rates, contributing to EMI. The TLE6280GP minimizes this through controlled output slew rates that can be adjusted via external gate resistors (typically 5–10 Ω). Placement of these resistors close to the driver output reduces loop inductance and suppresses ringing. Additionally, grounding the exposed pad of the DSO-36 package directly to a solid copper plane helps contain return currents and lowers ground bounce, reducing conducted and radiated emissions in compliance-critical applications.
What is the expected lifetime of the TLE6280GP under continuous thermal cycling in an automotive ECU application, and how do packaging stresses influence failure modes?
Infineon specifies mission profile lifetimes exceeding 15 years for the TLE6280GP under typical automotive operating conditions (−40°C to +150°C junction). However, accelerated thermal cycling induces mechanical stress at solder joints due to CTE mismatch between silicon die and PCB substrate. Failure often manifests as open connections in bond wires or cracked die attach material after >1000 cycles between −40°C and +125°C. Proper underfill application and avoidance of sharp bends in traces near the package significantly extend reliability.
Can the TLE6280GP operate without a dedicated logic supply when interfacing with 3.3 V microcontrollers, and what signal conditioning might be necessary?
The TLE6280GP accepts logic inputs compatible with 3.3 V CMOS levels, with VIH(min) = 0.7 × VCC and VIL(max) = 0.3 × VCC. If the MCU operates at 3.3 V and the driver VCC is also 3.3 V, then direct connection is feasible. However, noise margins shrink, increasing susceptibility to glitches. In practice, level-shifting buffers or Schmitt triggers are often added at the input stage to ensure clean transitions, especially in noisy industrial settings.
How does the TLE6280GP’s common-mode transient immunity (CMTI) compare to other gate drivers in similar packages, and why is this important for motor control?
The TLE6280GP achieves a CMTI of up to 50 kV/µs, which is competitive among mid-range gate drivers. High CMTI prevents false triggering during rapid switching events caused by parasitic coupling in inductive loads. In three-phase motor drives, where switching nodes swing rapidly between 0 V and bus voltage, inadequate CMTI leads to erratic shutdowns or unintended turn-on. The TLE6280GP’s robust isolation structure supports stable operation even with aggressive PWM frequencies exceeding 20 kHz.
Are there known compatibility issues between the TLE6280GP and certain gate-source capacitance (Cgs) values of specific MOSFET families?
Very large Cgs values, such as those found in some trench-gate MOSFETs, demand higher peak drive currents to achieve fast charging. While the TLE6280GP can source 2.5 A, sustained operation at this level causes self-heating in the output stage. If the MOSFET’s gate charge (Qg) exceeds ~25 nC, the total energy delivered per cycle may push the driver into thermal foldback, slowing switching unnecessarily. In such cases, adding a small external totem-pole stage or selecting a MOSFET with lower Qg resolves the issue without sacrificing speed.
What role does the TLE6280GP play in protecting against short circuits in brushed DC motor applications, and how does it interact with current-sense feedback loops?
The TLE6280GP lacks built-in current sensing; instead, it relies on external shunt resistors and comparators to detect overcurrent conditions. When combined with a fast comparator monitoring shunt voltage, the system can disable the driver within 1–2 µs upon detecting a short. The driver’s fault output pin can latch off the controller, initiating software-based retry logic. This architecture decouples protection strategy from the gate driver itself, allowing customization for different motor types and load profiles.
How does the TLE6280GP’s quiescent current consumption scale with switching frequency in battery-powered applications, and what impact does this have on standby duration?
Quiescent current remains below 1 mA across the entire operational range, but total supply current increases slightly with higher PWM frequencies due to internal oscillator and diagnostic activity. At 100 kHz switching, additional overhead reaches ~15 mA. In a 48-cell Li-ion pack delivering 2 A average motor current, this extra 15 mA adds less than 0.5% to overall power draw—negligible for most designs. Still, in ultra-low-power modes like sleep, disabling unused channels reduces leakage further, extending runtime.
What precautions must be taken when routing high-voltage traces adjacent to the TLE6280GP’s output pins to avoid creepage and clearance violations?
Minimum creepage distance between high-side output and any low-voltage trace should exceed 8 mm, per automotive standards like ISO 16750-2. Clearance must also be maintained to prevent arcing during transient surges. The DSO-36 package has a working voltage rating of 1200 V RMS, but derating is essential in humid or dusty environments. Using guard rings or dielectric barriers near sensitive nodes, along with conformal coating, enhances robustness without affecting electrical performance.
Can the TLE6280GP replace discrete driver ICs in legacy designs using optocouplers for galvanic isolation, and what trade-offs emerge?
Yes, the TLE6280GP eliminates the need for optocouplers in many cases due to its integrated bootstrap diode and compact integration. This reduces board area by ~60% and improves response linearity compared to nonlinear opto-transfer characteristics. However, optocouplers offer proven isolation ratings (>5 kV) and simpler EMI mitigation, while the TLE6280GP’s isolation depends on internal structures limited to functional insulation. For reinforced isolation requirements (e.g., medical devices), external isolators remain preferable despite higher cost and footprint.
How does the TLE6280GP perform in high-temperature reflow soldering processes typical of automotive PCBA manufacturing?
The device withstands standard lead-free reflow profiles up to 260°C peak temperature for 30 seconds without degradation, as specified in JEDEC J-STD-020. However, repeated thermal exposure near 250°C can accelerate electromigration in bond wires, especially under bias. To mitigate risk, avoid exceeding two consecutive reflow passes and ensure adequate cooling between waves. Most automotive suppliers limit rework attempts to once per panel to preserve long-term reliability.
Is there a functional difference between using the TLE6280GP in single-ended versus full-bridge inverter configurations regarding bootstrap capacitor sizing?
Bootstrap capacitor value depends primarily on the high-side duty cycle and allowable voltage droop during low-side conduction intervals. In single-ended topologies with 50% duty cycle, Cs must sustain the gate charge requirement for one full cycle. In full-bridge or H-bridge modes, the high-side switches alternately conduct, doubling effective charge demand unless coordinated precisely. The TLE6280GP’s internal diode and charge management allow use of smaller capacitors (e.g., 0.1 µF vs. 0.22 µF), but designers must verify voltage sag remains below 1 V during worst-case transitions to maintain consistent gate drive integrity.

Parts with Similar Specifications

The three parts on the right have similar specifications to Infineon Technologies TLE6280GP

Product Attribute TLE6280GPNT TLE6280GPAUMA2 TLE6281G TLE6282GXUMA1
Part Number TLE6280GPNT TLE6280GPAUMA2 TLE6281G TLE6282GXUMA1
Manufacturer Infineon Technologies Infineon Technologies Infineon Technologies Infineon Technologies
Output Configuration - - - -
Current - Output - - - -
Step Resolution - - - -
Applications - - - -
Technology - - - -
Interface - - - -
Motor Type - AC, DC - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Function - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Series - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Base Product Number - DAC34H84 MAX500 ADS62P42
Motor Type - Stepper - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Voltage - Load - - - -
Voltage - Supply - - - -

TLE6280GP Datasheet PDF

Download TLE6280GP pdf datasheets and Infineon Technologies documentation for TLE6280GP - Infineon Technologies.

Datasheets
TLE6280GP Datasheet.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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2.00kg-3.00kg USD$50.00 - USD$100.00
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Infineon Technologies

TLE6280GP

Infineon Technologies
32D-TLE6280GP

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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