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HomeProductsIntegrated Circuits (ICs)Interface - Drivers, Receivers, TransceiversTLE7259-2GE
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TLE7259-2GE - Infineon Technologies

Manufacturer Part Number
TLE7259-2GE
Manufacturer
Infineon Technologies
Allelco Part Number
32D-TLE7259-2GE
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
5,730 pcs available, New & Original
Parts Description
DEV KIT TOOL KIT PWR MGMT
Package
Box
Data sheet
TLE7259-2GE.pdf

PCN Packaging

Ship Label REV.pdf
RoHs Status
ROHS3 Compliant
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In stock: 5730

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Specifications

TLE7259-2GE Tech Specifications
Infineon Technologies - TLE7259-2GE technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies - TLE7259-2GE

Product Attribute Attribute Value
Manufacturer Infineon Technologies
Series *
Product Attribute Attribute Value
Package Box

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
REACH Status REACH Unaffected
ECCN OBSOLETE

Parts Introduction

Manufacturer Part Number

TLE7259-2GE

Manufacturer

infineon-technologies

Introduction

The TLE7259-2GE is a LIN transceiver designed by Infineon Technologies, specialized for reliable communication in automotive applications.

Product Features and Performance

Robust LIN transceiver for automotive applications

Handles LIN protocol communication effectively

Optimized for low electromagnetic emission

Integrated features for enhanced signal integrity

Product Advantages

High reliability in automotive environment

Superior electromagnetic compatibility (EMC)

Key Technical Parameters

Supply Voltage: 5.5V to 27V

Operating Temperature: -40°C to 150°C

LIN Bus Pin: protected against transients in automotive environments

Dominant Time-Out (DTO) function

Quality and Safety Features

Built with fail-safe features

Compliant with LIN 2.x and SAE J2602

Extensive protection against transients and other harsh conditions

Compatibility

Compatible with different microcontroller environments within automotive systems

Application Areas

Automotive communication systems

Network nodes in vehicles

Product Lifecycle

Product Status: Obsolete

No longer being manufactured, but potential alternatives or replacements may be available

Several Key Reasons to Choose This Product

Robust performance suitable for strenuous automotive applications

High compatibility and integration capabilities with various vehicle architectures

Proven reliability in field with protection features against common automotive disturbances

Frequently Asked Questions(FAQ)

What are the key electrical characteristics and performance limits of the TLE7259-2GE for use in automotive high-side switch applications?
The TLE7259-2GE supports a wide operating voltage range from 4.5 V to 36 V, making it suitable for automotive systems with load dump transients. Its output current capability is up to 1.5 A continuous at 25°C, with peak current handling of up to 10 A for brief durations, ensuring robust performance under fault conditions. The device features a low on-resistance (RDS(on)) of approximately 180 mΩ typical at 14 V gate drive, which minimizes conduction losses during high-current switching. Additionally, it includes integrated protection mechanisms such as overcurrent, overtemperature, and short-circuit detection, enhancing system reliability in harsh environments.
How does the TLE7259-2GE compare to alternative Infineon high-side switches like the TLE7259-3GE in terms of functionality and application suitability?
While both the TLE7259-2GE and TLE7259-3GE belong to Infineon’s TLE725x family and share core features such as ISO 7637 compliance and thermal shutdown, the TLE7259-2GE lacks diagnostic feedback capabilities present in the -3GE variant. Specifically, the -2GE does not provide status signals via an enable or diagnostic pin, limiting its use in systems requiring real-time fault monitoring. In contrast, the -3GE supports open-load detection and active diagnostics, making it more appropriate for safety-critical automotive applications. Therefore, the choice between them depends on whether diagnostic integration is essential for the design.
What layout and thermal considerations should be prioritized when integrating the TLE7259-2GE into a PCB design for optimal performance and longevity?
Due to its power dissipation capabilities—especially under continuous high-load conditions—the TLE7259-2GE requires careful thermal management. A solid copper pour on the power and ground planes adjacent to the IC package helps dissipate heat efficiently. The recommended thermal pad must be connected to a large ground plane with multiple vias to reduce junction temperature rise. For sustained loads above 1 A, external heatsinking or proximity to other thermal mass may be necessary. Layout should also minimize parasitic inductance in high-current loops to prevent voltage spikes and ensure stable operation during switching transitions.
Is the TLE7259-2GE compatible with 12 V and 24 V automotive battery systems, and what are the implications for EMC and transient protection?
Yes, the TLE7259-2GE is specifically designed for 12 V and 24 V automotive environments, supporting input voltages up to 36 V to accommodate load dump events per ISO 7637-2. This broad voltage tolerance ensures reliable switching across various vehicle platforms without additional clamping circuits. However, due to its unidirectional protection architecture, designers must still implement external TVS diodes or transient suppressors at the load side if reverse-polarity or inductive kickback exceeds the internal limits. The device’s built-in slew rate control also aids in reducing electromagnetic interference during turn-on and turn-off.
Can the TLE7259-2GE be used in parallel configurations to increase current handling, and what precautions are necessary to maintain balance and reliability?
Parallel operation of TLE7259-2GE devices is technically possible but requires careful current sharing due to potential mismatches in threshold voltages and RDS(on) variations between channels. Without external ballast resistors or matched gate drivers, one device may carry disproportionate current, leading to localized heating and reduced lifespan. To mitigate this, each channel should have individual gate resistance tuning and possibly sense resistors for current monitoring. Additionally, thermal coupling between devices improves dynamic current sharing. Given these challenges, paralleling is generally discouraged unless absolutely necessary, and simulation or prototype validation under worst-case conditions is strongly advised.
What role does the TLE7259-2GE play in enabling smart actuator control within modern automotive body electronics architectures?
The TLE7259-2GE functions as a monolithic high-side switch optimized for driving resistive or inductive loads such as relays, solenoids, and motors in door modules, seat controls, or lighting systems. Its integrated charge pump allows full enhancement of the MOSFET even at low supply voltages, ensuring strong drive strength across temperature ranges. Combined with short-circuit robustness and thermal foldback, it enables compact, fault-tolerant designs that comply with automotive quality standards. By replacing discrete transistor solutions, it reduces component count, simplifies diagnostics, and supports functional safety goals in distributed control networks.
How does the absence of diagnostic feedback in the TLE7259-2GE impact system-level troubleshooting and functional safety certification efforts?
Unlike variants with open-load or overcurrent reporting, the TLE7259-2GE provides only basic enable/disable control without status indication. This limits visibility into operational faults during post-deployment analysis or during manufacturing test routines. As a result, system architects must rely on external monitoring circuitry—such as current-sense resistors with comparators—to detect failures. For applications targeting ISO 26262 compliance, this increases verification complexity and may require additional safety mechanisms to meet ASIL requirements. Thus, the lack of internal diagnostics shifts responsibility for fault coverage to the surrounding logic, potentially increasing BOM cost and design effort.
Are there any known limitations or failure modes associated with prolonged operation at elevated ambient temperatures when using the TLE7259-2GE?
The TLE7259-2GE includes thermal shutdown at approximately 175°C junction temperature, providing protection against overheating. However, prolonged exposure to high ambient temperatures—especially above 85°C—reduces available current margin due to increased RDS(on) and accelerated degradation of internal passivation layers. At 125°C ambient, continuous output current may need derating by 30–40% compared to 25°C ratings. Designers should account for worst-case airflow, mounting orientation, and neighboring heat sources in enclosure thermal models to avoid unintended thermal throttling or premature failure.
What are the recommended gate drive strategies when interfacing the TLE7259-2GE with microcontroller units (MCUs) or gate driver ICs in mixed-voltage systems?
Since the TLE7259-2GE has an internal charge pump, its gate drive is largely self-contained, but external gate resistors (typically 5 Ω to 22 Ω) are advisable to dampen ringing and reduce EMI during switching. When driven directly by an MCU GPIO, ensure the logic level matches the required turn-on threshold (above 4.5 V). For systems with 3.3 V microcontrollers, no additional level shifting is needed due to the IC’s wide VCC tolerance. However, during startup or brownout conditions, ensure that the EN pin remains stable to prevent unintended switching. Decoupling capacitors near the VCC pin are critical for maintaining charge pump stability under dynamic loads.
How does the TLE7259-2GE handle inductive load switching, and what external components are necessary to protect against back EMF and voltage transients?
The TLE7259-2GE includes built-in flyback diode functionality through its internal body diode, allowing safe commutation of inductive loads without external diodes. However, for faster energy dissipation and improved efficiency, especially in high-frequency switching, an external fast-recovery or Schottky diode across the load is recommended. Additionally, snubber networks (e.g., RC filters) may be added near the output to suppress ringing caused by parasitic inductance in long traces. Despite internal protections, sustained inductive kickback above the clamped voltage can stress the device over time, so proper PCB routing and transient suppression remain essential.
What environmental and regulatory qualifications does the TLE7259-2GE possess, and how do they influence deployment in global automotive markets?
The TLE7259-2GE is RoHS3 compliant and unaffected by REACH regulations, meeting EU directives for hazardous substance restriction. It is also qualified under AEC-Q100 Grade 1 (−40°C to +125°C), ensuring reliability in engine compartments and passenger cabins. Although marked as OBSOLETE in some regions, it remains available through authorized distributors for legacy designs. Manufacturers must verify current production status and consider migration paths to newer derivatives if long-term supply continuity is required. These qualifications support worldwide deployment but do not guarantee future availability or compatibility with evolving OEM specifications.
Can the TLE7259-2GE operate reliably in systems with frequent cold cranking or voltage dips, and what design safeguards are typically employed?
Yes, the TLE7259-2GE is engineered to withstand cold crank events down to 4.5 V, enabling activation during starter motor engagement. Its robust gate drive maintains sufficient VGS even at marginal supply levels, preserving turn-on integrity. To enhance resilience during deep discharges or jump-start scenarios, designers often include bulk capacitance near the input and use soft-start circuitry on the EN pin. Some implementations integrate precharge stages or crowbar protection to prevent inrush currents from damaging upstream components. These measures ensure stable operation across the full range of automotive power anomalies without compromising switching performance.
What are the differences between the TLE7259-2GE and industrial-grade alternatives like the TLE7259-2SL in terms of qualification and intended use?
The TLE7259-2GE is targeted at automotive applications with AEC-Q100 qualification, whereas the TLE7259-2SL serves non-automotive industrial markets and may lack automotive-specific testing. While electrical performance is similar—including voltage range and current capability—the SL version typically omits ISO 7637 immunity testing and operates over a narrower ambient temperature range (often −40°C to +85°C). Additionally, the GE variant emphasizes functional safety integration and longer lifecycle support, making it preferable for mission-critical vehicle systems. Choosing the wrong variant could lead to field failures or non-compliance during homologation processes.
How should the enable (EN) pin of the TLE7259-2GE be managed during system initialization or reset sequences to avoid spurious switching?
The EN pin has a defined threshold (typically 1.2 V to 2.0 V for turn-on), but noise or floating states during power-up can cause unintended activation. To prevent this, connect the EN pin through a pull-down resistor (e.g., 10 kΩ) to GND and optionally add a small capacitor (0.1 µF) to filter glitches. Alternatively, drive the EN signal from a microcontroller with controlled sequencing during boot-up. This ensures deterministic behavior and prevents premature load energization before the rest of the system is ready, reducing risks of short circuits or data corruption in communication buses.
What are the implications of selecting the TLE7259-2GE over discrete MOSFET solutions in terms of board space, cost, and system complexity?
Integrating the TLE7259-2GE reduces component count by replacing multiple discretes (MOSFET, gate driver, protection diodes, and resistors) into a single package. This leads to smaller PCBs, lower assembly costs, and simplified thermal design. However, the IC’s fixed protection thresholds and lack of configurability may limit flexibility compared to custom discrete implementations. For low-volume or prototyping phases, discretes offer easier debugging, but for mass-produced automotive modules, the TLE7259-2GE delivers superior reliability and reduced development time despite a higher unit cost.

Parts with Similar Specifications

The three parts on the right have similar specifications to Infineon Technologies TLE7259-2GE

Product Attribute TLE72592GEXUMA1 TLE72592GEXUMA4 TLE7259-2GU TLE72592GUXUMA1
Part Number TLE72592GEXUMA1 TLE72592GEXUMA4 TLE7259-2GU TLE72592GUXUMA1
Manufacturer Infineon Technologies Infineon Technologies Infineon Technologies Infineon Technologies
Series - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)

TLE7259-2GE Datasheet PDF

Download TLE7259-2GE pdf datasheets and Infineon Technologies documentation for TLE7259-2GE - Infineon Technologies.

PCN Packaging
Ship Label REV.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
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New Zealand 5
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Middle East Israel 6
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Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
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Infineon Technologies

TLE7259-2GE

Infineon Technologies
32D-TLE7259-2GE

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