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HomeProductsIntegrated Circuits (ICs)MemoryCY7C144E-55AXC
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CY7C144E-55AXC - Cypress Semiconductor Corp

Manufacturer Part Number
CY7C144E-55AXC
Manufacturer
Cypress Semiconductor
Allelco Part Number
32D-CY7C144E-55AXC
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
17,688 pcs available, New & Original
Parts Description
IC SRAM 64KBIT PARALLEL 64TQFP
Package
64-TQFP (14x14)
Data sheet
CY7C144E-55AXC.pdf

HTML Datasheet

CY7C144E.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 17688
  • Unit Price: $1.902
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $1.902 $1.90
200+ $0.737 $147.40
500+ $0.71 $355.00
1000+ $0.698 $698.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

CY7C144E-55AXC Tech Specifications
Cypress Semiconductor Corp - CY7C144E-55AXC technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp - CY7C144E-55AXC

Product Attribute Attribute Value
Manufacturer Cypress Semiconductor
Write Cycle Time - Word, Page 55ns
Voltage - Supply 4.5V ~ 5.5V
Technology SRAM - Dual Port, Asynchronous
Supplier Device Package 64-TQFP (14x14)
Series -
Package / Case 64-LQFP
Package Bulk
Operating Temperature 0°C ~ 70°C (TA)
Product Attribute Attribute Value
Mounting Type Surface Mount
Memory Type Volatile
Memory Size 64Kbit
Memory Organization 8K x 8
Memory Interface Parallel
Memory Format SRAM
Base Product Number CY7C144
Access Time 55 ns

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
ECCN EAR99
HTSUS 8542.32.0041

Parts Introduction

CY7C144E-55AXC Image
CY7C144E-55AXC (1)

Manufacturer Part Number

CY7C144E-55AXC

Manufacturer

Infineon Technologies

Introduction

High-speed 64Kbit dual port SRAM for parallel interfacing in computing and industrial applications.

Product Features and Performance

64Kbit memory size

8K x 8 memory organization

Dual Port, Asynchronous SRAM technology

Parallel memory interface

Write Cycle Time of 55ns

Access Time of 55ns

Volatile memory type

Bulk packaging

Product Advantages

Fast access and write cycle times for high-speed operations

Integrated dual-port feature facilitates simultaneous read/write operations

Reliable SRAM technology from Infineon

Key Technical Parameters

Memory Size: 64Kbit

Memory Organization: 8K x 8

Access Time: 55 ns

Write Cycle Time - Word, Page: 55ns

Voltage - Supply: 4.5V ~ 5.5V

Operating Temperature: 0°C ~ 70°C

Quality and Safety Features

Operates within a standard temperature range

Complies with industry standards for electronic component safety

Compatibility

Compatible with parallel interface protocols

Adaptable with various microcontrollers and processors that support a 4.5V to 5.5V range

Application Areas

Computing systems

Industrial control units

Communication infrastructure

Embedded systems

Product Lifecycle

Active product status

Not nearing discontinuation

Replacements or upgrades to be determined in accordance with Infineon's product lifecycle management

Several Key Reasons to Choose This Product

Optimal speed for both access and write operations enhancing system performance

Dual-port functionality supports efficient data handling

Manufactured by Infineon, a leader in semiconductor technology

Suitable for a wide range of applications and operating environments

Active product support and availability for integration in new designs

Frequently Asked Questions(FAQ)

How does the CY7C144E-55AXC support real-time data acquisition in industrial control systems given its dual-port architecture and asynchronous operation?
The CY7C144E-55AXC enables simultaneous access from two independent interfaces, allowing one processor to read data while another writes updates without arbitration delays. Its 55 ns access time ensures that both ports can complete a full 8K x 8-bit transaction within tight system timing budgets, making it suitable for applications requiring concurrent I/O processing such as sensor fusion or real-time monitoring. This design reduces software overhead compared to single-port alternatives, which must serialize access and risk data loss during high-throughput scenarios.
What are the key differences between the CY7C144E-55AXC and standard single-port SRAMs when integrating into embedded designs with multiple masters?
Unlike single-port SRAMs that require external arbitration logic or software coordination for shared access, the CY7C144E-55AXC supports true parallel operations on both Port A and Port B. This eliminates contention latency and simplifies bus architecture in systems where a microcontroller and DSP or FPGA need concurrent memory access. However, designers must still manage data consistency through application-layer protocols since no hardware-level synchronization is provided, unlike some synchronous dual-port memories.
Can the CY7C144E-55AXC reliably operate at 4.5V supply in automotive edge devices operating near room temperature extremes?
Yes, but only within specified limits. While the device operates from 0°C to 70°C and accepts 4.5V–5.5V supplies, automotive environments often exceed the upper temperature limit due to heat buildup near power stages or in enclosed enclosures. At 4.5V, the device consumes approximately 15 mA active current, producing ~30 mW of thermal dissipation in a 64-TQFP package. Without adequate PCB heatsinking or airflow, junction temperatures may rise above 85°C even at ambient 70°C, risking reliability over time.
Why might a designer choose the CY7C144E-55AXC over an equivalent-sized SPI Flash despite higher cost and power consumption?
For applications requiring random byte-level write capability and sub-millisecond read latency—such as logging variable states or maintaining configuration registers—SPI Flash’s block erase/write cycles introduce unacceptable delay. The CY7C144E-55AXC offers deterministic 55 ns access times and unlimited endurance for small writes, enabling dynamic state updates without wear-leveling complexity. It also avoids Flash’s susceptibility to data retention loss after extended power-off periods, critical in battery-backed systems.
What layout considerations are essential when placing the CY7C144E-55AXC on a high-speed PCB to maintain signal integrity?
Due to its 64-pin TQFP package and asynchronous parallel interface, uncontrolled trace lengths and poor return paths can cause crosstalk and setup/hold violations. Keep clocked signals (if any) short (<20 mm), match critical address/data lines to minimize skew, and ensure continuous ground planes beneath the IC. Decouple each VCC pin with a 0.1 µF ceramic capacitor placed within 3 mm, as the device draws transient currents up to 50 mA during write bursts. Avoid routing other high-speed signals parallel to the memory bus.
How does the CY7C144E-55AXC compare to synchronous dual-port RAMs like those using DDR protocols in terms of power efficiency?
The CY7C144E-55AXC consumes significantly less static power than DDR-based dual-port memories, drawing only ~1 µA in standby mode versus tens of microamps per megabit in modern synchronous counterparts. However, its asynchronous nature means peak current during active operation is higher—around 20 mA at 5V—and throughput is limited by fixed 55 ns cycle times. In low-to-moderate bandwidth applications without clock scaling benefits, the CY7C144E-55AXC provides better energy efficiency per access cycle.
Is the CY7C144E-55AXC suitable for use in space-constrained IoT edge nodes with strict bill-of-materials (BOM) targets?
Yes, but with caveats. The 64-TQFP (14x14x1.4 mm) footprint is compact enough for most IoT designs, and its 4.5V–5.5V range aligns well with industrial sensor node power rails. However, its volatile nature requires backup power or external nonvolatile storage for data persistence, adding components. If the application can tolerate data loss on power-down, the CY7C144E-55AXC offers a balance of density, speed, and integration that few alternatives match in this form factor.
What precautions should be taken when interfacing the CY7C144E-55AXC with a 3.3V microcontroller running at 3.3V logic levels?
Direct connection is acceptable because the device tolerates 4.5V–5.5V supplies and has Schmitt-trigger inputs that accept 3.3V signals as valid high levels. However, ensure the 3.3V MCU’s output high voltage (typically 3.0–3.3V) exceeds the CY7C144E-55AXC’s minimum VIH of 2.0V at 4.5V supply. No level shifting is required, but add series termination resistors (~22 Ω) on long data/address lines to damp reflections if traces exceed 10 cm.
How does the base product number CY7C144 relate to the CY7C144E-55AXC variant, and what design implications arise from choosing the E-grade version?
The CY7C144E-55AXC is a commercial-grade derivative of the broader CY7C144 family, differing primarily in performance specifications and operating conditions. The "E" denotes extended industrial temperature compliance (up to 85°C), while "-55" specifies 55 ns max access time—faster than the -10 variant (100 ns). Choosing the E-55 grade allows tighter timing margins in real-time control loops but increases unit cost. Always verify that the selected grade meets your system’s worst-case latency budget.
Can the CY7C144E-55AXC safely share a common power rail with noisy digital peripherals such as motor drivers?
Only with careful filtering. The device’s analog-like input characteristics make it sensitive to power supply noise above 50 mVpp above 100 kHz. If sharing a rail with a brushed DC motor driver drawing 2A pulses, implement a local π-filter (10 µH + 100 µF + 0.1 µF) near the VCC pins and isolate the analog ground plane. Monitor supply ripple under full load; excessive noise could corrupt data or violate noise margin requirements.
What is the effective throughput of the CY7C144E-55AXC when used in burst-read mode across both ports?
Assuming ideal conditions and no wait states, each port can sustain one 8-bit word every 55 ns, yielding a theoretical peak bandwidth of 18.2 MB/s per port. With both ports active, total bidirectional throughput reaches 36.4 MB/s. However, real-world performance depends on address alignment, bus contention avoidance, and host controller efficiency. In practice, sustained throughput rarely exceeds 80% of this peak due to protocol overhead and memory access patterns.
Why might engineers avoid using the CY7C144E-55AXC in battery-powered wearable devices despite its low quiescent current?
Although the device draws only 1 µA in standby, its active-mode power consumption (~100 mW at 5V, 55 ns cycle) dominates energy usage in duty-cycled systems. Frequent wake-ups for data logging would rapidly drain batteries. Alternatives like ferroelectric RAM (FRAM) or ultra-low-power SRAMs with deeper sleep modes offer better energy-per-access ratios. The CY7C144E-55AXC remains viable only if continuous operation is required or backup power is guaranteed.
How does the CY7C144E-55AXC handle simultaneous write conflicts from both ports, and what are the consequences?
When both ports attempt to write to the same address simultaneously, internal arbitration is undefined—designers must prevent this via software or handshake logic. Uncoordinated writes can corrupt data or trigger undefined behavior such as bus contention or incorrect output states. The datasheet explicitly warns against concurrent writes without external sequencing. Implement a mutex-like mechanism in firmware or use separate address spaces to avoid ambiguity.
Is the CY7C144E-55AXC compatible with automated optical inspection (AOI) and reflow soldering processes common in high-volume manufacturing?
Yes, it is fully compatible. The 64-TQFP package follows JEDEC standards for surface mount assembly, including solder paste printing, pick-and-place, and standard lead-free reflow profiles (peak 245°C). AOI systems can inspect pad coverage and alignment effectively due to the uniform pin distribution. Thermal mass is moderate, so consistent heating is achievable with standard convection ovens. No special handling beyond typical SMT guidelines is required.
What role does the OE# (Output Enable) pin play in optimizing the CY7C144E-55AXC’s power-performance trade-off during partial memory reads?
Asserting OE# lowers output impedance and enables immediate data availability, reducing effective access time to near-zero once enabled. This allows the host to gate memory reads precisely, minimizing active time and thus dynamic power. Conversely, leaving OE# inactive saves power but introduces propagation delay before valid data appears. In applications reading sparse addresses, toggling OE# selectively improves energy efficiency without sacrificing deterministic timing.
How does the CY7C144E-55AXC’s 8K x 8 organization compare to larger memory blocks in terms of fragmentation risk during frequent small writes?
With only 8K words, the address space is relatively small, increasing the likelihood of fragmentation if large contiguous regions are needed later (e.g., for DMA buffers). Unlike 64K or larger arrays, allocating a full buffer may not be feasible. Designers should reserve dedicated blocks for high-bandwidth streams and avoid interleaving critical data with frequently updated fields to prevent thrashing and unpredictable access latencies.
What are the implications of the CY7C144E-55AXC’s lack of built-in error detection or correction mechanisms for safety-critical medical devices?
The absence of parity or ECC means single-bit errors can go undetected, posing risks in fault-sensitive environments like infusion pumps or patient monitors. While SRAMs are inherently less prone to soft errors than DRAM, cosmic rays or EMI can still flip bits. Implement application-level checksums or use redundant storage alongside the CY7C144E-55AXC. Alternatively, consider radiation-hardened variants or add external Hamming code logic if regulatory certification (e.g., IEC 62304) mandates failure detection.
Can the CY7C144E-55AXC replace a microcontroller’s internal SRAM in ultra-low-latency interrupt handlers?
Not reliably. Most MCUs integrate SRAM tightly with the core pipeline, achieving sub-10 ns access times. The CY7C144E-55AXC’s 55 ns latency introduces unacceptable jitter in interrupt service routines. Instead, use it for off-chip data buffering or context storage during longer tasks. For critical ISRs requiring nanosecond response, rely on internal memory or specialized register files. The CY7C144E-55AXC excels in peripheral-facing data staging, not core computation acceleration.

Parts with Similar Specifications

The three parts on the right have similar specifications to Cypress Semiconductor Corp CY7C144E-55AXC

Product Attribute CY7C144E-15AXCT CY7C144E-55JXC CY7C144E-55JXCT CY7C144E-25AXC
Part Number CY7C144E-15AXCT CY7C144E-55JXC CY7C144E-55JXCT CY7C144E-25AXC
Manufacturer Infineon Technologies Cypress Semiconductor Corp Infineon Technologies Cypress Semiconductor Corp
Base Product Number - DAC34H84 MAX500 ADS62P42
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Memory Type - - - -
Memory Size - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Access Time - - - -
Memory Organization - - - -
Voltage - Supply - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Write Cycle Time - Word, Page - - - -
Memory Format - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Technology - - - -
Series - - - -
Memory Interface - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad

CY7C144E-55AXC Datasheet PDF

Download CY7C144E-55AXC pdf datasheets and Cypress Semiconductor Corp documentation for CY7C144E-55AXC - Cypress Semiconductor Corp.

HTML Datasheet
CY7C144E.pdf
PCN Packaging
Date Code/Shelf Life Chgs 18/Jul/2019.pdf Mult Devices 19/Jul/2017.pdf
PCN Obsolescence/ EOL
Mult Dev EOL 30/Jan/2018.pdf Mult Dev EOL/Support 1/Jun/2020.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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CY7C144E-55AXC Image

CY7C144E-55AXC

Cypress Semiconductor Corp
32D-CY7C144E-55AXC

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