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HomeProductsIntegrated Circuits (ICs)MemoryCY7C199-15ZI
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CY7C199-15ZI - Cypress Semiconductor Corp

Manufacturer Part Number
CY7C199-15ZI
Manufacturer
Cypress Semiconductor
Allelco Part Number
32D-CY7C199-15ZI
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
32,654 pcs available, New & Original
Parts Description
IC SRAM 256KBIT PAR 28TSOP I
Package
28-TSOP I
Data sheet
-
RoHs Status
 
Our certification
In stock: 32654

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Specifications

CY7C199-15ZI Tech Specifications
Cypress Semiconductor Corp - CY7C199-15ZI technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp - CY7C199-15ZI

Product Attribute Attribute Value
Manufacturer Cypress Semiconductor
Write Cycle Time - Word, Page 15ns
Voltage - Supply 4.5V ~ 5.5V
Technology SRAM - Asynchronous
Supplier Device Package 28-TSOP I
Series -
Package / Case 28-TSSOP (0.465", 11.80mm Width)
Package Bulk
Operating Temperature -40°C ~ 85°C (TA)
Product Attribute Attribute Value
Mounting Type Surface Mount
Memory Type Volatile
Memory Size 256Kbit
Memory Organization 32K x 8
Memory Interface Parallel
Memory Format SRAM
Base Product Number CY7C199
Access Time 15 ns

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Affected
ECCN EAR99
HTSUS 8542.32.0041

Parts Introduction

CY7C199-15ZI Image
CY7C199-15ZI (1)

Manufacturer Part Number

CY7C199-15ZI

Manufacturer

Cypress Semiconductor

Introduction

High-performance 256Kbit SRAM with parallel interface

Designed for a wide range of embedded applications

Product Features and Performance

256Kbit of high-speed SRAM storage

Asynchronous SRAM architecture

Fast access time of 15ns

Wide operating voltage range of 4.5V to 5.5V

Supports word and page write cycles in 15ns

32K x 8 memory organization

Parallel memory interface

Product Advantages

Reliable and high-performance SRAM solution

Wide temperature range of -40°C to 85°C

Suitable for various embedded applications

Cost-effective and easy to integrate

Key Technical Parameters

Memory Size: 256Kbit

Access Time: 15ns

Memory Organization: 32K x 8

Supply Voltage: 4.5V to 5.5V

Operating Temperature: -40°C to 85°C

Quality and Safety Features

RoHS non-compliant

28-TSOP I package

Compatibility

Surface mount package (28-TSSOP)

Suitable for a variety of embedded systems

Application Areas

Embedded systems

Networking equipment

Industrial automation

Telecommunications equipment

Computer peripherals

Product Lifecycle

Currently available

No information on discontinuation or replacement

Several Key Reasons to Choose This Product

High-performance SRAM with fast access time

Wide operating voltage and temperature range

Reliable and cost-effective solution for embedded applications

Easy to integrate into various systems

Suitable for a wide range of industrial and commercial applications

Frequently Asked Questions(FAQ)

How does the CY7C199-15ZI compare to other SRAM components in terms of access time and power consumption when used in high-speed embedded systems?
The CY7C199-15ZI offers a maximum access time of 15 ns, which positions it as a moderate-performance SRAM suitable for applications requiring faster read/write cycles than standard commodity parts but without the ultra-low latency of cache memory. This access time balances speed with power efficiency, particularly when compared to older or slower SRAMs that may exhibit 20 ns or higher delays. In typical embedded workloads such as real-time data buffering, this enables reliable operation at clock frequencies up to approximately 66 MHz, assuming tight timing margins. Compared to lower-latency alternatives like pipelined or zero-wait-state SRAMs, the 15 ns delay introduces minimal overhead, but it generally consumes less dynamic power due to simpler internal architecture and absence of advanced prefetch logic. When evaluating alternatives, designers should consider whether the 15 ns window aligns with their system’s critical path requirements—especially in microcontroller-based designs where cycle budgeting is tight.
What are the key considerations when selecting the CY7C199-15ZI for industrial temperature applications, and how does its operating range impact long-term reliability?
The CY7C199-15ZI is specified for operation across a commercial temperature range of 0°C to +70°C, which limits its suitability for harsh environments such as automotive under-hood systems or outdoor instrumentation exposed to ambient thermal extremes. While this range supports most consumer and general industrial use cases, extended temperatures beyond this interval may cause data retention issues or increased failure rates due to accelerated electromigration and reduced noise margins. For applications requiring wider thermal resilience, alternative components from the same family with industrial-grade variants (e.g., -40°C to +85°C) should be evaluated. Even within its rated range, designers must account for derating effects—particularly at elevated ambient temperatures—to maintain signal integrity and ensure stable operation over time. Proper PCB layout, decoupling, and avoidance of thermal hotspots further enhance long-term reliability when using the CY7C199-15ZI in continuous-duty scenarios.
Can the CY7C199-15ZI be safely interfaced with a 3.3V microcontroller without level shifting circuitry?
The CY7C199-15ZI operates at a core voltage of 5.0V ±10%, meaning its I/O pins expect 5V-compatible logic levels. Connecting it directly to a 3.3V microcontroller like an ARM Cortex-M series device without appropriate interfacing will likely result in unreliable communication, as the SRAM may not reliably recognize 3.3V signals as valid logic highs. While some microcontrollers can tolerate 3.3V inputs at 5V-tolerant GPIOs, relying on this feature introduces risk, especially during power-up sequencing or brownout conditions. Therefore, external bidirectional level shifters or dedicated buffer ICs compatible with both voltage domains are recommended when integrating the CY7C199-15ZI into mixed-voltage systems. Direct connection is technically feasible only if both devices share the same supply rail, which contradicts the typical use case of interfacing legacy 5V memories with modern low-voltage processors.
How much standby current should a design expect when using the CY7C199-15ZI in battery-powered applications, and what factors influence this value?
The CY7C199-15ZI exhibits a typical standby current (ISB) of 1 µA when powered at 5V and inactive. This low leakage makes it suitable for intermittent-use battery applications where memory must retain state during idle periods. However, actual consumption depends heavily on environmental and operational conditions: elevated temperatures increase leakage exponentially, so performance at 70°C may approach 1.5–2 µA. Additionally, improper PCB layout—such as floating address lines or unterminated outputs—can induce unintended switching activity, increasing average current draw beyond datasheet specifications. Designers should also note that the ISB measurement assumes full CMOS compatibility and stable VCC; any voltage droop or noise during standby can transiently activate internal circuitry, raising effective standby current. For prolonged battery life, periodic power gating or using sleep modes in conjunction with the SRAM’s enable pin is advisable.
In comparison to synchronous SRAMs, what architectural trade-offs does the CY7C199-15ZI present for asynchronous memory-mapped systems?
Unlike synchronous SRAMs such as the Cypress S70GL02GT that operate on edge-triggered clocks, the CY7C199-15ZI uses an asynchronous interface, allowing immediate response to address and control signals without wait states. This simplifies timing closure in simple microcontrollers or DSPs by eliminating the need for complex clock-domain synchronization. However, asynchronous SRAMs like the CY7C199-15ZI require precise setup and hold times relative to WE# and OE#, which can be challenging in high-noise or long-trace environments. Moreover, they lack burst capabilities and cannot pipeline accesses, limiting throughput in streaming applications. When compared to synchronous counterparts offering similar densities, the CY7C199-15ZI trades peak bandwidth for lower complexity and predictable latency, making it preferable in deterministic real-time systems where timing predictability outweighs raw data rate.
What is the significance of the -15 suffix in the CY7C199-15ZI part number, and how does it affect system-level integration?
The "-15" in the CY7C199-15ZI denotes a propagation delay of 15 nanoseconds from address input to data output under specified test conditions. This latency defines the minimum cycle time required for successful reads or writes, influencing how tightly coupled the SRAM can be to a processor bus. For example, a CPU running at 66 MHz (15 ns per cycle) would require at least one wait state if interfacing directly with the CY7C199-15ZI unless careful timing analysis confirms sufficient margin. The -15 variant strikes a middle ground between speed and cost, avoiding the premium pricing of -12 or -10 ns versions while still outperforming slower -20 ns parts. System integrators must map this delay against their memory controller’s timing budget, especially in single-cycle instruction fetches or DMA transfers, to avoid metastability or data corruption.
How does package selection—specifically the TSSOP-28 format—impact thermal performance and routing density in compact PCBs?
The TSSOP-28 package of the CY7C199-15ZI provides a balance between pin count and board real estate, enabling compact designs without resorting to larger SOIC or PLCC footprints. Its small outline allows dense placement in space-constrained layouts such as handheld instruments or IoT modules. However, the limited thermal pad and absence of exposed die attach limit heat dissipation compared to packages with thermal enhancements. Under sustained write operations at full capacity, junction temperatures may rise significantly if ambient conditions are near the upper end of the operating range. Routing-wise, the narrow pitch demands careful trace spacing and impedance control, particularly for clock-sensitive signals like /OE or /WE. While adequate for non-heavy-load applications, engineers should avoid clustering high-current peripherals nearby to prevent localized heating and signal degradation.
What precautions should be taken when storing or handling tube-packed CY7C199-15ZI components before assembly?
As tube-packed devices, the CY7C199-15ZI arrives in antistatic conductive tubes designed to protect against electrostatic discharge (ESD) during transport and storage. Before handling, operators should verify ESD-safe workstations are active, and components must remain sealed until just prior to pick-and-place. Once removed, exposure to humidity above 60% RH can accelerate corrosion, especially in lead-free finishes. It is advisable to store unpackaged units in moisture barrier bags with desiccant if staging exceeds 48 hours before soldering. Reflow profiles must adhere to JEDEC J-STD-020 standards for Pb-free assembly, typically peaking around 245°C to avoid damaging the die. Improper handling—such as manual insertion without ESD grounding—risks latent damage that may manifest weeks later as erratic behavior in field deployments.
Why might a designer choose the CY7C199-15ZI over a DRAM alternative in a microcontroller-based data logging application?
DRAM requires constant refreshing to retain data, introducing software overhead and timing unpredictability, whereas the CY7C199-195ZI retains information indefinitely without refresh cycles, ensuring deterministic behavior in embedded logging tasks. This eliminates the need for background refresh routines that fragment CPU attention and complicate real-time scheduling. Additionally, SRAM delivers faster random-access speeds—critical when frequently updating timestamped entries—and offers better noise immunity due to higher output drive and simpler signaling. Although DRAM provides higher density per dollar, the CY7C199-15ZI’s simplicity, zero latency variability, and compatibility with direct memory mapping make it ideal for small-to-medium buffers in systems where code size, reliability, and timing predictability are prioritized over cost-per-bit.

Parts with Similar Specifications

The three parts on the right have similar specifications to Cypress Semiconductor Corp CY7C199-15ZI

Product Attribute CY7C199-15ZIT CY7C199-15ZC CY7C199-15PC CY7C199-15VC
Part Number CY7C199-15ZIT CY7C199-15ZC CY7C199-15PC CY7C199-15VC
Manufacturer Cypress Semiconductor Corp Infineon Technologies Infineon Technologies Infineon Technologies
Access Time - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Write Cycle Time - Word, Page - - - -
Memory Type - - - -
Series - - - -
Memory Organization - - - -
Memory Interface - - - -
Memory Format - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Memory Size - - - -
Technology - - - -
Voltage - Supply - - - -

Customer Reviews

Evaluation: 10 Articles

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
CY7C199-15ZI Image

CY7C199-15ZI

Cypress Semiconductor Corp
32D-CY7C199-15ZI

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