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HomeProductsIntegrated Circuits (ICs)Embedded - MicroprocessorsMCIMX6X3EVK10AB
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MCIMX6X3EVK10AB - NXP USA Inc.

Manufacturer Part Number
MCIMX6X3EVK10AB
Manufacturer
NXP Semiconductors
Allelco Part Number
32D-MCIMX6X3EVK10AB
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
9,184 pcs available, New & Original
Parts Description
IC MPU I.MX6SX 1GHZ 400MAPBGA
Package
400-MAPBGA (14x14)
Data sheet
MCIMX6X3EVK10AB.pdf

PCN Assembly/Origin

2.73KHz.pdf
RoHs Status
ROHS3 Compliant
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In stock: 9184

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Specifications

MCIMX6X3EVK10AB Tech Specifications
NXP USA Inc. - MCIMX6X3EVK10AB technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. - MCIMX6X3EVK10AB

Product Attribute Attribute Value
Manufacturer NXP Semiconductors
Voltage - I/O 1.8V, 2.5V, 2.8V, 3.15V
USB USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Supplier Device Package 400-MAPBGA (14x14)
Speed 227MHz, 1GHz
Series i.MX6SX
Security Features A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
SATA -
RAM Controllers LPDDR2, LVDDR3, DDR3
Package / Case 400-LFBGA
Package Tray
Product Attribute Attribute Value
Operating Temperature -20°C ~ 105°C (TJ)
Number of Cores/Bus Width 2 Core, 32-Bit
Mounting Type Surface Mount
Graphics Acceleration Yes
Ethernet 10/100/1000Mbps (2)
Display & Interface Controllers Keypad, LCD, LVDS
Core Processor ARM® Cortex®-A9, ARM® Cortex®-M4
Co-Processors/DSP Multimedia; NEON™ MPE
Base Product Number MCIMX6
Additional Interfaces AC'97, CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A992C
HTSUS 8542.31.0001

Parts Introduction

MCIMX6X3EVK10AB Image
MCIMX6X3EVK10AB (1)

Manufacturer Part Number

MCIMX6X3EVK10AB

Manufacturer

NXP Semiconductors

Introduction

The MCIMX6X3EVK10AB is a key component of NXP's i.MX6SX series, focusing on delivering a high-performance and energy-efficient processor solution for embedded applications.

Product Features and Performance

Dual-core configuration with ARM Cortex-A9 and Cortex-M4 processors

Operating speeds up to 1GHz for Cortex-A9 and 227MHz for Cortex-M4

NEON Multimedia Processing Engine for improved media processing

Integrated graphics acceleration

Supports multiple display and interface controllers including Keypad, LCD, and LVDS

Enhanced connectivity with dual Ethernet up to 1000Mbps, USB 2.0, and additional interfaces such as CAN, I2C, and UART

Product Advantages

Energy-efficient performance with dual core configuration

High-speed interfaces and data processing capabilities

Robust multimedia and graphic processing features

Extensive connectivity options for versatile applications

Key Technical Parameters

Cores: 2 Core, 32-Bit

Speed: Cortex-A9 at 1GHz, Cortex-M4 at 227MHz

RAM Controllers: LPDDR2, LVDDR3, DDR3

Graphics Acceleration: Enabled

Voltages I/O: 1.8V, 2.5V, 2.8V, 3.15V

Operating Temperature Range: -20°C to 105°C

Quality and Safety Features

Security features including A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE

Withstands harsh temperature conditions

Compatibility

Compatible with a range of memory and display controllers

Supports additional external interfaces for system expansion

Application Areas

Ideal for multimedia applications

Suitable for automotive, industrial, and consumer electronic devices

Product Lifecycle

Currently active product status

Long-term support and availability, without any known discontinuation notices

Several Key Reasons to Choose This Product

Robust multimedia and graphic processing capabilities

High-speed operational efficiency and dual-core processing power

Comprehensive security features ensure data integrity and safety

Extensive connectivity including advanced network interfaces for broader application scope

Frequently Asked Questions(FAQ)

How does the MCIMX6X3EVK10AB compare to other i.MX 6 series processors in terms of core architecture and integrated peripherals for industrial control applications?
The MCIMX6X3EVK10AB features dual-core ARM® Cortex®-A9 and a co-processor ARM® Cortex®-M4, enabling real-time task offloading from the application processor—ideal for deterministic control loops in industrial automation. While higher-end i.MX 6 variants like the i.MX 6Dual/Quad offer up to four A9 cores and enhanced GPU performance, the MCIMX6X3EVK10AB’s inclusion of the M4 core provides dedicated hardware acceleration for motor control or sensor fusion without burdening the main CPU. This architecture reduces interrupt latency by up to 40% compared to single-core solutions when handling time-critical peripherals such as VADC or SAI interfaces. Additionally, it supports DDR3/DDR3L and LPDDR2 memory options, offering a balance between power efficiency and bandwidth suitable for embedded vision and HMI systems.
What are the key thermal considerations when deploying the MCIMX6X3EVK10AB in extended temperature environments beyond standard operating conditions?
The MCIMX6X3EVK10AB is rated for operation from -20°C to 105°C (TJ), making it suitable for harsh environments such as automotive edge nodes or factory floor controllers. However, junction-to-ambient thermal resistance must be carefully evaluated under sustained full-load conditions. At 1GHz core frequency with both Cortex-A9 and M4 active, typical power dissipation reaches 2.8W under worst-case workloads. Without adequate heat sinking or airflow, die temperatures can exceed 110°C, triggering dynamic thermal throttling that reduces clock speeds by approximately 15–20%. Designers should ensure PCB copper area under the 400-MAPBGA package exceeds 120 mm² and consider thermal vias to adjacent ground planes for effective heat spreading.
Can the MCIMX6X3EVK10AB support multiple high-speed display interfaces simultaneously for a multi-monitor industrial HMI system?
Yes, but with constraints. The MCIMX6X3EVK10AB includes an LCD controller capable of driving displays up to 1920x1080 at 60Hz via its RGB parallel interface or LVDS. However, only one display path can be active at a time unless using external multiplexers, as the internal display pipeline shares memory bandwidth with the GPU and DDR controller. Attempting concurrent high-resolution outputs would result in frame drops due to memory contention. For dual-display setups requiring independent content streams, an external frame buffer IC or a companion FPGA is recommended to avoid bottlenecking the 667 MHz DDR3 interface, which has a theoretical peak bandwidth of 5.3 GB/s shared across all subsystems.
How does the security subsystem of the MCIMX6X3EVK10AB protect against firmware tampering in field-deployed devices?
The MCIMX6X3EVK10AB integrates a comprehensive suite of hardware-based security features including ARM TrustZone™ (TZ), Cryptographic Acceleration and Assurance Module (CAAM), Secure Non-Volatile Storage (SNVS), Chip Security Unit (CSU), and Advanced High-Assurance Boot (A-HAB). These elements form a root-of-trust architecture that validates boot code signatures during startup using public key cryptography, preventing unauthorized code execution even if the OS layer is compromised. The SNVS maintains secure key storage during power loss, while TVDECODE enables secure video playback by isolating decrypted streams from general-purpose memory. This layered approach reduces vulnerability to common attack vectors such as cold boot or DMA-based data extraction by over 90% compared to software-only security models.
In what scenarios would the inclusion of CANbus and I2S interfaces on the MCIMX6X3EVK10AB justify its selection over a simpler microcontroller solution?
The MCIMX6X3EVK10AB justifies its higher cost and complexity when designs require simultaneous processing of digital audio streams (via I2S/SAI) and real-time communication over Controller Area Network (CANbus). For example, in medical monitoring equipment, the I2S interface can directly ingest high-fidelity ADC outputs while the CANbus handles patient data transmission to hospital networks—tasks that exceed the capability of most MCUs lacking native audio peripherals. The presence of both interfaces eliminates the need for external protocol transceivers and reduces bill-of-materials count by up to three components. Furthermore, the M4 core can handle CAN message filtering independently, freeing the A9 core for user interface rendering or data logging.
What impact does the choice of external memory type—DDR3L vs LPDDR2—have on system power consumption and performance when using the MCIMX6X3EVK10AB?
Selecting DDR3L over LPDDR2 reduces active power by approximately 30% at 667 MHz due to lower supply voltage (1.35V vs 1.2V nominal, though LPDDR2 operates at 1.2V effectively). However, LPDDR2 offers slightly better burst efficiency and reduced leakage current in sleep modes, beneficial for battery-powered edge devices. In practice, DDR3L provides higher usable bandwidth (up to 5.3 GB/s bidirectional) compared to LPDDR2’s 4.8 GB/s, which benefits graphics-intensive applications. When using the MCIMX6X3EVK10AB, designers should match memory type to duty cycle: use DDR3L for continuous operation with moderate graphics load, and LPDDR2 for intermittent sensing tasks where deep sleep states dominate total energy budget.
How many USB host ports can be simultaneously driven by the MCIMX6X3EVK10AB, and what limitations exist when connecting high-power peripherals?
The MCIMX6X3EVK10AB supports one USB 2.0 host port with integrated PHY and two USB 2.0 OTG ports, each capable of functioning as either host or device depending on configuration. All three ports share the same 480 Mbps bandwidth, meaning parallel access to full-speed devices won’t exceed aggregate throughput. Crucially, the internal power management does not include per-port current limiting; thus, connecting high-power devices like SSDs or hubs requires external regulators capable of delivering up to 500 mA per port. Exceeding this without proper protection may cause brownouts or reset cycles, especially during enumeration phases. External ferrite beads and bulk capacitance are strongly advised near connector inputs.
Is it feasible to run Linux alongside bare-metal firmware on the MCIMX6X3EVK10AB without significant resource conflicts?
Yes, but with careful partitioning. The MCIMX6X3EVK10AB allows running Linux on the Cortex-A9 core while executing bare-metal code on the Cortex-M4 via AMP (Asymmetric Multi-Processing). Memory must be split using MMU remapping so that shared buffers reside in non-cacheable regions to prevent coherency issues. Typical allocations include assigning 512 MB to Linux for rootfs and UI stack, leaving 256 MB for M4 firmware handling sensor polling or actuator control. Inter-processor communication occurs through mailbox registers or shared SRAM with semaphore guarding. Latency between A9 and M4 interrupts averages 8–12 microseconds, sufficient for sub-millisecond control loops if tuned properly.

Parts with Similar Specifications

The three parts on the right have similar specifications to NXP USA Inc. MCIMX6X3EVK10AB

Product Attribute MCIMX6X3EVK10ABR MCIMX6X3EVK10ABR518 MCIMX6X3EVK10ABR MCIMX6X3EVO10AB
Part Number MCIMX6X3EVK10ABR MCIMX6X3EVK10ABR518 MCIMX6X3EVK10ABR MCIMX6X3EVO10AB
Manufacturer Freescale Semiconductor NXP USA Inc. NXP USA Inc. NXP USA Inc.
Graphics Acceleration - - - -
Ethernet - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Mounting Type - Surface Mount Through Hole Surface Mount
Co-Processors/DSP - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
RAM Controllers - - - -
SATA - - - -
Voltage - I/O - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Cores/Bus Width - - - -
Core Processor - - - -
Speed - - - -
Security Features - - - -
USB - - - -
Series - - - -
Display & Interface Controllers - - - -
Additional Interfaces - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Package - Tape & Reel (TR) Tube Tape & Reel (TR)

MCIMX6X3EVK10AB Datasheet PDF

Download MCIMX6X3EVK10AB pdf datasheets and NXP USA Inc. documentation for MCIMX6X3EVK10AB - NXP USA Inc..

Datasheets
MCIMX6XxAxx(B,C) Datasheet.pdf
PCN Packaging
All Dev Label Update 15/Dec/2020.pdf Mult Dev Pkg Seal 15/Dec/2020.pdf
HTML Datasheet
i.MX 6 Series Overview.pdf
PCN Design/Specification
i.MX 6SoloX 01/Jul/2016.pdf MCIMX6YYY 04/Jun/2017.pdf
PCN Assembly/Origin
2.73KHz.pdf
Environmental Information
NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
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We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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Certifications & Memberships

Third-party certified, strict quality control. Our certification
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MCIMX6X3EVK10AB Image

MCIMX6X3EVK10AB

NXP USA Inc.
32D-MCIMX6X3EVK10AB

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