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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersMKE02Z32VLC4R
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MKE02Z32VLC4R - NXP USA Inc.

Manufacturer Part Number
MKE02Z32VLC4R
Manufacturer
NXP Semiconductors
Allelco Part Number
32D-MKE02Z32VLC4R
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
17,814 pcs available, New & Original
Parts Description
IC MCU 32BIT 32KB FLASH 32LQFP
Package
32-LQFP (7x7)
Data sheet
MKE02Z32VLC4R.pdf

Datasheets

MKE02ZxxVxx4.pdf

PCN Design/Specification

MKE02/MKE04/MKE06 21/Feb/2019.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 17814
  • Unit Price: $0.809
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $0.809 $0.81
10+ $0.792 $7.92
30+ $0.779 $23.37
100+ $0.767 $76.70
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

MKE02Z32VLC4R Tech Specifications
NXP USA Inc. - MKE02Z32VLC4R technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. - MKE02Z32VLC4R

Product Attribute Attribute Value
Manufacturer NXP Semiconductors
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Supplier Device Package 32-LQFP (7x7)
Speed 40MHz
Series Kinetis KE02
RAM Size 4K x 8
Program Memory Type FLASH
Program Memory Size 32KB (32K x 8)
Peripherals LVD, PWM, WDT
Package / Case 32-LQFP
Package Tape & Reel (TR)
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 105°C (TA)
Number of I/O 28
Mounting Type Surface Mount
EEPROM Size 256 x 8
Data Converters A/D 16x12b; D/A 2x6b
Core Size 32-Bit Single-Core
Core Processor ARM® Cortex®-M0+
Connectivity I²C, SPI, UART/USART
Base Product Number MKE02Z32

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Parts Introduction

MKE02Z32VLC4R Image
MKE02Z32VLC4R (1)

Manufacturer Part Number

MKE02Z32VLC4R

Manufacturer

NXP Semiconductors

Introduction

ARM Cortex-M0+ based microcontroller for embedded applications

Product Features and Performance

ARM Cortex-M0+ core at 40MHz

32KB Flash memory

4KB RAM

256 Byte EEPROM

Internal oscillator

16-channel 12-bit A/D converter

2-channel 6-bit D/A converter

Extended operating temperature range from -40°C to 105°C

Product Advantages

High integration to save board space

Low power consumption for energy-sensitive applications

Broad connectivity options

Key Technical Parameters

32-bit single-core ARM Cortex-M0+ processor

Speed of 40MHz

28 I/O pins

I2C, SPI, UART/USART interfaces

Low Voltage Detect, Pulse Width Modulation, Watchdog Timer peripherals

Quality and Safety Features

Extended temperature support for industrial applications

Robust package for reliable surface mounting

Compatibility

Compatible with various external components via I2C, SPI, UART

Application Areas

Industrial control systems

Consumer electronics

Automotive products

Internet of Things devices

Product Lifecycle

Active product with ongoing manufacturer support

Several Key Reasons to Choose This Product

Efficient ARM Cortex-M0+ architecture

Wide range of integrated peripherals facilitating feature-rich designs

Flexible voltage supply options acclimating to different power environments

High-resolution data converters for precise analog signal management

Comprehensive connectivity for simplified system expansion

Durability for operation in extreme conditions

Surface-mount LQFP packaging for streamlined PCB design

Support for broad application portfolios, from industrial to consumer electronics

Frequently Asked Questions(FAQ)

How does the MKE02Z32VLC4R compare to other Kinetis KE series microcontrollers in terms of core architecture and power efficiency for battery-operated embedded systems?
The MKE02Z32VLC4R features an ARM® Cortex®-M0+ core operating at up to 40MHz, offering a balance between performance and power consumption suitable for low-power applications. While higher-end Kinetis KE series devices may offer larger memory or additional peripherals, the MKE02Z32VLC4R’s compact 32KB Flash and 4KB RAM configuration make it particularly efficient for constrained designs. Its supply voltage range of 2.7V to 5.5V allows flexibility across various battery chemistries, including Li-ion and alkaline cells. However, compared to ultra-low-power variants like those in the KL or K32 series, the KE02 lacks advanced sleep modes such as Stop or Deep Sleep with faster wake-up times, which could impact long-term energy savings in deeply embedded battery-powered nodes.
What are the key considerations when selecting the MKE02Z32VLC4R for automotive-grade temperature ranges, and how does its reliability profile support functional safety requirements?
Although the MKE02Z32VLC4R is rated for -40°C to +105°C operation, it is not qualified to AEC-Q100 standards, limiting its suitability for full automotive applications. Engineers considering use in harsh environments should verify whether alternative KE02 derivatives with extended certifications exist or if system-level derating strategies can mitigate risk. The device includes standard protection features like Low-Voltage Detection (LVD) and Watchdog Timer (WDT), which support basic fault tolerance but do not meet ISO 26262 functional safety mandates without additional hardware/software safeguards.
In what scenarios would the MKE02Z32VLC4R be preferable over a microcontroller with integrated wireless connectivity like the MK22FN512VLH7?
The MKE02Z32VLC4R is well-suited for cost-sensitive, wired-only sensing or control nodes where external communication modules handle connectivity via UART-to-I2C/SPI bridges. Compared to the MK22FN512VLH7—which integrates an IEEE 802.15.4 radio—the MKE02Z32VLC4R offers reduced bill-of-materials complexity and lower standby current when no RF activity is required. For applications prioritizing minimal pin count, moderate processing needs, and deterministic timing over data throughput, the MKE02Z32VLC4R provides sufficient I/O (28 GPIOs) and peripheral set (SPI, I2C, UART) without the overhead of radio firmware stacks.
Can the MKE02Z32VLC4R reliably drive high-capacitance loads on its GPIO pins without external buffering, and what timing constraints should be considered?
The MKE02Z32VLC4R's GPIOs can source/sink up to 20mA per pin under typical conditions, but driving large capacitive loads (e.g., >10nF) may exceed slew-rate limitations and violate setup/hold times during digital transitions. In such cases, external buffers or level translators are recommended. Additionally, switching high-frequency signals (>1MHz) on general-purpose I/O may introduce EMI concerns due to limited output impedance control. Engineers should consult NXP’s application notes on PCB layout and signal integrity for this MCU family when interfacing with displays, relays, or sensor buses requiring fast edge rates.
How does the internal oscillator stability of the MKE02Z32VLC4R affect timing-critical applications like motor control or real-time data logging?
The MKE02Z32VLC4R relies on an internal RC oscillator calibrated to ±1% accuracy at room temperature but drifting significantly with temperature variation and voltage changes. This makes it unsuitable for precision timing tasks unless compensated by periodic calibration using an external reference (e.g., crystal). For motor control requiring accurate PWM duty cycles or UART baud rates across environmental extremes, an external 4–32MHz crystal oscillator paired with clock multiplication via PLL is strongly advised. Without this, timing errors exceeding 5% could accumulate over time, degrading system performance.
What memory protection mechanisms are available in the MKE02Z32VLC4R, and how do they influence secure firmware development practices?
The MKE02Z32VLC4R supports basic flash memory protection through sector-based locking via the Flash Configuration Field (FCF) and access control registers. However, it lacks hardware cryptographic accelerators, tamper detection, or secure boot capabilities found in more recent secure MCUs. As a result, sensitive algorithms must be implemented in software using libraries like mbed TLS, increasing code size and execution time. Developers must also ensure that debug interfaces remain disabled post-deployment to prevent reverse engineering, given the absence of Arm TrustZone technology.
When integrating the MKE02Z32VLC4R into a mixed-signal PCB, what precautions are necessary to avoid noise coupling from analog peripherals?
The MKE02Z32VLC4R includes 16x 12-bit ADC channels and 2x 6-bit DACs, making it suitable for sensor conditioning tasks. To minimize digital-to-analog crosstalk, separate analog and digital ground planes with a single connection near the VDD pin, route high-speed digital traces away from ADC input paths, and place decoupling capacitors (typically 100nF ceramic) close to VDD/VSS pins. Also, avoid routing SPI or I2C lines parallel to analog signals over long distances. Grounding the exposed pad (EP) properly ensures stable reference potentials for both domains.
How should interrupt latency be managed when using multiple peripherals simultaneously with the MKE02Z32VLC4R?
With a single Cortex-M0+ core, simultaneous peripheral interrupts (e.g., UART RX, SPI CS, WDT) are serviced sequentially based on priority levels set in NVIC. Worst-case interrupt latency is approximately 12 clock cycles after the ISR entry, but context save/restore adds several microseconds depending on compiler optimization. To minimize jitter, disable global interrupts briefly during critical sections and prioritize time-sensitive events (e.g., encoder pulses) above background tasks. Avoid lengthy operations in ISRs; defer processing to main loop or DMA-driven transfers where possible.
What factors influence programming speed when flashing the MKE02Z32VLC4R using SWD or UART bootloader methods?
Programming speed depends heavily on interface choice: Serial Wire Debug (SWD) typically achieves ~250 kbps due to protocol overhead, while the built-in UART bootloader (if enabled) supports baud rates up to 115200 bps. Larger programs (approaching full 32KB Flash) may take 10–20 seconds over SWD versus 30–60 seconds over UART. Engineers should ensure adequate power stability during erase/write cycles and verify checksums after programming to detect corruption early. Using mass-erase commands reduces overhead compared to individual sector writes.
Is the MKE02Z32VLC4R suitable for industrial automation edge devices requiring deterministic response under variable load conditions?
The MKE02Z32VLC4R delivers predictable interrupt handling and fixed-cycle instruction execution due to the Cortex-M0+ architecture, supporting moderate determinism. However, peak memory usage approaching 32KB limits complex state machines, and dynamic allocation risks fragmentation over time. For hard real-time requirements (<1ms jitter), pair with hardware timers and prioritize static memory allocation. While adequate for simple PLC logic or sensor aggregation, complex motion control or vision-based feedback loops may require a more capable core (e.g., Cortex-M4).
How does the package thermal performance of the 32-LQFP (7x7) variant impact high-duty-cycle operation of the MKE02Z32VLC4R?
The 32-LQFP (7x7) package has limited thermal dissipation capability (~45°C/W junction-to-ambient). At maximum ambient temperature (+105°C) and full CPU utilization, self-heating may push junction temperatures beyond 125°C if airflow is restricted or copper area under the EP is insufficient. Engineers should conduct worst-case thermal simulations or prototype testing under sustained load. Adding thermal vias to inner layers and minimizing enclosure heat retention improves reliability, though continuous operation near peak frequencies should be avoided without active cooling.
What trade-offs exist between using internal vs. external memory expansion with the MKE02Z32VLC4R for data logging applications?
The MKE02Z32VLC4R’s 32KB Flash limits local storage to ~8,000 samples of 16-bit data. Expanding via external SPI EEPROM or FRAM increases capacity but introduces bus contention risks, slower write endurance (EEPROM), or higher component cost. Internal flash wear-out occurs after ~10k cycles per sector, so frequent writes should be buffered in RAM (limited to 4KB) or offloaded to non-volatile external memory. For infrequent updates, internal storage suffices, but larger datasets necessitate external solutions with wear-leveling algorithms.

Parts with Similar Specifications

The three parts on the right have similar specifications to NXP USA Inc. MKE02Z32VLC4R

Product Attribute MKE02Z32VLC4557 MKE02Z32VLC4 MKE02Z32VLD4R MKE02Z32VFM4R
Part Number MKE02Z32VLC4557 MKE02Z32VLC4 MKE02Z32VLD4R MKE02Z32VFM4R
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
EEPROM Size - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Mounting Type - Surface Mount Through Hole Surface Mount
Base Product Number - DAC34H84 MAX500 ADS62P42
Core Processor - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Oscillator Type - - - -
RAM Size - - - -
Series - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Program Memory Type - - - -
Data Converters - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Program Memory Size - - - -
Number of I/O - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Core Size - - - -
Connectivity - - - -
Speed - - - -
Peripherals - - - -

MKE02Z32VLC4R Datasheet PDF

Download MKE02Z32VLC4R pdf datasheets and NXP USA Inc. documentation for MKE02Z32VLC4R - NXP USA Inc..

Datasheets
MKE02ZxxVxx4.pdf
PCN Packaging
All Dev Label Update 15/Dec/2020.pdf Mult Dev Pkg Seal 15/Dec/2020.pdf
PCN Design/Specification
MKE02/MKE04/MKE06 21/Feb/2019.pdf
PCN Assembly/Origin
Mult Dev Site Chgs 18/Dec/2020.pdf
Environmental Information
NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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Delivery Time

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Brazil 7
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United Kingdom 4
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New Zealand 5
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Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
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1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


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We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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MKE02Z32VLC4R Image

MKE02Z32VLC4R

NXP USA Inc.
32D-MKE02Z32VLC4R

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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