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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersS9S12GN32ACLFR
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S9S12GN32ACLFR - NXP USA Inc.

Manufacturer Part Number
S9S12GN32ACLFR
Manufacturer
NXP Semiconductors
Allelco Part Number
32D-S9S12GN32ACLFR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
14,848 pcs available, New & Original
Parts Description
IC MCU 16BIT 32KB FLASH 48LQFP
Package
48-LQFP (7x7)
Data sheet
S9S12GN32ACLFR.pdf

PCN Design/Specification

MC9S12G DS Rev 10/May/2021.pdf
RoHs Status
ROHS3 Compliant
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In stock: 14848

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Specifications

S9S12GN32ACLFR Tech Specifications
NXP USA Inc. - S9S12GN32ACLFR technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. - S9S12GN32ACLFR

Product Attribute Attribute Value
Manufacturer NXP Semiconductors
Voltage - Supply (Vcc/Vdd) 3.13V ~ 5.5V
Supplier Device Package 48-LQFP (7x7)
Speed 25MHz
Series HCS12
RAM Size 2K x 8
Program Memory Type FLASH
Program Memory Size 32KB (32K x 8)
Peripherals LVD, POR, PWM, WDT
Package / Case 48-LQFP
Package Tape & Reel (TR)
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 40
Mounting Type Surface Mount
EEPROM Size 1K x 8
Data Converters A/D 8x10b
Core Size 16-Bit
Core Processor 12V1
Connectivity IrDA, LINbus, SCI, SPI
Base Product Number S9S12

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Parts Introduction

S9S12GN32ACLFR Image
S9S12GN32ACLFR (1)

Manufacturer Part Number

S9S12GN32ACLFR

Manufacturer

NXP Semiconductors

Introduction

Embedded 16-Bit Microcontroller for Automotive Applications

Product Features and Performance

16-Bit HCS12 Core

25MHz Operating Speed

IrDA, LINbus, SCI, SPI Connectivity

Low Voltage Detect, Power-On Reset, Pulse Width Modulation, Watchdog Timer Peripherals

40 Digital I/O Pins

32KB FLASH Program Memory

1KB EEPROM

2KB RAM

Internal 10-bit Analog-to-Digital Converter

Internal Oscillator

Product Advantages

Optimized for Automotive Control

Enhanced System Robustness

Flexible Communication Interfaces

On-chip Debugging Features

Low Power Consumption

Key Technical Parameters

Core Processor: 12V1

Core Size: 16-Bit

Speed: 25MHz

Program Memory: 32KB FLASH

EEPROM: 1KB

RAM: 2KB

Supply Voltage: 3.13V to 5.5V

Data Converters: A/D 8x10b

Operating Temperature: -40°C to 85°C

Quality and Safety Features

Extended Temperature Range

Robust I/O Protection

Low Voltage Detect Circuitry

Power-On Reset

Watchdog Timer for System Recovery

Compatibility

Standard 48-LQFP Package Compatible with Surface Mount Technology

Application Areas

Automotive Control Systems

Industrial Automation

Consumer Electronics

Embedded Control Applications

Product Lifecycle

Active Product

Not Nearing Discontinuation

Support for Replacements and Upgrades Available

Several Key Reasons to Choose This Product

Automotive Temperature Grade for Harsh Environments

Comprehensive Peripherals for Diverse Control Tasks

Space-Saving 48-LQFP Package

Long-Term Supplier Availability by NXP

Scalable Solution within the HCS12 Family

Internal Oscillator for Reduced External Components

Simple Integration with Various Communication Protocols

Frequently Asked Questions(FAQ)

What are the key operating voltage and temperature specifications for the NXP S9S12GN32ACLFR microcontroller, and how do these affect system-level power budgeting in industrial control applications?
The S9S12GN32ACLFR operates within a supply voltage range of 3.13V to 5.5V, making it compatible with both standard 3.3V digital systems and legacy 5V industrial environments. This wide tolerance allows designers to interface directly with sensors and actuators without requiring additional level-shifting circuitry. The device is rated for an operating temperature range of -40°C to 85°C (TA), which ensures reliable performance in harsh environments such as factory automation equipment or outdoor sensor networks. When designing power delivery networks, engineers must ensure stable rail regulation within ±5% to prevent brownout resets, especially during cold-start conditions at the lower temperature limit. This thermal and electrical robustness reduces the need for extensive environmental shielding, contributing to smaller form factors.
How does the 32KB flash memory size impact code development workflows and real-time performance when using the S9S12GN32ACLFR in motor control applications?
With 32KB (32K x 8) of on-chip flash memory, the S9S12GN32ACLFR supports moderate-complexity control algorithms but imposes constraints typical of embedded firmware development. For motor control tasks involving PID loops, commutation logic, and fault detection, this memory may require careful optimization—such as using lookup tables instead of floating-point math—to avoid overflow. Firmware updates can be performed via in-circuit programming due to flash programmability, enabling field upgrades. However, developers must segment code into modules to stay within bounds, potentially limiting reuse across projects. The 1K x 8 EEPROM provides limited non-volatile storage for configuration parameters, so calibration data must be managed efficiently to avoid exceeding capacity.
In what scenarios would the S9S12GN32ACLFR be preferable over other HCS12 family members, particularly when comparing peripheral sets and connectivity options?
The S9S12GN32ACLFR stands out among HCS12 variants due to its inclusion of IrDA, LINbus, SCI, and SPI interfaces, which support diverse communication topologies without external transceivers. Compared to base-line MCUs lacking LIN or IrDA, this model is ideal for automotive subsystems where LIN enables cost-effective sensor node integration, while IrDA facilitates short-range optical communication for diagnostic handshakes. Its combination of PWM channels, watchdog timer, low-voltage detect, and power-on reset enhances reliability in unattended deployments. Engineers selecting this part typically prioritize integrated peripheral richness over ultra-low power consumption, making it suitable for gateway devices rather than battery-powered endpoints.
What considerations apply when interfacing the S9S12GN32ACLFR with analog sensors given its internal ADC characteristics?
The S9S12GN32ACLFR features an 8-channel, 10-bit successive approximation ADC with approximately 1.2 LSB integral nonlinearity under typical 5V operation. For precision applications like pressure monitoring or current sensing, this resolution may necessitate oversampling and digital filtering to achieve usable accuracy. Input impedance varies with sampling time settings, so anti-aliasing filters must account for charge injection effects. Since the ADC reference can track VDD, noise coupling from switching regulators should be minimized through layout techniques such as guard rings or ground stitching. Given only 2K x 8 bytes of RAM, buffering multiple ADC samples requires efficient DMA-like handling or interrupt-driven state machines to avoid stack overflow.
How does the choice between internal oscillator versus external crystal affect startup time and timing accuracy for the S9S12GN32ACLFR in safety-critical systems?
The S9S12GN32ACLFR relies on an internal phase-locked loop (PLL) driven by a trimmed RC oscillator, which starts faster than crystal-based clocks but exhibits greater frequency drift over temperature and aging. At 25MHz maximum output, the internal oscillator typically achieves stable operation within 1–2 ms after power-up, advantageous for rapid response in motor drives or emergency shutdown sequences. However, systems requiring precise timing—such as CAN message synchronization or encoder counting—may demand an external 8–16 MHz crystal paired with the PLL to achieve ±1% stability. Designers must weigh boot speed against jitter performance; using the internal clock avoids PCB trace length matching issues but sacrifices deterministic behavior across temperature swings.
Can the S9S12GN32ACLFR support multi-master I2C implementations, and what limitations exist due to its peripheral configuration?
Although the S9S12GN32ACLFR includes a serial communication interface (SCI) and SPI, it does not natively support I2C mode, which limits direct compatibility with many sensor ICs that use I²C protocols. To interface with I²C devices, developers must implement bit-banged I²C using GPIO pins, introducing software overhead and potential timing inaccuracies. Alternatively, SPI-to-I²C bridge chips can be added externally, though this increases board space and component count. The absence of hardware I²C means no automatic clock stretching or arbitration handling, increasing risk of bus contention in multi-device environments. Therefore, selection of this MCU favors SPI-dominated architectures or alternative communication standards like LIN or IrDA.
What role does the watchdog timer play in enhancing system reliability when deploying the S9S12GN32ACLFR in remote monitoring nodes?
The S9S12GN32ACLFR integrates a windowed watchdog timer (WDT) that forces a reset if software fails to service it within a defined interval, preventing runaway code from causing permanent failures. Unlike simple WDTs, the windowed variant rejects servicing attempts outside a narrow time window, mitigating attacks from infinite loops that might otherwise bypass standard counters. In remote nodes subject to electromagnetic interference or software corruption, this feature ensures periodic reboots and reinitialization of critical peripherals. However, developers must carefully calibrate the window based on worst-case interrupt latency and task execution times to avoid false resets during legitimate operations. Coupled with POR and LVD, the trio forms a robust fault-tolerance framework suited to mission-critical edge devices.
How does the 48-LQFP (7x7) package influence thermal management and PCB routing density when integrating the S9S12GN32ACLFR into compact designs?
The 48-pin LQFP package measures just 7mm × 7mm with a 0.5mm pitch, enabling high-density layouts ideal for space-constrained applications like portable instrumentation or embedded controllers. However, its small footprint concentrates heat dissipation into a minimal surface area, requiring attention to copper pour strategies and via stitching for thermal relief. Signal integrity becomes critical due to close pin spacing; controlled-impedance traces and proper termination reduce crosstalk on high-speed lines like SPI or SCI. Routing 40 general-purpose I/Os demands careful layer assignment, often necessitating a four-layer board with dedicated power and ground planes. While the package simplifies pick-and-place assembly, manual soldering or rework presents challenges due to component miniaturization.
What trade-offs exist between using the S9S12GN32ACLFR’s PWM outputs versus external motor drivers in brushless DC (BLDC) control schemes?
The S9S12GN32ACLFR provides configurable PWM modules capable of generating complementary signals with dead-time insertion, essential for driving half-bridge MOSFETs in BLDC motor control. These peripherals reduce CPU load compared to software-generated waveforms, freeing cycles for position feedback processing and commutation logic. However, the MCU itself lacks current-sense inputs or overcurrent protection, so discrete sense resistors and comparator circuits are still required to protect against short circuits. Additionally, PWM resolution is limited by the 16-bit counter architecture—typically yielding ~10-bit effective resolution at 25MHz clock—which may necessitate interpolation algorithms for smooth torque control. Thus, while the MCU handles timing-critical aspects, external driver ICs remain necessary for gate driving and fault detection.
How does the Moisture Sensitivity Level (MSL) rating of 3 for the S9S12GN32ACLFR affect manufacturing handling procedures and shelf life?
Classified as MSL 3 (168-hour limit after opening), the S9S12GN32ACLFR must be stored in dry ambient conditions or under nitrogen atmosphere prior to reflow soldering. After removing the tape reel from sealed packaging, components lose moisture absorption resistance rapidly, increasing popcorning risk during thermal stress. Manufacturers therefore enforce strict bake-out protocols before wave or reflow processes, particularly in humid climates. Inventory rotation must follow FIFO principles, and operators should monitor humidity logs continuously. Failure to adhere to these guidelines compromises solder joint integrity, leading to latent defects that manifest post-deployment. This requirement underscores the importance of conformal coating or hermetic sealing in high-reliability end products.

Parts with Similar Specifications

The three parts on the right have similar specifications to NXP USA Inc. S9S12GN32ACLFR

Product Attribute S9S12GN32AMLFR S9S12GN32ACFTR S9S12GN32AVLFR S9S12GN32AVFTR
Part Number S9S12GN32AMLFR S9S12GN32ACFTR S9S12GN32AVLFR S9S12GN32AVFTR
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
RAM Size - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
EEPROM Size - - - -
Connectivity - - - -
Core Size - - - -
Peripherals - - - -
Speed - - - -
Program Memory Size - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Number of I/O - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Base Product Number - DAC34H84 MAX500 ADS62P42
Data Converters - - - -
Core Processor - - - -
Program Memory Type - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Series - - - -
Oscillator Type - - - -

S9S12GN32ACLFR Datasheet PDF

Download S9S12GN32ACLFR pdf datasheets and NXP USA Inc. documentation for S9S12GN32ACLFR - NXP USA Inc..

PCN Packaging
All Dev Label Update 15/Dec/2020.pdf Mult Dev Pkg Seal 15/Dec/2020.pdf
PCN Design/Specification
MC9S12G DS Rev 10/May/2021.pdf
PCN Assembly/Origin
Mult Dev Test Site 25/Mar/2021.pdf
Environmental Information
NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

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Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
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New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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S9S12GN32ACLFR Image

S9S12GN32ACLFR

NXP USA Inc.
32D-S9S12GN32ACLFR

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