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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~SPC5742PK1AMLQ9R~~

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SPC5742PK1AMLQ9R - NXP USA Inc.

Name: NXP USA Inc. SPC5742PK1AMLQ9R
Brand: NXP USA Inc.
SKU: SPC5742PK1AMLQ9R
Availability: InStock
Rating: 5 (9 reviews)

Manufacturer Part Number: SPC5742PK1AMLQ9R

Manufacturer: NXP Semiconductors

Allelco Part Number: 32D-SPC5742PK1AMLQ9R

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 10,837 pcs available, New & Original

Parts Description: IC MCU 32BIT 1.5MB FLASH 144LQFP

Package: 144-LQFP (20x20)

Data sheet: SPC5742PK1AMLQ9.pdf

Datasheets
MPC574xP Fact Sheet.pdf

PCN Packaging
All Dev Label Update 15/Dec/2020.pdf Mult Dev Pkg Seal 15/Dec/2020.pdf

Environmental Information
NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf

RoHs Status: ROHS3 Compliant

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Our certification

In stock: 10837

Specifications

SPC5742PK1AMLQ9R Tech Specifications
NXP USA Inc. - SPC5742PK1AMLQ9R technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. - SPC5742PK1AMLQ9R

Product Attribute	Attribute Value
Manufacturer	NXP Semiconductors
Voltage - Supply (Vcc/Vdd)	3.15V ~ 5.5V
Supplier Device Package	144-LQFP (20x20)
Speed	200MHz
Series	MPC57xx
RAM Size	192K x 8
Program Memory Type	FLASH
Program Memory Size	1.5MB (1.5M x 8)
Peripherals	DMA, LVD, POR, WDT
Package / Case	144-LQFP

Product Attribute	Attribute Value
Package	Tape & Reel (TR)
Oscillator Type	Internal
Operating Temperature	-40°C ~ 125°C (TA)
Mounting Type	Surface Mount
EEPROM Size	-
Data Converters	A/D 64x12b
Core Size	32-Bit Dual-Core
Core Processor	e200z4
Connectivity	CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Base Product Number	SPC5742

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991A2
HTSUS	8542.31.0001

Parts Introduction

SPC5742PK1AMLQ9R (1)

Manufacturer Part Number

SPC5742PK1AMLQ9R

Manufacturer

nxp-semiconductors

Introduction

The SPC5742PK1AMLQ9R is an advanced 32-bit dual-core microcontroller designed for embedded control applications within the MPC57xx series by NXP Semiconductors. It features robust processing capabilities with a e200z4 core processor and operates at a speed of 200MHz.

Product Features and Performance

Core Processor: e200z4

Core Size: 32-Bit Dual-Core

Speed: 200MHz

Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART

Peripherals: DMA, LVD, POR, WDT

Program Memory Size: 1.5MB (FLASH)

RAM Size: 192K

Data Converters: 64x12b A/D

Oscillator Type: Internal

Operating Temperature: -40°C to 125°C

Product Advantages

Robust Connectivity: Offers a wide range of interfaces.

Powerful Data Handling: Equipped with DMA, large FLASH memory, and adequate RAM.

Precision Control: Includes advanced peripherals and multiple data converters for precise control.

High-Speed Processing: Capable of executing complex tasks efficiently due to its dual-core architecture and 200MHz speed.

Key Technical Parameters

Voltage Supply (Vcc/Vdd): 3.15V to 5.5V

Mounting Type: Surface Mount

Package/Case: 144-LQFP

Supplier Device Package: 144-LQFP (20x20)

Quality and Safety Features

Features like Low Voltage Detection (LVD) and Power-On Reset (POR) enhance the microcontroller's reliability and operational safety.

Compatibility

Its surface mount 144-LQFP package ensures compatibility with modern PCB technologies, facilitating easy integration into a wide range of applications.

Application Areas

Automotive control systems

Industrial automation

Embedded systems requiring high-speed processing and connectivity

Product Lifecycle

Currently Active and not nearing discontinuation. Continual updates and support expected.

Several Key Reasons to Choose This Product

High-speed, dual-core processing capability ensures efficient multitasking.

The robust suite of connectivity options facilitates versatile application deployments.

Comprehensive safety and reliability features support demanding operational environments.

Designed for easy integration, supporting a broad array of application areas.

Ongoing product lifecycle support with no current indication of discontinuation.

Frequently Asked Questions(FAQ)

What are the key performance trade-offs when selecting the SPC5742PK1AMLQ9R for automotive powertrain control applications, and how do its dual-core architecture and memory configuration support real-time processing requirements?: The SPC5742PK1AMLQ9R features a 32-bit dual-core e200z4 processor running at 200MHz with 1.5MB of on-chip flash and 192KB of RAM, providing sufficient computational bandwidth for complex control algorithms in automotive systems. While this configuration supports deterministic response times critical for safety-critical functions like engine management or transmission control, the shared memory architecture introduces potential contention points during high-throughput data access. Designers must consider partitioning tasks across cores to avoid bottlenecks, as simultaneous execution of CANbus and FlexRay traffic alongside ADC sampling may saturate the internal bus matrix without careful DMA utilization. The 3.15V to 5.5V supply range allows compatibility with legacy automotive voltage rails but requires careful decoupling due to sensitivity near the lower threshold.

How does the SPC5742PK1AMLQ9R compare to single-core alternatives like the MPC5606S in terms of fault tolerance and system reliability for ISO 26262 ASIL-D compliant designs?: Unlike the single-core MPC5606S, which relies solely on software redundancy and periodic self-tests for safety integrity, the SPC5742PK1AMLQ9R’s dual independent e200z4 cores enable hardware-based lockstep operation—a key enabler for achieving higher Automotive Safety Integrity Levels such as ASIL-D. This architectural difference reduces reliance on lengthy diagnostic routines, improving diagnostic coverage efficiency. Additionally, the larger flash memory (1.5MB vs. typically <256KB) supports more sophisticated safety monitors and redundant code sections. However, achieving certification requires rigorous timing analysis to ensure no deadline misses occur during core synchronization checks, increasing verification overhead compared to simpler architectures.

What considerations should be made regarding electromagnetic interference (EMI) susceptibility when using the SPC5742PK1AMLQ9R in proximity to high-voltage motor drives, given its operating temperature range down to -40°C?: Operating across -40°C to 125°C, the SPC5742PK1AMLQ9R maintains stable logic thresholds but exhibits increased susceptibility to conducted noise from PWM-driven loads due to its mixed-signal integration of 64x12-bit ADCs. The internal oscillator stability degrades slightly at temperature extremes, potentially affecting communication baud rates over LIN or UART interfaces exposed to voltage transients. Proper PCB layout with star grounding, guard rings around analog inputs, and filtering capacitors on VDD lines are essential. Furthermore, the 144-pin LQFP package’s large footprint aids thermal dissipation but also increases loop area for high-frequency return currents, necessitating careful layer stackup design to minimize crosstalk between digital and analog domains.

Can the SPC5742PK1AMLQ9R reliably drive multiple CAN FD networks simultaneously without external transceivers, and what limits its native CAN capability?: Yes, the SPC5742PK1AMLQ9R includes two full-featured FlexCAN modules capable of supporting CAN FD at speeds up to 5 Mbps each, enabling direct connection to CAN physical layers without external transceivers under standard termination conditions. However, driving long cable lengths or multiple nodes requires attention to bus impedance matching and signal integrity. Each CAN controller shares access to the same internal clock source; therefore, simultaneous operation of both interfaces at maximum bit rates could strain timing margins if phase-locked loops experience jitter. Additionally, while the CPU can handle message filtering efficiently, complex routing tables exceeding ~500 entries may impact real-time responsiveness due to software overhead in interrupt handling.

What is the impact of flash memory write endurance on lifecycle management when using the SPC5742PK1AMLQ9R for firmware updates in field-deployed industrial equipment?: With 1.5MB of flash organized as 1.5M x 8 bits, the SPC5742PK1AMLQ9R typically offers >100k program/erase cycles per sector under typical automotive-grade usage. For most firmware update scenarios involving infrequent writes (e.g., once per year), this far exceeds operational lifetime expectations. Nevertheless, wear leveling becomes critical if logging or parameter storage occurs frequently within small address ranges. Without intelligent block rotation, localized degradation could lead to premature failure. The presence of a built-in error correction code (ECC) helps mitigate soft errors but does not extend physical endurance limits. Therefore, application designers should implement logical wear distribution across multiple sectors rather than relying solely on hardware safeguards.

How does the choice between internal versus external crystal oscillators affect startup time and jitter performance in safety-critical deployments using the SPC5742PK1AMLQ9R?: The SPC5742PK1AMLQ9R’s internal RC oscillator provides rapid boot-up (<1ms) and eliminates external component cost but exhibits higher frequency drift (±2%) and increased phase noise compared to a precision 40MHz crystal. In safety-certified systems requiring deterministic timing (e.g., motor control loops), an external oscillator ensures tighter synchronization between cores and peripherals, reducing worst-case latency variation. However, adding an external resonator increases bill-of-materials complexity and board space. Designers often combine both: use the internal oscillator for initial boot and switch to external during normal operation via clock gating, balancing reliability against development effort.

Are there any known limitations regarding debug access or trace functionality when securing production units with code protection features enabled on the SPC5742PK1AMLQ9R?: Enabling advanced code protection modes (such as JTAG and background debug disablement) effectively prevents unauthorized readback of flash contents and restricts emulation capabilities. While this enhances intellectual property security, it also disables real-time instruction trace through the Nexus Class 3+ interface, complicating post-mortem debugging after field failures. Engineers must plan validation strategies early, possibly using pre-production samples without full protection for extended testing. Additionally, boundary-scan (JTAG) remains available for manufacturing test even when debug is disabled, preserving yield control without compromising end-device security.

What role does the Watchdog Timer (WDT) configuration play in preventing unintended resets during brownout conditions on the SPC5742PK1AMLQ9R, and how does it interact with the Power-On Reset (POR) circuit?: The SPC5742PK1AMLQ9R integrates a windowed watchdog timer that enforces strict servicing windows, preventing accidental resets caused by software hangs. During brownouts where VDD drops below 3.15V, the POR circuit triggers a full reset, but if VDD recovers just above threshold before the WDT expires, the system may enter an undefined state if the WDT wasn’t properly reinitialized. Proper design practice involves disabling the WDT immediately upon POR detection and reconfiguring it only after stable operation resumes. Misconfiguration here risks cycling behavior instead of graceful recovery, especially in environments with frequent voltage sags.

Given its Ethernet connectivity, what considerations apply to implementing TCP/IP stacks on the SPC5742PK1AMLQ9R for time-sensitive industrial automation without dedicated MAC hardware assistance?: Although the SPC5742PK1AMLQ9R includes an integrated 10/100 Ethernet MAC capable of IEEE 802.3 compliance, software-based TCP/IP implementations face challenges due to limited RAM (192KB) and lack of DMA support for packet buffering. High-priority frames (e.g., EtherCAT or PROFINET IRT) require precise timestamping and low interrupt latency, which may exceed the CPU’s ability to service without specialized hardware assist. Instead, developers often offload protocol processing to external PHYs with embedded controllers or adopt RTOS-aware networking stacks that prioritize critical tasks. Even then, achieving sub-microsecond jitter demands careful scheduling and avoidance of memory fragmentation.

How does the Moisture Sensitivity Level (MSL) rating of 3 for the SPC5742PK1AMLQ9R influence reflow soldering process controls during mass production?: As an MSL 3 device (with 168-hour floor life at 30°C/60% RH), the SPC5742PK1AMLQ9R mandates controlled storage and handling prior to reflow. Exposure beyond 168 hours without baking accelerates moisture ingress, risking popcorning during thermal stress. Production workflows must include humidity monitoring, sealed packaging with desiccants, and scheduled bake-outs for open trays. Lead-free reflow profiles must stay within JEDEC J-STD-020 specifications to prevent delamination at the die attach interface. Failure to adhere increases defect rates in high-reliability automotive builds where rework is impractical.

What are the implications of choosing the 144-LQFP (20x20) package over alternative pin-compatible variants when designing thermal vias into the PCB for the SPC5742PK1AMLQ9R?: The SPC5742PK1AMLQ9R’s 144-pin LQFP package features an exposed pad beneath the IC, which acts as a primary heat-spreading node. Efficient thermal management requires connecting this pad to multiple vias in the inner ground plane, leveraging the large copper area for conduction. Compared to smaller packages like TQFP, the wider pitch (0.5mm vs. 0.4mm) simplifies routing but reduces density, allowing better isolation between power and ground planes. However, inadequate via stitching can create hotspots near high-current drivers like the ADCs or clock generators, degrading long-term reliability at elevated temperatures up to 125°C.

In what scenarios would the SPC5742PK1AMLQ9R’s dual-core architecture provide tangible benefits over a single-core solution despite higher power consumption, and when might it be overkill?: The dual-core advantage emerges in applications demanding parallel processing, such as sensor fusion combining CAN FD, FlexRay, and Ethernet inputs while executing vision algorithms on captured images. One core can manage communications while the other runs predictive diagnostics, maximizing throughput without extending cycle times. Conversely, simple LED blinking or basic sensor polling tasks gain little benefit from dual cores and incur unnecessary quiescent current penalties. Selection hinges on workload concurrency: if I/O handling dominates, consolidation onto one core suffices; if computation load peaks exceed 80% utilization on a single core, splitting improves predictability.

Parts with Similar Specifications

The three parts on the right have similar specifications to NXP USA Inc. SPC5742PK1AMLQ9R

Product Attribute
Part Number	SPC5742PFK1AMLQ9557	SPC5742PK1AMLQ9	SPC5743PFK1AMLQ9	SPC5742PK1AMLQ5557
Manufacturer	NXP USA Inc.	NXP USA Inc.	NXP USA Inc.	NXP USA Inc.
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Series	-	-	-	-
Speed	-	-	-	-
EEPROM Size	-	-	-	-
RAM Size	-	-	-	-
Oscillator Type	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Program Memory Type	-	-	-	-
Connectivity	-	-	-	-
Data Converters	-	-	-	-
Voltage - Supply (Vcc/Vdd)	-	-	-	-
Core Size	-	-	-	-
Program Memory Size	-	-	-	-
Core Processor	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Peripherals	-	-	-	-

SPC5742PK1AMLQ9R Datasheet PDF

Download SPC5742PK1AMLQ9R pdf datasheets and NXP USA Inc. documentation for SPC5742PK1AMLQ9R - NXP USA Inc..

Datasheets: MPC574xP Fact Sheet.pdf
PCN Packaging: All Dev Label Update 15/Dec/2020.pdf Mult Dev Pkg Seal 15/Dec/2020.pdf
Environmental Information: NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.

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